KR100731219B1 - 다층 세라믹 축전기용 말단 전극 조성물 - Google Patents

다층 세라믹 축전기용 말단 전극 조성물 Download PDF

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Publication number
KR100731219B1
KR100731219B1 KR1020040004388A KR20040004388A KR100731219B1 KR 100731219 B1 KR100731219 B1 KR 100731219B1 KR 1020040004388 A KR1020040004388 A KR 1020040004388A KR 20040004388 A KR20040004388 A KR 20040004388A KR 100731219 B1 KR100731219 B1 KR 100731219B1
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KR
South Korea
Prior art keywords
terminal electrode
composition
multilayer ceramic
ceramic capacitors
powder
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Expired - Fee Related
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KR1020040004388A
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English (en)
Korean (ko)
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KR20040068495A (ko
Inventor
히사시 마쯔노
히로유끼 소시
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20040068495A publication Critical patent/KR20040068495A/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020040004388A 2003-01-24 2004-01-20 다층 세라믹 축전기용 말단 전극 조성물 Expired - Fee Related KR100731219B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44220003P 2003-01-24 2003-01-24
US60/442,200 2003-01-24
US10/670,669 2003-09-25
US10/670,669 US7083744B2 (en) 2003-01-24 2003-09-25 Terminal electrode compositions for multilayer ceramic capacitors

Publications (2)

Publication Number Publication Date
KR20040068495A KR20040068495A (ko) 2004-07-31
KR100731219B1 true KR100731219B1 (ko) 2007-06-22

Family

ID=32659502

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040004388A Expired - Fee Related KR100731219B1 (ko) 2003-01-24 2004-01-20 다층 세라믹 축전기용 말단 전극 조성물

Country Status (7)

Country Link
US (1) US7083744B2 (enExample)
EP (1) EP1443531B1 (enExample)
JP (1) JP2004228094A (enExample)
KR (1) KR100731219B1 (enExample)
CN (1) CN100419918C (enExample)
DE (1) DE602004005252T2 (enExample)
TW (1) TW200417531A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6982864B1 (en) * 2004-06-09 2006-01-03 Ferro Corporation Copper termination inks containing lead free and cadmium free glasses for capacitors
JP2007194122A (ja) * 2006-01-20 2007-08-02 Sumitomo Electric Ind Ltd 導電性ペーストおよびそれを用いた配線基板
KR101730184B1 (ko) * 2010-11-08 2017-05-12 삼성전기주식회사 도전성 페이스트 조성물 및 이를 이용한 적층 세라믹 콘덴서의 제조방법
KR20130005518A (ko) * 2011-07-06 2013-01-16 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR102029468B1 (ko) * 2012-01-18 2019-10-07 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR102004792B1 (ko) 2014-06-24 2019-07-29 삼성전기주식회사 적층 전자부품 및 내부전극용 도전성 페이스트 조성물
US10636541B2 (en) * 2015-10-01 2020-04-28 Shoei Chemical Inc. Conductive paste and method for forming terminal electrodes of multilayer ceramic component
CN106024101B (zh) * 2016-08-05 2017-08-01 洛阳布鲁姆电子科技有限公司 一种复合导电陶瓷浆料及其制备方法
JP6933461B2 (ja) * 2016-12-21 2021-09-08 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7145652B2 (ja) * 2018-06-01 2022-10-03 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7446705B2 (ja) 2018-06-12 2024-03-11 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
CN109346322A (zh) * 2018-10-17 2019-02-15 成都宏明电子科大新材料有限公司 一种脉冲功率陶瓷电容器、端电极及制备方法
US12381017B2 (en) * 2021-07-21 2025-08-05 Kyocera Corporation Conductive paste for electrode formation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5645765A (en) * 1996-05-09 1997-07-08 Shoei Chemical Inc. Lead-free conductive paste

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516949A (en) * 1966-10-10 1970-06-23 Du Pont Copper/vanadium oxide compositions
US3922387A (en) * 1973-08-28 1975-11-25 Du Pont Metallizations comprising nickel oxide
JPS59184511A (ja) * 1983-04-04 1984-10-19 株式会社村田製作所 セラミツク積層コンデンサ
EP0132810A1 (en) 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
US4540604A (en) * 1983-08-25 1985-09-10 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS6222868A (ja) * 1985-07-22 1987-01-31 Copal Co Ltd 導伝性組成物
US4894273A (en) * 1987-05-22 1990-01-16 Ceramics Process Systems Corp. Bonding additives for refractory metallization inks
US4880567A (en) * 1987-08-20 1989-11-14 General Electric Company Thick film copper conductor inks
JP2788510B2 (ja) * 1989-10-27 1998-08-20 第一工業製薬株式会社 銅ペースト組成物
CN1051862C (zh) * 1991-04-20 2000-04-26 旭化成工业株式会社 高温烧结用糊剂及其应用
US5429670A (en) * 1993-04-26 1995-07-04 Matsushita Electric Industrial Co., Ltd. Gold paste for a ceramic circuit board
JP3015621B2 (ja) * 1993-05-10 2000-03-06 松下電器産業株式会社 導体ペ−スト組成物
JPH08180731A (ja) * 1994-12-26 1996-07-12 Murata Mfg Co Ltd 導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
JP2002012445A (ja) 2000-01-18 2002-01-15 Central Glass Co Ltd 低融点ガラス
JP2001307549A (ja) 2000-04-21 2001-11-02 Furuya Kinzoku:Kk 銀ペースト及びその製造方法
JP3861648B2 (ja) * 2001-10-10 2006-12-20 住友金属鉱山株式会社 銅導体ペースト組成物、その製造方法及びそれを用いてなる電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5645765A (en) * 1996-05-09 1997-07-08 Shoei Chemical Inc. Lead-free conductive paste

Also Published As

Publication number Publication date
CN1518008A (zh) 2004-08-04
DE602004005252T2 (de) 2008-04-03
US7083744B2 (en) 2006-08-01
EP1443531A1 (en) 2004-08-04
EP1443531B1 (en) 2007-03-14
KR20040068495A (ko) 2004-07-31
CN100419918C (zh) 2008-09-17
US20040144205A1 (en) 2004-07-29
DE602004005252D1 (de) 2007-04-26
JP2004228094A (ja) 2004-08-12
TW200417531A (en) 2004-09-16

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