CN100376911C - Light transmittingand receiving device and method for light transmitting and receiving device - Google Patents
Light transmittingand receiving device and method for light transmitting and receiving device Download PDFInfo
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- CN100376911C CN100376911C CNB2005100063393A CN200510006339A CN100376911C CN 100376911 C CN100376911 C CN 100376911C CN B2005100063393 A CNB2005100063393 A CN B2005100063393A CN 200510006339 A CN200510006339 A CN 200510006339A CN 100376911 C CN100376911 C CN 100376911C
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- 238000000034 method Methods 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims abstract description 169
- 230000003287 optical effect Effects 0.000 claims abstract description 77
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 238000012545 processing Methods 0.000 description 17
- 239000013307 optical fiber Substances 0.000 description 14
- 238000003466 welding Methods 0.000 description 9
- 230000002708 enhancing effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
Abstract
The invention is aimed to provide a light transmitting/receiving device that can easily and surely secure a light transmitting/receiving module by using two circuit substrates, and to provide a manufacturing method therefor. The light transmitting/receiving device is provided with a light transmitting/receiving module to transmit/receive an optical signal through an optical transmission line and two circuit substrates connecting with the light transmitting/receiving module. The light transmitting/receiving module is provided with a light transmitter having a lead pin that inputs an electric signal to convert it into an optical signal in a direction opposite to a part connecting with the optical transmission line, and a light receiver having a lead pin that outputs an electric signal obtained by converting an optical signal in a direction crossing a direction that face the light transmitter from a part connecting with the optical transmission line. One circuit substrate is formed with a lead pin connection hole to connect the lead pin, one lead pin is connected with the other circuit substrate, and the other lead pin is connected with one circuit substrate by using the lead pin connection hole.
Description
Technical field
The present invention relates to a kind of can be easily and connect the optical transceiver of the bi-directional light sending/receiving module that sends receiving optical signals and the manufacture method of this optical transceiver reliably.
Background technology
Recently, along with developing rapidly of the communication technology, the fast optical communication of signal velocity is more and more noticeable.When the optical fiber that is connected with on the optical transceiver that sends receiving optical signals as the light conveyer line, all use mostly to have light receiver and this two-part bi-directional light sending/receiving module of light sending part.
Existing bi-directional light transceiver module has the electronic circuit that comprises lens, photo detector, light-emitting component, preamplifier and capacitor on main part, connect (insertion) to an end of main part and be installed in sleeve pipe (Off エ Le one Le) as the optical fiber of light conveyer line.In addition, extend the pin (lead pin) of the light sending part that is used to import the electric signal that utilizes light-emitting component to be transformed into light signal from the other end of main part, extend the pin (with reference to non-patent literature 1) of the light receiver that is used to export the electric signal after the light signal that will be received by photo detector is changed near the side the central authorities of main part.
For the optical communication of using above-mentioned light transmitting receiving module, in the past, for example the scope of application in the communication between the backboard of the computer that utilizes telecommunication, the communication between the telephone exchange etc. enlarges, and is necessary the light transmitting receiving module of majority is configured on the circuit substrate of one.At this moment, one of important problem is exactly the packaging density that improves light transmitting receiving module, makes optical transceiver compactness with light transmitting receiving module etc.
But, disclosed light transmitting receiving module in the non-patent literature 1 must all be adjusted chip to each light transmitting receiving module because be used to improve the optical axis calibrator of light joint efficiency, in each light transmitting receiving module of manufacturing, all there is nuance in the relative position of light sending part, light receiver and main part.Therefore, from the extended pin of light sending part and also can be different each light transmitting receiving module from the relative position of the extended pin of light receiver, when pin is installed, because must eliminate its difference installs on circuit substrate, need the cost regular hour so install, installation process requires proficiency etc., and this becomes the main cause that manufacturing cost increases.
Specifically, for example, utilize method as shown in Figure 7 to use the optical transceiver that light transmitting receiving module is installed.In Fig. 7, circuit substrate 71 is provided with rectangular slits 72, the light transmitting receiving module main body of packing in rectangular slits 72.That is, be shaped processing light sending part 73 pin 75,75 ..., clamping circuit substrate 71, on about two sides welding pin 75,75 ....Equally, be shaped processing light receiver 74 pin 76,76 ..., clamping circuit substrate 71, on about two sides welding pin 76,76 ....
In addition, as shown in Figure 8, also adopt following optical transceiver: to the pin 85,85 of the light sending part 83 of light transmitting receiving module ... and the pin 86,86 of light receiver 84 ... form processing, so that its leading section is perpendicular to circuit substrate 81, be arranged at hole portion that pin on the circuit substrate 81 connects usefulness insert pin 85,85 ... and pin 86,86 ..., weld from the inside of circuit substrate 81.
[non-patent literature 1] Infineon Tehnologies AG, BIDI Test Board User ' sGuide, Germany, S23481-A5159-51, on March 25th, 2002
But there is following shortcoming in the former optical transceiver: must change one by one pin 75,75 after shaping ... and pin 76,76 ... shape, the work when causing installing is miscellaneous.In addition, also have following shortcoming: because the parts that are used for fixing light transmitting receiving module have only pin 75,75 ... and pin 76,76 ..., so shock resistance structurally is relatively poor, need be used for fixing the enhancing accessory of main part.
In addition, there is following shortcoming in the latter's optical transceiver: the pin 85,85 of processing the light sending part because of in installing and using, needing to be shaped ..., so require it to have suitable length, but, when the pin 85,85 of light sending part ... during growth, can cause the deterioration of the transfer characteristic of electric signal, thereby being difficult to keep transfer characteristic well and be difficult to is installed on the circuit substrate.
Summary of the invention
The present invention develops in view of the above problems, its purpose is to provide the manufacture method of a kind of optical transceiver and optical transceiver, by using two circuit substrates to connect light transmitting receiving module, thus can be easily and reliably to the installation of circuit substrate.
In addition, another object of the present invention is to provide the manufacture method of a kind of optical transceiver and optical transceiver, it is by using two circuit substrates to be easy to be shaped the pin of processing light transmitting receiving module, simultaneously, can not need the enhancing of stationary body portion to be installed on the circuit substrate with parts.
To achieve these goals, the light of first aspect present invention sends receiving device and comprises that Jie is sent the light transmitting receiving module and first circuit substrate that is connected with this light transmitting receiving module, second circuit substrate of receiving optical signals by the light conveyer line, described light transmitting receiving module comprises: the light sending part, and its direction relative with the part that connects described smooth conveyer line is provided with the pin that input is transformed into the electric signal of light signal; Light receiver, it is provided with the output transform light signal with the direction that intersects towards the direction of described smooth sending part from the part that is connected described smooth conveyer line and the pin of the electric signal that obtains.Described first circuit substrate has the pin connection that connects pin and uses hole portion, connects the pin of light sending part on described second circuit substrate, uses described pin to connect the pin that connects light receiver with hole portion on described first circuit substrate.
Thus, be easy to the pin of light sending part is formed processing, the pin that inserts a circuit substrate by the pin with light receiver connects the hole portion that uses, needn't about adjust the difference of the Pin locations that each light transmitting receiving module differs, light transmitting receiving module firmly can be fixedly mounted on the circuit substrate.
In addition, the optical transceiver of second aspect present invention comprises that Jie is sent the light transmitting receiving module and first circuit substrate that is connected with this light transmitting receiving module, second circuit substrate of receiving optical signals by the light conveyer line, described light transmitting receiving module comprises: light receiver, its direction relative with the part that connects described smooth conveyer line are provided with the output transform light signal and the pin of the electric signal that obtains; The light sending part, its be provided with the pin that input is transformed into the electric signal of light signal from the part that is connected described smooth conveyer line towards the direction that the direction of described light receiver intersects.Described first circuit substrate has the pin connection that connects pin and uses hole portion, connects the pin of light receiver on described second circuit substrate, uses described pin to connect the pin that connects the light sending part with hole portion on described first circuit substrate.
Thus, be easy to the pin of light sending part is formed processing, the pin that inserts a circuit substrate by the pin with light receiver connects the hole portion that uses, needn't about adjust the difference of the Pin locations that each light transmitting receiving module differs, light transmitting receiving module firmly can be fixedly mounted on the circuit substrate.
In addition, the optical transceiver of the third aspect present invention of Fig. 3, in the present invention first or second aspect, pin vertically on the first circuit substrate almost parallel second circuit substrate is set.
Thus, be easy to the pin of light sending part or light receiver is formed processing, can reliably the light transmitting receiving module main body be fixedly mounted on the circuit substrate simultaneously, can not need the enhancing of stationary body portion light transmitting receiving module to be installed on the circuit substrate with parts.
In addition, the optical transceiver of the fourth aspect present invention of Fig. 5 in the present invention first or second aspect, intersects with first circuit substrate second circuit substrate is set, and the second circuit substrate has the pin that connects pin and connects the hole portion that uses.
Thus, the pin shaping processing to light sending part or light receiver can not be fixedly mounted on another circuit substrate reliably yet, can not need the enhancing of stationary body portion with parts light transmitting receiving module to be installed on the circuit substrate.
In addition, the manufacture method of the optical transceiver of fifth aspect present invention, wherein, described optical transceiver comprises that Jie sends the light transmitting receiving module of receiving optical signals, first circuit substrate that is connected with this light transmitting receiving module and the second circuit substrate littler than this first circuit substrate by the light conveyer line, described light transmitting receiving module comprises: the light sending part, and its direction relative with the part that connects described smooth conveyer line is provided with the pin that input is transformed into the electric signal of light signal; Light receiver, it is provided with the output transform light signal with the direction that intersects towards the direction of described smooth sending part from the part that is connected described smooth conveyer line and the pin of the electric signal that obtains, and described first circuit substrate has the pin that connects pin and connects the hole portion that uses.After being connected to the pin of light sending part on the described second circuit substrate, on described first circuit substrate, use described pin to connect the pin that connects light receiver with hole portion.
Thus, be easy to the pin of light sending part is formed processing, the pin that inserts first circuit substrate by the pin with light receiver connects the hole portion that uses, needn't about adjust the difference of the Pin locations that each light transmitting receiving module differs, light transmitting receiving module firmly can be installed on the circuit substrate.In addition, can for example in an operation, will be installed on first circuit substrate by on little second circuit substrate, welding light transmitting receiving module earlier, improve the efficient of manufacture process with the incorporate light transmitting receiving module of second circuit substrate by flow soldering.
In addition, the manufacture method of the optical transceiver of sixth aspect present invention, described optical transceiver comprises that Jie sends the light transmitting receiving module of receiving optical signals, first circuit substrate that is connected with this light transmitting receiving module and the second circuit substrate littler than this first circuit substrate by the light conveyer line, described light transmitting receiving module comprises: light receiver, its direction relative with the part that connects described smooth conveyer line are provided with the pin of the electric signal that the output transform light signal obtains; The light sending part, its be provided with the pin that input is transformed into the electric signal of light signal from the part that is connected described smooth conveyer line towards the direction that the direction of described light receiver intersects, described first circuit substrate has the pin that connects pin and connects the hole portion that uses.After being connected to the pin of light receiver on the described second circuit substrate, on described first circuit substrate, use described pin to connect the pin that connects the light sending part with hole portion.
Therefore, be easy to the pin of light sending part is formed processing, the pin that inserts first circuit substrate by the pin with light receiver connects the hole portion that uses, needn't about adjust the difference of the Pin locations that each light transmitting receiving module differs, light transmitting receiving module firmly can be installed on the circuit substrate.In addition, can for example utilize mobile being welded on to be installed on first circuit substrate with the incorporate light transmitting receiving module of second circuit substrate in the operation by on little second circuit substrate, welding light transmitting receiving module earlier, improve the efficient of manufacture process.
In addition, the manufacture method of the optical transceiver of seventh aspect present invention, aspect the present invention the 5th or the 6th in, pin vertically on the described first circuit substrate almost parallel described second circuit substrate is set.
Thus, be easy to the pin of light sending part or light receiver is formed processing, can reliably the light transmitting receiving module main body be fixed on the circuit substrate reliably simultaneously, can not need the enhancing of stationary body portion light transmitting receiving module to be installed on the circuit substrate with parts.In addition, pin vertically on, by earlier manual little second circuit substrate is installed after, install to the first big circuit substrate again, can in very large range revise the processing when being easy to make to the deviation of link position.
In addition, the manufacture method of the optical transceiver of eighth aspect present invention, in aspect the present invention the 5th or the 6th, intersect with described first circuit substrate described second circuit substrate is set, described second circuit substrate has the pin that connects pin and connects the hole portion that uses.
Therefore, the pin of light sending part or light receiver is not formed processing and also can be fixedly mounted on reliably on the circuit substrate, can not need the enhancing of stationary body portion light transmitting receiving module to be installed on the circuit substrate with parts.In addition, the relative position to the pin of the connecting pin of first circuit substrate and light receiver of little second circuit substrate, be adjusted into the position relationship consistency of being connected with first circuit substrate easily, and the light transmitting receiving module that will be installed in easily on the little second circuit substrate is installed in the lump on the first big circuit substrate with hole portion.
Description of drawings
Fig. 1 (a) is the stereographic map that expression is installed in the structure of the light transmitting receiving module on the optical transceiver of first embodiment of the invention, and Fig. 1 (b) is a front view (FV), and Fig. 1 (c) is an outboard profile;
Fig. 2 is the figure in the light transmission path footpath in the expression light transmitting receiving module of the present invention;
Fig. 3 is the outboard profile that is illustrated in the installment state of the light transmitting receiving module in the optical transceiver of first embodiment of the invention;
Fig. 4 is the stereographic map of the secondary circuit substrate of first embodiment of the invention;
Fig. 5 is the outboard profile that is illustrated in the installment state of the light transmitting receiving module in the optical transceiver of second embodiment of the invention;
Fig. 6 is the stereographic map of the secondary circuit substrate of second embodiment of the invention;
Fig. 7 is the planimetric map that is illustrated in the installment state of the light transmitting receiving module in the optical transceiver of prior art;
Fig. 8 is the stereographic map of the installment state of the light transmitting receiving module in the optical transceiver of prior art.
Embodiment
Below, with reference to the accompanying drawings embodiments of the invention are specifically described.
(first embodiment)
Front view (FV) (b) and outboard profile (c) that Fig. 1 is the expression stereographic map (a) that is installed in the structure of the light transmitting receiving module on the optical transceiver of first embodiment of the invention, see from light sending part one side.Shown in Fig. 1 (a), with the main part 2 that is equipped with as the optical fiber 1 of light conveyer line is the center, the direction relative with the part that connects optical fiber 1 is provided with light sending part 3, with from the part that is connected optical fiber 1 on the direction that the direction of light sending part 3 intersects, promptly be provided with light receiver 4 in the side of main part 2 side.Shown in Fig. 1 (b), light sending part 3 extend four pins 51,51 ..., shown in Fig. 1 (c), light receiver 4 extend five pins 52,52 ....These radicals of pin are example, and for example, obviously the pin of light receiver is that four grades or other radicals are also passable.In addition, optical fiber 1 also can be situated between and is connected with light transmitting receiving module by connector.
Fig. 2 is the figure in the light transmission path footpath in the expression light transmitting receiving module of the present invention.As shown in Figure 2, in the encapsulation that forms main part 2, comprise: the optical splitter 21 that on the glass blocks end face, is formed with film; By producing the light-emitting component that laser diode constituted 22 that sends light; By the photo detector 23 of receiving that the photodiode that receives light, phototransistor etc. constitute; Jie is by being configured in the optical fiber 25 of combination in conjunction with lens 24 that sends on the common light path that receives light.
When transmitting light signal, the transmission light that is sent by light-emitting component 22 is transmitted to transmitting terminal by optical fiber 25 by optical splitter 21 and Jie.In addition, during receiving optical signals, inject the reception light that photo detector 23 receives by optical splitter 21 reflections from optical fiber 25.
Receive above-mentioned light signal in order to send reliably, and must respectively the optical axis of optical splitter 21, photo detector 23, light-emitting component 22 and optical fiber 25 etc. be adjusted, so that when sending light signal, correctly inject optical fiber 25 from the transmission light that light-emitting component 22 sends, when receiving optical signals, receive light and correctly inject photo detector 23.Specifically, send light or receive that from optical fiber 25 methods such as receiving light comes each parts is carried out optical axis calibrator by sending from light-emitting component 22.Therefore, in the assembling process of light transmitting receiving module, need certain hour, simultaneously, relatively as the pin 51,51 of the light transmitting receiving module of finished product ... and pin 52,52 ... the relative position of main part 2, owing to the adjustment situation of optical axis all there are differences each product.
The present invention is for the difference of above-mentioned Pin locations, by the installation method that uses following explanation light transmitting receiving module is installed in and makes its elimination on the circuit substrate.Fig. 3 is the outboard profile that is illustrated in the installment state of the light transmitting receiving module in the optical transceiver of first embodiment of the invention.In Fig. 3, on main circuit substrate 31, be equipped with and carry out the IC (not shown) that becomes delivering letters of electric signal that the reception of electric signal handles, sends as light signal to handle etc. converting optical signals.
In addition, main circuit substrate 31 is provided with the secondary circuit substrate 32 with main circuit substrate 31 almost parallels.Secondary circuit substrate 32 can be installed on the main circuit substrate 31, and it is littler than main circuit substrate 31.Fig. 4 is the stereographic map of the secondary circuit substrate 32 of first embodiment of the invention.Pin 51,51 ... vertically on secondary circuit substrate 32 is set, with can be easy to the pin 51,51 of light sending part 3 ... connect, it is equipped with Laser Driven IC41, and this Laser Driven IC41 determines to be used for relatively converting electrical signal is become the magnitude of current of the light-emitting component of light signal.In addition, in the inside and outside of secondary circuit substrate 32 with the pin 51,51 that can weld light sending part 3 ... mode be provided with pin connecting portion 42,42 ....Secondary circuit substrate 32 by insert to main circuit substrate 31 connecting pins 43,43 ... and install to main circuit substrate 31.
When light transmitting receiving module is installed, should with the pin 51,51 of light sending part 3 ... with pin connecting portion 42,42 ... connect, with pin 51,51 ... be shaped and be processed into suitable shape, and weld in mode from the about clamping of secondary circuit substrate 32.Thus, can be easy to eliminate light sending part 3 pin 51,51 ... the difference of relative position, simultaneously because the pin 51,51 of Laser Driven IC41 and light sending part 3 ... between distance short, so can reduce the loss of signal, and can improve the transmission efficiency of signal.
On main circuit substrate 31, be provided with five with the pin 52,52 of light receiver 4 ... corresponding pin connect usefulness hole portion 33,33 ....The diameter that pin connects the hole portion 33 of usefulness form than pin 52,52 ... diameter big.
When mounted, with the pin 51,51 of light sending part 3 ... after being installed on the secondary circuit substrate 32, with the pin 52,52 of light receiver 4 ... to pin connect with hole portion 33,33 ... insert, install from the inboard of main circuit substrate 31 by welding.Thus, the pin 52,52 of light receiver 4 ... relative position difference can by to have than pin 52,52 ... the pin of the big diameter of diameter connect usefulness hole portion 33,33 ... insert pin 52,52 ... and be easy to eliminate.In addition, can for example utilize flow soldering in an operation, will to be installed on the main circuit substrate 31 by on little secondary circuit substrate 32, welding light transmitting receiving module earlier, improve the efficient of manufacture process with secondary circuit substrate 32 incorporate light transmitting receiving modules.
In addition, secondary circuit substrate 32 because be situated between by connecting pin 43,43 ... perhaps connector and being fixed on the main circuit substrate 31, so, also there is no need to be provided with to strengthen to main part 2 especially to use parts even when secondary circuit substrate 32 connects light transmitting receiving modules.Therefore, even the situation that is situated between and by secondary circuit substrate 32 light transmitting receiving module is installed also can stably be fixed on the main circuit substrate 31, and there is no need to use other strengthening part.
According to above first embodiment of the invention, the pin of processing light sending part can be easy to be shaped, needn't about adjust the difference of the Pin locations that each light transmitting receiving module differs, the pin that inserts main circuit substrate by the pin with light receiver connects with hole portion and can be easily and fixed installation reliably.
(second embodiment)
Fig. 5 is the outboard profile that is illustrated in the installment state of the light transmitting receiving module in the optical transceiver of second embodiment of the invention.In Fig. 5, on main circuit substrate 31, be equipped with and carry out becoming the reception of electric signal to handle, send the IC (not shown) of transmission processing etc. that converting electrical signal is become the electric signal of light signal converting optical signals.
In addition, main circuit substrate 31 is provided with and the main circuit substrate 31 secondary circuit substrate 32 of quadrature roughly.Fig. 6 is the stereographic map of secondary circuit substrate 32. Pin 51,51 ... vertically on secondary circuit substrate 32 is set, with can with the pin 51,51 of light sending part 3 ... connect, it is equipped with Laser Driven IC41, and this Laser Driven IC41 determines to be used for relatively converting electrical signal is become the magnitude of current of the light-emitting component of light signal.In addition, on secondary circuit substrate 32 with the pin 51,51 that can insert light sending part 3 ... mode be provided with hole portion 61,61 that pin connects usefulness ....Secondary circuit substrate 32 by insert to main circuit substrate 31 connecting pins 43,43 ... and on main circuit substrate 31, install.
When mounted, with the pin 51,51 of light sending part 3 ... to the pin of secondary circuit substrate 32 connect usefulness hole portion 61,61 ... insert, install from the inboard of secondary circuit substrate 32 by welding.Then, with the pin 52,52 of light receiver 4 ... to pin connect with hole portion 33,33 ... insert, install from the inboard of main circuit substrate 31 by welding.Thus, the pin 51,51 of light sending part 3 ... and the pin 52,52 of light receiver 4 ... relative position difference by to have than pin 51,51 ... the pin of the big diameter of diameter connect usefulness hole portion 61,61 ... and have than pin 52,52 ... the pin of the big diameter of diameter connect usefulness hole portion 33,33 ... insert pin 51,51 ... and pin 52,52 ... and eliminate easily.In addition, because the pin 51,51 of Laser Driven IC41 and light sending part 3 ... between distance short, so can improve the transmission efficiency of signal.And, be easy to adjust little secondary circuit substrate 32 the connecting pin 43,43 to main circuit substrate 31 ... and the pin 52,52 of light receiver ... relative position, on making it and being arranged on main circuit substrate 31, with its connection that is connected respectively position relationship consistency with hole portion, and the light transmitting receiving module that is easy to be installed on the little secondary circuit substrate 32 is installed on the big main circuit substrate 31 in the lump.
In addition, secondary circuit substrate 32 because be situated between by connecting pin 43,43 ... perhaps connector and being fixed on the main circuit substrate 31, even so when secondary circuit substrate 32 connects light transmitting receiving module, also there is no need to be provided with to strengthen to main part 2 especially to use parts.Therefore, even the situation that is situated between and by secondary circuit substrate 32 light transmitting receiving module is installed also can stably be fixedly mounted on the main circuit substrate 31, there is no need to use other strengthening part.
According to above second embodiment of the invention, the pin of the processing light sending part that there is no need to be shaped, needn't about adjust the difference of the Pin locations that each light transmitting receiving module differs, can easily and reliably light transmitting receiving module be installed on the circuit substrate.
Simultaneously, in above-mentioned first embodiment and second embodiment, the installation direction of light sending part 3 and light receiver 4 can be opposite.That is, with the pin 51,51 of light sending part 3 ... the pin that inserts main circuit substrate 31 connects in the hole portion 33 of usefulness, from the inboard welding of main circuit substrate 31.The pin that Laser Driven IC41 is arranged on main circuit substrate 31 connect usefulness hole portion 33 near.In addition, with the pin 51,51 of the light sending part 3 of first embodiment or second embodiment ... installation direction identical, with the pin 52,52 of light receiver 4 ... be installed on the secondary circuit substrate 32.Thus, can obtain and first embodiment or the identical effect of second embodiment.
In addition, light transmitting receiving module can adopt the allocation position opposite configuration with light sending part 3 and light receiver 4.That is, light receiver 3 is set, with the direction that intersects towards the direction of light receiver 3 from the part that is connected optical fiber 1, promptly light sending part 4 is set in the side of main part 2 side in the direction relative with the part that connects optical fiber 1.In this structure, also can obtain and first embodiment or the identical effect of second embodiment.
Claims (12)
1. optical transceiver, it comprises that Jie is sent the light transmitting receiving module and first circuit substrate that is connected with this light transmitting receiving module, second circuit substrate of receiving optical signals by the light conveyer line,
Described light transmitting receiving module comprises: the light sending part, and its direction relative with the part that connects described smooth conveyer line is provided with the pin that input is transformed into the electric signal of light signal; Light receiver, it is provided with the output transform light signal with the direction that intersects towards the direction of described smooth sending part from the part that is connected described smooth conveyer line and the pin of the electric signal that obtains,
This optical transceiver is characterised in that: described first circuit substrate has the pin that connects pin and connects the hole portion that uses, the pin that connects the light sending part on described second circuit substrate uses described pin to connect the pin that connects light receiver with hole portion on described first circuit substrate.
2. optical transceiver, it comprises that Jie is sent the light transmitting receiving module and first circuit substrate that is connected with this light transmitting receiving module, second circuit substrate of receiving optical signals by the light conveyer line,
Described light transmitting receiving module comprises: light receiver, its direction relative with the part that connects described smooth conveyer line are provided with the output transform light signal and the pin of the electric signal that obtains; The light sending part, its be provided with the pin that input is transformed into the electric signal of light signal from the part that is connected described smooth conveyer line towards the direction that the direction of described light receiver intersects,
This optical transceiver is characterised in that: described first circuit substrate has the pin that connects pin and connects the hole portion that uses, the pin that connects light receiver on described second circuit substrate uses described pin to connect the pin that connects the light sending part with hole portion on described first circuit substrate.
3. optical transceiver as claimed in claim 1 is characterized in that, the described pin connection diameter of the diameter of hole portion greater than described pin.
4. optical transceiver as claimed in claim 2 is characterized in that, the described pin connection diameter of the diameter of hole portion greater than described pin.
5. as each described optical transceiver in the claim 1～4, it is characterized in that, pin vertically on the described first circuit substrate almost parallel described second circuit substrate is set.
6. as each described optical transceiver in the claim 1～4, it is characterized in that, intersect with described first circuit substrate described second circuit substrate is set that described second circuit substrate has the pin that connects pin and connects the hole portion that uses.
7. the manufacture method of an optical transceiver, wherein, described optical transceiver comprises that Jie sends the light transmitting receiving module of receiving optical signals, first circuit substrate that is connected with this light transmitting receiving module and the second circuit substrate littler than this first circuit substrate by the light conveyer line
Described light transmitting receiving module comprises: the light sending part, and its direction relative with the part that connects described smooth conveyer line is provided with the pin that input is transformed into the electric signal of light signal; Light receiver, it is provided with the output transform light signal with the direction that intersects towards the direction of described smooth sending part from the part that is connected described smooth conveyer line and the pin of the electric signal that obtains, described first circuit substrate has the pin connection that connects pin and uses hole portion, it is characterized in that:
After being connected to the pin of light sending part on the described second circuit substrate, on described first circuit substrate, use described pin to connect the pin that connects light receiver with hole portion.
8. the manufacture method of an optical transceiver, wherein, described optical transceiver comprises that Jie sends the light transmitting receiving module of receiving optical signals, first circuit substrate that is connected with this light transmitting receiving module and the second circuit substrate littler than this first circuit substrate by the light conveyer line
Described light transmitting receiving module comprises: light receiver, its direction relative with the part that connects described smooth conveyer line are provided with the pin of the electric signal that the output transform light signal obtains; The light sending part, its be provided with the pin that input is transformed into the electric signal of light signal from the part that is connected described smooth conveyer line towards the direction that the direction of described light receiver intersects, described first circuit substrate has the pin connection that connects pin and uses hole portion, it is characterized in that:
After being connected to the pin of light receiver on the described second circuit substrate, on described first circuit substrate, use described pin to connect the pin that connects the light sending part with hole portion.
9. the manufacture method of optical transceiver as claimed in claim 7 is characterized in that, the described pin connection diameter of the diameter of hole portion greater than described pin.
10. the manufacture method of optical transceiver as claimed in claim 8 is characterized in that, the described pin connection diameter of the diameter of hole portion greater than described pin.
11. the manufacture method as each described optical transceiver in the claim 7～10 is characterized in that, pin vertically on parallel with described first circuit substrate described second circuit substrate is set.
12. the manufacture method as each described optical transceiver in the claim 7～10 is characterized in that, with described first circuit substrate described second circuit substrate arranged in a crossed manner, described second circuit substrate has the pin that connects pin and connects the hole portion that uses.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP020511/04 | 2004-01-28 | ||
| JP020511/2004 | 2004-01-28 | ||
| JP2004020511A JP4114614B2 (en) | 2004-01-28 | 2004-01-28 | Optical transmitter / receiver and method for manufacturing optical transmitter / receiver |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1648705A CN1648705A (en) | 2005-08-03 |
| CN100376911C true CN100376911C (en) | 2008-03-26 |
Family
ID=34879073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100063393A Expired - Fee Related CN100376911C (en) | 2004-01-28 | 2005-01-26 | Light transmittingand receiving device and method for light transmitting and receiving device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4114614B2 (en) |
| KR (1) | KR100684021B1 (en) |
| CN (1) | CN100376911C (en) |
| TW (1) | TWI257776B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007324343A (en) * | 2006-05-31 | 2007-12-13 | Mitsubishi Electric Corp | Optical transmitter and receiver |
| JP2008071784A (en) * | 2006-09-12 | 2008-03-27 | Mitsubishi Electric Corp | Optical transmitter and receiver |
| JP5228676B2 (en) * | 2008-07-29 | 2013-07-03 | 日産自動車株式会社 | COMMUNICATION SYSTEM, CENTER SYSTEM, IN-VEHICLE COMMUNICATION DEVICE, AND COMMUNICATION METHOD |
| JP2010199302A (en) * | 2009-02-25 | 2010-09-09 | Sumitomo Electric Ind Ltd | Optical semiconductor device |
| CN102298182A (en) * | 2011-08-16 | 2011-12-28 | 深圳市国扬通信股份有限公司 | Connection method for optical device and mainboard and optical device |
| CN103676038B (en) * | 2013-12-30 | 2017-02-22 | 上海斐讯数据通信技术有限公司 | Pin fixing and bending jig for Bosa optical device |
| TWI590753B (en) * | 2016-11-02 | 2017-07-01 | 和碩聯合科技股份有限公司 | Pin protective cover and bi-directional optical sub-assemblies device using the same |
| CN110417481A (en) * | 2019-07-09 | 2019-11-05 | 广东九联科技股份有限公司 | A kind of modified ROSA for passive optical network |
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| JPH0546879A (en) * | 1991-08-08 | 1993-02-26 | Nohmi Bosai Ltd | Radiation type fire sensor |
| US5552981A (en) * | 1991-04-15 | 1996-09-03 | Canon Kabushiki Kaisha | Electronic apparatus |
| US6369924B1 (en) * | 1998-04-20 | 2002-04-09 | Stratos Lightwave, Inc. | Optical transceiver with enhanced shielding and related methods |
| US20040008954A1 (en) * | 2002-03-26 | 2004-01-15 | Industrial Technology Research Institute | Packaging for optical transceiver module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0494582A (en) * | 1990-08-10 | 1992-03-26 | Sharp Corp | Package for semiconductor laser |
| JP2000269582A (en) * | 1999-03-15 | 2000-09-29 | Fuji Xerox Co Ltd | Optical device |
| JP2001196766A (en) * | 2000-01-17 | 2001-07-19 | Hitachi Cable Ltd | Attaching structure of optical element, and light transmitting and receiving module |
| JP2002343984A (en) * | 2001-05-21 | 2002-11-29 | Hitachi Ltd | Optical transmitter and receiver |
| KR20030016523A (en) * | 2001-08-21 | 2003-03-03 | 변동환 | Hub Assembly Having a Braking System |
| JP2003344725A (en) * | 2002-03-18 | 2003-12-03 | Sumitomo Electric Ind Ltd | Ferrule component and optical communication module |
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2004
- 2004-01-28 JP JP2004020511A patent/JP4114614B2/en not_active Expired - Fee Related
-
2005
- 2005-01-14 TW TW094101082A patent/TWI257776B/en not_active IP Right Cessation
- 2005-01-19 KR KR1020050004809A patent/KR100684021B1/en not_active IP Right Cessation
- 2005-01-26 CN CNB2005100063393A patent/CN100376911C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5552981A (en) * | 1991-04-15 | 1996-09-03 | Canon Kabushiki Kaisha | Electronic apparatus |
| JPH0546879A (en) * | 1991-08-08 | 1993-02-26 | Nohmi Bosai Ltd | Radiation type fire sensor |
| US6369924B1 (en) * | 1998-04-20 | 2002-04-09 | Stratos Lightwave, Inc. | Optical transceiver with enhanced shielding and related methods |
| US20040008954A1 (en) * | 2002-03-26 | 2004-01-15 | Industrial Technology Research Institute | Packaging for optical transceiver module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1648705A (en) | 2005-08-03 |
| KR20050077736A (en) | 2005-08-03 |
| JP2005217074A (en) | 2005-08-11 |
| JP4114614B2 (en) | 2008-07-09 |
| KR100684021B1 (en) | 2007-02-20 |
| TW200527839A (en) | 2005-08-16 |
| TWI257776B (en) | 2006-07-01 |
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