KR100765376B1 - 와이어 본딩 방법 - Google Patents

와이어 본딩 방법 Download PDF

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Publication number
KR100765376B1
KR100765376B1 KR1020050121554A KR20050121554A KR100765376B1 KR 100765376 B1 KR100765376 B1 KR 100765376B1 KR 1020050121554 A KR1020050121554 A KR 1020050121554A KR 20050121554 A KR20050121554 A KR 20050121554A KR 100765376 B1 KR100765376 B1 KR 100765376B1
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South Korea
Prior art keywords
bonding
wire
capillary
bump
wiring
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Expired - Fee Related
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KR1020050121554A
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English (en)
Korean (ko)
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KR20060090567A (ko
Inventor
다츠나리 미이
도시히코 도야마
신스케 데이
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가부시키가이샤 신가와
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1020050121554A 2005-02-08 2005-12-12 와이어 본딩 방법 Expired - Fee Related KR100765376B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005031701A JP4298665B2 (ja) 2005-02-08 2005-02-08 ワイヤボンディング方法
JPJP-P-2005-00031701 2005-02-08

Publications (2)

Publication Number Publication Date
KR20060090567A KR20060090567A (ko) 2006-08-14
KR100765376B1 true KR100765376B1 (ko) 2007-10-10

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