KR100740444B1 - 발광 사이리스터 매트릭스 어레이 및 그 구동 회로 - Google Patents

발광 사이리스터 매트릭스 어레이 및 그 구동 회로 Download PDF

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Publication number
KR100740444B1
KR100740444B1 KR1020017012311A KR20017012311A KR100740444B1 KR 100740444 B1 KR100740444 B1 KR 100740444B1 KR 1020017012311 A KR1020017012311 A KR 1020017012311A KR 20017012311 A KR20017012311 A KR 20017012311A KR 100740444 B1 KR100740444 B1 KR 100740444B1
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South Korea
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light emitting
terminal
gate
matrix array
chip
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KR1020017012311A
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Korean (ko)
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KR20020004984A (ko
Inventor
오노세이지
쿠스다유키히사
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후지제롯쿠스 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Facsimile Heads (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
KR1020017012311A 2000-01-31 2001-01-31 발광 사이리스터 매트릭스 어레이 및 그 구동 회로 Expired - Lifetime KR100740444B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00021458 2000-01-31
JP2000021458A JP4345173B2 (ja) 2000-01-31 2000-01-31 発光サイリスタアレイの駆動回路

Publications (2)

Publication Number Publication Date
KR20020004984A KR20020004984A (ko) 2002-01-16
KR100740444B1 true KR100740444B1 (ko) 2007-07-19

Family

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KR1020017012311A Expired - Lifetime KR100740444B1 (ko) 2000-01-31 2001-01-31 발광 사이리스터 매트릭스 어레이 및 그 구동 회로

Country Status (8)

Country Link
US (1) US6717183B2 (enExample)
EP (1) EP1168462A1 (enExample)
JP (1) JP4345173B2 (enExample)
KR (1) KR100740444B1 (enExample)
CN (1) CN1196206C (enExample)
CA (1) CA2368988A1 (enExample)
TW (1) TW476167B (enExample)
WO (1) WO2001057935A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153168B2 (en) * 2002-07-09 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Method for deciding duty factor in driving light-emitting device and driving method using the duty factor
JP3901151B2 (ja) * 2003-12-25 2007-04-04 セイコーエプソン株式会社 ドライバｉｃ並びにドライバｉｃ及び出力装置の検査方法
JP4607696B2 (ja) * 2005-07-28 2011-01-05 京セラ株式会社 発光装置および画像記録装置
JP5225592B2 (ja) * 2006-02-20 2013-07-03 京セラ株式会社 発光素子アレイ、発光装置および画像形成装置
JP4885760B2 (ja) * 2006-02-20 2012-02-29 京セラ株式会社 発光素子アレイ、発光装置および画像形成装置
WO2007097347A1 (ja) 2006-02-20 2007-08-30 Kyocera Corporation 発光素子アレイ、発光装置および画像形成装置
JP5343311B2 (ja) * 2006-10-24 2013-11-13 富士ゼロックス株式会社 露光装置および画像形成装置
JP4758921B2 (ja) * 2007-01-29 2011-08-31 株式会社日立製作所 線状光源装置、及びバックライト装置
JP5086345B2 (ja) * 2007-06-25 2012-11-28 京セラ株式会社 発光素子アレイ、発光装置および画像形成装置
JP4682231B2 (ja) 2008-08-01 2011-05-11 株式会社沖データ 光プリントヘッドおよび画像形成装置
JP5366511B2 (ja) * 2008-11-14 2013-12-11 株式会社沖データ 駆動回路、光プリントヘッド及び画像形成装置
JP5428591B2 (ja) * 2009-01-28 2014-02-26 富士ゼロックス株式会社 Ｌｅｄ基板装置、ｌｅｄプリントヘッドおよび画像形成装置
JP4871978B2 (ja) * 2009-07-10 2012-02-08 株式会社沖データ 半導体装置、及び光プリントヘッド
JP5582771B2 (ja) 2009-12-04 2014-09-03 株式会社沖データ 駆動装置及び画像形成装置
KR102139681B1 (ko) 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
JP2020120018A (ja) * 2019-01-25 2020-08-06 富士ゼロックス株式会社 発光装置、光学装置、光計測装置及び画像形成装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194978A (ja) * 1989-12-22 1991-08-26 Nippon Sheet Glass Co Ltd 発光素子アレイ
JPH09150543A (ja) * 1995-11-29 1997-06-10 Canon Inc 画像形成装置
JPH09216416A (ja) * 1996-05-31 1997-08-19 Nippon Sheet Glass Co Ltd 自己走査形発光素子アレイおよびその駆動方法
JPH09283792A (ja) * 1996-04-12 1997-10-31 Nippon Sheet Glass Co Ltd 面発光サイリスタおよび自己走査型発光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4394653A (en) * 1980-11-24 1983-07-19 General Instrument Corporation Bi-directional drive multiplexed display system
US5324958A (en) * 1991-02-19 1994-06-28 Synaptics, Incorporated Integrating imaging systgem having wide dynamic range with sample/hold circuits
JP3194978B2 (ja) 1991-05-07 2001-08-06 株式会社ユーシン コントロールノブの照明装置
EP0884781A3 (en) * 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03194978A (ja) * 1989-12-22 1991-08-26 Nippon Sheet Glass Co Ltd 発光素子アレイ
JP2807910B2 (ja) * 1989-12-22 1998-10-08 日本板硝子株式会社 発光素子アレイ
JPH09150543A (ja) * 1995-11-29 1997-06-10 Canon Inc 画像形成装置
JPH09283792A (ja) * 1996-04-12 1997-10-31 Nippon Sheet Glass Co Ltd 面発光サイリスタおよび自己走査型発光装置
JPH09216416A (ja) * 1996-05-31 1997-08-19 Nippon Sheet Glass Co Ltd 自己走査形発光素子アレイおよびその駆動方法

Also Published As

Publication number Publication date
CN1419714A (zh) 2003-05-21
CA2368988A1 (en) 2001-08-09
US20030071274A1 (en) 2003-04-17
KR20020004984A (ko) 2002-01-16
TW476167B (en) 2002-02-11
WO2001057935A1 (fr) 2001-08-09
US6717183B2 (en) 2004-04-06
CN1196206C (zh) 2005-04-06
EP1168462A1 (en) 2002-01-02
JP4345173B2 (ja) 2009-10-14
JP2001217460A (ja) 2001-08-10

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