DE602004005252D1 - Zusammensetzungen für Anschlusselektroden von keramischen Vielschichtkondensatoren - Google Patents

Zusammensetzungen für Anschlusselektroden von keramischen Vielschichtkondensatoren

Info

Publication number
DE602004005252D1
DE602004005252D1 DE602004005252T DE602004005252T DE602004005252D1 DE 602004005252 D1 DE602004005252 D1 DE 602004005252D1 DE 602004005252 T DE602004005252 T DE 602004005252T DE 602004005252 T DE602004005252 T DE 602004005252T DE 602004005252 D1 DE602004005252 D1 DE 602004005252D1
Authority
DE
Germany
Prior art keywords
compositions
connection electrodes
ceramic multilayer
multilayer capacitors
capacitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004005252T
Other languages
English (en)
Other versions
DE602004005252T2 (de
Inventor
Hisashi Matsuno
Hiroyuki Soshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE602004005252D1 publication Critical patent/DE602004005252D1/de
Application granted granted Critical
Publication of DE602004005252T2 publication Critical patent/DE602004005252T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE602004005252T 2003-01-24 2004-01-19 Zusammensetzungen für Anschlusselektroden von keramischen Vielschichtkondensatoren Expired - Lifetime DE602004005252T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44220003P 2003-01-24 2003-01-24
US442200P 2003-01-24
US670669 2003-09-25
US10/670,669 US7083744B2 (en) 2003-01-24 2003-09-25 Terminal electrode compositions for multilayer ceramic capacitors

Publications (2)

Publication Number Publication Date
DE602004005252D1 true DE602004005252D1 (de) 2007-04-26
DE602004005252T2 DE602004005252T2 (de) 2008-04-03

Family

ID=32659502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004005252T Expired - Lifetime DE602004005252T2 (de) 2003-01-24 2004-01-19 Zusammensetzungen für Anschlusselektroden von keramischen Vielschichtkondensatoren

Country Status (7)

Country Link
US (1) US7083744B2 (de)
EP (1) EP1443531B1 (de)
JP (1) JP2004228094A (de)
KR (1) KR100731219B1 (de)
CN (1) CN100419918C (de)
DE (1) DE602004005252T2 (de)
TW (1) TW200417531A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6982864B1 (en) * 2004-06-09 2006-01-03 Ferro Corporation Copper termination inks containing lead free and cadmium free glasses for capacitors
JP2007194122A (ja) * 2006-01-20 2007-08-02 Sumitomo Electric Ind Ltd 導電性ペーストおよびそれを用いた配線基板
KR101730184B1 (ko) * 2010-11-08 2017-05-12 삼성전기주식회사 도전성 페이스트 조성물 및 이를 이용한 적층 세라믹 콘덴서의 제조방법
KR20130005518A (ko) * 2011-07-06 2013-01-16 삼성전기주식회사 내부전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자부품
KR102029468B1 (ko) * 2012-01-18 2019-10-07 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR102004792B1 (ko) * 2014-06-24 2019-07-29 삼성전기주식회사 적층 전자부품 및 내부전극용 도전성 페이스트 조성물
JP6354970B2 (ja) * 2015-10-01 2018-07-11 昭栄化学工業株式会社 導電性ペースト及び積層セラミック部品の端子電極形成方法
CN106024101B (zh) * 2016-08-05 2017-08-01 洛阳布鲁姆电子科技有限公司 一种复合导电陶瓷浆料及其制备方法
JP6933461B2 (ja) * 2016-12-21 2021-09-08 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7145652B2 (ja) * 2018-06-01 2022-10-03 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7446705B2 (ja) 2018-06-12 2024-03-11 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
CN109346322A (zh) * 2018-10-17 2019-02-15 成都宏明电子科大新材料有限公司 一种脉冲功率陶瓷电容器、端电极及制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516949A (en) 1966-10-10 1970-06-23 Du Pont Copper/vanadium oxide compositions
US3922387A (en) 1973-08-28 1975-11-25 Du Pont Metallizations comprising nickel oxide
JPS59184511A (ja) 1983-04-04 1984-10-19 株式会社村田製作所 セラミツク積層コンデンサ
EP0132810A1 (de) 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilikatglaszusammensetzung
US4540604A (en) * 1983-08-25 1985-09-10 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS6222868A (ja) * 1985-07-22 1987-01-31 Copal Co Ltd 導伝性組成物
US4894273A (en) * 1987-05-22 1990-01-16 Ceramics Process Systems Corp. Bonding additives for refractory metallization inks
US4880567A (en) 1987-08-20 1989-11-14 General Electric Company Thick film copper conductor inks
JP2788510B2 (ja) * 1989-10-27 1998-08-20 第一工業製薬株式会社 銅ペースト組成物
CN1051862C (zh) * 1991-04-20 2000-04-26 旭化成工业株式会社 高温烧结用糊剂及其应用
US5429670A (en) * 1993-04-26 1995-07-04 Matsushita Electric Industrial Co., Ltd. Gold paste for a ceramic circuit board
JP3015621B2 (ja) 1993-05-10 2000-03-06 松下電器産業株式会社 導体ペ−スト組成物
JPH08180731A (ja) 1994-12-26 1996-07-12 Murata Mfg Co Ltd 導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
JP3209089B2 (ja) * 1996-05-09 2001-09-17 昭栄化学工業株式会社 導電性ペースト
JP2002012445A (ja) 2000-01-18 2002-01-15 Central Glass Co Ltd 低融点ガラス
JP2001307549A (ja) 2000-04-21 2001-11-02 Furuya Kinzoku:Kk 銀ペースト及びその製造方法
JP3861648B2 (ja) * 2001-10-10 2006-12-20 住友金属鉱山株式会社 銅導体ペースト組成物、その製造方法及びそれを用いてなる電子部品

Also Published As

Publication number Publication date
TW200417531A (en) 2004-09-16
KR100731219B1 (ko) 2007-06-22
US7083744B2 (en) 2006-08-01
EP1443531B1 (de) 2007-03-14
JP2004228094A (ja) 2004-08-12
US20040144205A1 (en) 2004-07-29
CN100419918C (zh) 2008-09-17
DE602004005252T2 (de) 2008-04-03
KR20040068495A (ko) 2004-07-31
CN1518008A (zh) 2004-08-04
EP1443531A1 (de) 2004-08-04

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted