KR100800636B1 - 기판반송 시스템, 기판반송 장치 및 기억 매체 - Google Patents

기판반송 시스템, 기판반송 장치 및 기억 매체 Download PDF

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Publication number
KR100800636B1
KR100800636B1 KR1020060091636A KR20060091636A KR100800636B1 KR 100800636 B1 KR100800636 B1 KR 100800636B1 KR 1020060091636 A KR1020060091636 A KR 1020060091636A KR 20060091636 A KR20060091636 A KR 20060091636A KR 100800636 B1 KR100800636 B1 KR 100800636B1
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South Korea
Prior art keywords
substrate
transfer
wafer
processing apparatus
conveyance
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Expired - Fee Related
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KR1020060091636A
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English (en)
Korean (ko)
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KR20070033908A (ko
Inventor
도시히코 이이지마
신야 시미즈
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동경 엘렉트론 주식회사
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Publication of KR100800636B1 publication Critical patent/KR100800636B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020060091636A 2005-09-22 2006-09-21 기판반송 시스템, 기판반송 장치 및 기억 매체 Expired - Fee Related KR100800636B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00276441 2005-09-22
JP2005276441A JP4589853B2 (ja) 2005-09-22 2005-09-22 基板搬送システム及び基板搬送方法

Publications (2)

Publication Number Publication Date
KR20070033908A KR20070033908A (ko) 2007-03-27
KR100800636B1 true KR100800636B1 (ko) 2008-02-01

Family

ID=37882801

Family Applications (1)

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KR1020060091636A Expired - Fee Related KR100800636B1 (ko) 2005-09-22 2006-09-21 기판반송 시스템, 기판반송 장치 및 기억 매체

Country Status (3)

Country Link
US (1) US8121723B2 (enExample)
JP (1) JP4589853B2 (enExample)
KR (1) KR100800636B1 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102153972B1 (ko) 2019-04-23 2020-09-09 주식회사 에스에프에이 이송물 분리 겸용 이송장치 및 그 방법
KR20200106352A (ko) 2019-03-04 2020-09-14 주식회사 에스에프에이 선반 클리닝장치 및 이를 구비하는 반송물 이적재 시스템
KR102171687B1 (ko) 2019-04-23 2020-10-29 주식회사 에스에프에이 이송물 매수확인 겸용 이송장치 및 그 방법
KR20200123985A (ko) 2019-04-23 2020-11-02 주식회사 에스에프에이 이송물 이송장치 및 이송방법
KR20200129868A (ko) 2019-05-10 2020-11-18 주식회사 에스에프에이 스마트 팩토리를 위한 이동 설비의 실시간 센싱 데이터 처리 시스템 및 그 방법
KR20200129869A (ko) 2019-05-10 2020-11-18 주식회사 에스에프에이 스마트 팩토리를 위한 이동 설비의 실시간 센싱 데이터 처리 시스템 및 그 방법
KR20220053761A (ko) 2020-10-22 2022-05-02 삼성디스플레이 주식회사 자동반송시스템의 제어방법
KR20220064452A (ko) 2020-11-11 2022-05-19 삼성디스플레이 주식회사 자동반송시스템의 제어방법
KR20240105646A (ko) 2022-12-28 2024-07-08 삼성디스플레이 주식회사 자동티칭이 가능한 반송시스템 및 방법
WO2025071127A1 (ko) * 2023-09-25 2025-04-03 (주)쎄믹스 프로브 카드 핸들링 장치
KR20250058468A (ko) 2023-10-23 2025-04-30 주식회사 에스에프에이 자동티칭이 가능한 반송시스템 및 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4313824B2 (ja) * 2007-03-23 2009-08-12 東京エレクトロン株式会社 基板移載装置及び基板移載方法並びに記憶媒体
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5384219B2 (ja) * 2009-06-19 2014-01-08 東京エレクトロン株式会社 検査装置におけるプリアライメント方法及びプリアライメント用プログラム
JP5436949B2 (ja) 2009-06-23 2014-03-05 東京エレクトロン株式会社 アダプタユニット内蔵型ローダ室
JP4949454B2 (ja) * 2009-11-17 2012-06-06 東京エレクトロン株式会社 プローブ装置
CN102116835B (zh) * 2009-11-06 2014-12-03 东京毅力科创株式会社 探测装置以及衬底运送方法
US8802545B2 (en) * 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US20150200514A1 (en) * 2014-01-13 2015-07-16 United Microelectronics Corp. Method for calibrating a plurality of pincettes of a wafer conveyer
JP6869080B2 (ja) * 2017-03-31 2021-05-12 株式会社ダイヘン ロボット制御装置及び制御プログラム
CN111498401A (zh) * 2019-01-31 2020-08-07 泰科电子(上海)有限公司 部件输送装置和方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980042217A (ko) * 1996-11-08 1998-08-17 히가시데쓰로 처리장치
JPH11330197A (ja) 1998-05-15 1999-11-30 Hitachi Ltd 搬送制御方法とその装置
JP2003197711A (ja) 2001-12-27 2003-07-11 Tokyo Electron Ltd 被処理体の搬送システム及び被処理体の搬送方法
KR20040019892A (ko) * 2002-08-29 2004-03-06 토레센티 테크노로지즈 가부시키가이샤 반송방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2931820B2 (ja) * 1991-11-05 1999-08-09 東京エレクトロン株式会社 板状体の処理装置及び搬送装置
JP2001338968A (ja) * 2000-05-30 2001-12-07 Kaapu:Kk 半導体製造ライン
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
JP4696373B2 (ja) * 2001-02-20 2011-06-08 東京エレクトロン株式会社 処理システム及び被処理体の搬送方法
TWI256372B (en) * 2001-12-27 2006-06-11 Tokyo Electron Ltd Carrier system of polishing processing body and conveying method of polishing processing body
JP4234934B2 (ja) * 2002-02-15 2009-03-04 東京エレクトロン株式会社 無人搬送車システム
JP4025069B2 (ja) * 2001-12-28 2007-12-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4450664B2 (ja) * 2003-06-02 2010-04-14 東京エレクトロン株式会社 基板処理装置及び基板搬送方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980042217A (ko) * 1996-11-08 1998-08-17 히가시데쓰로 처리장치
JPH11330197A (ja) 1998-05-15 1999-11-30 Hitachi Ltd 搬送制御方法とその装置
JP2003197711A (ja) 2001-12-27 2003-07-11 Tokyo Electron Ltd 被処理体の搬送システム及び被処理体の搬送方法
KR20040019892A (ko) * 2002-08-29 2004-03-06 토레센티 테크노로지즈 가부시키가이샤 반송방법

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200106352A (ko) 2019-03-04 2020-09-14 주식회사 에스에프에이 선반 클리닝장치 및 이를 구비하는 반송물 이적재 시스템
KR102153972B1 (ko) 2019-04-23 2020-09-09 주식회사 에스에프에이 이송물 분리 겸용 이송장치 및 그 방법
KR102171687B1 (ko) 2019-04-23 2020-10-29 주식회사 에스에프에이 이송물 매수확인 겸용 이송장치 및 그 방법
KR20200123985A (ko) 2019-04-23 2020-11-02 주식회사 에스에프에이 이송물 이송장치 및 이송방법
KR20200129868A (ko) 2019-05-10 2020-11-18 주식회사 에스에프에이 스마트 팩토리를 위한 이동 설비의 실시간 센싱 데이터 처리 시스템 및 그 방법
KR20200129869A (ko) 2019-05-10 2020-11-18 주식회사 에스에프에이 스마트 팩토리를 위한 이동 설비의 실시간 센싱 데이터 처리 시스템 및 그 방법
KR20220053761A (ko) 2020-10-22 2022-05-02 삼성디스플레이 주식회사 자동반송시스템의 제어방법
KR20220064452A (ko) 2020-11-11 2022-05-19 삼성디스플레이 주식회사 자동반송시스템의 제어방법
KR20240105646A (ko) 2022-12-28 2024-07-08 삼성디스플레이 주식회사 자동티칭이 가능한 반송시스템 및 방법
WO2025071127A1 (ko) * 2023-09-25 2025-04-03 (주)쎄믹스 프로브 카드 핸들링 장치
KR20250058468A (ko) 2023-10-23 2025-04-30 주식회사 에스에프에이 자동티칭이 가능한 반송시스템 및 방법

Also Published As

Publication number Publication date
JP2007088286A (ja) 2007-04-05
JP4589853B2 (ja) 2010-12-01
US20070062446A1 (en) 2007-03-22
KR20070033908A (ko) 2007-03-27
US8121723B2 (en) 2012-02-21

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Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20170129