KR100722026B1 - 처리 챔버 및 처리 장치 - Google Patents

처리 챔버 및 처리 장치 Download PDF

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Publication number
KR100722026B1
KR100722026B1 KR1020060009413A KR20060009413A KR100722026B1 KR 100722026 B1 KR100722026 B1 KR 100722026B1 KR 1020060009413 A KR1020060009413 A KR 1020060009413A KR 20060009413 A KR20060009413 A KR 20060009413A KR 100722026 B1 KR100722026 B1 KR 100722026B1
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KR
South Korea
Prior art keywords
sidewalls
processing chamber
chamber
base
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020060009413A
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English (en)
Korean (ko)
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KR20060106636A (ko
Inventor
겐지 아마노
Original Assignee
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20060106636A publication Critical patent/KR20060106636A/ko
Application granted granted Critical
Publication of KR100722026B1 publication Critical patent/KR100722026B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Surface Treatment Of Glass (AREA)
  • Chemical Vapour Deposition (AREA)
  • Liquid Crystal (AREA)
KR1020060009413A 2005-03-31 2006-01-31 처리 챔버 및 처리 장치 Expired - Fee Related KR100722026B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00103654 2005-03-31
JP2005103654A JP4767574B2 (ja) 2005-03-31 2005-03-31 処理チャンバおよび処理装置

Publications (2)

Publication Number Publication Date
KR20060106636A KR20060106636A (ko) 2006-10-12
KR100722026B1 true KR100722026B1 (ko) 2007-05-25

Family

ID=37030593

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060009413A Expired - Fee Related KR100722026B1 (ko) 2005-03-31 2006-01-31 처리 챔버 및 처리 장치

Country Status (4)

Country Link
JP (1) JP4767574B2 (https=)
KR (1) KR100722026B1 (https=)
CN (1) CN100405535C (https=)
TW (1) TWI391724B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101059365B1 (ko) 2008-06-25 2011-08-24 도쿄엘렉트론가부시키가이샤 진공 처리 장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4791110B2 (ja) * 2005-09-02 2011-10-12 東京エレクトロン株式会社 真空チャンバおよび真空処理装置
TWI438829B (zh) * 2007-11-21 2014-05-21 Sfa Engineering Corp 用於化學氣相沈積設備的裝載室
KR100948860B1 (ko) * 2007-11-21 2010-03-22 주식회사 에스에프에이 화학 기상 증착 장치의 로드락 챔버
KR101309363B1 (ko) 2007-12-14 2013-09-17 가부시키가이샤 알박 챔버 및 성막 장치
KR20110067939A (ko) * 2009-12-15 2011-06-22 주식회사 테스 로드락 챔버
KR101308389B1 (ko) * 2011-03-14 2013-09-16 엘아이지에이디피 주식회사 기판처리장치의 챔버
JP6230021B2 (ja) * 2014-02-06 2017-11-15 ナビタス株式会社 熱転写装置
KR102914561B1 (ko) * 2021-10-19 2026-01-16 세메스 주식회사 반도체 장비용 수납 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06176895A (ja) * 1992-12-01 1994-06-24 Ishikawajima Harima Heavy Ind Co Ltd 粒子加速器の真空チェンバーおよびその製造方法
KR100564044B1 (ko) 2004-10-06 2006-03-29 주식회사 에이디피엔지니어링 진공처리장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161378A (ja) * 1985-01-07 1986-07-22 科学技術庁長官官房会計課長 大形ｆｒｐ製デユワ−
JP2743471B2 (ja) * 1989-05-19 1998-04-22 日本電気株式会社 ▲ｉｉｉ▼―ｖ族化合物半導体の気相成長装置
US5121531A (en) * 1990-07-06 1992-06-16 Applied Materials, Inc. Refractory susceptors for epitaxial deposition apparatus
JPH0819765A (ja) * 1994-07-07 1996-01-23 Kaijo Corp 超音波洗浄槽
SE9703420D0 (sv) * 1997-09-22 1997-09-22 Formcook Ab Cooking process
US6121581A (en) * 1999-07-09 2000-09-19 Applied Materials, Inc. Semiconductor processing system
JP2001029917A (ja) * 1999-07-22 2001-02-06 Jiro Sasaoka 有機廃物加熱再利用法と装置
JP4540796B2 (ja) * 2000-04-21 2010-09-08 東京エレクトロン株式会社 石英ウインドウ、リフレクタ及び熱処理装置
JP3300330B2 (ja) * 2000-08-28 2002-07-08 東京化工機株式会社 処理室の窓蓋
JP4174557B2 (ja) * 2002-10-17 2008-11-05 ゴールド工業株式会社 ウエハ等精密基板収容容器
JP4084293B2 (ja) * 2002-12-05 2008-04-30 株式会社アドヴァンスド・ディスプレイ・プロセス・エンジニアリング Ｆｐｄ製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06176895A (ja) * 1992-12-01 1994-06-24 Ishikawajima Harima Heavy Ind Co Ltd 粒子加速器の真空チェンバーおよびその製造方法
KR100564044B1 (ko) 2004-10-06 2006-03-29 주식회사 에이디피엔지니어링 진공처리장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101059365B1 (ko) 2008-06-25 2011-08-24 도쿄엘렉트론가부시키가이샤 진공 처리 장치

Also Published As

Publication number Publication date
KR20060106636A (ko) 2006-10-12
TW200634369A (en) 2006-10-01
JP2006283096A (ja) 2006-10-19
TWI391724B (zh) 2013-04-01
CN1841648A (zh) 2006-10-04
JP4767574B2 (ja) 2011-09-07
CN100405535C (zh) 2008-07-23

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