TWI391724B - Processing chamber and processing device - Google Patents

Processing chamber and processing device Download PDF

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Publication number
TWI391724B
TWI391724B TW094134347A TW94134347A TWI391724B TW I391724 B TWI391724 B TW I391724B TW 094134347 A TW094134347 A TW 094134347A TW 94134347 A TW94134347 A TW 94134347A TW I391724 B TWI391724 B TW I391724B
Authority
TW
Taiwan
Prior art keywords
side walls
processing chamber
thickness
chamber
processing
Prior art date
Application number
TW094134347A
Other languages
English (en)
Chinese (zh)
Other versions
TW200634369A (en
Inventor
天野健次
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW200634369A publication Critical patent/TW200634369A/zh
Application granted granted Critical
Publication of TWI391724B publication Critical patent/TWI391724B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Surface Treatment Of Glass (AREA)
  • Chemical Vapour Deposition (AREA)
  • Liquid Crystal (AREA)
TW094134347A 2005-03-31 2005-09-30 Processing chamber and processing device TWI391724B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005103654A JP4767574B2 (ja) 2005-03-31 2005-03-31 処理チャンバおよび処理装置

Publications (2)

Publication Number Publication Date
TW200634369A TW200634369A (en) 2006-10-01
TWI391724B true TWI391724B (zh) 2013-04-01

Family

ID=37030593

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134347A TWI391724B (zh) 2005-03-31 2005-09-30 Processing chamber and processing device

Country Status (4)

Country Link
JP (1) JP4767574B2 (https=)
KR (1) KR100722026B1 (https=)
CN (1) CN100405535C (https=)
TW (1) TWI391724B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4791110B2 (ja) * 2005-09-02 2011-10-12 東京エレクトロン株式会社 真空チャンバおよび真空処理装置
TWI438829B (zh) * 2007-11-21 2014-05-21 Sfa Engineering Corp 用於化學氣相沈積設備的裝載室
KR100948860B1 (ko) * 2007-11-21 2010-03-22 주식회사 에스에프에이 화학 기상 증착 장치의 로드락 챔버
KR101309363B1 (ko) 2007-12-14 2013-09-17 가부시키가이샤 알박 챔버 및 성막 장치
JP5062057B2 (ja) 2008-06-25 2012-10-31 東京エレクトロン株式会社 真空処理装置
KR20110067939A (ko) * 2009-12-15 2011-06-22 주식회사 테스 로드락 챔버
KR101308389B1 (ko) * 2011-03-14 2013-09-16 엘아이지에이디피 주식회사 기판처리장치의 챔버
JP6230021B2 (ja) * 2014-02-06 2017-11-15 ナビタス株式会社 熱転写装置
KR102914561B1 (ko) * 2021-10-19 2026-01-16 세메스 주식회사 반도체 장비용 수납 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0819765A (ja) * 1994-07-07 1996-01-23 Kaijo Corp 超音波洗浄槽
TW467765B (en) * 2000-08-28 2001-12-11 Tokyo Kakoki Co Ltd Cap of treating chamber
TW200415091A (en) * 2002-10-17 2004-08-16 Daihachikasei Kk Storage container for receiving precision substrates such as wafers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161378A (ja) * 1985-01-07 1986-07-22 科学技術庁長官官房会計課長 大形ｆｒｐ製デユワ−
JP2743471B2 (ja) * 1989-05-19 1998-04-22 日本電気株式会社 ▲ｉｉｉ▼―ｖ族化合物半導体の気相成長装置
US5121531A (en) * 1990-07-06 1992-06-16 Applied Materials, Inc. Refractory susceptors for epitaxial deposition apparatus
JPH06176895A (ja) * 1992-12-01 1994-06-24 Ishikawajima Harima Heavy Ind Co Ltd 粒子加速器の真空チェンバーおよびその製造方法
SE9703420D0 (sv) * 1997-09-22 1997-09-22 Formcook Ab Cooking process
US6121581A (en) * 1999-07-09 2000-09-19 Applied Materials, Inc. Semiconductor processing system
JP2001029917A (ja) * 1999-07-22 2001-02-06 Jiro Sasaoka 有機廃物加熱再利用法と装置
JP4540796B2 (ja) * 2000-04-21 2010-09-08 東京エレクトロン株式会社 石英ウインドウ、リフレクタ及び熱処理装置
JP4084293B2 (ja) * 2002-12-05 2008-04-30 株式会社アドヴァンスド・ディスプレイ・プロセス・エンジニアリング Ｆｐｄ製造装置
KR100564044B1 (ko) 2004-10-06 2006-03-29 주식회사 에이디피엔지니어링 진공처리장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0819765A (ja) * 1994-07-07 1996-01-23 Kaijo Corp 超音波洗浄槽
TW467765B (en) * 2000-08-28 2001-12-11 Tokyo Kakoki Co Ltd Cap of treating chamber
TW200415091A (en) * 2002-10-17 2004-08-16 Daihachikasei Kk Storage container for receiving precision substrates such as wafers

Also Published As

Publication number Publication date
KR20060106636A (ko) 2006-10-12
KR100722026B1 (ko) 2007-05-25
TW200634369A (en) 2006-10-01
JP2006283096A (ja) 2006-10-19
CN1841648A (zh) 2006-10-04
JP4767574B2 (ja) 2011-09-07
CN100405535C (zh) 2008-07-23

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MM4A Annulment or lapse of patent due to non-payment of fees