KR100713509B1 - 전자부품 실장용 필름 캐리어 테이프 - Google Patents

전자부품 실장용 필름 캐리어 테이프 Download PDF

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Publication number
KR100713509B1
KR100713509B1 KR1020057007338A KR20057007338A KR100713509B1 KR 100713509 B1 KR100713509 B1 KR 100713509B1 KR 1020057007338 A KR1020057007338 A KR 1020057007338A KR 20057007338 A KR20057007338 A KR 20057007338A KR 100713509 B1 KR100713509 B1 KR 100713509B1
Authority
KR
South Korea
Prior art keywords
film carrier
carrier tape
resist layer
film
solder resist
Prior art date
Application number
KR1020057007338A
Other languages
English (en)
Korean (ko)
Other versions
KR20050053790A (ko
Inventor
슈이치 가와사키
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20050053790A publication Critical patent/KR20050053790A/ko
Application granted granted Critical
Publication of KR100713509B1 publication Critical patent/KR100713509B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR1020057007338A 2002-11-07 2003-10-09 전자부품 실장용 필름 캐리어 테이프 KR100713509B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002324445A JP3914135B2 (ja) 2002-11-07 2002-11-07 電子部品実装用フィルムキャリアテープ
JPJP-P-2002-00324445 2002-11-07

Publications (2)

Publication Number Publication Date
KR20050053790A KR20050053790A (ko) 2005-06-08
KR100713509B1 true KR100713509B1 (ko) 2007-04-30

Family

ID=32310448

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057007338A KR100713509B1 (ko) 2002-11-07 2003-10-09 전자부품 실장용 필름 캐리어 테이프

Country Status (6)

Country Link
US (1) US20060118457A1 (ja)
JP (1) JP3914135B2 (ja)
KR (1) KR100713509B1 (ja)
CN (1) CN100377325C (ja)
TW (1) TWI284106B (ja)
WO (1) WO2004042814A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010036790A1 (en) * 2008-09-25 2010-04-01 Illinois Tool Works Inc. Devices and methods for handling microelectronic assemblies
TWI412818B (zh) * 2009-09-15 2013-10-21 Chunghwa Picture Tubes Ltd 液晶顯示面板及其走線結構
CN102543765B (zh) * 2012-01-13 2014-12-10 迈普通信技术股份有限公司 一种贴片元器件焊盘设计方法、焊盘结构及印刷电路板
CN105451458B (zh) * 2014-08-19 2018-10-30 宁波舜宇光电信息有限公司 一种控制软硬结合板微量变形的方法及pcb基板半成品
CN105552048A (zh) * 2016-01-28 2016-05-04 珠海格力节能环保制冷技术研究中心有限公司 导热焊盘及具有其的qfp芯片的封装结构
CN105611722A (zh) * 2016-03-21 2016-05-25 安捷利电子科技（苏州）有限公司 一种mems产品的印制电路板
CN109714896B (zh) * 2018-11-23 2021-03-19 广州广合科技股份有限公司 一种改善多层印制电路大拼板内套板局部形变的方法
CN110351959A (zh) * 2019-07-17 2019-10-18 高德(苏州)电子有限公司 改善不对称压合线路板板翘的方法以及控制结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529395A (ja) * 1991-07-22 1993-02-05 Mitsui Mining & Smelting Co Ltd Ｔａｂテープの製造方法
JPH065662A (ja) * 1992-06-17 1994-01-14 Hitachi Cable Ltd 半導体装置用フィルムキャリアテープ及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60216573A (ja) * 1984-04-12 1985-10-30 Seiko Epson Corp フレキシブル印刷配線板の製造方法
JP3339387B2 (ja) * 1997-11-07 2002-10-28 日立電線株式会社 Ｔａｂ用テープの製造方法
US6914196B2 (en) * 1998-01-09 2005-07-05 Samsung Electronics Co., Ltd. Reel-deployed printed circuit board
JPH11307594A (ja) * 1998-04-23 1999-11-05 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープおよび半導体素子
CN1146030C (zh) * 1998-07-28 2004-04-14 精工爱普生株式会社 半导体装置及其制造方法、半导体模块、电路基板以及电子装置
JP3457547B2 (ja) * 1998-09-09 2003-10-20 松下電器産業株式会社 半導体装置およびその製造方法ならびにフィルムキャリア
US6320135B1 (en) * 1999-02-03 2001-11-20 Casio Computer Co., Ltd. Flexible wiring substrate and its manufacturing method
JP3827497B2 (ja) * 1999-11-29 2006-09-27 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2002190674A (ja) * 2000-12-21 2002-07-05 Sony Chem Corp 多層フレキシブル配線板の製造方法
JP4701563B2 (ja) * 2001-08-23 2011-06-15 日本テキサス・インスツルメンツ株式会社 半導体チップ搭載基板及びそれを用いた半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529395A (ja) * 1991-07-22 1993-02-05 Mitsui Mining & Smelting Co Ltd Ｔａｂテープの製造方法
JPH065662A (ja) * 1992-06-17 1994-01-14 Hitachi Cable Ltd 半導体装置用フィルムキャリアテープ及びその製造方法

Also Published As

Publication number Publication date
CN100377325C (zh) 2008-03-26
TW200407248A (en) 2004-05-16
JP3914135B2 (ja) 2007-05-16
US20060118457A1 (en) 2006-06-08
WO2004042814A1 (ja) 2004-05-21
JP2004158725A (ja) 2004-06-03
TWI284106B (en) 2007-07-21
KR20050053790A (ko) 2005-06-08
CN1708841A (zh) 2005-12-14

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