KR100779813B1 - 이산화규소 분산액 - Google Patents
이산화규소 분산액 Download PDFInfo
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- KR100779813B1 KR100779813B1 KR1020057003206A KR20057003206A KR100779813B1 KR 100779813 B1 KR100779813 B1 KR 100779813B1 KR 1020057003206 A KR1020057003206 A KR 1020057003206A KR 20057003206 A KR20057003206 A KR 20057003206A KR 100779813 B1 KR100779813 B1 KR 100779813B1
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- silicon dioxide
- dioxide powder
- aqueous dispersion
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 94
- 239000006185 dispersion Substances 0.000 claims abstract description 64
- 230000007062 hydrolysis Effects 0.000 claims abstract description 24
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 23
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 23
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 230000002378 acidificating effect Effects 0.000 claims abstract description 6
- 239000007864 aqueous solution Substances 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims description 26
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000000084 colloidal system Substances 0.000 claims description 5
- 150000007522 mineralic acids Chemical class 0.000 claims description 5
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 239000007800 oxidant agent Substances 0.000 claims description 4
- 230000035484 reaction time Effects 0.000 claims description 4
- 238000004062 sedimentation Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000002296 dynamic light scattering Methods 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- -1 Lithium aluminum hydride Chemical compound 0.000 claims 6
- 239000012280 lithium aluminium hydride Substances 0.000 claims 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000011149 active material Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 230000008719 thickening Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 4
- 238000012856 packing Methods 0.000 abstract description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 229910004298 SiO 2 Inorganic materials 0.000 description 9
- 238000011049 filling Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002737 fuel gas Substances 0.000 description 2
- 238000005816 glass manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000003755 preservative agent Substances 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 239000005049 silicon tetrachloride Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229910002013 Aerosil® 90 Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BKPKZAGCDUUIPH-UHFFFAOYSA-N C(O)(O)=O.[P] Chemical compound C(O)(O)=O.[P] BKPKZAGCDUUIPH-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DOAYJPJLHNHQSU-UHFFFAOYSA-N aluminum;lithium;hydrate Chemical compound [Li].O.[Al] DOAYJPJLHNHQSU-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 150000001556 benzimidazoles Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229960004275 glycolic acid Drugs 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004967 organic peroxy acids Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000005053 propyltrichlorosilane Substances 0.000 description 1
- 150000003216 pyrazines Chemical class 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- DOEHJNBEOVLHGL-UHFFFAOYSA-N trichloro(propyl)silane Chemical compound CCC[Si](Cl)(Cl)Cl DOEHJNBEOVLHGL-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
- C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
- C01P2002/52—Solid solutions containing elements as dopants
- C01P2002/54—Solid solutions containing elements as dopants one element only
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
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- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
- C01P2006/82—Compositional purity water content
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- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/90—Other properties not specified above
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- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Silicon Compounds (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
Description
실시예 | 출발물질 | 처리 | 반응 시간 (시간) | 온도 (℃) | BET (m2/g) | OH 밀도 (OH/nm2) | LOD (중량%) |
PA0 | OX 50 | 안 함 | - | - | 40 | 2.3 | 0.6 |
PA1 | OX 50 | HCl/H2O | 18 | 100 | 40 | 4.6 | 0.51 |
PA2 | OX 50 | H2O | 18 | 100 | 41 | 4.7 | 0.58 |
PB0 | AE 90 | 안 함 | - | - | 84 | 2.4 | 0.8 |
PB1 | AE 90 | HCl/H2O | 18 | 100 | 80 | 4.7 | 1 |
PB2 | AE 90 | H2O | 18 | 100 | 85 | 5.4 | 0.9 |
PC0 | AE 200 | 안 함 | - | - | 198 | 2.1 | 0.9 |
PC1 | AE 200 | HCl/H2O | 18 | 100 | 197 | 3.7 | 0.8 |
PC2 | AE 200 | H2O | 18 | 100 | 200 | 3.8 | 2.2 |
PD0 | K/SiO2 (1) | 안 함 | - | - | 132 | 1.8 | 0.5 |
PD1 | K/SiO2 | 증기 | 0.1 | 550 | 130 | 2.8 | 0.7 |
PE0 | Na/SiO2 | 안 함 | - | - | 89 | 1.9 | 0.6 |
PE1 | Na/SiO2 | 증기 | 0.1 | 550 | 90 | 2.6 | 0.6 |
PF0 | Li/SiO2 | 안 함 | - | - | 88 | 2.1 | 0.5 |
PF1 | Li/SiO2 | 증기 | 0.1 | 550 | 91 | 2.7 | 0.6 |
(1) 0.2 중량%의 도핑 성분으로 도핑된 모든 분말 |
Claims (16)
- 화염가수분해에 의해 제조되고, J.Mathias 및 G.Wannemacher의 Journal of Colloid and Interface Science 125(1988) p.61에 기재된 리튬 알루미늄 히드라이드와의 반응에 따른, 이산화규소 분말의 리튬 알루미늄 히드라이드와의 반응에 의해 측정된 히드록실기 밀도가 2.5 내지 4.7 OH/㎚2를 나타내는 것을 특징으로 하는 이산화규소 분말.
- 제 1 항에 있어서, 상기 이산화규소 분말이 도핑 성분으로 도핑된 것임을 특징으로 하는 이산화규소 분말.
- 제 1 항 또는 제 2 항에 있어서, 이산화규소 분말이 규소-금속 혼합 산화물 분말이고, 이 때 이산화규소의 함량이 60 중량% 이상임을 특징으로 하는 이산화규소 분말.
- 제 1 항 또는 제 2 항에 있어서, 이산화규소 분말의 히드록실기 밀도가 3 내지 4 OH/㎚2 임을 특징으로 하는 이산화규소 분말.
- 제 1 항 또는 제 2 항에 있어서, 이산화규소 분말의 BET 표면적이 5 내지 600 ㎡/g 임을 특징으로 하는 이산화규소 분말.
- 화염가수분해 공정에 의해 제조되고 2.5 OH/㎚2 미만의 히드록실기 밀도를 갖는 이산화규소 분말을 40 내지 700 ℃의 온도에서 산 조건 하에 5 분 내지 20 시간의 반응 시간 동안 처리한 후, 반응 혼합물로부터 분리함을 특징으로 하고, 상기 히드록실기 밀도는 J.Mathias 및 G.Wannemacher의 Journal of Colloid and Interface Science 125(1988) p.61에 기재된 리튬 알루미늄 히드라이드와의 반응에 따른, 이산화규소 분말의 리튬 알루미늄 히드라이드와의 반응에 의해 측정된 것인, 제 1 항 또는 제 2 항에 따르는 이산화규소 분말의 제조방법.
- 제 6 항에 있어서, 무기산 또는 유기산을 처리에 사용함을 특징으로 하는, 이산화규소 분말의 제조방법.
- 제 1 항 또는 제 2 항에 따르는 이산화규소 분말을 함유하는 수성 분산액.
- 제 8 항에 있어서, 6개월 동안 더욱 증점되거나 침강되지 않음을 특징으로 하는 수성 분산액.
- 제 8 항에 있어서, 이산화규소 분말의 함량이 10 내지 70 중량% 임을 특징으로 하는 수성 분산액.
- 제 8 항에 있어서, pH가 3 내지 12 임을 특징으로 하는 수성 분산액.
- 제 8 항에 있어서, 동적 광 산란법으로 측정된 분산액 중의 평균 집합체 직경이 200 ㎚ 미만임을 특징으로 하는 수성 분산액.
- 제 8 항에 있어서, 산화제, 부식방지제, 표면활성 물질, 또는 이들의 조합을 함유함을 특징으로 하는 수성 분산액.
- 화염가수분해에 의해 제조된 이산화규소 분말로부터 얻어지고 2.5 내지 4.7 OH/㎚2의 히드록실기 밀도를 갖는 이산화규소 분말을 분산 장치를 사용해서 수용액에 혼입시킴을 특징으로 하고, 상기 히드록실기 밀도는 J.Mathias 및 G.Wannemacher의 Journal of Colloid and Interface Science 125(1988) p.61에 기재된 리튬 알루미늄 히드라이드와의 반응에 따른, 이산화규소 분말의 리튬 알루미늄 히드라이드와의 반응에 의해 측정된 것인, 제 8 항에 따르는 분산액의 제조방법.
- 제 8 항에 따르는 수성 분산액을 포함하는 것을 특징으로 하는 화학적 기계적 연마제.
- 제 8 항에 따르는 수성 분산액을 포함하는 특징으로 하는 잉크젯 종이.
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DE10239144A DE10239144A1 (de) | 2002-08-27 | 2002-08-27 | Dispersion |
DE10239144.0 | 2002-08-27 |
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KR20050059090A KR20050059090A (ko) | 2005-06-17 |
KR100779813B1 true KR100779813B1 (ko) | 2007-11-28 |
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KR1020057003206A KR100779813B1 (ko) | 2002-08-27 | 2003-07-29 | 이산화규소 분산액 |
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US (3) | US7824643B2 (ko) |
EP (1) | EP1539644B1 (ko) |
JP (1) | JP2005536435A (ko) |
KR (1) | KR100779813B1 (ko) |
CN (1) | CN100381357C (ko) |
AT (1) | ATE503724T1 (ko) |
AU (1) | AU2003260333A1 (ko) |
DE (2) | DE10239144A1 (ko) |
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DE10360464A1 (de) * | 2003-12-22 | 2005-07-14 | Wacker-Chemie Gmbh | Dispersion die mindestens 2 Arten von Partikeln enthält |
DE102004031785A1 (de) * | 2004-07-01 | 2006-01-26 | Degussa Ag | Polyol enthaltende Siliciumdioxid-Dispersion |
DE102004054392A1 (de) * | 2004-08-28 | 2006-03-02 | Heraeus Quarzglas Gmbh & Co. Kg | Verfahren zum Verbinden von Bauteilen aus hochkieselsäurehaltigem Werkstoff, sowie aus derartigen Bauteilen zusammengefügter Bauteil-Verbund |
DE102007049742A1 (de) * | 2007-10-16 | 2009-04-23 | Evonik Degussa Gmbh | Verfahren zur Herstellung einer Titan-Silicium-Mischoxid enthaltenden Dispersion |
JP5653637B2 (ja) * | 2010-03-01 | 2015-01-14 | 古河電気工業株式会社 | 正極活物質材料、正極、2次電池及びこれらの製造方法 |
EP3467052B1 (de) | 2017-10-06 | 2022-04-13 | Evonik Operations GmbH | Wässrige dispersion enthaltend siliziumdioxid und trimethyl 1,6-hexamethylendiamin |
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DE19620942A1 (de) * | 1995-06-05 | 1996-12-12 | Gen Electric | Effizientes Verfahren zum Hydrophobieren von anorganischem Pulver |
JPH092812A (ja) * | 1995-06-15 | 1997-01-07 | Nippon Cambridge Filter Kk | フィルタテスト用シリカエアロゾル |
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SG54606A1 (en) | 1996-12-05 | 1998-11-16 | Fujimi Inc | Polishing composition |
JPH10172935A (ja) * | 1996-12-05 | 1998-06-26 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
KR20000006595A (ko) * | 1998-09-22 | 2000-02-07 | 유현식 | 반도체소자 cmp용 금속산화물 슬러리의 제조방법 |
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DE19953029A1 (de) * | 1999-11-04 | 2001-05-17 | Degussa | Polyester |
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- 2003-07-29 EP EP03790828A patent/EP1539644B1/en not_active Expired - Lifetime
- 2003-07-29 DE DE60336566T patent/DE60336566D1/de not_active Expired - Lifetime
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- 2003-07-29 KR KR1020057003206A patent/KR100779813B1/ko active IP Right Grant
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US20100037800A1 (en) | 2010-02-18 |
US7888396B2 (en) | 2011-02-15 |
DE10239144A1 (de) | 2004-03-18 |
EP1539644B1 (en) | 2011-03-30 |
AU2003260333A1 (en) | 2004-03-19 |
WO2004020334A1 (en) | 2004-03-11 |
DE60336566D1 (de) | 2011-05-12 |
JP2005536435A (ja) | 2005-12-02 |
US7824643B2 (en) | 2010-11-02 |
US7892510B2 (en) | 2011-02-22 |
EP1539644A1 (en) | 2005-06-15 |
US20060093542A1 (en) | 2006-05-04 |
US20100071594A1 (en) | 2010-03-25 |
CN100381357C (zh) | 2008-04-16 |
ATE503724T1 (de) | 2011-04-15 |
KR20050059090A (ko) | 2005-06-17 |
CN1678525A (zh) | 2005-10-05 |
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