JP4114614B2 - Optical transmitter / receiver and method for manufacturing optical transmitter / receiver - Google Patents

Description

  The present invention relates to an optical transceiver capable of easily and surely connecting a bidirectional optical transceiver module for transmitting and receiving an optical signal, and a method for manufacturing the optical transceiver.

  In recent years, with the rapid development of communication technology, optical communication with a high signal transmission speed has attracted attention. When an optical fiber that is an optical transmission line is connected to an optical transmission / reception apparatus that transmits and receives an optical signal, a bidirectional optical transmission / reception module that includes both a lead pin of an optical reception unit and a lead pin of an optical transmission unit is often used.

  A conventional bidirectional optical transceiver module has an electronic circuit including a lens, a light receiving element, a light emitting element, a preamplifier, and a capacitor in a main body, and an optical fiber as an optical transmission line at one end of the main body. The ferrule attached to is connected (inserted). Further, from the other end of the main body part, a lead pin of the optical transmission part for inputting an electric signal converted into an optical signal by the light emitting element extends, and the optical signal received by the light receiving element is present on the side surface near the center of the main body part. A lead pin of the optical receiver that outputs the converted electric signal extends (see Non-Patent Document 1).

  The optical communication using the optical transceiver module described above has been applied to, for example, communications between back panels of computers that have conventionally used telecommunications, communications between telephone exchanges, and the like. It has become necessary to arrange the transmission / reception module on an integrated circuit board. In this case, improvement of the mounting density of the optical transceiver module, downsizing of the optical transceiver apparatus provided with the optical transceiver module, and the like are important issues.

  However, the optical transmission / reception module disclosed in Non-Patent Document 1 needs to be aligned for each optical transmission / reception module in order to perform optical axis alignment to increase the coupling efficiency of light, and is manufactured. Every time, the relative positional relationship of the optical transmitter, the optical receiver, and the main body is slightly different. As a result, the relative positions of the lead pins extending from the optical transmitting unit and the lead pins extending from the optical receiving unit are also different for each optical transmission / reception module, and are attached to the circuit board while absorbing these differences when the lead pins are mounted. Since it is necessary, it takes a considerable amount of time for attachment, and a degree of proficiency is required for the attachment process.

  Specifically, for example, an optical transmission / reception apparatus to which an optical transmission / reception module is attached by a method as shown in FIG. 7 is used. In FIG. 7, a “U” -shaped cutout 72 is provided in the circuit board 71, and the optical transmission / reception module main body is inserted into the cutout 72. That is, the lead pins 75, 75,... Of the optical transmission unit 73 are formed, and the lead pins 75, 75,. Similarly, the lead pins 76, 76,... Of the optical receiver 74 are formed, and the lead pins 76, 76,.

Further, as shown in FIG. 8, the tip portions of the lead pins 85, 85,... Of the optical transmitter 83 of the optical transceiver module and the lead pins 86, 86,. The lead pins 85, 85,... And the lead pins 86, 86,... Are inserted into holes for connecting the lead pins provided in the circuit board 81, and the back surface of the circuit board 81 is formed. An optical transmission / reception apparatus soldered from the above is also employed.
Infineon Tehnologies AG, BIDI Test Board User's Guide, Germany, S23481-A5159-51, March 25, 2002

  However, in the former optical transmitter / receiver, it is necessary to change the shape of the formed lead pins 75, 75,... And the lead pins 76, 76,. There was a point. Further, since the members for fixing the optical transceiver module are only the lead pins 75, 75,... And the lead pins 76, 76,..., They are structurally weak against vibrations and need a reinforcing metal fitting for fixing the main body. There was also a problem of becoming.

  The latter optical transmitter / receiver is required to have a considerable length because the lead pins 85, 85,... Of the optical transmitter need to be formed for mounting. When 85, 85,... Become longer, there is a problem in that the transmission characteristics of the electric signal are deteriorated and it is difficult to attach the circuit board to the circuit board while maintaining the transmission characteristics satisfactorily.

  The present invention has been made in view of such circumstances, and an optical transmission / reception apparatus and an optical transmission / reception apparatus that can be easily and surely attached to a circuit board by connecting the optical transmission / reception module using two circuit boards. It aims at providing the manufacturing method of.

  In addition, the present invention makes it easy to form the lead pins in the optical transceiver module by using two circuit boards, and can be attached to the circuit board without requiring a reinforcing member for fixing the main body. An object of the present invention is to provide a device and a method for manufacturing an optical transceiver.

In order to achieve the above object, an optical transmission / reception apparatus according to a first aspect of the present invention includes an optical transmission / reception module that transmits / receives an optical signal via an optical transmission line, and two circuit boards connected to the optical transmission / reception module. in the optical transceiver, the optical transceiver module, the lead pins for inputting an electric signal to be converted to optical signals, and one end connected to said optical transmission line and optical transmission unit that is extended from the opposite other end the lead pin for outputting an electrical signal obtained by converting an optical signal, and an optical receiver which is extended in the direction of the plane intersecting the direction facing the other end from the one end, one circuit board is Li has Dopin connecting hole, be connected to one one of the lead pins of the other circuit board said light transmitting portions or light receiving unit, the other lead pins with the lead pin connection holes in the circuit board of the one be connected to one, The other circuit board has a connection pin, the one circuit board has a hole for connecting the connection pin, and the one circuit board is connected to the other circuit board by using the connection pin and the hole. A circuit board is connected.

An optical transmission / reception apparatus according to a second aspect of the present invention is an optical transmission / reception apparatus comprising an optical transmission / reception module for transmitting / receiving an optical signal via an optical transmission line, and two circuit boards connected to the optical transmission / reception module. The optical transmission / reception module includes: an optical receiver that extends a lead pin that outputs an electrical signal obtained by converting an optical signal from the other end opposite to one end connected to the optical transmission line; A lead pin for inputting an electric signal to be converted into a signal is extended from a surface intersecting with the direction facing the other end from the one end, and one circuit board has a lead pin connecting hole portion. And having one lead pin of the optical transmitter or optical receiver connected to the other circuit board, and connecting the other lead pin to the one circuit board using the lead pin connection hole, The other circuit board Has a connecting pin, the circuit board of the one having a hole for connecting the connecting pin, with said connecting pin and the hole, and connecting the other of the circuit board to the one circuit board It is characterized by being.

In the optical transceiver according to the third aspect of the present invention, in the first or second aspect of the present invention , the other circuit board is installed so as to be substantially parallel to the one circuit board in the longitudinal direction of the one lead pin. It is characterized by being.
Further, the optical transmitter-receiver according to the fourth invention, in the first or second aspect of the invention, Yes and the other circuit board is placed so as to cross with the circuit board of the one, the other circuit board is re Dopin connection It is characterized by comprising a hole for use.

Method of manufacturing an optical transmitting and receiving apparatus according to the fifth aspect of the present invention in order to achieve the above object, an optical transceiver module for transmitting and receiving an optical signal via an optical transmission line, the first circuit board is connected to the optical transceiver module And a second circuit board smaller than the first circuit board, wherein the optical transmission / reception module has a lead pin for inputting an electric signal to be converted into an optical signal, and one end connected to the optical transmission line. The optical transmission part extended from the other end on the opposite side and the lead pin for outputting the electrical signal obtained by converting the optical signal were extended from the surface intersecting the direction from the one end to the other end . and a light receiving portion, the first circuit board in the manufacturing method of the optical transceiver having a hole for re Dopin connection, said second circuit board has a connection pin, said first circuit board Has a hole for connecting the connection pin, After connecting the one lead pin of the light transmitting unit or the light receiving unit to serial second circuit board, with the lead pin connection hole connecting the other lead pin to the first circuit board, and the connecting pin The second circuit board is connected to the first circuit board using the hole.

According to a sixth aspect of the present invention, there is provided a method of manufacturing an optical transmission / reception device, an optical transmission / reception module for transmitting / receiving an optical signal through an optical transmission line, a first circuit board to which the optical transmission / reception module is connected, and the first A second circuit board smaller than the circuit board, wherein the optical transmission / reception module has a lead pin for outputting an electrical signal obtained by converting an optical signal, on the side opposite to one end connecting the optical transmission line An optical receiver that extends from the other end of the optical signal, and an optical transmitter that extends a lead pin for inputting an electrical signal to be converted into an optical signal from a plane that intersects the direction from the one end to the other end. And the first circuit board has a lead pin connection hole, and the second circuit board has a connection pin, and the first circuit board connects the connection pin. Said second circuit board After connecting one lead pin of the optical transmitter or optical receiver, the other lead pin is connected to the first circuit board using the lead pin connection hole, and the connection pin and the hole are used. The second circuit board is connected to the first circuit board .

According to a seventh aspect of the present invention, in the fifth or sixth aspect of the invention , the second circuit board is substantially parallel to the first circuit board in the longitudinal direction of the one lead pin. It is installed so that it becomes.
According to an eighth aspect of the present invention, in the fifth or sixth aspect of the invention, the second circuit board is installed so as to cross the first circuit board. circuit board is characterized by having a for Li Dopin connection hole.

In the first invention, the optical transmission unit has two circuit boards, and the optical transmission unit has a lead pin for inputting an electric signal to be converted into an optical signal on the side opposite to one end of the optical transmission / reception module connected to the optical transmission line . The optical receiver extends the lead pin that outputs an electrical signal obtained by converting the optical signal from the surface of the optical transceiver module in a direction crossing the direction from the one end to the other end. Te Yes, one of the lead pins of the light transmitting portions or light receiving portions are connected to the other circuit board, it is inserted the other lead pin of the light transmitting portions or light receiving unit to the lead pin connection hole of the one circuit board The connection pin of the other circuit board is inserted into the hole of one circuit board, and the other lead pin and connection pin are soldered . Thus, the other lead pin is inserted into the lead pin connection hole of one circuit board, and the connection pin of the other circuit board is inserted into the hole of one circuit board, which differs for each optical transceiver module. without being affected by the difference of the lead pin position, it is possible to firmly attached to the two circuit boards optical transceiver module without separately requiring a reinforcing member.

In the second aspect of the invention , the optical receiver has two circuit boards, and the optical receiver has a lead pin for outputting an electrical signal obtained by converting the optical signal, and one end of the optical transceiver module connected to the optical transmission line. The optical transmitter extends a lead pin for inputting an electric signal to be converted into an optical signal from the surface of the optical transceiver module in a direction crossing the direction from the one end to the other end. Connect one lead pin of the optical transmitter or optical receiver to the other circuit board, and insert the other lead pin of the optical transmitter or optical receiver into the lead pin connection hole of one circuit board At the same time, the connection pins of the other circuit board are inserted into the holes of the one circuit board, and the other lead pins and connection pins are soldered. Thus, the other lead pin is inserted into the lead pin connection hole of one circuit board, and the connection pin of the other circuit board is inserted into the hole of one circuit board, which differs for each optical transceiver module. The optical transmission / reception module can be firmly attached to the two circuit boards without depending on the difference in the lead pin position and without requiring a separate reinforcing member.

In the third invention , the other circuit board connected to one circuit board is provided so as to be substantially parallel to the one circuit board in the longitudinal direction of one lead pin connected to the other circuit board. Form one lead pin so as to sandwich the other circuit board from the front and back and connect it by soldering, insert the other lead pin into the lead pin connection hole of one circuit board, and insert into the hole of one circuit board The connection pins of the other circuit board are inserted, and the other lead pins and connection pins are soldered from the back side of the one circuit board. As a result, the forming of only one lead pin facilitates the forming of the lead pin, and the longitudinal direction of one lead pin is substantially the same as the surface of the other circuit board, so that the optical transceiver module is securely fixed to the circuit board. Therefore, the optical transmission / reception module can be firmly attached to the circuit board by the two circuit boards arranged substantially in parallel without requiring a separate reinforcing member.
In the fourth invention, the other circuit board is provided so as to cross the one circuit board , and one lead pin is inserted into the lead pin connection hole provided in the other circuit board, from the back side of the other circuit board. Solder and insert the other lead pin into the lead pin connection hole of one circuit board, insert the connection pin of the other circuit board into the hole of one circuit board, and connect the other lead pin and connection pin to one Solder from the back side of the circuit board. Thus, one optical pin can be securely fixed to the other circuit board without forming one lead pin, and the optical transmission / reception module can be connected to the circuit board by two cross-arranged circuit boards without requiring a separate reinforcing member. It becomes possible to attach firmly to .

In the fifth invention, the first circuit board and the second circuit board smaller than the first circuit board have two circuit boards, and the optical transmission unit is a lead pin for inputting an electric signal to be converted into an optical signal Extending from the other end opposite to one end of the optical transmission / reception module to which the optical transmission line is connected, and the optical receiver has a lead pin for outputting an electric signal obtained by converting the optical signal, the one end intersecting the direction facing the other end from the Yes and is extended from the surface of the optical transceiver module in a direction, after contacting one of the lead pins of the light transmitting portions or light receiving section to a small second circuit board connection, large first lead pin connection hole of the circuit board to the insertion, with soldered by inserting the other of the lead pin of the light transmitting portions or light receiving unit, a connection pin of the second circuit board into the hole of the first circuit board And solder . Accordingly, the other lead pin is inserted into the lead pin connection hole of the first circuit board, and the connection pin of the second circuit board is inserted into the hole of the first circuit board. Therefore, the optical transmission / reception module can be firmly attached to the two circuit boards without the need for a separate reinforcing member, regardless of the difference in the lead pin positions. In addition, by first soldering the optical transceiver module to the small second circuit board, the optical transceiver module integrated with the second circuit board is attached to the first circuit board in one step, for example, by flow soldering. And the manufacturing process becomes efficient.

In the sixth aspect of the invention, the first circuit board and the second circuit board smaller than the first circuit board are provided, and the optical receiver obtains the electric signal obtained by converting the optical signal. A lead pin for outputting a signal is extended from the other end opposite to one end of the optical transmission / reception module connected to the optical transmission line, and the optical transmission unit has a lead pin for inputting an electrical signal to be converted into an optical signal, It is extended from the surface of the optical transceiver module in a direction crossing the direction from the one end to the other end, and after connecting one lead pin of the optical transmitter or the optical receiver to a small second circuit board, Insert and solder the other lead pin of the optical transmitter or receiver to the lead pin connection hole of one circuit board, and connect the connection pin of the second circuit board to the hole of the first circuit board. Insert and solder each one. Accordingly, the other lead pin is inserted into the lead pin connection hole of the first circuit board, and the connection pin of the second circuit board is inserted into the hole of the first circuit board. Therefore, the optical transmission / reception module can be firmly attached to the two circuit boards without the need for a separate reinforcing member, regardless of the difference in the lead pin positions. In addition, by first soldering the optical transceiver module to the small second circuit board, the optical transceiver module integrated with the second circuit board is attached to the first circuit board in one step, for example, by flow soldering. And the manufacturing process becomes efficient.

In the seventh invention , the second circuit board connected to the first circuit board is substantially parallel to the first circuit board in the longitudinal direction of one lead pin connecting the second circuit board. For example, one lead pin is formed so as to sandwich the second circuit board from the front and back and connected by soldering, and then the other lead pin is inserted into the lead pin connection hole of the first circuit board, The connection pins of the second circuit board are inserted into the holes of the circuit board, and the other lead pins and connection pins are soldered from the back side of the first circuit board. As a result, only one lead pin is formed to facilitate the formation of the lead pin, and the longitudinal direction of one lead pin is substantially the same as the surface of the second circuit board, and the optical transceiver module is securely fixed to the circuit board. Therefore, the optical transmission / reception module can be firmly attached to the circuit board by the two circuit boards arranged substantially in parallel without requiring a separate reinforcing member. In addition, after adjusting the position in the longitudinal direction of one lead pin, solder the small second circuit board first, and then attach it to the large first circuit board to correct the displacement of the connection position over a wide range. This makes it easier to handle during manufacturing.
In the eighth invention, the second circuit board is provided so as to cross the first circuit board, and after inserting one lead pin into the lead pin connection hole provided in the second circuit board and soldering. The other lead pin is inserted into the lead pin connection hole of the first circuit board, the connection pin of the second circuit board is inserted into the hole of the first circuit board, and the other lead pin and the connection pin are inserted into the first circuit board. Solder from the back side of the circuit board. Thus, one optical pin can be securely fixed to the other circuit board without forming one lead pin, and the optical transmission / reception module can be connected to the circuit board by two cross-arranged circuit boards without requiring a separate reinforcing member. It becomes possible to attach firmly to. In addition, the relative position between the small second circuit board connection pin and the other lead pin can be easily adjusted to match the positional relationship between the first circuit board connection hole and the lead pin connection hole. It is possible to easily attach the optical transceiver module attached to the small second circuit board to the large first circuit board in a lump.

According to the first and second inventions , the other lead pin is inserted into the lead pin connection hole of one circuit board, and the connection pin of the other circuit board is inserted into the hole of one circuit board. By attaching, it is possible to firmly attach the optical transceiver module to the two circuit boards without depending on the difference in the lead pin position which is different for each optical transceiver module, and without requiring a separate reinforcing member. Become.

According to the third invention, the forming of one of the lead pin is facilitated, it is possible to reliably fix the optical transceiver module to a circuit board, the optical transceiver module without separately requiring reinforcement member It becomes possible to firmly attach to two circuit boards arranged substantially in parallel .

Further, according to the fourth invention, the two lead pins can be securely fixed to the other circuit board without forming one lead pin, and the optical transmission / reception modules are cross-arranged without requiring a separate reinforcing member . It can be firmly attached to the circuit board.

According to the fifth and sixth inventions , the other lead pin is inserted into the lead pin connection hole of the first circuit board and the connection pin of the second circuit board is inserted into the hole of the first circuit board. by respectively soldering Te, without being influenced by the differences in the lead pin position is different for each optical transceiver module, rigidly attached to the optical transceiver module to the two circuit boards without separately requiring reinforcement member Is possible. In addition, by first soldering the optical transceiver module to the small second circuit board, the optical transceiver module integrated with the second circuit board is attached to the first circuit board in one step, for example, by flow soldering. And the manufacturing process becomes efficient.

According to the seventh invention, the forming of one of the lead pin is facilitated, it is possible to reliably fix the optical transceiver module to a circuit board, the optical transceiver module without separately requiring reinforcement member It becomes possible to firmly attach to two circuit boards arranged substantially in parallel . Further, while adjusting the position in the longitudinal direction of one of the lead pins, after soldering a small second circuit board previously, by mounting a large first circuit board, to extensively modify the deviation of the connection position This makes it easier to handle during manufacturing.

According to the eighth aspect of the present invention, it is possible to securely fix one lead pin to the second circuit board without forming one , and to connect the optical transceiver module to two circuits without requiring a separate reinforcing member. It can be firmly attached to the substrate. Also, a small second relative position of the connecting pin and the other lead pins of the circuit board is easily be adjusted to match the positional relationship between the connection hole of the first circuit board and the lead pin connecting hole Therefore, it becomes easy to collectively attach the optical transceiver module attached to the small second circuit board to the large first circuit board.

  Hereinafter, the present invention will be specifically described with reference to the drawings showing embodiments thereof.

(Embodiment 1)
FIG. 1 is a perspective view (a) showing a configuration of an optical transmission / reception module attached to an optical transmission / reception apparatus according to Embodiment 1 of the present invention, a front view (b) and a side view (c) viewed from the optical transmission unit side. is there. As shown in FIG. 1A, the optical transmission unit 3 is placed in a direction opposite to the portion to which the optical fiber 1 is connected, with the main body 2 to which the optical fiber 1 serving as an optical transmission line is attached. The light receiving unit 4 is provided in a direction crossing the direction of facing the light transmitting unit 3 from the portion where the two are connected, that is, on the side surface side of the main body unit 2. The optical transmission unit 3 extends four lead pins 51, 51,... As shown in FIG. 1B, and the optical reception unit 4 includes lead pins 52, 52 as shown in FIG. ... 5 are extended. Needless to say, the optical fiber 1 may be connected to the optical transceiver module via a connector.

  FIG. 2 is a diagram showing an optical transmission line in the optical transceiver module according to the present invention. As shown in FIG. 2, a package forming the main body 2 includes a beam splitter 21 in which a thin film is formed on the end face of the glass block, a light emitting element 22 composed of a laser diode that generates transmission light, and a photo that receives received light. A light receiving element 23 composed of a diode, a phototransistor, and the like, and an optical fiber 25 coupled through a coupling lens 24 disposed in a common optical path of transmission / reception light are provided.

  When transmitting an optical signal, the transmission light emitted from the light emitting element 22 passes through the beam splitter 21 and is transmitted to the transmission destination via the optical fiber 25. At the time of receiving an optical signal, the light receiving element 23 receives the received light that is incident from the optical fiber 25 and reflected by the beam splitter 21.

  In order to reliably transmit and receive the optical signal described above, the transmission light emitted from the light emitting element 22 is transmitted through the optical axes of the beam splitter 21, the light receiving element 23, the light emitting element 22, the optical fiber 25, and the like. Must be adjusted so that the received light accurately enters the light receiving element 23 when receiving the optical signal so that the light enters the optical fiber 25 accurately. Specifically, the optical axes of the respective members are aligned by a method such as transmitting light from the light emitting element 22 or receiving received light from the optical fiber 25. Therefore, it takes a considerable time to assemble the optical transceiver module, and the relative positions of the lead pins 51, 51,... And the lead pins 52, 52,. Will differ for each product depending on how the optical axis is adjusted.

  In the present invention, the difference in the lead pin position described above is absorbed by attaching the optical transceiver module to the circuit board using the attachment method described below. FIG. 3 is a side view showing an attached state of the optical transceiver module in the optical transceiver according to Embodiment 1 of the present invention. In FIG. 3, the main circuit board 31 is mounted with an IC (not shown) that performs reception processing of an electrical signal converted from an optical signal, transmission processing of an electrical signal transmitted as an optical signal, and the like.

  Further, a sub circuit board 32 that is substantially parallel to the main circuit board 31 is provided on the main circuit board 31. The sub circuit board 32 can be mounted on the main circuit board 31 and is smaller than the main circuit board 31. FIG. 4 is a perspective view of the sub circuit board 32 according to Embodiment 1 of the present invention. The sub circuit board 32 is provided in the longitudinal direction of the lead pins 51, 51,... So that the lead pins 51, 51,. A laser driver IC 41 that determines the amount of current for the light emitting element for conversion into a signal is mounted. Further, lead pin connection portions 42, 42,... Are provided on the front and back surfaces of the sub circuit board 32 so that the lead pins 51, 51,. The sub circuit board 32 is attached to the main circuit board 31 by inserting the connection pins 43, 43,... Into the main circuit board 31.

  When the optical transmission / reception module is attached, the lead pins 51, 51,... Of the optical transmission unit 3 are formed into an appropriate shape so as to be connected to the lead pin connection portions 42, 42,. Then, soldering is performed so as to be sandwiched from the front and back of the sub circuit board 32. As a result, the difference in the relative positions of the lead pins 51, 51,... Of the optical transmission unit 3 can be easily absorbed, and the laser driver IC 41 and the lead pins 51, 51,. Since the distance is short, signal loss can be reduced and signal transmission efficiency can be increased.

  The main circuit board 31 is provided with five lead pin connection holes 33, 33,... Corresponding to the lead pins 52, 52,. The hole 33 for connecting the lead pins is formed so that the diameter thereof is larger than the diameter of the lead pins 52, 52,.

  At the time of attachment, after the lead pins 51, 51,... Of the optical transmitter 3 are attached to the sub circuit board 32, the lead pins 52, 52,.・ Attach to and attach by soldering from the back side of the main circuit board 31. As a result, the difference in the relative positions of the lead pins 52, 52,... Of the optical receiver 4 is such that the lead pins connecting holes 33, 33,. It can be easily absorbed by inserting the lead pins 52, 52,. In addition, by first soldering the optical transceiver module to the small sub circuit board 32, the optical transceiver module integrated with the sub circuit board 32 can be attached to the main circuit board 31 in one step, for example, by flow soldering. The manufacturing process becomes efficient.

  Since the sub circuit board 32 is fixed to the main circuit board 31 via the connection pins 43, 43,... Or the connector, even when the optical transmission / reception module is connected to the sub circuit board 32, In particular, it is not necessary to provide a reinforcing member on the main body 2. Therefore, even when the optical transmission / reception module is attached via the sub circuit board 32, it can be firmly fixed to the main circuit board 31, and a separate reinforcing member is not required.

  As described above, according to the first embodiment, the lead pin of the optical transmitter can be easily formed, and the lead pin of the optical receiver is not affected by the difference in the lead pin position that is different for each optical transceiver module. Can be easily and surely fixed by inserting into the lead pin connection hole of the main circuit board.

(Embodiment 2)
FIG. 5 is a side view showing an attached state of the optical transceiver module in the optical transceiver according to Embodiment 2 of the present invention. In FIG. 5, the main circuit board 31 is mounted with an IC (not shown) that performs a reception process of an electrical signal converted from an optical signal, a transmission process of transmitting an electrical signal that converts the electrical signal into an optical signal, and the like. ing.

  On the main circuit board 31, a sub circuit board 32 substantially orthogonal to the main circuit board 31 is provided. FIG. 6 is a perspective view of the sub circuit board 32. The sub circuit board 32 is provided in the longitudinal direction of the lead pins 52, 52,... So that the lead pins 51, 51,. A laser driver IC 41 for determining the amount of current for the light emitting element for mounting is mounted. Further, the sub circuit board 32 is provided with lead pin connecting holes 61, 61,... So that the lead pins 51, 51,. The sub circuit board 32 is attached to the main circuit board 31 by inserting the connection pins 43, 43,... Into the main circuit board 31.

  The main circuit board 31 is provided with five lead pin connection holes 33, 33,... Corresponding to the lead pins 52, 52,. As in the first embodiment, the lead pin connecting hole 33 is formed so that its diameter is larger than the diameter of the lead pins 52, 52,.

  At the time of attachment, the lead pins 51, 51,... Of the optical transmission unit 3 are inserted into the hole portions 61, 61,... For connecting the lead pins of the sub circuit board 32 and soldered from the back side of the sub circuit board 32. It attaches by. Then, the lead pins 52, 52,... Of the optical receiver 4 are inserted into the lead pin connection holes 33, 33,... And soldered from the back side of the main circuit board 31. , And the relative positions of the lead pins 52, 52,... Of the optical receiver 4 are larger than the diameters of the lead pins 51, 51,. The lead pins 51, 51,... And the lead pin connection holes 33, 33,... Having a diameter larger than the diameter of the lead pins 51, 51,. , ... and the lead pins 52, 52, ... can be easily absorbed. Further, since the distance between the laser driver IC 41 and the lead pins 51, 51,... Of the optical transmission unit 3 is short, it is possible to increase the transmission efficiency. Further, relative positions of the connection pins 43, 43,... To the main circuit board 31 of the small sub circuit board 32 and the lead pins 52, 52,. Further, the optical transmission / reception module attached to the small sub circuit board 32 can be easily attached to the large main circuit board 31 in a lump so that it can be easily adjusted so as to coincide with the positional relationship of the connection holes connecting the respective parts. It becomes easy.

  Since the sub circuit board 32 is fixed to the main circuit board 31 via the connection pins 43, 43,... Or the connector, even when the optical transmission / reception module is connected to the sub circuit board 32, In particular, it is not necessary to provide a reinforcing member on the main body 2. Therefore, even when the optical transmission / reception module is attached via the sub circuit board 32, it can be firmly fixed to the main circuit board 31, and a separate reinforcing member is not required.

  As described above, according to the second embodiment, it is not necessary to form the lead pin of the optical transmission unit, and the optical transmission / reception module is not affected by the difference in the lead pin position that is different for each optical transmission / reception module. It is possible to easily and reliably attach to.

  In the first and second embodiments described above, the mounting directions of the optical transmitter 3 and the optical receiver 4 may be reversed. In other words, the lead pins 51, 51,... Of the optical transmission unit 3 are inserted into the hole 33 for connecting the lead pins of the main circuit board 31 and soldered from the back side of the main circuit board 31. The laser driver IC 41 is provided in the vicinity of the hole 33 for connecting the lead pins of the main circuit board 31. On the other hand, the lead pins 52, 52,... Of the optical receiver 4 are attached to the sub circuit board 32 in the same manner as the mounting of the lead pins 51, 51,. Install. As a result, the same effect as in the first or second embodiment can be expected.

  Further, the optical transceiver module may be configured such that the arrangement positions of the optical transmitter 3 and the optical receiver 4 are reversed. That is, the light receiving unit 3 is crossed with the direction in which the optical receiving unit 3 is desired from the portion connecting the optical fiber 1 in the direction facing the portion connecting the optical fiber 1, that is, the side surface of the main body 2. The structure which provides the optical transmission part 4 in the side may be sufficient. Even in such a configuration, the same effect as in the first or second embodiment can be expected.

(A) is a perspective view which shows the structure of the optical transmission / reception module attached to the optical transmission / reception apparatus which concerns on Embodiment 1 of this invention, (b) is a front view, (c) is a side view. It is a figure which shows the optical transmission line in the optical transmission / reception module which concerns on this invention. It is a side view which shows the attachment state of the optical transmission / reception module in the optical transmission / reception apparatus which concerns on Embodiment 1 of this invention. 1 is a perspective view of a sub circuit board according to Embodiment 1 of the present invention. It is a side view which shows the attachment state of the optical transmission / reception module in the optical transmission / reception apparatus which concerns on Embodiment 2 of this invention. It is a perspective view of the sub circuit board concerning Embodiment 2 of the present invention. It is a top view which shows the attachment state of the optical transmission / reception module in the conventional optical transmission / reception apparatus. It is a perspective view which shows the attachment state of the optical transmission / reception module in the conventional optical transmission / reception apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical fiber 2 Main body part 3 Optical transmission part 4 Optical reception part 31 Main circuit board 32 Subcircuit board 33 Hole part 51, 52 Lead pin

Claims (8)

In an optical transmission / reception apparatus comprising an optical transmission / reception module for transmitting / receiving an optical signal via an optical transmission line, and two circuit boards to which the optical transmission / reception module is connected,
The optical transmission / reception module converts an optical signal with an optical transmission unit in which a lead pin for inputting an electrical signal to be converted into an optical signal is extended from the other end opposite to one end connected to the optical transmission line. the lead pin for outputting an electric signal obtained by, and a light receiving unit is extended in the direction of the plane intersecting the direction facing the other end from the one end,
One circuit board has a hole for re Dopin connection,
Yes Connect one lead pin on the other of the circuit board the light transmitting unit or the light receiving unit, by using the lead pin connection holes in the circuit board of the one be connected to one another lead pin,
The other circuit board has a connection pin, the one circuit board has a hole for connecting the connection pin, and the one circuit board is connected to the other circuit board by using the connection pin and the hole. An optical transmission / reception device having a circuit board connected thereto. In an optical transmission / reception apparatus comprising an optical transmission / reception module for transmitting / receiving an optical signal via an optical transmission line, and two circuit boards to which the optical transmission / reception module is connected,
The optical transmission / reception module includes: an optical receiver that extends a lead pin that outputs an electrical signal obtained by converting an optical signal from the other end opposite to one end connected to the optical transmission line; A lead pin for inputting an electrical signal to be converted into a signal, and an optical transmitter extending from a surface in a direction crossing the direction facing the other end from the one end;
One circuit board has a lead pin connection hole,
One lead pin of the optical transmitter or the optical receiver is connected to the other circuit board, and the other lead pin is connected to the one circuit board using the lead pin connection hole,
The other circuit board has a connection pin, the one circuit board has a hole for connecting the connection pin, and the one circuit board is connected to the other circuit board by using the connection pin and the hole. An optical transmission / reception device having a circuit board connected thereto. The other circuit board, the longitudinal direction of one of the lead pins, the optical transceiver according to claim 1 or 2, wherein said are installed so as to be parallel to one of the circuit board and substantially. The other Yes of a circuit board installed to cross the circuit board of the one, the other circuit board is a light transmitting and receiving device according to claim 1, wherein further comprising a for Li Dopin connection hole. An optical transceiver module for transmitting and receiving an optical signal via an optical transmission line, a first circuit board to which the optical transceiver module is connected, and a second circuit board smaller than the first circuit board,
The optical transmission / reception module converts an optical signal with an optical transmission unit in which a lead pin for inputting an electrical signal to be converted into an optical signal is extended from the other end opposite to one end connected to the optical transmission line. the lead pin for outputting an electric signal obtained by, and a light receiving unit is extended in the direction of the plane intersecting the direction facing the other end from the one end,
Said first circuit board in the manufacturing method of the optical transceiver having a hole for re Dopin connection,
The second circuit board has a connection pin, the first circuit board has a hole for connecting the connection pin,
After connecting one lead pin of the optical transmitter or the optical receiver to the second circuit board, connect the other lead pin to the first circuit board using the lead pin connection hole, and A method of manufacturing an optical transceiver, wherein the second circuit board is connected to the first circuit board using the hole. An optical transceiver module for transmitting and receiving an optical signal via an optical transmission line, a first circuit board to which the optical transceiver module is connected, and a second circuit board smaller than the first circuit board,
The optical transmission / reception module includes: an optical receiver that extends a lead pin that outputs an electrical signal obtained by converting an optical signal from the other end opposite to one end connected to the optical transmission line; A lead pin for inputting an electrical signal to be converted into a signal, and an optical transmitter extending from a surface in a direction crossing the direction facing the other end from the one end;
In the method of manufacturing an optical transceiver having the lead pin connection hole portion, the first circuit board,
The second circuit board has a connection pin, the first circuit board has a hole for connecting the connection pin,
After connecting one lead pin of the optical transmitter or the optical receiver to the second circuit board, connect the other lead pin to the first circuit board using the lead pin connection hole, and A method of manufacturing an optical transceiver, wherein the second circuit board is connected to the first circuit board using the hole. 7. The optical transceiver according to claim 5, wherein the second circuit board is disposed so as to be substantially parallel to the first circuit board in a longitudinal direction of the one lead pin. Method. The second Yes circuit board installed to cross with the first circuit board, the second circuit board light according to claim 5 or 6, wherein further comprising a hole for Li Dopin connection Manufacturing method of transmission / reception device.

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