200527839 九、發明說明： 【發明所屬之技術領域】 本發明爲可易於且確實連接收發光信號之雙向光收發 模組之光收發裝置及該光收發裝置之製造方法。 【先前技術】 近來，隨著通訊技術之急速發展，信號傳送速度較快之 光通訊則受到眾人之關注。於收發光信號之光收發裝置連接 光傳送線之光纖時，通常使用兼具光接收部及光傳送部兩方 • 之雙向光收發模組較多。 先前之雙向光收發模組係於本體部具有包含透鏡、感光 元件、發光元件、前置放大器及電容器之電子電路等，於本 體部之一端連接（插入）安裝於光傳送線光纖之套環。另外， 從本體部之另一端延伸光傳送部之導線引腳，用於輸入以發 光元件轉換成光信號之電氣信號，而於本體部中央附近之側 面，延伸光接收部之導線引腳，用於輸出以感光元件接收的 光信號所轉換之電氣信號（參照非專利文件1 )。 ® 使用上述之光收發模組之光通信，例如，擴大適用於利 用先前電氣通信之電腦背部面板（back panel)間之通信、 電話交換機間之通信等，但都必需將多數光收發模組配置於 整體之電路基板。此種情況，改善光收發模組之安裝密度， 和具備光收發模組之光收發裝置之精簡化等將成爲重要課 題之一 ° 但是，於非專利文件1中所揭示之光收發模組，爲了進 行提高光結合率之光軸對合，乃有必要對每個光收發模組進 200527839 行調芯，且在每個所製造光收發模組，光傳送部、光接收部 及本體部之相對位置關係乃些微不同。藉此，從光傳送部所 延出之導線引腳，從光接收部所延出之導線引腳之相對位置 亦依每個光收發模組而異，於安裝導線引腳時，由於有必要 接收此等差異及安裝於電路基板，故安裝時需要相當的時 間、要求熟練於安裝步驟等，都造成製造成本增加之主因。 具體來說，係使用如第7圖所示之方法安裝光收發模組 之光收發裝置。於第7圖中，於電路基板71設置矩形狀之 • 缺口 72，於缺口 72裝入光收發模組本體。亦即，形成 (Forming)光傳送部73之導線引腳75、75…，爲了挾住電路 基板71而於正反兩面焊接導線引腳75、75...。同樣的，形 成光接收部74之導線引腳76、76...，爲了挾住電路基板71 而於正反兩面焊接導線引腳76、76...。 另外，如第8圖所示，對於光收發模組之光傳送部83 之導線引腳85、85…及光接收部84之導線引腳86、86...， 此等之前端部分係形成爲垂直於電路基板8 1，於設置於電路 • 基板81之導線引腳連接用孔部，插入導線引腳85、85...及 導線引腳86、86··.，從電路基板81之背面亦可採用已焊接 之光收發裝置。 【非專利文件1】Infineon Tehnologies AG、BIDI測試 板使用者手冊（BIDI Test Board User’s Guide)、德國、 S23481-A5159-51 、 2002 年 3 月 25 日 但前者之光收發裝置係有必要一個個改變形成之導線 引腳75、75…及導線引腳76、76…之形狀，且具有安裝作業 200527839 時非常煩雜之問題點。同時，固定光收發模組之構件，由於 係僅導線引腳75、75…及導線引腳76、76…來組成，故於構 造上不耐震且必需固定本體部之補強用金屬構件。 另外，後者之光收發裝置，由於需將光傳送部之導線引 腳85、85…形成成安裝用，故需要相當的長度。但當光傳送 部導線引腳85、85···增長時，則將導致電氣信號之傳送特性 惡化，且不易維持良好傳送信號特性及安裝於電路基板等之 問題點。 【發明內容】 本發明係有鑑於此情況而發明之，藉由使用2片電路基 板連接光收發模組，以提供可易於且確實安裝於電路基板之 光收發裝置，及光收發裝置之製造方法爲目的。 又，本發明係以提供一種藉由使用2片電路基板，於易 於形成光收發模組中的導線引腳之同時，亦無需固定本體部 之補強用元件，即可安裝於電路基板之光收發裝置，及光收 發裝置之製造方法爲目的。 爲了達成上述目的，第1發明之光收發裝置係具備經由 光傳送線收發光信號之光收發模組，和連接該光收發模組之 2片電路基板者；其特徵係前述光收發模組具有：光傳送部， 設置導線引腳，用於朝對向於連接前述光傳送線部分之方 向，輸入要轉換成光信號之電氣信號；和光接收部’設置有 導線引腳，用於朝交叉於從連接前述光傳送線的部分面對前 述光傳送部的方向，輸出轉換光信號而得之電氣信號；且一 方電路基板係具有連接導線引腳之導線引腳連接用孔部’而 200527839 在另一方電路基板連接光傳送部之導線引腳，於一方電路基 板使用前述導線引腳連接用孔部連接光接收部之導線引腳° 藉此，較易於形成光傳送部之導線引腳，將光接收部之 導線引腳插入於一方之電路基板之導線引腳連接用孔部，則 不會受到每個光收發模組不同之導線引腳位置之不同的影 響，且可將光收發模組堅固安裝於電路基板。 另外，關於第2發明之光收發裝置，係具備經由光傳送 線收發光信號之光收發模組，和連接該光收發模組之2片電 # 路基板者， 其特徵係前述光收發模組係具有：光接收部，具有導線 引腳，用於朝對向於連接前述光傳送線部分之方向，輸出轉 換光信號而得之電氣信號；和光傳送部，具有導線引腳，用 於朝交叉於從連接前述光傳送線的部分面對前述光接收部 的方向，輸入要轉換成光信號之電氣信號； 一方電路基板係具有連接導線引腳之導線引腳連接用 孔部，而於另一方電路基板連接光接收部之導線引腳，於一 • 方電路基板使用前述導線引腳連接用孔部連接光傳送部之 導線引腳。 藉此，較易於形成光接收部之導線引腳，將光傳送部之 導線引腳插入於一方之電路基板導線引腳連接用孔部，則不 會受到每個光收發模組相異之導線引腳位置的影響，且可將 光收發模組堅固安裝於電路基板。 另外，於第3圖之第3發明之光接收裝置上，於第1或 第2發明中，其特徵係另一方電路基板係於導線引腳之長邊 200527839 方向設置成大致平行於另一方電路基板。 藉此，於較易於形成光傳送部或光接收部之導線引腳， 同時，可確實將光收發模組本體固定於電路基板，無須固定 本體部之補強用構件即可將光收發模組安裝於電路基板。 另外，第5圖之第4發明之光收發裝置，於第1或第2 發明中，其特徵係將另一方電路基板設置成交叉於一方電路 基板，另一方電路基板係具備連接導線引腳之導線引腳連接 用孔部。 Φ 藉此，無須形成光傳送部或光接收部之導線引腳，既可 確實固定另一方電路基板，且無需固定本體部之補強用構件 即可將光收發模組安裝於電路基板。 另外，第5發明之光收發裝置之製造方法，係於具備經 由光傳送線收發光信號之光收發模組，和連接該光收發模組 之2片電路基板的光收發裝置中，其特徵係前述光收發模組 具備：光傳送部，設置有導線引腳，用於朝對向於連接前述 光傳送線部分之方向，輸入要轉換成光信號之電氣信號；和 ^ 光接收部，設置有導線引腳，用於朝交叉於從連接前述光傳 送線的部分面對前述光傳送部的方向，輸出轉換光信號而得 之電氣信號；一方電路基板係具有連接導線引腳之導線引腳 連接用孔部，而於另一方電路基板連接光傳送部之導線引 腳’於一方電路基板使用前述導線引腳連接用孔部連接光接 收部之導線引腳。 藉此，較易於形成光傳送部之導線引腳，將光接收部之 導線引腳插入於第一電路基板之導線引腳連接用孔部，則不 -10- 200527839 會受到每個光收發模組相異之導線引腳位置的影響，且可將 光收發模組堅固安裝於電路基板。同時，於較小之第二電路 基板藉由事先焊接光收發模組，可將一體化於第二電路基板 之光收發模組，例如藉由流動（flow)焊接而以一步驟安裝於 第一電路基板，進而有效提升製造步驟。 另外，第6發明之光收發裝置之製造方法係於具備經由 光傳送線收發光信號之光收發模組，和連接該光收發模組之 2片電路基板之光收發裝置中， # 其特徵係前述光收發模組具備：光接收部，設置有導線 引腳，用於朝對向於連接前述光傳送線部分之方向，輸出轉 換光信號而得之電氣信號；和光傳送部，設置有導線引腳， 用於朝交叉於從連接前述光傳送線的部分面對前述光接收 部的方向，輸入要轉換成光信號之電氣信號；且 一方電路基板係具有連接導線引腳之導線引腳連接用 孔部，而於另一方電路基板連接光接收部之導線引腳，於一 方電路基板使用前述導線引腳連接用孔部連接光接收部之 •導線引腳。 藉此，較易於形成光接收部之導線引腳，將光傳送部之 導線引腳插入於第一電路基板之導線引腳連接用孔部，則不 會受到每個光收發模組相異之導線引腳位置的影響，且可將 光收發模組堅固安裝於電路基板。同時，於較小之第二電路 基板藉由事先焊接光收發模組，使得一體化於第二電路基板 之光收發模組，譬如可藉由流動焊接而以一步驟安裝於第一 電路基板，進而有效提升製造步驟。 -11- 200527839 另外，第7發明之光收發裝置之製造方法，於第5或第 6發明中，其特徵係前述第二電路基板係於導線引腳之長邊 方向設置成大致平行於前述第一電路基板。 藉此，於較易於形成光傳送部或光接收部之導線引腳， 同時可確實將光收發模組本體固定於電路基板，且無需固定 本體部之補強用構件，即可將光收發模組安裝於電路基板。 又，於導線引腳之長邊方向中，事先焊接較小之第二電路基 板之後，再藉由安裝於較大之第一電路基板，可於大範圍修 • 正連接位置之偏移，且亦易於製造時之回收。 另外，第8發明之光收發裝置之製造方法，於第5或第 6發明中，其特徵係將前述第二電路基板設置成交叉於前述 第一電路基板，前述第二電路基板係具備連接導線引腳之導 線引腳連接用孔部。 藉此，無需形成光傳送部或光接收部之導線引腳，即可 確實固定於第二電路基板，且無需固定本體部之補強用構 件，即可將光收發模組安裝於電路基板。同時，較小之第二 ® 電路基板對第一電路基板的連接引腳，與光接收部之導線引 腳之相對位置，係可容易地調整成與第一電路基板之連接用 孔部位置關係一致，使安裝於較小之第二電路基板之光收發 模組，容易一次安裝於較大之第一電路基板。 【實施方式】 以下’將本發明基於其實施形態之圖面具體說明。 (實施形態1 ) 第1圖爲表示安裝於本發明之實施形態1的收發裝置之 -12- 200527839 光收發模組構成之斜視圖（a )，從光傳送部側來看正面圖 (b )及側面圖（c )。如第1 (a)圖所示，係以安裝光傳送線 光纖1之本體部2爲中心，於對向於連接光纖1部分的方向’ 設置光傳送部3，於交叉於從連接光纖1的部分面對光傳送 部3的方向，亦即，於本體部2之側面側設置光接收部4。 光傳送部3係如第1(b)圖所示延伸出4支導線引腳51、 5 1...，光接收部4係如第1(c)圖所示延伸出5支導線引腳 52、52...。又，導線引腳之該等支數爲例示，例如光接收部 φ 之導線引腳爲4支等，當然爲其他支數亦可。又，光纖1係 經由連接器與光收發模組連接亦可。 第2圖爲表示本發明之光收發模組內之光傳送路徑示意 圖。如第2圖所示，於形成本體部2之殼體內，具備：於玻 璃區塊端面形成薄膜的分光器（beam splitter)21、由產生傳 送光之雷射二極體所形成之發光元件22、由接受接收光之光 二極體、光電晶體等所形成之感光元件23、經由配置於收發 光之共通光路徑之結合透鏡24而結合之光纖25。 φ 於傳送光信號時，發光元件22發出之傳送光係通過分 光器21，經由光纖25而傳送往傳送端。又，於接收光信號 時，從光纖25射入，由感光元件23接受藉由分光器21反 射之接收光。 爲了確實進行上述之光信號之收發，必須將分光器2 1、 感光元件23、發光元件22及光纖25等之光軸各自調整成於 光信號之傳送時，從發光元件22所發出之傳送光將可正確 入射於光纖2 5，於接收光信號時，接收光可正確射入感光元 -13- 200527839 件23。具體來說藉由從發光元件22發出傳送光，或從光纖 25接受接收光等之方法，係各構件進行光軸對合。因此，於 組合光收發模組時，需要相當之時間外，對於完成品之光收 發模組之導線引腳51、51…及導線引腳52、52…之本體部2 之相對位置，係根據調整光軸之情況而每個製品不同。 本發明對於上述導線引腳位置之不同，係使用以下說明 之安裝方法，將光收發模組安裝於電路基板而加以吸收。第 3圖爲表示於本發明實施形態1之光收發裝置中之光收發模 • 組之安裝狀態側面圖。於第3圖中，對主電路基板31係搭 載著進行轉換光信號之電氣信號之接收處理，及作爲光信號 送出之電氣信號之傳送處理等之1C (未圖示）。 另外，於主電路基板31上設置著大致與主電路基板31 平行之副電路基板32。副電路基板32係可安裝於主電路基 板3 1上，且比主電路基板3 1較小。第4圖爲本發明實施形 態1之副電路基板32之斜視圖。副電路基板32係爲了可易 於連接光傳送部3之導線引腳51、51…，而設置於導線引腳 # 5 1、5 1…之長邊方向，且搭載著對於爲了將電氣信號轉成光 信號之對發光元件規定電流量的雷射驅動裝置IC41。又，於 副電路基板32之內外面爲了可焊接光傳送部3之導線引腳 51、51…，故設置導線引腳連接部42、42···。副電路基板32 係藉由將連接引腳43、43…插入主電路基板3 1，而可安裝 於主電路基板3 1。 於安裝光收發模組時，應將光傳送部3之導線引腳5 1、 5 1…連接於導線引腳連接部42、42···，以適當形狀形成導線 -14- 200527839 引腳51、51…，焊接成從副電路基板32之內外面挾住。藉 此，由於可易於吸收光傳送部3之導線引腳5 1、5 1…之相對 位置之相異，且可縮短雷射驅動裝置IC4 1與光傳送部3之 導線引腳5 1、5 1…之距離，故可減少信號之損失且可提高信 號之傳送効率。 於主電路基板3 1設置5個對應於光接收部4之導線引 腳52、52…之導線引腳連接用孔部33、33···。導線引腳連接 用孔部33係形成其直徑比導線引腳52、52…之直徑較爲大。 φ 於安裝時，將光傳送部3之導線引腳5 1、5 1…安裝於副 電路基板32後，再將光接收部4之導線引腳52、52···插入 於導線引腳連接用孔部3 3、3 3…，從主電路基板3 1內側藉 由焊接安裝。藉此，光接收部4之導線引腳52、52...相對位 置之相異，係以在具有比導線引腳52、52··.之直徑較大之直 徑之導線引腳連接用之孔部33、33...插入導線引腳52、 5 2...，故可易於吸收。同時，於較小的副電路基板32藉由 事先焊接光收發模組，例如，可藉由流動焊接而以一步驟將 φ 與副電路基板3 2爲整體化之光收發模組，安裝於主電路基 板3 1而製造步驟也較有効率。 又，副電路基板32係經由連接引腳43、43...或連接器 固定於主電路基板3 1，故即使將光收發模組連接於副電路基 板3 2時，亦無需特別於本體部2設置補強用構件。因此， 即使經由副電路基板3 2安裝光收發模組時，亦可堅固固定 於主電路基板3 1而無需特別補強用構件。 如上所述，藉由本實施形態1時，係可易於形成光傳送 -15- 200527839 部之導線引腳，不受到每個光收發模組相異之導線引腳位置 的影響，且由於將光接收部之導線引腳插入主電路基板之導 線引腳連接用孔部，故更可易於且確實固定。 (實施形態2 ) 第5圖爲表示於本發明實施形態2之光收發裝置中之光 收發模組之安裝狀態側面圖。於第5圖中於主電路基板3 1 中搭載著進行轉換光信號之電氣信號之接收處理，及送出將 電氣信號轉成光信號之電氣信號之傳送處理等之1C (未圖 鲁示）。 同時，於主電路基板31上設置著大致與主電路基板31 垂直之副電路基板3 2。第6圖爲副電路基板3 2之斜視圖。 副電路基板32係爲了可連接光傳送部3之導線引腳5 1、 51 ...，而設置於導線引腳52、52…之長邊方向，且搭載著對 於爲了將電氣信號轉成光信號的發光元件規定電流量之電 射驅動裝置IC41。又，於副電路基板32，爲了可插入光傳 送部3之導線引腳5 1、5 1…，故設置導線引腳連接用孔部 • 61、61...。副電路基板32係藉由將連接引腳43、43…插入 主電路基板31，而可安裝於主電路基板31。 於主電路基板31設置5個對應於光接收部4之導線引 腳52、52…之導線引腳連接用孔部33、33...。相同於實施形 態1，導線引腳連接用孔部33係形成其直徑比導線引腳52、 52...之直徑較爲大。 於安裝時，將光傳送部3之導線引腳5 1、5 1 ...插入副電 路基板3 2之導線引腳連接用孔部6 1、6 1…，再從副電路基 -16- 200527839 板3 2內側藉由焊接安裝。之後，將光接收部4之導線引腳 52、5 2...，插入導線引腳連接用孔部33、33···從主電路基板 3 1內側藉由焊接安裝。藉此光傳送部3之導線引腳5 1、5 1… 及光接收部4之導線引腳5 2、5 2…之相對位置之相異，係以 在具有比導線引腳51、51…直徑較大直徑之導線引腳連接用 之孔部61、61…，及具有比導線引腳52、52…直徑較大直徑 之導線引腳連接用之孔部33、33···，插入導線引腳51、51… 及導線引腳52、52...，故可易於吸收。在此情況，由於雷射 # 驅動裝置IC41與光傳送部3之導線引腳51、51…之距離較 短，故亦可提高傳送効率。再者，將較小之副電路基板32 對主電路基板31之連接引腳43、43...，與光接收部之導線 引腳52、52...之相對位置設於主電路基板31，可易於調整 成連接各自之連接用孔部之位置關係一致，故較易於將安裝 於較小的副電路基板32之光收發模組一次整合安裝於較大 之主電路基板3 1。 又，副電路基板32係經由連接引腳43、43…或連接器 # 固定於主電路基板3 1，故即使將光收發模組連接於副電路基 板3 2時，亦無需特別於本體部2設置補強用構件。因此， 即使經由副電路基板3 2安裝光收發模組時，亦可堅固固定 於主電路基板3 1而無需特別補強用構件。 如上所述，若藉由本實施形態2時，由於無需形成光傳 送部之導線引腳，且不受到每個光收發模組相異之導線引腳 位置的影響，故可易於確實將光收發模組安裝於電路基板。 又，於上述實施形態1及2中，光傳送部3與光接收部 -17- 200527839 4之安裝方向亦可相反。亦即，於主電路基板3 1之導線引腳 連接用之孔部3 3插入光傳送部3之導線引腳5 1、5 ! •，再 從主電路基板3 1之內側焊接。雷射驅動裝置IC4〗則設置於 主電路基板3 1之導線引腳連接用孔部3 3之附近。另外，將 光接收部4之導線引腳52、52···，則與實施形態1或2中之 光傳送部3之導線引腳5 1、5 1…之安裝方法相同地，安裝於 副電路基板3 2。藉此，可期待得到與實施形態丨及2相同之 効果。 • 又，光傳送信號模組亦可反向於光傳送部3與光接收部 4之配置位置之構造。亦即。於對向於連接光纖1部分的方 向設置光接收部3，而在交叉於從連接光纖丨的部分面向光 接收部3之方向，亦即，亦可於本體部2之側面設置光傳送 部4。於此構造中亦可期待得到與實施形態1及2相同之効 果。 【圖式簡單說明】 第1(a)圖爲表示安裝於本發明之實施形態1之光收發裝 # 置之光收發模組構造之斜視圖，（b)爲正面圖，（c)爲側面圖。 第2圖爲表示本發明之光收發模組內之光傳送路徑之示 意圖。 第3圖爲表示於本發明實施形態1之光收發裝置中之光 收發模組之安裝狀態側面圖。 第4圖爲本發明實施形態1之副電路基板之斜視圖。 第5圖爲表示於本發明實施形態2之光收發裝置中之光 收發模組之安裝狀態側面圖。 -18- 200527839 第6圖爲本發明實施形態2之副電路基板之斜視圖。 弟7圖爲表不先即之光收發裝置中之光收發模組之安裝 狀態平面圖。 第8圖爲表示先前之光收發裝置中之光收發模組之安裝 狀態斜視圖 【元件符號之說明】 1 光 纖 2 本 mob 體 部 3 光 傳 送 部 4 光 接 收 部 3 1 主 電 路 基 板 32 副 電 路 基 板 33 孔 部 51、52 導 線 引 腳200527839 IX. Description of the invention: [Technical field to which the invention belongs] The present invention is an optical transceiver device capable of easily and surely connecting a bidirectional optical transceiver module for receiving and emitting signals and a method for manufacturing the optical transceiver device. [Previous Technology] Recently, with the rapid development of communication technology, optical communication with faster signal transmission speed has attracted the attention of everyone. When the optical transceiver that receives and emits light signals is connected to the optical fiber of the optical transmission line, two-way optical transceiver modules with both a light receiving section and a light transmitting section are usually used. The previous two-way optical transceiver module has an electronic circuit including a lens, a photosensitive element, a light emitting element, a preamplifier, and a capacitor in the main body, and is connected (inserted) to a ferrule mounted on the optical fiber of the optical transmission line at one end of the main body. In addition, the lead pins of the light transmitting portion are extended from the other end of the main body portion for inputting electrical signals converted into light signals by the light emitting element. On the side near the center of the main body portion, the lead pins of the light receiving portion are extended. It is used to output the electrical signal converted by the light signal received by the photosensitive element (refer to Non-Patent Document 1). ® Optical communication using the above-mentioned optical transceiver module, for example, it is expanded to be used for communication between back panels of computers using previous electrical communications, communication between telephone exchanges, etc., but all optical transceiver modules must be configured On the overall circuit board. In this case, improving the installation density of the optical transceiver module and simplifying the optical transceiver device with the optical transceiver module will become one of the important issues. However, the optical transceiver module disclosed in Non-Patent Document 1, In order to align the optical axes to improve the optical coupling rate, it is necessary to align 200527839 lines for each optical transceiver module, and in each of the manufactured optical transceiver modules, the optical transmission section, the light receiving section and the main body section are relatively aligned. The positional relationship is slightly different. As a result, the relative positions of the lead pins extended from the light transmitting section and the lead pins extended from the light receiving section also vary with each optical transceiver module. When installing the lead pins, it is necessary to Receiving these differences and mounting on a circuit substrate requires considerable time during installation and requires proficiency in mounting steps, all of which are the main causes of increased manufacturing costs. Specifically, it is an optical transceiver using an optical transceiver module as shown in FIG. 7. In Fig. 7, a rectangular-shaped notch 72 is provided on the circuit substrate 71, and the optical transceiver module body is installed in the notch 72. That is, the lead pins 75, 75, ... of the forming light transmitting portion 73 are formed, and the lead pins 75, 75, ... are soldered on both the front and back sides to hold the circuit substrate 71. Similarly, the lead pins 76, 76, ... of the light receiving portion 74 are formed, and the lead pins 76, 76, ... are soldered on both the front and back sides to hold the circuit substrate 71. In addition, as shown in FIG. 8, for the lead pins 85, 85, ... of the light transmitting section 83 of the optical transceiver module and the lead pins 86, 86, ... of the light receiving section 84, these front end portions are formed In order to be perpendicular to the circuit board 81, insert the lead pins 85, 85 ... and the lead pins 86, 86 ... in the hole for connecting the lead pins of the circuit board 81. The back side can also use soldered optical transceivers. [Non-Patent Document 1] Infineon Tehnologies AG, BIDI Test Board User's Guide, Germany, S23481-A5159-51, March 25, 2002, but the former optical transceiver must be changed one by one The shape of the formed lead pins 75, 75 ... and lead pins 76, 76 ... has a problem that is very complicated during installation work 200527839. At the same time, since the components for fixing the optical transceiver module are composed of only the lead pins 75, 75 ... and the lead pins 76, 76 ..., the structure is not shock-resistant and must be fixed with a metal member for reinforcement of the main body. In the latter optical transceiver, the lead pins 85, 85, ... of the optical transmission unit need to be formed for mounting, and therefore require a considerable length. However, when the lead pins 85 and 85 of the optical transmission unit are increased, the transmission characteristics of electrical signals are deteriorated, and it is difficult to maintain good transmission signal characteristics and mounting on circuit boards. [Summary of the Invention] The present invention has been made in view of this situation. By using two circuit substrates to connect an optical transceiver module, an optical transceiver device that can be easily and surely mounted on a circuit substrate, and a method for manufacturing the optical transceiver device are provided. for purpose. In addition, the present invention is to provide an optical transceiver that can be mounted on a circuit substrate by using two circuit substrates, which is easy to form the lead pins of the optical transceiver module, and does not need to fix the reinforcing component of the body portion The purpose is to manufacture a device and a method for manufacturing an optical transceiver. In order to achieve the above object, the optical transceiver of the first invention is provided with an optical transceiver module for receiving and emitting light signals via an optical transmission line, and two circuit boards connected to the optical transceiver module; and the feature is that the aforementioned optical transceiver module has : The light transmitting section is provided with a lead pin for inputting an electrical signal to be converted into an optical signal in a direction opposite to the part connecting the aforementioned light transmitting line; and the light receiving section is provided with a lead pin for crossing the An electrical signal obtained by converting an optical signal is output from a direction in which the light transmission line is connected to the light transmission section; and one circuit substrate is a wire pin connection hole portion having a connection wire pin, and 200527839 is in another One circuit board is connected to the lead pins of the light transmitting section, and the one circuit board is connected to the lead pins of the light receiving section using the aforementioned lead pin connection hole section. Thus, it is easier to form the lead pins of the light transmitting section, and the light The lead pin of the receiving part is inserted into the lead pin connection hole of one circuit substrate, and will not be subject to different lead pin positions of each optical transceiver module. The impact of different, and may be robust optical transceiver module mounted on the circuit board. In addition, the optical transceiver of the second invention includes an optical transceiver module that receives light-emitting signals via an optical transmission line, and two electrical circuit boards connected to the optical transceiver module, and is characterized by the aforementioned optical transceiver module The system includes: a light receiving unit having a lead pin for outputting an electrical signal obtained by converting an optical signal in a direction opposite to a portion connected to the aforementioned optical transmission line portion; and a light transmitting unit having a lead pin for crosswise In the direction from the part connecting the optical transmission line to the light receiving part, an electrical signal to be converted into an optical signal is input; one circuit board is a wire pin connection hole part with a connecting wire pin, and the other is The circuit board is connected to the lead pins of the light receiving part, and the one-sided circuit board is connected to the lead pins of the light transmission part using the aforementioned lead pin connection hole part. Thereby, it is easier to form the lead pins of the light receiving part, and the lead pins of the light transmitting part are inserted into one of the hole holes for connecting the lead pins of the circuit board, so that they will not be subjected to the different leads of each optical transceiver module. Influence of the pin position, and the optical transceiver module can be firmly installed on the circuit substrate. In addition, in the light receiving device of the third invention of FIG. 3, in the first or second invention, the feature is that the other circuit board is located on the long side of the lead pin 200527839, and the direction is substantially parallel to the other circuit. Substrate. Thereby, it is easier to form the lead pins of the light transmitting section or the light receiving section, and at the same time, the optical transceiver module body can be fixed to the circuit substrate without any need to fix the reinforcing member of the main body section to install the optical transceiver module. On circuit board. In addition, in the optical transmitting and receiving device of the fourth invention of FIG. 5, in the first or second invention, the other circuit board is provided so as to intersect one circuit board, and the other circuit board is provided with a connecting wire pin. Hole for lead pin connection. Φ As a result, it is not necessary to form the lead pins of the light transmitting part or the light receiving part, and the other circuit board can be fixed surely, and the optical transceiver module can be mounted on the circuit board without fixing the reinforcing member of the main body part. In addition, the method for manufacturing an optical transceiver device according to the fifth invention is an optical transceiver device including an optical transceiver module that receives a light-emitting signal via an optical transmission line, and an optical transceiver device connected to two circuit substrates of the optical transceiver module. The optical transceiver module includes: a light transmitting section provided with a lead pin for inputting an electrical signal to be converted into an optical signal in a direction opposite to the part connecting the optical transmitting line; and a light receiving section provided with A lead pin is used to output an electrical signal obtained by converting an optical signal in a direction crossing from a portion connecting the aforementioned optical transmission line to the aforementioned light transmitting portion; one circuit board is a lead pin connection having a lead pin connected thereto The lead pin of the light transmitting portion is connected to the other circuit substrate through the hole portion, and the lead pin of the light receiving portion is connected to the circuit receiving portion by using the aforementioned lead pin connection hole portion. Thereby, it is easier to form the lead pins of the light transmitting portion, and the lead pins of the light receiving portion are inserted into the lead pin connection hole portions of the first circuit substrate, so that each of the optical transceiver modules will not be subject to -10- 200527839 The effect of different sets of wire pin positions, and the optical transceiver module can be firmly installed on the circuit substrate. At the same time, the optical transceiver module integrated on the second circuit substrate can be mounted on the first circuit board in a single step by welding the optical transceiver module on the smaller second circuit substrate by welding in advance. Circuit board, which effectively improves manufacturing steps. In addition, the manufacturing method of the optical transceiving device of the sixth invention is in an optical transceiving module provided with an optical transceiving module for receiving and emitting light signals through an optical transmission line, and two circuit substrates connected to the optical transceiving module. The optical transceiver module includes: a light receiving section provided with a lead pin for outputting an electrical signal obtained by converting the optical signal toward a direction opposite to the part connecting the optical transmission line; and an optical transmission section provided with a lead wire. Pin for inputting an electrical signal to be converted into an optical signal in a direction crossing from a portion connected to the optical transmission line to the aforementioned light receiving portion; and one circuit board is a lead pin connection having a lead pin Hole part, and the lead pin of the light receiving part is connected to the other circuit board, and the lead pin of the light receiving part is connected to the circuit board using the aforementioned lead pin connection hole part. Thereby, it is easier to form the lead pins of the light receiving portion, and the lead pins of the light transmitting portion are inserted into the lead pin connection hole portions of the first circuit substrate, so that they will not be different for each optical transceiver module. Influence of the position of the lead pins, and the optical transceiver module can be firmly installed on the circuit substrate. At the same time, by welding the optical transceiver module in advance on the smaller second circuit substrate, the optical transceiver module integrated on the second circuit substrate can be mounted on the first circuit substrate in one step by flow soldering, for example. This effectively improves manufacturing steps. -11- 200527839 In addition, in the fifth or sixth invention, the manufacturing method of the optical transmitting and receiving device according to the seventh invention is characterized in that the second circuit board is disposed substantially parallel to the first side of the lead pin of the lead wire. A circuit substrate. This makes it possible to easily form the lead pins of the light transmitting section or the light receiving section, and at the same time, securely fix the optical transceiver module body to the circuit substrate, and the optical transceiver module can be fixed without fixing the reinforcing member of the body section. Mounted on a circuit board. In addition, in the direction of the long side of the lead pin, a smaller second circuit substrate is soldered in advance, and then it can be repaired in a wide range by mounting on a larger first circuit substrate. It is also easy to recycle during manufacture. In addition, in the method for manufacturing an optical transceiver according to the eighth invention, in the fifth or sixth invention, the second circuit board is provided to intersect the first circuit board, and the second circuit board is provided with a connecting wire. The hole for the lead pin connection of the pin. This makes it possible to securely fix the second circuit substrate without forming the lead pins of the light transmitting portion or the light receiving portion, and the optical transceiver module can be mounted on the circuit substrate without fixing the reinforcing member of the main body portion. At the same time, the relative position of the connection pin of the smaller second circuit board to the first circuit board and the lead pin of the light receiving part can be easily adjusted to the position relationship with the connection hole of the first circuit board Consistent, making the optical transceiver module mounted on a smaller second circuit substrate easier to install on a larger first circuit substrate at a time. [Embodiment] Hereinafter, the present invention will be specifically described based on the drawings of its embodiment. (Embodiment 1) FIG. 1 is a perspective view (a) showing the structure of an optical transceiver module installed in the first embodiment of the present invention (-12-200527839), and a front view (b) of the optical transmission unit side And side view (c). As shown in Fig. 1 (a), the main body 2 of the optical transmission line fiber 1 is installed as the center, and the optical transmission portion 3 is provided in the direction opposite to the portion where the optical fiber 1 is connected. A part facing the direction of the light transmitting section 3, that is, a light receiving section 4 is provided on the side of the body section 2. The light transmitting part 3 is extended with four lead pins 51, 5 1 ... as shown in Fig. 1 (b), and the light receiving part 4 is extended with five lead pins as shown in Fig. 1 (c). 52, 52 ... In addition, these counts of the lead pins are exemplified. For example, the number of the lead pins of the light receiving section φ is 4, and other counts may be used. The optical fiber 1 may be connected to the optical transceiver module via a connector. Fig. 2 is a schematic diagram showing an optical transmission path in the optical transceiver module of the present invention. As shown in FIG. 2, the housing forming the body portion 2 includes a beam splitter 21 that forms a thin film on the end face of the glass block, and a light emitting element 22 that is formed by a laser diode that transmits light. A light receiving element 23 formed by a light diode, a photoelectric crystal, etc. that receives light, and an optical fiber 25 combined through a combining lens 24 arranged in a common light path for receiving and emitting light. φ When transmitting an optical signal, the transmitted light from the light emitting element 22 is transmitted to the transmitting end through the optical splitter 21 and the optical fiber 25. When receiving an optical signal, it is incident from an optical fiber 25, and the light received by the light receiving element 23 is reflected by the beam splitter 21. In order to reliably perform the above-mentioned optical signal transmission and reception, the optical axes of the beam splitter 21, the light receiving element 23, the light emitting element 22, and the optical fiber 25 must be adjusted to transmit light transmitted from the light emitting element 22 when the optical signal is transmitted It will be correctly incident on the optical fiber 25, and when receiving the optical signal, the received light can be correctly incident on the photosensitive element-13-200527839 pieces23. Specifically, by transmitting light from the light-emitting element 22 or receiving light from the optical fiber 25, the optical axes of the respective members are aligned. Therefore, when the optical transceiver module is combined, it takes considerable time. The relative positions of the lead pins 51, 51 ... and the lead pins 52, 52 ... of the finished optical transceiver module are based on The situation of adjusting the optical axis is different for each product. For the difference in the positions of the lead pins of the present invention, the optical transceiver module is mounted on a circuit substrate and absorbed by using a mounting method described below. Fig. 3 is a side view showing the installation state of the optical transceiver module in the optical transceiver device according to the first embodiment of the present invention. In Fig. 3, the main circuit board 31 is provided with 1C (not shown) for receiving and receiving electrical signals for converting optical signals, and transmitting and receiving electrical signals for optical signals. In addition, the main circuit board 31 is provided with a sub-circuit board 32 that is substantially parallel to the main circuit board 31. The sub-circuit board 32 can be mounted on the main circuit board 31 and is smaller than the main circuit board 31. Fig. 4 is a perspective view of the sub-circuit board 32 according to the first embodiment of the present invention. The sub-circuit board 32 is provided in the longitudinal direction of the lead pins # 5 1, 5 1... So as to be easily connected to the lead pins 51, 51... Of the optical transmission section 3. The laser signal driving device IC41 having a predetermined amount of current to the light emitting element of the optical signal. In addition, since the lead pins 51, 51, ... of the light transmitting portion 3 can be soldered on the inner and outer surfaces of the sub-circuit board 32, the lead pin connecting portions 42, 42 are provided. The sub-circuit board 32 can be mounted on the main circuit board 31 by inserting the connection pins 43, 43 ... into the main circuit board 31. When installing the optical transceiver module, the lead pins 5 1, 5 1 of the optical transmission part 3 should be connected to the lead pin connection parts 42, 42 ..., and the lead wire 14- 200527839 pin 51 should be formed in an appropriate shape. , 51..., Are soldered so as to be clamped from the inside to the outside of the sub-circuit board 32. Thereby, the relative positions of the lead pins 5 1, 5 1,... Of the light transmitting portion 3 can be easily absorbed, and the laser driving device IC 4 1 and the lead pins 5 1, 5 of the light transmitting portion 3 can be shortened. 1 ... distance, so can reduce the loss of the signal and improve the transmission efficiency of the signal. The main circuit board 31 is provided with five lead pin connection holes 33, 33, ... corresponding to the lead pins 52, 52, ... of the light receiving section 4. The lead pin connection hole 33 is formed to have a larger diameter than the lead pins 52, 52,.... φ At the time of installation, the lead pins 5 1, 5 1 of the light transmitting section 3 are mounted on the sub-circuit board 32, and then the lead pins 52, 52 of the light receiving section 4 are inserted into the lead pins for connection The holes 3, 3, 3, ... are mounted by soldering from the inside of the main circuit board 31. Thereby, the relative positions of the lead pins 52, 52, ... of the light receiving section 4 are different, and they are used for connection of lead pins having a larger diameter than the lead pins 52, 52 ... Since the hole portions 33, 33 ... are inserted into the lead pins 52, 5 2 ..., they can be easily absorbed. At the same time, the optical transceiver module is soldered to the smaller sub-circuit substrate 32 in advance, for example, φ and the sub-circuit substrate 32 can be integrated into the main optical transceiver module in one step by flow soldering and installed on the main The circuit board 31 is also more efficient in manufacturing steps. In addition, the sub-circuit board 32 is fixed to the main circuit board 31 via the connection pins 43, 43 ... or a connector. Therefore, even when the optical transceiver module is connected to the sub-circuit board 32, there is no need to specifically attach the main circuit board. 2 Install a reinforcing member. Therefore, even when an optical transceiver module is mounted via the sub-circuit board 32, it can be firmly fixed to the main circuit board 31 without requiring a special reinforcing member. As described above, according to the first embodiment, it is possible to easily form the lead wires of the light transmission -15-200527839, and it is not affected by the position of the lead wires of each optical transceiver module. The lead pins of the main part are inserted into the hole parts for connecting the lead pins of the main circuit board, so they can be fixed more easily and surely. (Embodiment 2) FIG. 5 is a side view showing the installation state of an optical transceiver module in an optical transceiver according to Embodiment 2 of the present invention. In FIG. 5, 1C (not shown) is provided on the main circuit board 31 for receiving processing for converting electrical signals into electrical signals and transmitting processing for converting electrical signals to optical signals. At the same time, the main circuit board 31 is provided with a sub-circuit board 32 substantially perpendicular to the main circuit board 31. Fig. 6 is a perspective view of the sub-circuit board 32. The sub-circuit board 32 is provided in the longitudinal direction of the lead pins 52, 52, ... so as to be able to be connected to the lead pins 51, 51, ... of the light transmitting portion 3. The sub-circuit board 32 is provided for converting electrical signals into light. The light emitting element of the signal is an electro-radiation driving device IC41 having a predetermined amount of current. In addition, in the sub-circuit board 32, in order to insert the lead pins 5 1, 5 1 ... of the optical transmission section 3, hole portions for connecting the lead pins 61, 61, ... are provided. The sub circuit board 32 can be mounted on the main circuit board 31 by inserting the connection pins 43, 43... Into the main circuit board 31. The main circuit substrate 31 is provided with five lead pin connection holes 33, 33 ... corresponding to the lead pins 52, 52, ... of the light receiving portion 4. Similar to the first embodiment, the lead pin connection hole 33 is formed to have a diameter larger than that of the lead pins 52, 52, .... At the time of installation, insert the lead pins 5 1 and 5 1 of the optical transmission part 3 into the lead pin connection holes 6 1, 6 1 ... of the sub-circuit board 3 2, and then from the sub-circuit base -16- 200527839 The inside of plate 3 2 is installed by welding. Thereafter, the lead pins 52, 5 2 ... of the light receiving portion 4 are inserted into the lead pin connection holes 33, 33 ..., and are mounted by soldering from the inside of the main circuit board 31. As a result, the relative positions of the lead pins 5 1, 5 1 ... of the light transmitting portion 3 and the lead pins 5 2, 5 2, ... of the light receiving portion 4 are different, so that the relative positions of the lead pins 51, 51 ... Holes 61, 61 for connecting lead wires having a larger diameter, and holes 33, 33, ... for connecting lead wires having a larger diameter than those of the lead pins 52, 52 ..., to insert a lead wire Pins 51, 51 ... and lead pins 52, 52 ... can be easily absorbed. In this case, since the distance between the laser # driving device IC41 and the lead pins 51, 51,... Of the optical transmission section 3 is short, the transmission efficiency can also be improved. Moreover, the relative positions of the connection pins 43, 43,... Of the smaller auxiliary circuit substrate 32 to the main circuit substrate 31, and the lead pins 52, 52... Of the light receiving section are set on the main circuit substrate 31. It can be easily adjusted so that the positional relationship of the respective connection holes is the same, so it is easier to integrate and install the optical transceiver module mounted on the smaller sub-circuit board 32 on the larger main circuit board 31 at a time. In addition, the sub-circuit board 32 is fixed to the main circuit board 31 via the connection pins 43, 43 ... or the connector #. Therefore, even when the optical transceiver module is connected to the sub-circuit board 32, there is no need to particularly attach the main circuit board 2 Set up reinforcement members. Therefore, even when an optical transceiver module is mounted via the sub-circuit board 32, it can be firmly fixed to the main circuit board 31 without requiring a special reinforcing member. As described above, according to the second embodiment, since it is not necessary to form the lead pins of the optical transmission section, and it is not affected by the position of the lead pins of each optical transceiver module, the optical transceiver module can be easily and reliably fixed. The group is mounted on a circuit board. Further, in the first and second embodiments, the mounting directions of the light transmitting section 3 and the light receiving section -17- 200527839 4 may be reversed. That is, the lead pins 5 3 of the light transmitting part 3 are inserted into the lead pin connecting holes 3 3 of the main circuit board 31, and then soldered from the inside of the main circuit board 31. The laser driving device IC4 is disposed near the lead pin connection hole 33 of the main circuit board 31. In addition, the lead pins 52 and 52 of the light receiving section 4 are mounted on the sub-stations in the same manner as in the mounting method of the lead pins 5 of the light transmitting section 3 in Embodiment 1 or 2. Circuit board 3 2. Thereby, it is expected that the same effects as those of Embodiments 1 and 2 can be obtained. • In addition, the optical transmission signal module can also be configured to be reversed to the positions of the optical transmission section 3 and the light receiving section 4. that is. The light receiving portion 3 is provided in a direction opposite to the portion where the optical fiber 1 is connected, and in a direction crossing the portion from the connecting fiber 1 to the light receiving portion 3, that is, the light transmitting portion 4 can also be provided on the side of the main body portion 2. . This structure can also be expected to obtain the same effects as those of the first and second embodiments. [Brief description of the drawings] Fig. 1 (a) is a perspective view showing the structure of an optical transceiver module installed in the optical transceiver device # 1 of Embodiment 1 of the present invention, (b) is a front view, and (c) is a side view. Illustration. Fig. 2 is a schematic diagram showing an optical transmission path in the optical transceiver module of the present invention. Fig. 3 is a side view showing the installation state of the optical transceiver module in the optical transceiver device according to the first embodiment of the present invention. Fig. 4 is a perspective view of a sub-circuit board according to the first embodiment of the present invention. Fig. 5 is a side view showing the installation state of the optical transceiver module in the optical transceiver device according to the second embodiment of the present invention. -18- 200527839 FIG. 6 is a perspective view of a sub circuit board according to a second embodiment of the present invention. Figure 7 is a plan view of the installation state of the optical transceiver module in the optical transceiver device that is not immediately available. Fig. 8 is a perspective view showing the installation state of the optical transceiver module in the previous optical transceiver. [Explanation of the component symbols] 1 Optical fiber 2 Mob body 3 Optical transmission unit 4 Optical receiver 3 1 Main circuit board 32 Sub-circuit Substrate 33 Holes 51, 52 Lead pins
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