JP2005536435A - 二酸化ケイ素分散液 - Google Patents
二酸化ケイ素分散液 Download PDFInfo
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- JP2005536435A JP2005536435A JP2004531828A JP2004531828A JP2005536435A JP 2005536435 A JP2005536435 A JP 2005536435A JP 2004531828 A JP2004531828 A JP 2004531828A JP 2004531828 A JP2004531828 A JP 2004531828A JP 2005536435 A JP2005536435 A JP 2005536435A
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- silicon dioxide
- dioxide powder
- aqueous dispersion
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 90
- 239000006185 dispersion Substances 0.000 claims abstract description 63
- 230000007062 hydrolysis Effects 0.000 claims abstract description 25
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 18
- 230000002378 acidificating effect Effects 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 8
- 239000003125 aqueous solvent Substances 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims description 25
- 239000000377 silicon dioxide Substances 0.000 claims description 21
- 235000012239 silicon dioxide Nutrition 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 239000003112 inhibitor Substances 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 239000007800 oxidant agent Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 239000000047 product Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 3
- 150000007522 mineralic acids Chemical class 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002244 precipitate Substances 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 abstract description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000002253 acid Substances 0.000 description 8
- 238000011049 filling Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 239000005049 silicon tetrachloride Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229910002013 Aerosil® 90 Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001556 benzimidazoles Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229960004275 glycolic acid Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- -1 lithium aluminum hydride Chemical compound 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004967 organic peroxy acids Chemical class 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000005053 propyltrichlorosilane Substances 0.000 description 1
- 150000003216 pyrazines Chemical class 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- DOEHJNBEOVLHGL-UHFFFAOYSA-N trichloro(propyl)silane Chemical compound CCC[Si](Cl)(Cl)Cl DOEHJNBEOVLHGL-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
- C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
- C01P2002/52—Solid solutions containing elements as dopants
- C01P2002/54—Solid solutions containing elements as dopants one element only
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
- C01P2006/82—Compositional purity water content
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/90—Other properties not specified above
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Silicon Compounds (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
Description
化学的分析
粒子のBET表面積は、DIN66131によって測定した。
実施例PA1:二酸化ケイ素粉末700g(OX50、デグッサ)を、水2100gおよび塩酸(37%)2100g中で18時間還流した。次に、粉末をろ過によって生成物から分離し、pH5が得られるまで水で洗浄した。
実施例D1:実施例PA1から得られた粉末56gを、Ultra-Turraxを用いて水44g内に混ぜて撹拌した。56質量%の充填含有量が得られた。4日後、10rpmのせん断速度で110mPasの粘度が得られた。室温での6か月の保存期間後、分散液に変化はなかった。
Claims (15)
- 火炎加水分解によって製造されかつ2.5〜4.7OH/nm2のヒドロキシ基密度を有している二酸化ケイ素粉末であることを特徴とする、二酸化ケイ素粉末。
- 前記二酸化ケイ素粉末が、ドープされた二酸化ケイ素粉末である、請求項1に記載の二酸化ケイ素粉末。
- 前記二酸化ケイ素粉末が、ケイ素−金属混合酸化物の粉末であって、該酸化物の粉末中の二酸化ケイ素の含有量が少なくとも60%である、請求項1または2に記載の二酸化ケイ素粉末。
- 前記二酸化ケイ素粉末のヒドロキシ基密度が3〜4OH/nm2である、請求項1から3までのいずれか1項に記載の二酸化ケイ素粉末。
- 前記二酸化ケイ素粉末のBET表面積が、5〜600m2/gである、請求項1から4までのいずれか1項に記載の二酸化ケイ素粉末。
- 火炎加水分解法によって製造されかつ2.5OH/nm2より小さいヒドロキシ基密度を有している二酸化ケイ素粉末を、40〜700℃の温度で、酸性条件下で、5分〜20時間の反応時間で処理し、次に、反応混合物から分離する、請求項1から5までのいずれか1項に記載の二酸化ケイ素粉末の製造方法。
- 前記処理のために無機酸または有機酸を使用する、請求項6に記載の二酸化ケイ素の製造方法。
- 請求項1から5までのいずれか1項に記載の二酸化ケイ素粉末を含有している水性分散液。
- 6ヶ月の期間にわたって、さらに増粘することなく、沈殿を形成することもない、請求項8に記載の水性分散液。
- 二酸化ケイ素粉末の含有量が10〜70質量%である、請求項8または9に記載の水性分散液。
- pHが3〜12である、請求項8から10までのいずれか1項に記載の水性分散液。
- 前記水性分散液中の凝集体の平均直径が、200nmより小さい、請求項8から11までのいずれか1項に記載の水性分散液。
- 酸化剤、腐食抑制剤および/または界面活性物質を含有している、請求項8から12までのいずれか1項に記載の水性分散液。
- 火炎加水分解によって製造された二酸化ケイ素粉末から得られた、2.5〜4.7OH/nm2のヒドロキシ基密度を有している二酸化ケイ素粉末を、分散装置を用いて水性溶媒中に混合する、請求項8から13までのいずれか1項に記載の分散液の製造方法。
- 透明塗料の製造、化学的機械研磨、ガラス製造、ゾルゲルガラス製品、例えばオーバークラッド材料、るつぼ、装飾品、被覆材、焼結材料、インクジェット用紙のための、請求項8から13までのいずれか1項に記載の水性分散液の使用。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10239144A DE10239144A1 (de) | 2002-08-27 | 2002-08-27 | Dispersion |
PCT/EP2003/008332 WO2004020334A1 (en) | 2002-08-27 | 2003-07-29 | Silicon dioxide dispersion |
Publications (1)
Publication Number | Publication Date |
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JP2005536435A true JP2005536435A (ja) | 2005-12-02 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004531828A Pending JP2005536435A (ja) | 2002-08-27 | 2003-07-29 | 二酸化ケイ素分散液 |
Country Status (9)
Country | Link |
---|---|
US (3) | US7824643B2 (ja) |
EP (1) | EP1539644B1 (ja) |
JP (1) | JP2005536435A (ja) |
KR (1) | KR100779813B1 (ja) |
CN (1) | CN100381357C (ja) |
AT (1) | ATE503724T1 (ja) |
AU (1) | AU2003260333A1 (ja) |
DE (2) | DE10239144A1 (ja) |
WO (1) | WO2004020334A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10360464A1 (de) * | 2003-12-22 | 2005-07-14 | Wacker-Chemie Gmbh | Dispersion die mindestens 2 Arten von Partikeln enthält |
DE102004031785A1 (de) * | 2004-07-01 | 2006-01-26 | Degussa Ag | Polyol enthaltende Siliciumdioxid-Dispersion |
DE102004054392A1 (de) * | 2004-08-28 | 2006-03-02 | Heraeus Quarzglas Gmbh & Co. Kg | Verfahren zum Verbinden von Bauteilen aus hochkieselsäurehaltigem Werkstoff, sowie aus derartigen Bauteilen zusammengefügter Bauteil-Verbund |
DE102007049742A1 (de) * | 2007-10-16 | 2009-04-23 | Evonik Degussa Gmbh | Verfahren zur Herstellung einer Titan-Silicium-Mischoxid enthaltenden Dispersion |
JP5653637B2 (ja) * | 2010-03-01 | 2015-01-14 | 古河電気工業株式会社 | 正極活物質材料、正極、2次電池及びこれらの製造方法 |
EP3467052B1 (de) | 2017-10-06 | 2022-04-13 | Evonik Operations GmbH | Wässrige dispersion enthaltend siliziumdioxid und trimethyl 1,6-hexamethylendiamin |
Citations (7)
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-
2002
- 2002-08-27 DE DE10239144A patent/DE10239144A1/de not_active Ceased
-
2003
- 2003-07-29 WO PCT/EP2003/008332 patent/WO2004020334A1/en active Search and Examination
- 2003-07-29 AU AU2003260333A patent/AU2003260333A1/en not_active Abandoned
- 2003-07-29 EP EP03790828A patent/EP1539644B1/en not_active Expired - Lifetime
- 2003-07-29 CN CNB038202778A patent/CN100381357C/zh not_active Expired - Lifetime
- 2003-07-29 AT AT03790828T patent/ATE503724T1/de not_active IP Right Cessation
- 2003-07-29 DE DE60336566T patent/DE60336566D1/de not_active Expired - Lifetime
- 2003-07-29 KR KR1020057003206A patent/KR100779813B1/ko active IP Right Grant
- 2003-07-29 US US10/524,037 patent/US7824643B2/en active Active
- 2003-07-29 JP JP2004531828A patent/JP2005536435A/ja active Pending
-
2009
- 2009-08-05 US US12/536,150 patent/US7888396B2/en not_active Expired - Lifetime
- 2009-10-16 US US12/580,384 patent/US7892510B2/en not_active Expired - Fee Related
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JPH09110415A (ja) * | 1995-06-05 | 1997-04-28 | General Electric Co <Ge> | 無機粉末を疎水性にする効率的な方法 |
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JPH10172935A (ja) * | 1996-12-05 | 1998-06-26 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
JP2001354408A (ja) * | 2000-01-19 | 2001-12-25 | Oji Paper Co Ltd | シリカ微粒子分散液及びその製造方法 |
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JP2002029730A (ja) * | 2000-07-17 | 2002-01-29 | Titan Kogyo Kk | 疎水性微粒子及びその応用 |
JP2002121323A (ja) * | 2000-10-11 | 2002-04-23 | Denki Kagaku Kogyo Kk | 真球状シリカ超微粉、その製造方法及び用途 |
Also Published As
Publication number | Publication date |
---|---|
US7888396B2 (en) | 2011-02-15 |
WO2004020334A1 (en) | 2004-03-11 |
DE60336566D1 (de) | 2011-05-12 |
US7824643B2 (en) | 2010-11-02 |
AU2003260333A1 (en) | 2004-03-19 |
US20060093542A1 (en) | 2006-05-04 |
KR20050059090A (ko) | 2005-06-17 |
CN100381357C (zh) | 2008-04-16 |
US20100037800A1 (en) | 2010-02-18 |
EP1539644B1 (en) | 2011-03-30 |
CN1678525A (zh) | 2005-10-05 |
KR100779813B1 (ko) | 2007-11-28 |
EP1539644A1 (en) | 2005-06-15 |
DE10239144A1 (de) | 2004-03-18 |
US20100071594A1 (en) | 2010-03-25 |
ATE503724T1 (de) | 2011-04-15 |
US7892510B2 (en) | 2011-02-22 |
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