KR100724256B1 - 스퍼터링 타겟트 및 그 제조 방법 - Google Patents

스퍼터링 타겟트 및 그 제조 방법 Download PDF

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Publication number
KR100724256B1
KR100724256B1 KR1020057016191A KR20057016191A KR100724256B1 KR 100724256 B1 KR100724256 B1 KR 100724256B1 KR 1020057016191 A KR1020057016191 A KR 1020057016191A KR 20057016191 A KR20057016191 A KR 20057016191A KR 100724256 B1 KR100724256 B1 KR 100724256B1
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South Korea
Prior art keywords
target
sputtering target
sintering
sputtering
temperature
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Expired - Fee Related
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English (en)
Korean (ko)
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KR20050106475A (ko
Inventor
히데오 호소노
카즈시게 우에다
마사타카 야하기
히데오 타카미
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닛코킨조쿠 가부시키가이샤
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Assigned to 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 reassignment 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 권리의 전부이전등록 Assignors: 닛코킨조쿠 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C04B35/645—Pressure sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/547—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on sulfides or selenides or tellurides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3227—Lanthanum oxide or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/446—Sulfides, tellurides or selenides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5409—Particle size related information expressed by specific surface values
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/72—Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/77—Density
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/786—Micrometer sized grains, i.e. from 1 to 100 micron
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Physical Vapour Deposition (AREA)
KR1020057016191A 2003-03-04 2004-02-03 스퍼터링 타겟트 및 그 제조 방법 Expired - Fee Related KR100724256B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00056811 2003-03-04
JP2003056811 2003-03-04

Related Child Applications (1)

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KR1020077007922A Division KR100762081B1 (ko) 2003-03-04 2004-02-03 스퍼터링 타겟트 및 그 제조 방법

Publications (2)

Publication Number Publication Date
KR20050106475A KR20050106475A (ko) 2005-11-09
KR100724256B1 true KR100724256B1 (ko) 2007-05-31

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KR1020057016191A Expired - Fee Related KR100724256B1 (ko) 2003-03-04 2004-02-03 스퍼터링 타겟트 및 그 제조 방법
KR1020077007922A Expired - Fee Related KR100762081B1 (ko) 2003-03-04 2004-02-03 스퍼터링 타겟트 및 그 제조 방법

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Country Status (7)

Country Link
US (1) US7344660B2 (https=)
EP (1) EP1600526B1 (https=)
JP (2) JP4417908B2 (https=)
KR (2) KR100724256B1 (https=)
DE (1) DE602004026281D1 (https=)
TW (1) TWI254748B (https=)
WO (1) WO2004079036A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3978541B2 (ja) * 2002-09-25 2007-09-19 現代自動車株式会社 エンジンのシリンダヘッドカバー及びその組立方法
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8790499B2 (en) * 2005-11-25 2014-07-29 Applied Materials, Inc. Process kit components for titanium sputtering chamber
EP2048262B1 (en) * 2006-07-27 2018-09-12 JX Nippon Mining & Metals Corporation Lithium-containing transition metal oxide target, process for producing the same and method for producing lithium ion thin-film secondary battery
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
JP4954816B2 (ja) * 2007-07-18 2012-06-20 山陽特殊製鋼株式会社 Ｎｉ−Ｗ系中間層用スパッタリングターゲット材の製造方法
KR101175091B1 (ko) * 2007-09-13 2012-08-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 소결체의 제조 방법, 소결체, 당해 소결체로 이루어지는 스퍼터링 타겟 및 스퍼터링 타겟-백킹 플레이트 조립체
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
US20090107834A1 (en) * 2007-10-29 2009-04-30 Applied Materials, Inc. Chalcogenide target and method
KR101021848B1 (ko) 2007-11-13 2011-03-17 한양대학교 산학협력단 ＺｎＳ계 스퍼터링 타겟의 제조방법 및 이로써 얻어진ＺｎＳ계 스퍼터링 타겟
WO2009084318A1 (ja) * 2007-12-28 2009-07-09 Nippon Mining & Metals Co., Ltd. 高純度ランタン、高純度ランタンからなるスパッタリングターゲット及び高純度ランタンを主成分とするメタルゲート膜
EP2270252B1 (en) * 2008-03-17 2016-06-22 JX Nippon Mining & Metals Corporation Sintered target and method for production of sintered material
WO2010004862A1 (ja) * 2008-07-07 2010-01-14 日鉱金属株式会社 酸化物焼結体、同焼結体からなるスパッタリングターゲット、同焼結体の製造方法及び同焼結体スパッタリングターゲットゲートの製造方法
KR101222789B1 (ko) 2008-07-07 2013-01-15 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 산화란탄기 소결체, 동 소결체로 이루어지는 스퍼터링 타겟, 산화란탄기 소결체의 제조 방법 및 동 제조 방법에 의한 스퍼터링 타겟의 제조 방법
KR20120023022A (ko) 2009-05-27 2012-03-12 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 소결체 타겟 및 소결체의 제조 방법
CA2825301C (en) 2011-01-21 2015-05-12 Jx Nippon Mining & Metals Corporation Method for producing high-purity lanthanum, high-purity lanthanum, sputtering target formed from high-purity lanthanum, and metal gate film having high-purity lanthanum as main component
WO2014066883A1 (en) * 2012-10-26 2014-05-01 The Florida State University Research Foundation, Inc. An article comprising a semiconducting material

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127670A (ja) * 1984-11-22 1986-06-14 日立金属株式会社 焼結体の製造方法
JP3721014B2 (ja) 1999-09-28 2005-11-30 株式会社日鉱マテリアルズ スッパタリング用タングステンターゲットの製造方法
US6656260B2 (en) * 1999-12-28 2003-12-02 Kyocera Corporation ZnS-series sintered material and method for producing the same, target using the ZnS-series sintered material, thin film, and optical recording medium using the thin film
JP2001181045A (ja) * 1999-12-28 2001-07-03 Furuya Kinzoku:Kk 硫化亜鉛系焼結材料とその製造方法及びこれを用いたスパッタリングターゲット
JP2002080222A (ja) * 2000-06-19 2002-03-19 Rikogaku Shinkokai 半導体、並びに、これを用いる透明電極、発光体、蛍光体、透明半導体デバイス、光触媒、および非線形光学材料
DE10108553C2 (de) * 2001-02-22 2003-06-05 Siemens Ag Verfahren zur Herstellung einer Szintillatorkeramik und Verwendung der Szintillatorkeramik
JP4083486B2 (ja) * 2002-02-21 2008-04-30 独立行政法人科学技術振興機構 ＬｎＣｕＯ（Ｓ，Ｓｅ，Ｔｅ）単結晶薄膜の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Applied Physics Letters, vol.77, no.17, 2000.10.23., American Institute of Physics, 미국, K.Ueda, et al., Transparent p-type semiconductor: LaCuOS layered oxysulfide, pp.2701-2703

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Publication number Publication date
TW200422413A (en) 2004-11-01
DE602004026281D1 (https=) 2010-05-12
JPWO2004079036A1 (ja) 2006-06-08
JP4417908B2 (ja) 2010-02-17
KR20070042590A (ko) 2007-04-23
JP2009084696A (ja) 2009-04-23
EP1600526A1 (en) 2005-11-30
JP4754612B2 (ja) 2011-08-24
TWI254748B (en) 2006-05-11
KR100762081B1 (ko) 2007-10-01
US20060099126A1 (en) 2006-05-11
WO2004079036A1 (ja) 2004-09-16
US7344660B2 (en) 2008-03-18
EP1600526A4 (en) 2008-05-28
EP1600526B1 (en) 2010-03-31
KR20050106475A (ko) 2005-11-09

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