KR100692267B1 - Ⅲ족 질화물 반도체 결정의 제조 방법 - Google Patents

Ⅲ족 질화물 반도체 결정의 제조 방법 Download PDF

Info

Publication number
KR100692267B1
KR100692267B1 KR1020067010518A KR20067010518A KR100692267B1 KR 100692267 B1 KR100692267 B1 KR 100692267B1 KR 1020067010518 A KR1020067010518 A KR 1020067010518A KR 20067010518 A KR20067010518 A KR 20067010518A KR 100692267 B1 KR100692267 B1 KR 100692267B1
Authority
KR
South Korea
Prior art keywords
group iii
substrate
nitride semiconductor
iii nitride
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020067010518A
Other languages
English (en)
Korean (ko)
Other versions
KR20060079259A (ko
Inventor
히사유키 미키
테츠오 사쿠라이
미네오 오쿠야마
Original Assignee
쇼와 덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼와 덴코 가부시키가이샤 filed Critical 쇼와 덴코 가부시키가이샤
Publication of KR20060079259A publication Critical patent/KR20060079259A/ko
Application granted granted Critical
Publication of KR100692267B1 publication Critical patent/KR100692267B1/ko
Assigned to 도요다 고세이 가부시키가이샤 reassignment 도요다 고세이 가부시키가이샤 권리의 전부이전등록 Assignors: 쇼와 덴코 가부시키가이샤
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Led Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Semiconductor Lasers (AREA)
KR1020067010518A 2002-02-15 2003-02-14 Ⅲ족 질화물 반도체 결정의 제조 방법 Expired - Lifetime KR100692267B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00038841 2002-02-15
JP2002038841A JP3656606B2 (ja) 2002-02-15 2002-02-15 Iii族窒化物半導体結晶の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020047012652A Division KR100659520B1 (ko) 2002-02-15 2003-02-14 Ⅲ족 질화물 반도체 결정의 제조 방법

Publications (2)

Publication Number Publication Date
KR20060079259A KR20060079259A (ko) 2006-07-05
KR100692267B1 true KR100692267B1 (ko) 2007-03-12

Family

ID=27780051

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020067010518A Expired - Lifetime KR100692267B1 (ko) 2002-02-15 2003-02-14 Ⅲ족 질화물 반도체 결정의 제조 방법
KR1020047012652A Expired - Lifetime KR100659520B1 (ko) 2002-02-15 2003-02-14 Ⅲ족 질화물 반도체 결정의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020047012652A Expired - Lifetime KR100659520B1 (ko) 2002-02-15 2003-02-14 Ⅲ족 질화물 반도체 결정의 제조 방법

Country Status (4)

Country Link
JP (1) JP3656606B2 (https=)
KR (2) KR100692267B1 (https=)
CN (1) CN100338733C (https=)
TW (1) TWI221638B (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI258873B (en) * 2004-01-26 2006-07-21 Showa Denko Kk Group III nitride semiconductor multilayer structure
JP2005244202A (ja) * 2004-01-26 2005-09-08 Showa Denko Kk Iii族窒化物半導体積層物
EP1709670B1 (en) 2004-01-26 2012-09-12 Showa Denko K.K. Group iii nitride semiconductor multilayer structure
JP4901115B2 (ja) 2004-03-04 2012-03-21 昭和電工株式会社 窒化ガリウム系半導体素子
US7436045B2 (en) 2004-03-04 2008-10-14 Showa Denko K.K. Gallium nitride-based semiconductor device
WO2005088738A1 (en) 2004-03-12 2005-09-22 Showa Denko K.K. Group iii nitride semiconductor light-emitting device, forming method thereof, lamp and light source using same
TWI287880B (en) 2004-03-18 2007-10-01 Showa Denko Kk Group III nitride semiconductor light-emitting device and method of producing the same
WO2005109478A1 (en) * 2004-05-12 2005-11-17 Showa Denko K.K. P-type group iii nitride semiconductor and production method thereof
JP2006229219A (ja) * 2004-05-12 2006-08-31 Showa Denko Kk III族窒化物p型半導体およびその製造方法
JP4833616B2 (ja) 2004-09-13 2011-12-07 昭和電工株式会社 Iii族窒化物半導体の製造方法
US7652299B2 (en) 2005-02-14 2010-01-26 Showa Denko K.K. Nitride semiconductor light-emitting device and method for fabrication thereof
US7803648B2 (en) 2005-03-09 2010-09-28 Showa Denko K.K. Nitride semiconductor light-emitting device and method for fabrication thereof
US8076165B2 (en) 2005-04-01 2011-12-13 Sharp Kabushiki Kaisha Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method
JP4432827B2 (ja) 2005-04-26 2010-03-17 住友電気工業株式会社 Iii族窒化物半導体素子およびエピタキシャル基板
US7951617B2 (en) 2005-10-06 2011-05-31 Showa Denko K.K. Group III nitride semiconductor stacked structure and production method thereof
JP2007220745A (ja) * 2006-02-14 2007-08-30 Showa Denko Kk III族窒化物p型半導体の製造方法
WO2007129773A1 (ja) 2006-05-10 2007-11-15 Showa Denko K.K. Iii族窒化物化合物半導体積層構造体
JP5250856B2 (ja) 2006-06-13 2013-07-31 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子の製造方法
JP2009123718A (ja) 2007-01-16 2009-06-04 Showa Denko Kk Iii族窒化物化合物半導体素子及びその製造方法、iii族窒化物化合物半導体発光素子及びその製造方法、並びにランプ
JP4993627B2 (ja) * 2009-03-24 2012-08-08 古河機械金属株式会社 Iii族窒化物半導体層の製造方法
WO2012137309A1 (ja) * 2011-04-05 2012-10-11 住友電気工業株式会社 窒化物電子デバイスを作製する方法
JP5948698B2 (ja) * 2012-04-13 2016-07-06 パナソニックIpマネジメント株式会社 紫外発光素子およびその製造方法
JP6442957B2 (ja) * 2014-09-29 2018-12-26 日亜化学工業株式会社 窒化物半導体テンプレートの製造方法
CN107039250B (zh) * 2016-02-03 2018-08-21 中晟光电设备(上海)股份有限公司 一种在蓝宝石衬底上生长氮化镓材料的方法、氮化镓材料及其用途
JP7429522B2 (ja) * 2019-11-22 2024-02-08 住友化学株式会社 Iii族窒化物積層基板および半導体素子
JP7535399B2 (ja) * 2020-07-08 2024-08-16 住友化学株式会社 Iii族窒化物積層物、半導体素子およびiii族窒化物積層物の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751752A (en) * 1994-09-14 1998-05-12 Rohm Co., Ltd. Semiconductor light emitting device and manufacturing method therefor
JPH08264886A (ja) * 1995-03-27 1996-10-11 Sumitomo Electric Ind Ltd 半導体レーザ素子およびその製造方法
JP3491492B2 (ja) * 1997-04-09 2004-01-26 松下電器産業株式会社 窒化ガリウム結晶の製造方法
CN1044840C (zh) * 1997-07-24 1999-08-25 北京大学 GaN/Al2O3复合材料在Ⅲ-V族氮化物外延生长中做衬底的方法
JP3615081B2 (ja) * 1999-03-30 2005-01-26 古河電気工業株式会社 GaN単結晶の作製方法
CN1313412A (zh) * 2000-03-10 2001-09-19 广镓光电股份有限公司 在单晶基板上形成第三族氮化物外延层方法、制品及设备
KR100319300B1 (ko) * 2000-03-23 2002-01-04 윤종용 이종접합구조의 양자점 버퍼층을 가지는 반도체 소자
JP3285341B2 (ja) * 2000-06-01 2002-05-27 士郎 酒井 窒化ガリウム系化合物半導体の製造方法

Also Published As

Publication number Publication date
KR100659520B1 (ko) 2006-12-20
JP3656606B2 (ja) 2005-06-08
TWI221638B (en) 2004-10-01
KR20060079259A (ko) 2006-07-05
CN100338733C (zh) 2007-09-19
JP2003243302A (ja) 2003-08-29
KR20040079443A (ko) 2004-09-14
CN1639393A (zh) 2005-07-13
TW200307313A (en) 2003-12-01

Similar Documents

Publication Publication Date Title
KR100692267B1 (ko) Ⅲ족 질화물 반도체 결정의 제조 방법
US6852161B2 (en) Method of fabricating group-iii nitride semiconductor crystal, method of fabricating gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor light-emitting device, and light source using the semiconductor light-emitting device
KR100712753B1 (ko) 화합물 반도체 장치 및 그 제조방법
US8148712B2 (en) Group III nitride compound semiconductor stacked structure
US5679152A (en) Method of making a single crystals Ga*N article
US8772060B2 (en) Method for manufacturing group III nitride semiconductor light emitting element, group III nitride semiconductor light emitting element and lamp
US8882910B2 (en) AlGaN substrate and production method thereof
EP2071053B1 (en) Filming method for iii-group nitride semiconductor laminated structure
WO1996041906A1 (en) Bulk single crystal gallium nitride and method of making same
JP3940673B2 (ja) Iii族窒化物半導体結晶の製造方法、および窒化ガリウム系化合物半導体の製造方法
JP2007103774A (ja) Iii族窒化物半導体積層構造体およびその製造方法
EP1474824B1 (en) Production method for group iii nitride semiconductor layer
KR20020065892A (ko) 3족 질화물 반도체 결정 제조 방법, 갈륨나이트라이드-기재 화합물 반도체 제조 방법, 갈륨나이트라이드-기재 화합물 반도체, 갈륨나이트라이드-기재 화합물 반도체 발광 소자, 및 반도체발광 소자를 이용한 광원
JP3991823B2 (ja) Iii族窒化物半導体結晶、その製造方法、iii族窒化物半導体エピタキシャルウェーハ
JP4222287B2 (ja) Iii族窒化物半導体結晶の製造方法
US8529699B2 (en) Method of growing zinc-oxide-based semiconductor and method of manufacturing semiconductor light emitting device
KR100742986B1 (ko) 컴플라이언트 기판을 갖는 질화갈륨계 화합물 반도체 소자의 제조 방법
CN100356595C (zh) Ⅲ族氮化物半导体元件及其制造方法
TW200527721A (en) Group III nitride semiconductor device and light-emitting device using the same
JP3214349B2 (ja) InGaN層を有する半導体ウエハ及びその製造方法並びにそれを具備する発光素子
JP4193379B2 (ja) 3−5族化合物半導体の製造方法
JP2006222360A (ja) Iii−v族窒化物半導体及びその製造方法
JPWO1999023693A1 (ja) GaN単結晶基板及びその製造方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20130227

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20140204

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20150224

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20160219

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20170221

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20180220

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20190219

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

FPAY Annual fee payment

Payment date: 20200219

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20230215

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000