KR100813405B1 - 회로 기판 - Google Patents

회로 기판 Download PDF

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Publication number
KR100813405B1
KR100813405B1 KR1020060059144A KR20060059144A KR100813405B1 KR 100813405 B1 KR100813405 B1 KR 100813405B1 KR 1020060059144 A KR1020060059144 A KR 1020060059144A KR 20060059144 A KR20060059144 A KR 20060059144A KR 100813405 B1 KR100813405 B1 KR 100813405B1
Authority
KR
South Korea
Prior art keywords
land
resist
circuit board
pad electrode
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020060059144A
Other languages
English (en)
Korean (ko)
Other versions
KR20070003617A (ko
Inventor
코이치 히가사
요시유키 스미모토
다이스케 요시오카
Original Assignee
오므론 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오므론 가부시키가이샤 filed Critical 오므론 가부시키가이샤
Publication of KR20070003617A publication Critical patent/KR20070003617A/ko
Application granted granted Critical
Publication of KR100813405B1 publication Critical patent/KR100813405B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1020060059144A 2005-06-30 2006-06-29 회로 기판 Expired - Fee Related KR100813405B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005191310A JP4265578B2 (ja) 2005-06-30 2005-06-30 回路基板
JPJP-P-2005-00191310 2005-06-30

Publications (2)

Publication Number Publication Date
KR20070003617A KR20070003617A (ko) 2007-01-05
KR100813405B1 true KR100813405B1 (ko) 2008-03-12

Family

ID=36954369

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060059144A Expired - Fee Related KR100813405B1 (ko) 2005-06-30 2006-06-29 회로 기판

Country Status (5)

Country Link
US (1) US20070001297A1 (enExample)
EP (1) EP1740029B1 (enExample)
JP (1) JP4265578B2 (enExample)
KR (1) KR100813405B1 (enExample)
CN (1) CN1893772B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5004654B2 (ja) * 2007-05-16 2012-08-22 パナソニック株式会社 配線基板の接続方法および配線基板構造
WO2009084127A1 (ja) * 2007-12-28 2009-07-09 Onamba Co., Ltd. 端子板回路
CN101494951A (zh) * 2009-02-18 2009-07-29 旭丽电子(广州)有限公司 印刷电路板
US20110075392A1 (en) 2009-09-29 2011-03-31 Astec International Limited Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets
JP4825919B1 (ja) 2010-05-31 2011-11-30 株式会社東芝 電子機器
EP2408284A1 (en) * 2010-07-14 2012-01-18 Research In Motion Limited Assembly, and associated method, for forming a solder connection
CN103380467B (zh) * 2011-02-24 2016-04-27 株式会社村田制作所 电子元器件的安装结构
EP2680301B1 (en) * 2011-02-24 2020-05-06 Murata Manufacturing Co., Ltd. Structure comprising electronic component and mounting body
US9076782B2 (en) * 2011-08-10 2015-07-07 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing same
DE102013215588A1 (de) * 2013-08-07 2015-02-12 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Leiterplattenanordnung, Steuervorrichtung für ein Kühlerlüftermodul und Verfahren
JP2015035531A (ja) * 2013-08-09 2015-02-19 キヤノン株式会社 回路基板及び電子機器
JP6311568B2 (ja) * 2014-10-21 2018-04-18 株式会社デンソー 電子装置
JP6352149B2 (ja) * 2014-10-31 2018-07-04 カルソニックカンセイ株式会社 電子部品の実装構造
CN204408283U (zh) * 2015-02-15 2015-06-17 华为技术有限公司 一种功率放大器的功率管连接结构及功率放大器
JP2022025389A (ja) * 2020-07-29 2022-02-10 Fdk株式会社 部品実装基板
JP7286608B2 (ja) * 2020-11-30 2023-06-05 株式会社タムラ製作所 プリント回路基板の製造方法
JP7574311B2 (ja) * 2021-12-29 2024-10-28 香港時代新能源科技有限公司 回路基板、電池モジュール、電池パック及び電力消費装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5842275A (en) * 1995-09-05 1998-12-01 Ford Motor Company Reflow soldering to mounting pads with vent channels to avoid skewing
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
US6414246B1 (en) * 2001-04-16 2002-07-02 Tyco Electronics Corporation Printed circuit board (PCB)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2528000B2 (de) * 1975-06-24 1979-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung einer Lötfläche relativ großer Abmessungen
JP3639505B2 (ja) * 2000-06-30 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板及び半導体装置
JP4923336B2 (ja) * 2001-04-10 2012-04-25 日本電気株式会社 回路基板及び該回路基板を用いた電子機器
JP2005340684A (ja) * 2004-05-31 2005-12-08 Calsonic Kansei Corp 基板への電子素子の取付構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5842275A (en) * 1995-09-05 1998-12-01 Ford Motor Company Reflow soldering to mounting pads with vent channels to avoid skewing
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
US6414246B1 (en) * 2001-04-16 2002-07-02 Tyco Electronics Corporation Printed circuit board (PCB)

Also Published As

Publication number Publication date
CN1893772A (zh) 2007-01-10
JP2007012850A (ja) 2007-01-18
JP4265578B2 (ja) 2009-05-20
KR20070003617A (ko) 2007-01-05
EP1740029B1 (en) 2012-09-12
CN1893772B (zh) 2012-05-23
US20070001297A1 (en) 2007-01-04
EP1740029A1 (en) 2007-01-03

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