KR100740920B1 - 피복도전성입자 , 도전성 재료, 이방성도전접착제 및이방성도전접합 구조 - Google Patents

피복도전성입자 , 도전성 재료, 이방성도전접착제 및이방성도전접합 구조 Download PDF

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KR100740920B1
KR100740920B1 KR1020057009806A KR20057009806A KR100740920B1 KR 100740920 B1 KR100740920 B1 KR 100740920B1 KR 1020057009806 A KR1020057009806 A KR 1020057009806A KR 20057009806 A KR20057009806 A KR 20057009806A KR 100740920 B1 KR100740920 B1 KR 100740920B1
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South Korea
Prior art keywords
particle
particles
conductive
coated
coating layer
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KR1020057009806A
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English (en)
Korean (ko)
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KR20060040572A (ko
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야수히로 하세가와
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나토코 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
KR1020057009806A 2003-07-04 2004-07-02 피복도전성입자 , 도전성 재료, 이방성도전접착제 및이방성도전접합 구조 KR100740920B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003191704 2003-07-04
JPJP-P-2003-00191704 2003-07-04

Publications (2)

Publication Number Publication Date
KR20060040572A KR20060040572A (ko) 2006-05-10
KR100740920B1 true KR100740920B1 (ko) 2007-07-20

Family

ID=33562373

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057009806A KR100740920B1 (ko) 2003-07-04 2004-07-02 피복도전성입자 , 도전성 재료, 이방성도전접착제 및이방성도전접합 구조

Country Status (5)

Country Link
JP (1) JP4412669B2 (ja)
KR (1) KR100740920B1 (ja)
CN (1) CN1332400C (ja)
TW (1) TWI276117B (ja)
WO (1) WO2005004171A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4674119B2 (ja) * 2005-06-06 2011-04-20 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物
KR101100507B1 (ko) * 2007-05-09 2011-12-29 히다치 가세고교 가부시끼가이샤 필름상 회로 접속 재료 및 회로 부재의 접속 구조
WO2009078469A1 (ja) * 2007-12-18 2009-06-25 Hitachi Chemical Company, Ltd. 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法
JP5549069B2 (ja) * 2008-04-22 2014-07-16 日立化成株式会社 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤
JP2012003917A (ja) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP5619675B2 (ja) * 2010-08-16 2014-11-05 株式会社日本触媒 導電性微粒子および異方性導電材料
JP5576231B2 (ja) * 2010-09-30 2014-08-20 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
CN102136313B (zh) * 2010-12-06 2013-07-24 苏州纳微生物科技有限公司 一种复合微球及各向异性导电材料和各向异性导电膜与导电结构
WO2013125517A1 (ja) * 2012-02-21 2013-08-29 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
TWI570208B (zh) * 2012-09-07 2017-02-11 日立化成股份有限公司 電路連接材料及連接體
CN104471650A (zh) * 2012-10-02 2015-03-25 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
KR20170090353A (ko) * 2014-11-20 2017-08-07 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체
WO2016133113A1 (ja) * 2015-02-19 2016-08-25 積水化学工業株式会社 導電ペースト及び接続構造体
WO2018151139A1 (ja) * 2017-02-17 2018-08-23 日立化成株式会社 接着剤フィルム
CN108928056B (zh) * 2018-08-01 2020-06-05 京东方科技集团股份有限公司 膜材及其制备方法、显示基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002035555A1 (fr) * 2000-10-23 2002-05-02 Sekisui Chemical Co., Ltd. Particule enrobee
JP2003157717A (ja) * 2001-11-20 2003-05-30 C Uyemura & Co Ltd 導電性粒子及び導電接続部材並びに導電接続方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002035555A1 (fr) * 2000-10-23 2002-05-02 Sekisui Chemical Co., Ltd. Particule enrobee
KR20030051732A (ko) * 2000-10-23 2003-06-25 세키스이가가쿠 고교가부시키가이샤 피복 입자
EP1335389A1 (en) 2000-10-23 2003-08-13 Sekisui Chemical Co., Ltd. Coated particle
JP2003157717A (ja) * 2001-11-20 2003-05-30 C Uyemura & Co Ltd 導電性粒子及び導電接続部材並びに導電接続方法

Also Published As

Publication number Publication date
TWI276117B (en) 2007-03-11
JP4412669B2 (ja) 2010-02-10
KR20060040572A (ko) 2006-05-10
WO2005004171A1 (ja) 2005-01-13
CN1332400C (zh) 2007-08-15
CN1706008A (zh) 2005-12-07
TW200511328A (en) 2005-03-16
JPWO2005004171A1 (ja) 2006-08-17

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