KR100769860B1 - 이미지센서 패키지 검사 장치 및 방법 - Google Patents
이미지센서 패키지 검사 장치 및 방법 Download PDFInfo
- Publication number
- KR100769860B1 KR100769860B1 KR1020050121803A KR20050121803A KR100769860B1 KR 100769860 B1 KR100769860 B1 KR 100769860B1 KR 1020050121803 A KR1020050121803 A KR 1020050121803A KR 20050121803 A KR20050121803 A KR 20050121803A KR 100769860 B1 KR100769860 B1 KR 100769860B1
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- Prior art keywords
- image sensor
- sensor package
- package
- socket
- image
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- 238000012360 testing method Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 48
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- 238000013102 re-test Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
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- 238000003825 pressing Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 description 22
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- 235000012431 wafers Nutrition 0.000 description 18
- 230000008569 process Effects 0.000 description 16
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050121803A KR100769860B1 (ko) | 2005-12-12 | 2005-12-12 | 이미지센서 패키지 검사 장치 및 방법 |
TW095124628A TWI323503B (en) | 2005-12-12 | 2006-07-06 | Apparatus, unit and method for testing image sensor packages |
CN200610098477A CN100582794C (zh) | 2005-12-12 | 2006-07-07 | 测试图像传感器封装的装置、单元和方法 |
JP2006189559A JP2007163453A (ja) | 2005-12-12 | 2006-07-10 | イメージセンサーパッケージの検査装置、その検査ユニット及び検査方法 |
US11/457,771 US7427768B2 (en) | 2005-12-12 | 2006-07-14 | Apparatus, unit and method for testing image sensor packages |
US12/127,665 US7714310B2 (en) | 2005-12-12 | 2008-05-27 | Apparatus, unit and method for testing image sensor packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050121803A KR100769860B1 (ko) | 2005-12-12 | 2005-12-12 | 이미지센서 패키지 검사 장치 및 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100769860B1 true KR100769860B1 (ko) | 2007-10-24 |
Family
ID=38165578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050121803A KR100769860B1 (ko) | 2005-12-12 | 2005-12-12 | 이미지센서 패키지 검사 장치 및 방법 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100769860B1 (zh) |
CN (1) | CN100582794C (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100939302B1 (ko) | 2008-03-04 | 2010-01-28 | 코아셈(주) | 이미지센서 패키지 검사 유닛 및 이를 구비하는 이미지센서패키지 검사 장치 |
KR101437096B1 (ko) | 2008-03-20 | 2014-09-02 | 세메스 주식회사 | 반도체 모듈 정렬 방법 및 장치 |
KR101474652B1 (ko) * | 2013-07-11 | 2014-12-17 | 삼성전기주식회사 | 카메라모듈 검사장치 |
KR101477658B1 (ko) * | 2013-07-24 | 2015-01-05 | 조영진 | 모바일 기기용 카메라 렌즈모듈 검사장치 |
KR101625491B1 (ko) * | 2014-07-03 | 2016-05-31 | 황영수 | 손 떨림 보정 시험용 동축 멀티 포트 가진기 및 이를 가진 시험 장치 |
WO2017217771A1 (ko) * | 2016-06-14 | 2017-12-21 | (주)제이티 | 무선이동모듈, 그가 설치된 소자핸들러 |
Families Citing this family (9)
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---|---|---|---|---|
CN101360254B (zh) * | 2007-07-30 | 2010-06-16 | 比亚迪股份有限公司 | 用于cmos图像传感器电性能的测试系统 |
KR100924115B1 (ko) * | 2009-07-15 | 2009-10-29 | 김대봉 | 카메라 모듈 검사 장치 및 방법 |
TWI572873B (zh) * | 2012-12-07 | 2017-03-01 | 鴻海精密工業股份有限公司 | 測試用連接器 |
CN105588439B (zh) * | 2014-10-20 | 2018-03-09 | 宝山钢铁股份有限公司 | 烧结机台车篦条检测方法 |
KR20160137865A (ko) * | 2015-05-22 | 2016-12-01 | 주식회사 탑 엔지니어링 | 카메라 모듈의 메모리 검사 장치 |
CN106298569B (zh) * | 2016-07-28 | 2019-03-22 | 深圳芯启航科技有限公司 | 一种图像芯片的量产测试方法及装置 |
KR102461013B1 (ko) * | 2016-10-13 | 2022-11-01 | (주)테크윙 | 전자부품 테스트용 핸들러 및 그 티칭점 조정 방법 |
US10944379B2 (en) * | 2016-12-14 | 2021-03-09 | Qualcomm Incorporated | Hybrid passive-on-glass (POG) acoustic filter |
TWI663412B (zh) * | 2018-08-17 | 2019-06-21 | 皓琪科技股份有限公司 | 協助陣列排版之電路板辨識且記錄缺陷位置的系統 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5865319A (en) * | 1994-12-28 | 1999-02-02 | Advantest Corp. | Automatic test handler system for IC tester |
US6765396B2 (en) * | 2002-04-04 | 2004-07-20 | Freescale Semiconductor, Inc. | Method, apparatus and software for testing a device including both electrical and optical portions |
KR20040107881A (ko) * | 2003-06-14 | 2004-12-23 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 안착장치 |
KR20050063359A (ko) * | 2003-12-22 | 2005-06-28 | 한미반도체 주식회사 | 반도체 패키지 이송 메카니즘 및 이송방법 |
KR20050085408A (ko) * | 2002-12-06 | 2005-08-29 | 인터 액션 코포레이션 | 고체 촬상소자의 시험장치 |
KR20050101819A (ko) * | 2004-04-20 | 2005-10-25 | 미래산업 주식회사 | 콤팩트 카메라 모듈용 핸들러 및 그의 작동방법 |
KR20050101820A (ko) * | 2004-04-20 | 2005-10-25 | 미래산업 주식회사 | 콤팩트 카메라 모듈용 핸들러의 접속장치 |
-
2005
- 2005-12-12 KR KR1020050121803A patent/KR100769860B1/ko active IP Right Grant
-
2006
- 2006-07-07 CN CN200610098477A patent/CN100582794C/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5865319A (en) * | 1994-12-28 | 1999-02-02 | Advantest Corp. | Automatic test handler system for IC tester |
US6765396B2 (en) * | 2002-04-04 | 2004-07-20 | Freescale Semiconductor, Inc. | Method, apparatus and software for testing a device including both electrical and optical portions |
KR20050085408A (ko) * | 2002-12-06 | 2005-08-29 | 인터 액션 코포레이션 | 고체 촬상소자의 시험장치 |
KR20040107881A (ko) * | 2003-06-14 | 2004-12-23 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 안착장치 |
KR20050063359A (ko) * | 2003-12-22 | 2005-06-28 | 한미반도체 주식회사 | 반도체 패키지 이송 메카니즘 및 이송방법 |
KR20050101819A (ko) * | 2004-04-20 | 2005-10-25 | 미래산업 주식회사 | 콤팩트 카메라 모듈용 핸들러 및 그의 작동방법 |
KR20050101820A (ko) * | 2004-04-20 | 2005-10-25 | 미래산업 주식회사 | 콤팩트 카메라 모듈용 핸들러의 접속장치 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100939302B1 (ko) | 2008-03-04 | 2010-01-28 | 코아셈(주) | 이미지센서 패키지 검사 유닛 및 이를 구비하는 이미지센서패키지 검사 장치 |
KR101437096B1 (ko) | 2008-03-20 | 2014-09-02 | 세메스 주식회사 | 반도체 모듈 정렬 방법 및 장치 |
KR101474652B1 (ko) * | 2013-07-11 | 2014-12-17 | 삼성전기주식회사 | 카메라모듈 검사장치 |
KR101477658B1 (ko) * | 2013-07-24 | 2015-01-05 | 조영진 | 모바일 기기용 카메라 렌즈모듈 검사장치 |
KR101625491B1 (ko) * | 2014-07-03 | 2016-05-31 | 황영수 | 손 떨림 보정 시험용 동축 멀티 포트 가진기 및 이를 가진 시험 장치 |
WO2017217771A1 (ko) * | 2016-06-14 | 2017-12-21 | (주)제이티 | 무선이동모듈, 그가 설치된 소자핸들러 |
Also Published As
Publication number | Publication date |
---|---|
CN100582794C (zh) | 2010-01-20 |
CN1982904A (zh) | 2007-06-20 |
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