KR100714480B1 - 포토마스크의 테스트 패턴 이미지로부터 인쇄된 테스트피쳐들을 이용하는 포토리소그래피 공정에 있어서 초점변화를 측정하는 시스템 및 방법 - Google Patents
포토마스크의 테스트 패턴 이미지로부터 인쇄된 테스트피쳐들을 이용하는 포토리소그래피 공정에 있어서 초점변화를 측정하는 시스템 및 방법 Download PDFInfo
- Publication number
- KR100714480B1 KR100714480B1 KR1020060030741A KR20060030741A KR100714480B1 KR 100714480 B1 KR100714480 B1 KR 100714480B1 KR 1020060030741 A KR1020060030741 A KR 1020060030741A KR 20060030741 A KR20060030741 A KR 20060030741A KR 100714480 B1 KR100714480 B1 KR 100714480B1
- Authority
- KR
- South Korea
- Prior art keywords
- test
- focus
- feature
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70641—Focus
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67162605P | 2005-04-15 | 2005-04-15 | |
| US60/671,626 | 2005-04-15 | ||
| US67366905P | 2005-04-21 | 2005-04-21 | |
| US60/673,669 | 2005-04-21 | ||
| US11/324,739 | 2006-01-03 | ||
| US11/324,739 US7642019B2 (en) | 2005-04-15 | 2006-01-03 | Methods for monitoring and adjusting focus variation in a photolithographic process using test features printed from photomask test pattern images; and machine readable program storage device having instructions therefore |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060109310A KR20060109310A (ko) | 2006-10-19 |
| KR100714480B1 true KR100714480B1 (ko) | 2007-05-04 |
Family
ID=37108867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060030741A Expired - Fee Related KR100714480B1 (ko) | 2005-04-15 | 2006-04-04 | 포토마스크의 테스트 패턴 이미지로부터 인쇄된 테스트피쳐들을 이용하는 포토리소그래피 공정에 있어서 초점변화를 측정하는 시스템 및 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7642019B2 (https=) |
| JP (1) | JP5371179B2 (https=) |
| KR (1) | KR100714480B1 (https=) |
| DE (1) | DE102006017938B4 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9570364B2 (en) | 2014-08-19 | 2017-02-14 | Samsung Electronics Co., Ltd. | Method of detecting focus shift in lithography process, method of analyzing error of transferred pattern using the same and method of manufacturing semiconductor device using the methods |
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| JP4588368B2 (ja) * | 2004-06-15 | 2010-12-01 | 富士通セミコンダクター株式会社 | 露光計測方法及び装置、並びに半導体装置の製造方法 |
| US7642019B2 (en) | 2005-04-15 | 2010-01-05 | Samsung Electronics Co., Ltd. | Methods for monitoring and adjusting focus variation in a photolithographic process using test features printed from photomask test pattern images; and machine readable program storage device having instructions therefore |
| EP1770439B1 (en) * | 2005-10-03 | 2010-05-05 | Imec | Alternating phase shift mask |
| US7596420B2 (en) * | 2006-06-19 | 2009-09-29 | Asml Netherlands B.V. | Device manufacturing method and computer program product |
| US7493590B1 (en) * | 2006-07-11 | 2009-02-17 | Kla-Tencor Technologies Corporation | Process window optical proximity correction |
| DE102006056625B4 (de) * | 2006-11-30 | 2014-11-20 | Globalfoundries Inc. | Verfahren und Teststruktur zum Bestimmen von Fokuseinstellungen in einem Lithographieprozess auf der Grundlage von CD-Messungen |
| JP5084239B2 (ja) * | 2006-12-06 | 2012-11-28 | キヤノン株式会社 | 計測装置、露光装置並びにデバイス製造方法 |
| KR101769258B1 (ko) * | 2007-01-18 | 2017-08-17 | 가부시키가이샤 니콘 | 스캐너 기반의 광 근접 보정 시스템 및 이용 방법 |
| US7999920B2 (en) | 2007-08-22 | 2011-08-16 | Asml Netherlands B.V. | Method of performing model-based scanner tuning |
| DE102007054994A1 (de) * | 2007-11-17 | 2009-05-20 | Carl Zeiss Sms Gmbh | Verfahren zur Reparatur von Phasenverschiebungsmasken |
| NL1036189A1 (nl) | 2007-12-05 | 2009-06-08 | Brion Tech Inc | Methods and System for Lithography Process Window Simulation. |
| US9046788B2 (en) * | 2008-05-19 | 2015-06-02 | International Business Machines Corporation | Method for monitoring focus on an integrated wafer |
| US7966583B2 (en) * | 2008-07-08 | 2011-06-21 | Synopsys, Inc. | Method and apparatus for determining the effect of process variations |
| US7932004B1 (en) * | 2008-10-02 | 2011-04-26 | Kla-Tencor Corporation | Feature identification for metrological analysis |
| EP2207064A1 (en) * | 2009-01-09 | 2010-07-14 | Takumi Technology Corporation | Method of selecting a set of illumination conditions of a lithographic apparatus for optimizing an integrated circuit physical layout |
| KR101087874B1 (ko) * | 2009-06-29 | 2011-11-30 | 주식회사 하이닉스반도체 | 광학 근접 효과 보상 방법 |
| KR101082103B1 (ko) * | 2009-07-01 | 2011-11-10 | 주식회사 하이닉스반도체 | 광 근접효과 보정의 검증방법 |
| US8400634B2 (en) * | 2010-02-08 | 2013-03-19 | Micron Technology, Inc. | Semiconductor wafer alignment markers, and associated systems and methods |
| CN102193304B (zh) * | 2010-03-12 | 2012-12-05 | 中芯国际集成电路制造(上海)有限公司 | 光掩模版和使用所述光掩模版的测试方法 |
| JP5790644B2 (ja) * | 2010-04-30 | 2015-10-07 | 株式会社ニコン | 検査装置および検査方法 |
| JP5221611B2 (ja) * | 2010-09-13 | 2013-06-26 | 株式会社東芝 | ドーズデータ生成装置、露光システム、ドーズデータ生成方法および半導体装置の製造方法 |
| US8792080B2 (en) | 2011-01-27 | 2014-07-29 | International Business Machines Corporation | Method and system to predict lithography focus error using simulated or measured topography |
| NL2008702A (en) | 2011-05-25 | 2012-11-27 | Asml Netherlands Bv | Computational process control. |
| US9360662B2 (en) | 2011-10-20 | 2016-06-07 | Samsung Electronics Co., Ltd. | Optical measurement system and method for measuring critical dimension of nanostructure |
| KR20130067332A (ko) * | 2011-11-16 | 2013-06-24 | 삼성디스플레이 주식회사 | 노광용 마스크 및 그 마스크를 사용한 기판 제조 방법 |
| US8959465B2 (en) * | 2011-12-30 | 2015-02-17 | Intel Corporation | Techniques for phase tuning for process optimization |
| RU2509718C1 (ru) * | 2012-08-07 | 2014-03-20 | Корпорация "САМСУНГ ЭЛЕКТРОНИКС Ко., Лтд." | Оптическая измерительная система и способ измерения критического размера |
| US9411223B2 (en) | 2012-09-10 | 2016-08-09 | Globalfoundries Inc. | On-product focus offset metrology for use in semiconductor chip manufacturing |
| US9261775B2 (en) * | 2013-03-11 | 2016-02-16 | Carl Zeiss Sms Gmbh | Method for analyzing a photomask |
| TWI544452B (zh) * | 2013-06-25 | 2016-08-01 | 日立全球先端科技股份有限公司 | A sample preparation device for a sample observation apparatus, and a sample observation apparatus |
| US9411249B2 (en) | 2013-09-23 | 2016-08-09 | Globalfoundries Inc. | Differential dose and focus monitor |
| JP6189242B2 (ja) * | 2014-03-28 | 2017-08-30 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク及び表示装置の製造方法 |
| US10133191B2 (en) | 2014-07-21 | 2018-11-20 | Asml Netherlands B.V. | Method for determining a process window for a lithographic process, associated apparatuses and a computer program |
| KR102246872B1 (ko) | 2014-07-29 | 2021-04-30 | 삼성전자 주식회사 | 포커스 계측 마크를 포함하는 포토마스크, 포커스 모니터 패턴을 포함하는 계측용 기판 타겟, 노광 공정 계측 방법, 및 집적회로 소자의 제조 방법 |
| KR102235615B1 (ko) * | 2014-07-29 | 2021-04-02 | 삼성전자주식회사 | 노광 공정 계측용 기판 타겟 및 노광 공정 계측 방법과 이를 이용한 집적회로 소자의 제조 방법 |
| WO2017016839A1 (en) | 2015-07-24 | 2017-02-02 | Asml Netherlands B.V. | Inspection apparatus, inspection method, lithographic apparatus and manufacturing method |
| WO2017059445A1 (en) * | 2015-10-02 | 2017-04-06 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Fabrication of optical interconnect structures for a photonic integrated circuit |
| KR102146434B1 (ko) | 2015-12-17 | 2020-08-21 | 에이에스엠엘 네델란즈 비.브이. | 측정을 향상시키기 위한 비대칭 서브 해상도 피처를 사용하는 리소그래피 공정의 광학적 메트롤로지 |
| US10276375B2 (en) * | 2016-11-18 | 2019-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Assistant pattern for measuring critical dimension of main pattern in semiconductor manufacturing |
| JP2018138990A (ja) | 2016-12-08 | 2018-09-06 | ウルトラテック インク | 再構成ウェハーのリソグラフィ処理のための焦点制御のための走査方法 |
| US10908515B2 (en) * | 2016-12-23 | 2021-02-02 | Asml Netherlands B.V. | Method and apparatus for pattern fidelity control |
| JP2019028171A (ja) * | 2017-07-27 | 2019-02-21 | Hoya株式会社 | フォトマスクの検査方法、フォトマスクの製造方法、及びフォトマスク検査装置 |
| KR102368435B1 (ko) * | 2017-07-28 | 2022-03-02 | 삼성전자주식회사 | 기판 검사 장치, 기판 검사 방법 및 이를 이용한 반도체 소자의 제조 방법 |
| US10811492B2 (en) | 2018-10-31 | 2020-10-20 | Texas Instruments Incorporated | Method and device for patterning thick layers |
| US11733615B2 (en) * | 2019-01-03 | 2023-08-22 | Asml Netherlands B.V. | Methods and patterning devices and apparatuses for measuring focus performance of a lithographic apparatus, device manufacturing method |
| EP4292822B1 (en) | 2022-06-13 | 2025-10-15 | 3C Project Management Limited | A monolithic inkjet printhead and ink compositions |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000124104A (ja) | 1998-10-16 | 2000-04-28 | Nec Corp | 縮小投影型露光装置の調整方法 |
| JP2003059813A (ja) | 2001-08-20 | 2003-02-28 | Hitachi Ltd | 電子線を用いたプロセス変動監視システムおよび方法 |
| JP2006301631A (ja) | 2005-04-15 | 2006-11-02 | Samsung Electronics Co Ltd | 向上したフォトリソグラフィ工程ウィンドーを提供するフォトマスク構造及びその製造方法 |
| JP2006303498A (ja) | 2005-04-15 | 2006-11-02 | Samsung Electronics Co Ltd | フォトマスクのテストパターンイメージから印刷されたテストフィーチャーを用いるフォトリソグラフィ工程における焦点変化を測定するシステム及び方法 |
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| JP3850746B2 (ja) * | 2002-03-27 | 2006-11-29 | 株式会社東芝 | フォトマスク、フォーカスモニター方法、露光量モニター方法及び半導体装置の製造方法 |
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| JP2004253589A (ja) * | 2003-02-20 | 2004-09-09 | Renesas Technology Corp | フォーカスモニタ用光学マスク、露光装置、および半導体装置の製造方法 |
| JP3854234B2 (ja) * | 2003-02-24 | 2006-12-06 | 株式会社東芝 | フォーカスモニタ方法及びマスク |
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2006
- 2006-01-03 US US11/324,739 patent/US7642019B2/en not_active Expired - Fee Related
- 2006-04-04 KR KR1020060030741A patent/KR100714480B1/ko not_active Expired - Fee Related
- 2006-04-11 DE DE102006017938A patent/DE102006017938B4/de not_active Expired - Fee Related
- 2006-04-14 JP JP2006112545A patent/JP5371179B2/ja not_active Expired - Fee Related
-
2009
- 2009-12-02 US US12/629,115 patent/US7855037B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000124104A (ja) | 1998-10-16 | 2000-04-28 | Nec Corp | 縮小投影型露光装置の調整方法 |
| JP2003059813A (ja) | 2001-08-20 | 2003-02-28 | Hitachi Ltd | 電子線を用いたプロセス変動監視システムおよび方法 |
| JP2006301631A (ja) | 2005-04-15 | 2006-11-02 | Samsung Electronics Co Ltd | 向上したフォトリソグラフィ工程ウィンドーを提供するフォトマスク構造及びその製造方法 |
| JP2006303498A (ja) | 2005-04-15 | 2006-11-02 | Samsung Electronics Co Ltd | フォトマスクのテストパターンイメージから印刷されたテストフィーチャーを用いるフォトリソグラフィ工程における焦点変化を測定するシステム及び方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9570364B2 (en) | 2014-08-19 | 2017-02-14 | Samsung Electronics Co., Ltd. | Method of detecting focus shift in lithography process, method of analyzing error of transferred pattern using the same and method of manufacturing semiconductor device using the methods |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006017938A1 (de) | 2006-11-16 |
| US20060234136A1 (en) | 2006-10-19 |
| US7642019B2 (en) | 2010-01-05 |
| US7855037B2 (en) | 2010-12-21 |
| DE102006017938B4 (de) | 2011-07-28 |
| US20100081068A1 (en) | 2010-04-01 |
| KR20060109310A (ko) | 2006-10-19 |
| JP5371179B2 (ja) | 2013-12-18 |
| JP2006303498A (ja) | 2006-11-02 |
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