KR100684021B1 - 광송수신장치 및 광송수신장치의 제조방법 - Google Patents

광송수신장치 및 광송수신장치의 제조방법 Download PDF

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Publication number
KR100684021B1
KR100684021B1 KR1020050004809A KR20050004809A KR100684021B1 KR 100684021 B1 KR100684021 B1 KR 100684021B1 KR 1020050004809 A KR1020050004809 A KR 1020050004809A KR 20050004809 A KR20050004809 A KR 20050004809A KR 100684021 B1 KR100684021 B1 KR 100684021B1
Authority
KR
South Korea
Prior art keywords
optical
circuit board
optical transmission
lead pin
lead
Prior art date
Application number
KR1020050004809A
Other languages
English (en)
Korean (ko)
Other versions
KR20050077736A (ko
Inventor
타카하시히로유키
나카자와아쯔시
카와니시야스유키
Original Assignee
스미토모덴키고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모덴키고교가부시키가이샤 filed Critical 스미토모덴키고교가부시키가이샤
Publication of KR20050077736A publication Critical patent/KR20050077736A/ko
Application granted granted Critical
Publication of KR100684021B1 publication Critical patent/KR100684021B1/ko

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)
KR1020050004809A 2004-01-28 2005-01-19 광송수신장치 및 광송수신장치의 제조방법 KR100684021B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004020511A JP4114614B2 (ja) 2004-01-28 2004-01-28 光送受信装置及び光送受信装置の製造方法
JPJP-P-2004-00020511 2004-01-28

Publications (2)

Publication Number Publication Date
KR20050077736A KR20050077736A (ko) 2005-08-03
KR100684021B1 true KR100684021B1 (ko) 2007-02-20

Family

ID=34879073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050004809A KR100684021B1 (ko) 2004-01-28 2005-01-19 광송수신장치 및 광송수신장치의 제조방법

Country Status (4)

Country Link
JP (1) JP4114614B2 (zh)
KR (1) KR100684021B1 (zh)
CN (1) CN100376911C (zh)
TW (1) TWI257776B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324343A (ja) * 2006-05-31 2007-12-13 Mitsubishi Electric Corp 光送受信器
JP2008071784A (ja) * 2006-09-12 2008-03-27 Mitsubishi Electric Corp 光送受信器
JP5228676B2 (ja) * 2008-07-29 2013-07-03 日産自動車株式会社 通信システム、センターシステム、車載用通信装置および通信方法
JP2010199302A (ja) * 2009-02-25 2010-09-09 Sumitomo Electric Ind Ltd 光半導体装置
CN102298182A (zh) * 2011-08-16 2011-12-28 深圳市国扬通信股份有限公司 光器件与主板的连接方法及光器件
CN103676038B (zh) * 2013-12-30 2017-02-22 上海斐讯数据通信技术有限公司 Bosa 光器件的引脚固定弯折治具
TWI590753B (zh) 2016-11-02 2017-07-01 和碩聯合科技股份有限公司 引腳包覆裝置及應用其之雙向光學組裝裝置
CN110417481A (zh) * 2019-07-09 2019-11-05 广东九联科技股份有限公司 一种用于无源光网络的改进型rosa

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030016523A (ko) * 2001-08-21 2003-03-03 변동환 제동 기능을 갖는 허브 조립체

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0494582A (ja) * 1990-08-10 1992-03-26 Sharp Corp 半導体レーザ用パッケージ
JP3310990B2 (ja) * 1991-04-15 2002-08-05 キヤノン株式会社 電子機器
JP2754427B2 (ja) * 1991-08-08 1998-05-20 能美防災株式会社 輻射式火災感知器
US6369924B1 (en) * 1998-04-20 2002-04-09 Stratos Lightwave, Inc. Optical transceiver with enhanced shielding and related methods
JP2000269582A (ja) * 1999-03-15 2000-09-29 Fuji Xerox Co Ltd 光学装置
JP2001196766A (ja) * 2000-01-17 2001-07-19 Hitachi Cable Ltd 光素子の取付構造及び光送受信モジュール
JP2002343984A (ja) * 2001-05-21 2002-11-29 Hitachi Ltd 光送受信器
JP2003344725A (ja) * 2002-03-18 2003-12-03 Sumitomo Electric Ind Ltd フェルール部品及び光通信モジュール
TW564601B (en) * 2002-03-26 2003-12-01 Ind Tech Res Inst Packaging of optical transmission module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030016523A (ko) * 2001-08-21 2003-03-03 변동환 제동 기능을 갖는 허브 조립체

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
2003165230000

Also Published As

Publication number Publication date
TWI257776B (en) 2006-07-01
CN100376911C (zh) 2008-03-26
JP4114614B2 (ja) 2008-07-09
CN1648705A (zh) 2005-08-03
TW200527839A (en) 2005-08-16
JP2005217074A (ja) 2005-08-11
KR20050077736A (ko) 2005-08-03

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