KR100703906B1 - 무선 통신 매체 - Google Patents

무선 통신 매체 Download PDF

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Publication number
KR100703906B1
KR100703906B1 KR1020040079555A KR20040079555A KR100703906B1 KR 100703906 B1 KR100703906 B1 KR 100703906B1 KR 1020040079555 A KR1020040079555 A KR 1020040079555A KR 20040079555 A KR20040079555 A KR 20040079555A KR 100703906 B1 KR100703906 B1 KR 100703906B1
Authority
KR
South Korea
Prior art keywords
antenna
transmitting
receiving
chip
base substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020040079555A
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English (en)
Korean (ko)
Other versions
KR20050033833A (ko
Inventor
쯔노다시게하루
간다나오야
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 히타치세이사쿠쇼 filed Critical 가부시키가이샤 히타치세이사쿠쇼
Publication of KR20050033833A publication Critical patent/KR20050033833A/ko
Application granted granted Critical
Publication of KR100703906B1 publication Critical patent/KR100703906B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/0095—Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
KR1020040079555A 2003-10-07 2004-10-06 무선 통신 매체 Expired - Fee Related KR100703906B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003348806A JP3803097B2 (ja) 2003-10-07 2003-10-07 無線通信媒体の製造方法
JPJP-P-2003-00348806 2003-10-07

Publications (2)

Publication Number Publication Date
KR20050033833A KR20050033833A (ko) 2005-04-13
KR100703906B1 true KR100703906B1 (ko) 2007-04-05

Family

ID=34309222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040079555A Expired - Fee Related KR100703906B1 (ko) 2003-10-07 2004-10-06 무선 통신 매체

Country Status (7)

Country Link
US (1) US7141451B2 (https=)
EP (1) EP1522956B1 (https=)
JP (1) JP3803097B2 (https=)
KR (1) KR100703906B1 (https=)
CN (1) CN1316423C (https=)
DE (1) DE602004007861T2 (https=)
TW (1) TW200513978A (https=)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3803097B2 (ja) * 2003-10-07 2006-08-02 株式会社日立製作所 無線通信媒体の製造方法
JP4290620B2 (ja) * 2004-08-31 2009-07-08 富士通株式会社 Ｒｆｉｄタグ、ｒｆｉｄタグ用アンテナ、ｒｆｉｄタグ用アンテナシートおよびｒｆｉｄタグの製造方法
JP2006277233A (ja) * 2005-03-29 2006-10-12 Fujitsu Ltd タグ試験装置、タグ試験方法およびタグ試験プログラム
US7749350B2 (en) * 2005-04-27 2010-07-06 Avery Dennison Retail Information Services Webs and methods of making same
US7842156B2 (en) * 2005-04-27 2010-11-30 Avery Dennison Corporation Webs and methods of making same
US7571862B2 (en) * 2005-06-02 2009-08-11 Avery Dennison Corporation RFID tag that provides a flat print area and a pinch roller that enables the same
KR100720077B1 (ko) 2005-09-09 2007-05-18 (주)티이에스 메모리 카드 제조 방법
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
US7388504B2 (en) * 2005-12-02 2008-06-17 Brady Worldwide, Inc. RFID standoff label and method of use
JP4754344B2 (ja) * 2005-12-20 2011-08-24 富士通株式会社 Ｒｆｉｄタグ
US20070183184A1 (en) * 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Ltd. Apparatus and method for manufacturing semiconductor device
EP2259213B1 (en) 2006-02-08 2015-12-23 Semiconductor Energy Laboratory Co., Ltd. RFID device
JP4782605B2 (ja) * 2006-04-13 2011-09-28 日本電信電話株式会社 電子装置及びその製造方法
US7727809B2 (en) 2006-05-31 2010-06-01 Semiconductor Energy Laboratory Co., Ltd. Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device
US7533455B2 (en) * 2006-06-13 2009-05-19 The Kennedy Group, Inc. Method of making RFID devices
DE102006040180A1 (de) * 2006-08-26 2008-03-13 Nordenia Deutschland Gronau Gmbh Verfahren zum kontaktlosen Testen von auf einer Materialbahn aufgebrachten Antennen
US7823269B2 (en) * 2006-10-17 2010-11-02 Tagsys Sas Method for manufacturing an auxiliary antenna
JP5018309B2 (ja) * 2007-07-23 2012-09-05 大日本印刷株式会社 Ｉｃタグ
JP5116528B2 (ja) * 2008-03-27 2013-01-09 トッパン・フォームズ株式会社 非接触型データ受送信体の製造方法
EP2377150B1 (en) 2008-12-13 2015-07-29 Mühlbauer GmbH & Co. KG. Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
DE102009020540B4 (de) 2009-05-08 2012-06-21 Mühlbauer Ag Verfahren und Vorrichtung zum Herstellen einer elektronischen Baugruppe und mit dem Verfahren oder in der Vorrichtung hergestellte elektronische Baugruppe
DE102009023405A1 (de) 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
CN101739586A (zh) * 2009-12-31 2010-06-16 上海杰远环保科技有限公司 一种复合多层型射频识别发射组件及其制造方法
WO2012126063A1 (en) * 2011-03-24 2012-09-27 Tagsys Sas Rfid tag assembly and label process
FR2985408A1 (fr) * 2011-12-30 2013-07-05 Chi-Yuan Ou Procede de fabrication de carte electronique
JP6056978B2 (ja) * 2013-08-15 2017-01-11 富士通株式会社 Ｒｆｉｄタグ及びその製造方法
DE102017113380A1 (de) * 2017-06-19 2018-12-20 Schreiner Group Gmbh & Co. Kg Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie
DE102017113375A1 (de) 2017-06-19 2018-12-20 Schreiner Group Gmbh & Co. Kg Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie
DE102018117364A1 (de) * 2018-07-18 2020-01-23 Infineon Technologies Ag Verfahren und Vorrichtung zum Trimmen einer auf einem Träger aufgebrachten Antenne, Verfahren zum Herstellen einer Trägerstruktur, Trägerstruktur und Chipkarte
US11600912B2 (en) 2019-12-12 2023-03-07 Au Optronics Corporation Antenna device and manufacturing method thereof
DE202022003018U1 (de) 2022-05-20 2024-06-03 All4Labels Group GmbH RFID-Etikett
DE102022112697A1 (de) 2022-05-20 2023-11-23 All4Labels Group GmbH Verfahren zur Herstellung eines Bandes mit RFID-Etiketten
DE102022112693A1 (de) 2022-05-20 2023-11-23 All4Labels Group GmbH RFID-Etikett und Verfahren zur Herstellung und Prüfung eines solchen RFID-Etiketts

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001061646A1 (en) * 2000-02-18 2001-08-23 Moore North America, Inc. Rfid manufacturing concepts
EP1143378A1 (en) * 2000-04-04 2001-10-10 Smartag (S) Pte. Ltd. Method for manufacturing of RFID inlet
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4343297B2 (ja) 1998-11-30 2009-10-14 リンテック株式会社 Ｉｃカード用基板およびその製造方法
JP2001043341A (ja) 1999-07-30 2001-02-16 Toppan Forms Co Ltd チップカード
JP2001209778A (ja) 1999-11-15 2001-08-03 Oji Paper Co Ltd Ｉｃカード
DE19962194A1 (de) * 1999-12-22 2001-06-28 Flexchip Ag Verfahren zur Herstellung von kontaktierbaren Leiterschleifen für Transponder
CN1251131C (zh) * 2000-07-19 2006-04-12 株式会社哈尼克斯 射频识别标签的收容结构,安装结构及使用该标签的通信
JP2002157561A (ja) 2000-11-17 2002-05-31 Sony Corp Ｉｃカード及びその製造方法
JP4873776B2 (ja) 2000-11-30 2012-02-08 ソニー株式会社 非接触ｉｃカード
JP2002189999A (ja) 2000-12-21 2002-07-05 Toppan Forms Co Ltd 電子線を用いたｉｃメディアの製法
JP2002187223A (ja) 2000-12-22 2002-07-02 Sato Corp Ｉｃインレット仮着帯の製造方法およびｉｃ内蔵表示札の製造方法
JP2003067696A (ja) 2001-08-28 2003-03-07 Nec Tokin Corp 非接触通信媒体及びその製造方法
JP3803097B2 (ja) * 2003-10-07 2006-08-02 株式会社日立製作所 無線通信媒体の製造方法
US7057562B2 (en) * 2004-03-11 2006-06-06 Avery Dennison Corporation RFID device with patterned antenna, and method of making
US7158037B2 (en) * 2004-03-22 2007-01-02 Avery Dennison Corporation Low cost method of producing radio frequency identification tags with straps without antenna patterning

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001061646A1 (en) * 2000-02-18 2001-08-23 Moore North America, Inc. Rfid manufacturing concepts
EP1143378A1 (en) * 2000-04-04 2001-10-10 Smartag (S) Pte. Ltd. Method for manufacturing of RFID inlet
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing

Also Published As

Publication number Publication date
EP1522956B1 (en) 2007-08-01
CN1606036A (zh) 2005-04-13
DE602004007861T2 (de) 2008-04-10
CN1316423C (zh) 2007-05-16
US20050085010A1 (en) 2005-04-21
DE602004007861D1 (de) 2007-09-13
TW200513978A (en) 2005-04-16
JP2005115646A (ja) 2005-04-28
JP3803097B2 (ja) 2006-08-02
KR20050033833A (ko) 2005-04-13
EP1522956A1 (en) 2005-04-13
US7141451B2 (en) 2006-11-28
TWI295033B (https=) 2008-03-21

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