KR100707572B1 - 브롬화된 트리아진 난연제를 함유하는 경화가능한 에폭시수지 조성물 - Google Patents

브롬화된 트리아진 난연제를 함유하는 경화가능한 에폭시수지 조성물 Download PDF

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Publication number
KR100707572B1
KR100707572B1 KR1020000053014A KR20000053014A KR100707572B1 KR 100707572 B1 KR100707572 B1 KR 100707572B1 KR 1020000053014 A KR1020000053014 A KR 1020000053014A KR 20000053014 A KR20000053014 A KR 20000053014A KR 100707572 B1 KR100707572 B1 KR 100707572B1
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South Korea
Prior art keywords
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epoxy resin
curable composition
poly
epoxy
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KR1020000053014A
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English (en)
Korean (ko)
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KR20010050370A (ko
Inventor
예거개리윌리엄
Original Assignee
제너럴 일렉트릭 캄파니
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Publication of KR20010050370A publication Critical patent/KR20010050370A/ko
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Publication of KR100707572B1 publication Critical patent/KR100707572B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Polyethers (AREA)
KR1020000053014A 1999-09-10 2000-09-07 브롬화된 트리아진 난연제를 함유하는 경화가능한 에폭시수지 조성물 KR100707572B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/393,772 1999-09-10
US9/393,772 1999-09-10
US09/393,772 US6387990B1 (en) 1999-09-10 1999-09-10 Curable epoxy resin compositions with brominated triazine flame retardants

Publications (2)

Publication Number Publication Date
KR20010050370A KR20010050370A (ko) 2001-06-15
KR100707572B1 true KR100707572B1 (ko) 2007-04-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000053014A KR100707572B1 (ko) 1999-09-10 2000-09-07 브롬화된 트리아진 난연제를 함유하는 경화가능한 에폭시수지 조성물

Country Status (7)

Country Link
US (4) US6387990B1 (US06770691-20040803-C00001.png)
EP (1) EP1083198B1 (US06770691-20040803-C00001.png)
JP (1) JP2001192538A (US06770691-20040803-C00001.png)
KR (1) KR100707572B1 (US06770691-20040803-C00001.png)
AT (1) ATE323130T1 (US06770691-20040803-C00001.png)
DE (1) DE60027239T2 (US06770691-20040803-C00001.png)
TW (1) TW546334B (US06770691-20040803-C00001.png)

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JP2003332749A (ja) * 2002-01-11 2003-11-21 Denso Corp 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板
JP4102112B2 (ja) * 2002-06-06 2008-06-18 株式会社東芝 半導体装置及びその製造方法
KR100561070B1 (ko) * 2003-09-05 2006-03-15 주식회사 엘지화학 고속전송 회로기판용 열경화성 수지 조성물
US7101933B2 (en) * 2003-12-10 2006-09-05 Uniplus Electronics Co., Ltd. Process for producing high speed transmitting dielectric material
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US7429800B2 (en) 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070287983A1 (en) * 2006-06-07 2007-12-13 Richard Worthington Lodge Absorbent article having an anchored core assembly
US20080071035A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Curable poly(arylene ether) composition and method
US20080071036A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Cured poly(arylene ether) composition, method, and article
US9056031B2 (en) 2007-09-07 2015-06-16 The Procter & Gamble Company Disposable wearable absorbent articles with anchoring subsystems
WO2009117345A2 (en) 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
CN102597089B (zh) * 2009-08-28 2015-08-19 帕克电气化学有限公司 热固性树脂组合物及物件
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
US20110315435A1 (en) * 2010-06-28 2011-12-29 Ming Jen Tzou Acid anhydride curable thermosetting resin composition
US8859672B2 (en) 2011-06-27 2014-10-14 Sabic Global Technologies B.V. Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making
US8552105B2 (en) 2012-03-08 2013-10-08 Sabic Innovative Plastics Ip B.V. Compatibilized composition, method for the formation thereof, and article comprising same
US8686079B2 (en) 2012-04-13 2014-04-01 Sabic Innovative Plastics Ip B.V. Compatibilized composition, method for the formation thereof, and article comprising same
KR101730283B1 (ko) * 2012-10-31 2017-04-25 셍기 테크놀로지 코. 엘티디. 열경화성 수지 조성물 및 그 용도
US8865823B2 (en) 2013-02-01 2014-10-21 Sabic Global Technologies B.V. Triblock copolymer, method for its formation, and compatibilized compositions comprising it
CN104177828A (zh) * 2014-07-30 2014-12-03 同济大学 一种改性的双马来酰亚胺树脂胶膜的制备方法
JP7008331B2 (ja) * 2018-07-18 2022-01-25 学校法人加計学園 難燃性化合物、その難燃性化合物で化学修飾したリグノセルロース及び木粉、並びにそれらを含有する樹脂組成物
CN110317433A (zh) * 2019-07-15 2019-10-11 山东金宝电子股份有限公司 一种半固化片及其制备方法
WO2021106847A1 (ja) * 2019-11-28 2021-06-03 東洋紡株式会社 接着フィルム、積層体およびプリント配線板

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US5218030A (en) * 1989-02-08 1993-06-08 Asahi Kasei Kogyo Kabushiki Kaisha Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom
US5352745A (en) * 1991-01-11 1994-10-04 Asahi Kasei Kogyo Kabushiki Kaisha Curable polyphenylene ether and cyanurate resin composition and a cured resin composition obtainable therefrom
JPH11209723A (ja) * 1998-01-30 1999-08-03 Hitachi Chem Co Ltd 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置

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US4975319A (en) * 1988-07-14 1990-12-04 General Electric Company Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether
US5218030A (en) * 1989-02-08 1993-06-08 Asahi Kasei Kogyo Kabushiki Kaisha Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom
US5352745A (en) * 1991-01-11 1994-10-04 Asahi Kasei Kogyo Kabushiki Kaisha Curable polyphenylene ether and cyanurate resin composition and a cured resin composition obtainable therefrom
JPH11209723A (ja) * 1998-01-30 1999-08-03 Hitachi Chem Co Ltd 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置

Also Published As

Publication number Publication date
EP1083198A3 (en) 2001-10-17
ATE323130T1 (de) 2006-04-15
US20020111398A1 (en) 2002-08-15
DE60027239T2 (de) 2007-03-15
JP2001192538A (ja) 2001-07-17
EP1083198A2 (en) 2001-03-14
US20020107308A1 (en) 2002-08-08
DE60027239D1 (de) 2006-05-24
EP1083198B1 (en) 2006-04-12
TW546334B (en) 2003-08-11
US6767639B2 (en) 2004-07-27
US6387990B1 (en) 2002-05-14
KR20010050370A (ko) 2001-06-15
US6770691B2 (en) 2004-08-03
US6774160B2 (en) 2004-08-10
US20020107307A1 (en) 2002-08-08

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