JP2006023777A - Optical module, optical communication apparatus, photoelectric consolidated integrated circuit, circuit board and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module that can be miniaturized. <P>SOLUTION: The optical module (1) is mounted with an optical plug (50) installed at one end of an optical transmission line (52) and is designed to perform information communication by transmitting/receiving a signal light through the optical transmission line (52). The optical module (1) is equipped with: a transparent substrate (10) having light transmissivity to the wavelength of a signal light to be used; an optical socket (18) arranged on one side of the transparent substrate and mounted with the optical plug (50); an optical element (12) which is arranged on one side of the transparent substrate (10), which emits an optical signal to the other side thereof in accordance with an electric signal supplied, or which generates an electric signal in accordance with the intensity of the signal light supplied from the other side of the transparent substrate (10); and a reflection part (22) which is arranged on the other side of the transparent substrate (10), which changes nearly 90° the route of the signal light emitted from the optical element (12) to guide to the optical transmission line (52), or which changes nearly 90° the route of the optical signal emitted from the optical transmission line (52) to guide to the optical element (12). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to devices, components, and the like used for performing information communication (signal transmission) between a plurality of devices or inside a device by an optical signal.

  In recent years, signal transfer speeds between circuit chips or circuit boards included in various devices have been increased, and problems such as crosstalk between signal lines, noise radiation, impedance mismatch, and high power consumption have occurred. It is becoming something that cannot be ignored. For this reason, optical communication has begun to be introduced in signal transmission inside the device. Instead of the conventional method of passing an electrical signal through a metal wiring between circuit chips or modules in the device, an optical fiber (tape fiber) or A technique for performing communication through an optical signal through an optical transmission line such as an optical waveguide is being adopted. Such a technique is described in, for example, the December 3, 2001 issue (Non-Patent Document 1) of a technical magazine “Nikkei Electronics” published by Nikkei Business Publications, Inc.

  When performing optical communication, for example, alignment between optical fibers or between connection points on the optical signal transmission path such as between an optical fiber and a light emitting element or a light receiving element (optical axis alignment). It is important to accurately perform the above and avoid an increase in optical coupling loss, and various techniques are employed to achieve such a demand. Such a technique is described in, for example, JP-A-7-49437 (Patent Document 1).

“Nikkei Electronics”, Nikkei BP Co., Ltd., December 3, 2001, p. 112-122 JP 7-49437 A

  When the fitting pin is provided in one connector and the fitting hole into which the fitting pin is to be inserted is provided in the other connector as in the optical connector described in Patent Document 1 described above, the size reduction can be achieved. There is an inconvenience that it is difficult.

  In the photoelectric conversion module described in Non-Patent Document 1 described above, the end face of the optical fiber (optical transmission line) is directly connected to the light emitting surface or the light receiving surface of the optical element via a small connector (optical plug). It is the composition to arrange. For this reason, when the small connector is removed, the light emitting / receiving surface of the optical element and the end face of the optical fiber are both exposed, and problems such as damage to the light emitting surface and adhesion of foreign matter are likely to occur.

  Therefore, an object of the present invention is to provide an optical module that can be miniaturized.

  It is another object of the present invention to provide an optical module capable of protecting the light emitting surface or the light receiving surface of an optical element with a simple structure.

    In order to achieve the above object, an optical module of the present invention is provided with an optical plug provided at one end of an optical transmission line, for transmitting and receiving signal light through the optical transmission line for information communication. An optical module, a transparent substrate having optical transparency with respect to the wavelength of signal light to be used, an optical socket disposed on one side of the transparent substrate, to which an optical plug is attached, and the other side of the transparent substrate Light that is arranged on the side and emits signal light to one side of the transparent substrate according to the supplied electric signal, or generates an electric signal according to the intensity of the signal light supplied from one side of the transparent substrate The element is disposed on one side of the transparent substrate, and the path of the signal light emitted from the optical element is changed by approximately 90 degrees to be guided to the optical transmission path, or the path of the signal light emitted from the optical transmission path is approximately And a reflection part that changes 90 degrees and guides it to the optical element.

  Since the signal light emitted from the optical element and the signal light emitted from the optical transmission path are reflected by approximately 90 degrees to achieve optical coupling, the longitudinal direction of the optical transmission path extends along the surface of the transparent substrate. The optical module can be miniaturized. In particular, since space saving in the thickness direction of the transparent substrate can be achieved, it is suitable when an opto-electric hybrid circuit is configured using the optical module according to the present invention. Further, since the light emitting surface / light receiving surface of the optical element is structured to face the transparent substrate, the light emitting surface or the light receiving surface of the optical element can be protected with a simple structure.

  The reflection part described above is preferably formed in the optical socket. More preferably, the optical socket including the reflecting portion may be formed by integral molding of resin or the like. Thereby, it is possible to reduce the number of parts and simplify the manufacturing process by simplifying the structure.

  A first lens that collects the signal light emitted from the optical element and guides it to the reflection part; or condenses the signal light emitted from the optical transmission path and reflected by the reflection part to guide to the optical element. It is preferable to further provide. Thereby, it is possible to improve the optical coupling efficiency.

  The first lens described above is preferably formed in an optical socket. More preferably, the optical socket including the first lens may be formed by integral molding such as resin. Thereby, it is possible to reduce the number of parts and simplify the manufacturing process by simplifying the structure. In addition, the optical axis can be easily aligned during assembly.

  The first lens is also preferably formed on a transparent substrate. In this case, it is possible to employ a manufacturing process such as cutting the base material substrate after forming a plurality of first lenses on the base material substrate at once.

  Further, the second lens that collects the signal light emitted from the optical element and reflected by the reflecting portion and guides it to the optical transmission path, or collects the signal light emitted from the optical transmission path and guides it to the reflecting section. Is preferably further provided. Thereby, it is possible to improve the optical coupling efficiency.

  The second lens described above is preferably formed in an optical plug or an optical socket. More preferably, the optical plug or optical socket including the second lens may be formed by integral molding of resin or the like. Thereby, it is possible to reduce the number of parts and simplify the manufacturing process by simplifying the structure. In addition, the optical axis can be easily aligned during assembly.

  The first lens condenses the signal light emitted from the optical element to be substantially parallel light, and the second lens condenses the signal light emitted from the optical transmission path to be substantially parallel. It is preferable to use light. As a result, the optical plug and the optical socket are connected by parallel light (infinite system), and a large fitting tolerance can be obtained. Therefore, the accuracy requirements at the time of manufacture and design are lowered, which is convenient.

  The optical socket preferably has a guide surface for positioning the optical plug. This eliminates the need to provide positioning pins and fitting holes corresponding to the pins, thereby reducing the number of components and reducing the size of the optical socket and optical plug. In addition, the optical socket and the optical plug can be easily processed.

  The guide surface described above preferably includes two surfaces that are substantially parallel to each other and substantially orthogonal to the other surface of the transparent substrate. The optical plug can be accurately positioned by the two surfaces and the other surface of the transparent substrate.

  Moreover, it is preferable to further comprise a pressing means for pressing the optical plug to the other surface side of the transparent substrate. As the pressing means, for example, a leaf spring can be used. Thereby, the position in the up-down direction (direction orthogonal to a transparent substrate) of an optical plug can be stabilized more.

  The guide surface described above preferably includes two surfaces that are substantially parallel to each other and substantially orthogonal to the other surface of the transparent substrate, and one surface that is substantially parallel to the other surface of the transparent substrate. With these surfaces and the other surface of the transparent substrate, the optical plug can be accurately positioned.

  Moreover, it is also preferable that the above-described guide surfaces include two surfaces that are substantially orthogonal to each other and are disposed at an angle of approximately 45 degrees with respect to the other surface of the transparent substrate. Further, in this case, it is more preferable that each of the two surfaces has a protrusion for urging the optical plug. As a result, the optical plug can be accurately positioned.

  Moreover, it is preferable to further include a locking means for holding the optical plug and the optical socket fitted together. As the locking means, for example, a hook formed using an elastic body such as a leaf spring can be used. As a result, it is possible to more reliably avoid the optical plug from being detached from the optical socket or displaced.

  The optical socket preferably has a guide groove for positioning the optical plug. Using the guide groove, the optical plug can be accurately positioned.

  The guide groove described above preferably includes a surface substantially parallel to one surface of the transparent substrate and a surface substantially orthogonal to the one surface, and is penetrated from one end side to the other end side of the optical socket. As a result, the optical plug can be more smoothly inserted into the optical socket.

  Further, the present invention is a method of manufacturing an optical module for attaching an optical plug provided at one end of an optical transmission line and performing information communication by transmitting and receiving signal light through the optical transmission line, A step of forming a wiring film on each of a plurality of regions on one side of the transparent substrate having optical transparency, a step of disposing an optical element on the other side of the transparent substrate corresponding to each of the wiring films, The process includes a step of attaching an optical coupling component corresponding to each of the optical elements, and a step of cutting the transparent substrate into a plurality of regions.

  Here, the “optical coupling component” refers to a component for optically coupling an optical transmission line (for example, an optical fiber) supported by the optical plug and an optical element. Such an optical socket corresponds. According to the manufacturing method of the present invention, it is possible to manufacture an optical module that is small in size and excellent in protection of the light emitting / receiving surface of the optical element at low cost.

  Moreover, this invention is also an optical communication apparatus (optical transceiver) provided with the optical module mentioned above. Such an optical communication device according to the present invention is used for various electronic devices that perform information communication with an external device or the like using light as a transmission medium, such as a personal computer or a so-called PDA (portable information terminal device). It is possible. In this specification, the term “optical communication device” refers not only to a device that includes both a configuration related to transmission of signal light (such as a light emitting element) and a configuration related to reception of signal light (such as a light receiving element). It includes an apparatus having only such a configuration (so-called optical transmission module) and an apparatus having only a configuration relating to reception (so-called optical reception module).

  The present invention is also an opto-electric hybrid integrated circuit including the above-described optical module, and is also a circuit board including the above-described optical module and an optical waveguide for transmitting signal light. Such a circuit board may be referred to as an “opto-electric hybrid board”.

  Moreover, this invention is also an electronic device provided with the optical module mentioned above. More specifically, the electronic device of the present invention includes any of the above-described optical communication device, opto-electric hybrid integrated circuit, and circuit board including the optical module, in addition to the above-described optical module itself. Including cases. In this specification, “electronic device” means a general device that realizes a certain function using an electronic circuit or the like, and its configuration is not particularly limited. For example, a personal computer, a PDA (portable information) Terminal) and various devices such as an electronic notebook. The optical module, the optical communication device, the opto-electric hybrid integrated circuit, or the circuit board according to the present invention can be used for information communication inside the device or information communication with an external device in these electronic devices.

    Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a diagram illustrating the configuration of the optical module according to the first embodiment. FIG. 1A is a plan view of the optical module of the present embodiment, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. The optical module 1 shown in FIG. 1 is provided with an optical plug 50 provided at one end of a tape fiber 52 as an optical transmission line, for transmitting and receiving signal light through the tape fiber 52 for information communication. It includes a transparent substrate 10, an optical element 12, an electronic circuit 14, a wiring film 16, an optical socket 18, a lens 20, and a reflection portion 22.

  The transparent substrate 10 has optical transparency with respect to the wavelength of light to be used, and supports each element constituting the optical module 1. For example, when the wavelength of the light emitted from the optical element 12 or the light received by the optical element 12 is visible light or a value close thereto (for example, 850 nm), the transparent substrate 10 is made of a material such as glass or plastic. Good. In addition, when the wavelength of the emitted light is relatively long (for example, 1300 nm to 1500 nm), the transparent substrate 10 can be made of a material such as silicon or germanium.

  The optical element 12 emits signal light according to the drive signal given from the electronic circuit 14 or generates an electrical signal according to the intensity of the received signal light, and is placed at a predetermined position on the back surface of the transparent substrate 10. The light emitting surface or the light receiving surface is arranged with the transparent substrate 10 side facing. The optical element 12 has a light emitting surface or a light receiving surface disposed in an opening provided in the wiring film 16 on the transparent substrate 10 so that an optical signal is emitted or incident through the opening and the transparent substrate 10. It has become. For example, when the optical module 1 shown in FIG. 1 is used on the information transmission side, a light emitting element such as a VCSEL (surface emitting laser) is used as the optical element 12. When the optical module 1 is used on the information receiving side, a light receiving element is used as the optical element 12. In the present embodiment, the configuration includes four optical elements 12, but the number of optical elements 12 is not limited to this, and may be one.

  The electronic circuit 14 includes a driver for driving the optical element 12 and is disposed at a predetermined position on the back surface of the transparent substrate 10. The electronic circuit 14 is connected to the optical element 12 through a wiring film 16 formed on the transparent substrate 10, and further connected to other circuit elements, circuit chips, external devices, etc. (not shown) as necessary. Is done.

  The wiring film 16 is provided on the back side of the transparent substrate 10 using a conductor film such as copper, and is patterned into a predetermined shape. As described above, the wiring film 16 is responsible for electrical connection between the optical element 12, the electronic circuit 14, and other circuit elements.

  The optical socket 18 is disposed on the front surface side of the transparent substrate 10 to which the optical plug 50 is attached. For example, the optical socket 18 is formed using glass, plastic, or the like. The optical socket 18 has a guide surface for positioning the optical plug 50. Specifically, the guide surfaces are substantially parallel to each other, two surfaces 24 that are substantially orthogonal to the upper surface of the transparent substrate 10, and one guide surface that is approximately orthogonal to these surfaces 24 and substantially orthogonal to the upper surface of the transparent substrate 10. Surface 26. The optical plug 50 is provided with contact surfaces corresponding to these guide surfaces.

  The two surfaces 24 provided on the optical socket 18 are substantially parallel to the yz plane, and the distance between the surfaces 24 is formed with high accuracy so that the optical plug 50 inserted into the optical socket 18 can be formed. Positioning is performed with respect to the position in the x-axis direction and the arrangement angle in the xz plane. Further, the above-described surface 26 is substantially parallel to the xy plane, and the optical plug 50 is positioned in the z-axis direction by contacting one end side of the optical plug 50 with the surface 26. At this time, by mounting the optical plug 50 by making the distance between the two surfaces 24 slightly shorter than the width (the length in the x-axis direction) of the portion of the optical plug 50 that is inserted into the optical socket 18. It is also possible to prevent subsequent displacement. Further, a means for preventing the optical plug 50 from being displaced may be provided. A configuration example in the case of providing the positional deviation prevention means will be described later.

  Each lens 20 is formed integrally with the optical socket 18, condenses the signal light emitted from each optical element 12, converts it into substantially parallel light, guides it to the reflecting portion 22, and emits it from the tape fiber 52. Then, the signal light reflected by the reflecting portion 22 is collected and led to the optical element 12 as substantially parallel light. The lens 20 corresponds to a “first lens”.

  The reflection unit 22 changes the path of the signal light collected by the lens 20 by approximately 90 degrees and guides it to the tape fiber 52, and also changes the path of the signal light emitted from the tape fiber 52 by approximately 90 degrees. Lead to twelve. The reflecting portion 22 is formed integrally with the optical socket 18 as a surface (reflecting surface) disposed at an angle of approximately 45 degrees with respect to the optical axis of the optical element 12 (main propagation direction of signal light). Here, by setting the refractive index of the material constituting the optical socket 18 to about 1.5, the signal light incident on the reflecting portion 22 can be totally reflected, thereby changing the path of the signal light by approximately 90 degrees. can do. Alternatively, the reflecting portion 22 may be configured by providing a metal film, a dielectric multilayer film, or the like on a slope of approximately 45 degrees formed in the optical socket 18.

  The optical socket 50 attached to the optical plug 18 described above supports the tape fiber 52 so that its extending direction (extending direction of the core wire) is substantially parallel to the upper surface of the transparent substrate 10. The optical socket 50 can be freely attached to and detached from the optical plug 18. In the illustrated example, the tape fiber 52 having four cores is shown, but the present invention is not limited to this, and a tape fiber having a desired number of cores (including one core) can be used. Moreover, although the tape fiber comprised in the film form is shown as an example of an optical transmission path, it is not the meaning limited to this but optical transmission paths, such as another general optical fiber, can also be used.

  In addition, the optical socket 50 of the present embodiment is provided with a plurality of lenses 54 on one end side in contact with the optical plug 18. These lenses 54 condense the signal light emitted from the optical element 12 and reflected by the reflecting section 22, make it substantially parallel light, guide it to the tape fiber 52, and collect the signal light emitted from the tape fiber 52. The light is then made into substantially parallel light and led to the reflecting portion 22. The lens 54 corresponds to a “second lens”. Note that the second lens can take various forms other than being formed in the optical socket 50, and specific examples thereof will be described later.

  FIG. 2 is a diagram illustrating a configuration example in the case of providing a member for preventing the displacement of the optical plug 50 more reliably. As shown in the figure, a plate spring 28 is disposed on the upper side of the optical plug 50, and the optical plug 50 is pressed toward the transparent substrate 10 by the plate spring 28. As a result, the position of the optical plug 50 in the y-axis direction, the angle in the xy plane, and the angle in the yz plane can be more reliably determined with reference to the upper surface of the transparent substrate 10, and the relative relationship of the optical plug 50 can be determined. Position and posture are determined. The leaf spring 28 corresponds to “pressing means”. Further, a hook-shaped hook portion 30 is provided on one end side of the leaf spring 28, and the state in which the optical plug 50 and the optical socket 18 are fitted together by the hook portion 30 is maintained. Misalignment is prevented. The leaf spring 28 may be supported by, for example, the transparent substrate 10, and further supported by a housing of various devices (specific examples will be described later) including the optical module 1 of this example. Good. The hook portion 30 corresponds to “locking means”.

  The optical module 1 of the present embodiment has such a configuration. Next, a method for manufacturing the optical module 1 will be described with reference to the drawings.

  3 and 4 are diagrams for explaining a manufacturing process of the optical module 1 of the embodiment. First, as shown in FIG. 3A, a base material substrate 100 is prepared which is a base material from which a plurality of transparent substrates 10 are cut out later. Next, as shown in FIG. 3B, a conductive material such as aluminum or copper is deposited on the surface of the base material substrate 100 by sputtering or electroforming to form a metal film (conductive film). The metal film is patterned corresponding to a desired circuit to form a wiring film 16. A plurality of wiring films 16 are formed in each of a plurality of sub-regions of the base material substrate 100. In this way, it is preferable in terms of mass production to form wiring films having unit wiring patterns at a plurality of locations at once.

  Next, as shown in FIG. 3C, circuit elements such as the optical element 12 and the electronic circuit 14 are mounted on one surface side of the base material substrate 100. The mounting can be performed using flip chip bonding, wire bonding, solder reflow, or the like. As described above, when unit wiring patterns are collectively formed at a plurality of locations on the base material substrate 100, the process shown in FIG. 3C corresponds to one of the base material substrates 100 corresponding to each of the unit wiring patterns. A plurality of optical elements 12 and the like are respectively arranged on the surface.

  Next, as shown in FIG. 3D, an optical socket 18 is attached at a position corresponding to the optical element 12 on the other surface side of the base material substrate 100. In this attachment, an adhesive is applied to the surfaces of the optical socket 18 and the base material substrate 100 facing each other, or the adhesive is applied to either surface, and then the optical socket 18 is placed on the base material substrate 100. By doing. As the adhesive, it is preferable to use an adhesive that is cured by performing some kind of treatment (for example, light irradiation or the like) later. The optical socket 18 is placed with its position adjusted so that the optical axis of the lens 20 and the optical axis of the optical element 12 substantially coincide.

  After the alignment of the optical socket 18 is completed, the adhesive is solidified to fix the optical socket 18 to the base material substrate 100. As the adhesive, for example, a resin such as photo-curing property or thermosetting property can be used. As shown in FIG. 4, the process of placing the optical socket 18 and adjusting the position after adjusting the position is repeated as many times as necessary to attach the optical socket 18 to a plurality of sub-regions of the base material substrate 100 to mount the optical module 1. assemble.

  Thereafter, as shown in FIG. 3E, the base material substrate 100 is cut into sub-regions to obtain a large number of optical modules 1. In addition, the optical module of each embodiment mentioned later can also be manufactured with the same manufacturing method.

  As described above, the optical module 1 according to this embodiment has a structure in which the signal light emitted from the optical element 12 and the signal light emitted from the tape fiber (optical transmission path) 52 are reflected by approximately 90 degrees to achieve optical coupling. Therefore, the longitudinal direction of the tape fiber 52 can be arranged along the surface of the transparent substrate 10. Therefore, the optical module can be miniaturized. In particular, since space saving in the thickness direction of the transparent substrate 10 can be achieved, it is suitable when an opto-electric hybrid circuit is configured using the optical module according to the present invention. Further, since the light emitting surface / light receiving surface of the optical element 12 is configured to face the transparent substrate 10, it is possible to protect the light emitting surface or the light receiving surface of the optical element with a simple structure. In addition, the manufacturing method of the present embodiment makes it possible to manufacture a small-sized optical module excellent in protection of the light emitting surface / light receiving surface of the optical element at low cost.

<Second Embodiment>
FIG. 5 is a diagram illustrating the configuration of the optical module according to the second embodiment. Fig.5 (a) shows the top view of the optical module of this embodiment, FIG.5 (b) has shown sectional drawing in the BB line of Fig.5 (a). The optical module 1a shown in the figure basically has the same configuration as the optical module 1 of the first embodiment, and common constituent elements are denoted by the same reference numerals. Hereinafter, differences will be mainly described.

  The optical module 1a shown in FIG. 5 is different from the first embodiment in the shape of the optical socket 18a to which the optical plug 50 is attached. The optical socket 18a of the present embodiment includes a surface 24 and a surface 26 as guide surfaces like the optical socket 18 described above, and further includes a surface 32 for positioning the optical module 1a in the y-axis direction. . The surface 32 is formed substantially parallel to the xz plane, and the optical plug 50 is positioned in the y-axis direction with reference to the surface 32 and the upper surface of the transparent substrate 10. Further, the distance between the surface 32 and the upper surface of the transparent substrate 10 is slightly smaller than the thickness of the optical plug 50 in the y-axis direction, so that the upper surface of the optical plug 50 is covered by the portion including the surface 32 of the optical socket 18a. It is also possible to bias to the transparent substrate 10 side. In this case, the optical socket 18a provided with the surface 32 can be considered as a “pressing means”.

  Further, the leaf spring 28a provided in the optical module 1a of the present embodiment is configured to surround the optical socket 18a and the optical plug 50, and a hook-like hook portion 30a is provided on one end side thereof. The state where the optical plug 50 and the optical socket 18a are fitted together is held by the hook portion 30, and the optical plug 50 is prevented from coming off. The hook portion 30a corresponds to “locking means”.

<Third Embodiment>
FIG. 6 is a diagram illustrating the configuration of the optical module according to the third embodiment. 6A shows a plan view of the optical module of the present embodiment, and FIG. 6B shows a cross-sectional view taken along the line CC in FIG. 6A. The optical module 1b shown in the figure basically has the same configuration as the optical module of each embodiment described above, and common constituent elements are denoted by the same reference numerals. Hereinafter, differences will be mainly described.

  The optical module 1b shown in FIG. 6 differs from the above embodiments in the shape of the optical socket 18b to which the optical plug 50 is attached. The optical socket 18b of the present embodiment includes a surface 24a, a surface 26a, and a surface 32a as guide surfaces, like the optical socket 18a described above. The functions of the surfaces 24a, 26a and 32a are the same as those of the surfaces 24, 26 and 32 described above.

  In this example, the lens 54a as the second lens is formed on the optical socket 18b side, and the structure of the optical plug 50a is simplified compared to the optical plug 50 in each of the above embodiments. Thereby, cost reduction is attained. Then, the lens 54a forming surface of the optical socket 18b and the surface 32a serving as the guide surface described above are different surfaces, whereby the lens 54a and the core wire (fiber core) of the tape fiber 52 supported by the optical plug 50a are formed. The optical distance between them is secured, and the end face of the fiber core is protected. A protective film for protecting the tape fiber 52 may be provided on the end face of the optical plug 50a.

<Fourth Embodiment>
FIG. 7 is a diagram illustrating the configuration of the optical module according to the fourth embodiment. Fig.7 (a) shows the top view of the optical module of this embodiment, FIG.7 (b) has shown sectional drawing in the DD line | wire of Fig.7 (a). The optical module 1c shown in the figure has the same configuration as the optical modules of the above-described embodiments, and common constituent elements are given the same reference numerals. Hereinafter, differences will be mainly described.

  The optical module 1c shown in FIG. 7 has a structure in which the optical plug 50b and the optical socket 18c are directly attached. Specifically, the optical socket 18c includes a surface 26b as a guide surface, and the optical plug 50b is attached by bonding the surface 26b and a contact surface provided on the optical plug 50b. .

  In this example, the lens 54b as the second lens is formed on the optical socket 18c side, and the structure of the optical plug 50b is simplified. Thereby, cost reduction is attained. Then, the surface of the optical socket 18c on which the lens 54b is formed is different from the surface 26b as the guide surface described above, and a cavity is formed, whereby the core wire (fiber optic) of the tape fiber 52 supported by the lens 54b and the optical plug 50b. The optical distance to the core) is secured, and the end face of the fiber core is protected. A protective film for protecting the tape fiber 52 may be provided on the end face of the optical plug 50b.

  Further, the lens 20a as the first lens is arranged at a position facing the optical element 12 on the upper surface of the transparent substrate 10 as a lens array including the four lenses 20a. The optical socket 18c includes a surface 34 and a surface 36 as guide surfaces, and the optical socket 18c is positioned by bringing the surface 34 and the surface 36 into contact with the lens array.

<Fifth Embodiment>
FIG. 8 is a diagram illustrating the configuration of the optical module according to the fifth embodiment. FIG. 8A shows a perspective view of the optical module of the present embodiment, and FIG. 8B shows a cross-sectional view taken along line EE of FIG. 8A. The optical module 1d shown in the figure basically has the same configuration as the optical module of each embodiment described above, and common constituent elements are denoted by the same reference numerals. Hereinafter, differences will be mainly described.

  The optical module 1d shown in FIG. 8 is different from the above embodiments in the shape of the optical socket 18d to which the optical plug 50c is attached. The optical socket 18 d has a fitting hole 40 having a reverse T-shaped cross section, and the cross-sectional shape of the optical plug 50 c is also an inverted T shape corresponding to the shape of the fitting hole 40. The fitting hole 40 includes a guide groove 42 that guides the direction when the optical plug 50c is inserted. The guide groove 42 includes a surface substantially parallel to the upper surface of the transparent substrate 10 and a surface substantially orthogonal to the upper surface, and is penetrated from one end side to the other end side of the optical socket 18d. The guide groove 42 allows the optical plug 50 to be inserted into the optical socket 18 more smoothly.

  A reflecting plate (reflecting part) 44 is disposed on one end side of the optical socket 18d, and a lens 20b as a first lens is disposed at a position facing the optical element 12 on the upper surface of the transparent substrate 10. Yes. The reflection plate 44 is arranged so that the reflection surface forms an angle of about 45 degrees with the upper surface of the transparent substrate 10, and the tape fiber 52 is changed by changing the path of the signal light emitted from the optical element 12 by about 90 degrees. Or the path of the signal light emitted from the tape fiber 52 is changed by approximately 90 degrees and guided to the optical element 12. As the reflecting plate 44, for example, a glass substrate formed with a metal film by a thin film forming method such as vapor deposition, plating, or sputtering can be used. Further, the reflection plate 44 of this example also serves as a reference position that determines the position in the insertion direction when the optical plug 50c is inserted. An abutting surface 56 having an angle of approximately 45 degrees is provided at a position where the optical plug 50c abuts on the reflecting plate 44. The contact surface 56 is provided above the portion of the tape fiber 52 where the fiber core is exposed. This prevents the end face of the fiber core from coming into contact with other members, secures an optical distance from the reflecting plate 44, and protects the end face of the fiber core.

  In particular, when a receiving module is configured using a light receiving element as the optical element 12, the distance from the fiber core end face of the tape fiber 52 to the lens 20b via the reflecting plate 44 is increased, and the lens diameter is increased. If the beam diameter of the signal light is relatively large, the optical coupling efficiency is reduced and mutual interference (crosstalk) with adjacent channels (an optical system including other optical elements 12) is likely to occur. Is important. The optimization of the focal length depends on the lens diameter of the lens 20b (which may be a lens pitch) and the divergence angle of the outgoing beam from the fiber core. For example, when the pitch of the lenses 20b is 0.25 mm and the divergence angle of the outgoing beam is 11 degrees at half value, in order to prevent the outgoing beam from entering the other adjacent lens 20b, the focal length is set to about 0.64 mm. There is a need to. In this example, the shape and arrangement of the reflector 44 are set so as to satisfy this focal length.

  As described above, in this example, since the optical plug 50c is configured to abut against the reflection plate 44 disposed on one end side of the optical socket 18d, the end face of the optical plug 50c to the reflection position on the reflection surface of the reflection plate 42 is used. It is possible to shorten the distance and the distance from the reflection position to the lens 20b (that is, shorten the optical path). Further, in this example, the guide groove 42 provided in the optical socket 18d has a structure penetrating from one end side to the other end side of the optical socket 18d, so that high-precision processing can be easily performed by cutting or the like. Thus, there is an advantage that it is possible to easily realize high accuracy of the fitting position between the optical plug 50c and the optical socket 18d.

  Also in the present embodiment, a second lens that condenses the signal light emitted from the tape fiber 52 may be provided on one end side of the optical plug 50c.

<Sixth Embodiment>
Next, an opto-electric hybrid integrated circuit configured using the optical module described in the above embodiment and a circuit board configured using the opto-electric hybrid integrated circuit will be described. In addition, although the case where the optical module 1a mentioned above is used is illustrated below, another optical module may be used.

  FIG. 9 is a diagram illustrating a configuration example of an opto-electric hybrid integrated circuit and a circuit board including the integrated circuit. The circuit board 200 shown in the figure includes an opto-electric hybrid integrated circuit 202 including the optical module 1a according to the above-described embodiment, and a wiring board 204.

  The opto-electric hybrid integrated circuit 202 includes an optical module 1a and a signal processing chip 206, and has a structure in which both are integrally molded with plastic or the like. The optical module 1a and the signal processing chip 206 are electrically connected by wire bonding. The optical module 1a is arranged so that the emission direction of the emitted light from the optical element is directed to the wiring board 204 side. The optical socket provided in the optical module 1a is exposed from the mold resin and is in a state where an optical plug can be connected. The wiring substrate 204 is provided with a wiring film 208 on the top, and the opto-electric hybrid integrated circuit 202 is placed thereon. A socket 210 is disposed on the upper surface of the wiring board 204, and a pin grid array (PGA) provided in the opto-electric hybrid integrated circuit 202 is inserted into the socket 210, so that the opto-electric hybrid integrated circuit 202 is fixed.

  FIG. 10 is a diagram for explaining another configuration example of the opto-electric hybrid integrated circuit and a circuit board including the integrated circuit. A circuit board 210 shown in the figure includes an opto-electric hybrid integrated circuit 212 including the optical module 1a according to the above-described embodiment, and a wiring board 214.

  The opto-electric hybrid integrated circuit 212 includes an optical module 1a and a signal processing chip 216, and has a structure in which both are integrally molded with plastic or the like. The optical module 1 a is arranged so that the emission direction of the emitted light from the optical element is opposite to the wiring board 214. The optical socket provided in the optical module 1a is exposed from the mold resin and is in a state where an optical plug can be connected. The wiring substrate 214 is provided with a wiring film 218 on the top, and the opto-electric hybrid integrated circuit 212 is placed thereon. The opto-electric hybrid integrated circuit 212 is connected to the wiring substrate 214 by a ball grid array (BGA).

  Such an opto-electric hybrid integrated circuit and a circuit board according to the present embodiment are applied to various electronic devices such as a personal computer and used for information communication within the device and information communication with external devices. Is possible.

<Modified Example>
In addition, this invention is not limited to the content of each embodiment mentioned above, A various deformation | transformation implementation is possible within the scope of the summary of this invention. For example, in the above-described embodiment, the optical plug is positioned by the guide surface provided in the optical socket. However, the protrusion is provided in the fitting hole (the space in which the optical plug is inserted) of the optical socket. It is also preferable to position the optical plug by urging the projection.

  FIG. 11 is a diagram illustrating a configuration example of the optical socket when the optical plug is positioned by the protrusion. FIG. 11A shows a plan view of the optical socket 118 according to the present embodiment as viewed from the opening side of the fitting hole into which the optical plug is inserted, and FIG. 11B shows the FF shown in FIG. A cross-sectional view along the line is shown.

  An optical socket 118 shown in FIG. 11 has a slope in a fitting hole into which an optical plug is to be inserted, and a projection having a semicircular cross section extending in a direction substantially parallel to the z axis on the slope. A section 120 is provided. The protrusion 120 has a function of contacting and abutting the contact surface (details will be described later) formed on the optical plug side corresponding to the protrusion 120. Further, a lens 122 and a reflecting portion 124 are integrally formed on the other end side of the optical socket 118 of this example. Such an optical socket 118 can be used in place of the optical socket 18a described above, for example, in the optical module 1a of the second embodiment described above.

  FIG. 12 is a diagram for explaining a configuration example of an optical plug suitable for use in combination with the optical socket 118 shown in FIG. 12A is a plan view of the optical plug 150 as viewed from above, and FIG. 12B is a front view of the optical plug 150. FIG. 12C is a front view showing components disassembled for explaining the structure of the optical plug 150.

  An optical plug 150 shown in FIG. 12 holds one end of the tape fiber 152 and includes a base 156, an upper plate 158, a lens support member 160, and a plurality of lenses 162. As shown in FIG. 12C, the base 156 has a V-shaped groove, a fiber clad 154 of the tape fiber 152 is placed along the V-groove, and an upper plate 158 is arranged on the upper side. The fiber clad 154 is sandwiched between the upper plate 158 and the base 156.

  Further, as shown in FIG. 12B, the base 156 and the upper plate 158 are fixed using an adhesive 164. The lens support member 160 is fixed to the end portion of the complex of the base 156 and the upper plate 158. The lens support member 160 is integrally formed with four lenses 162. The lens support member 160 is positioned and fixed so as to optically connect the lens 162 and the fiber core 154. ing. A surface 166 provided on the base 156 is a contact surface provided corresponding to the protrusion 120 of the optical plug 118 described above, and the surface 166 is urged by the protrusion 120. The bottom surface 168 of the base 156 is disposed in contact with the top surface of the transparent substrate 10, and the surface 166 is urged by the protrusion 120, whereby the position of the optical plug 150 in the optical socket 118 is determined.

  FIG. 13 is a diagram for explaining another configuration example of the optical plug suitable for use in combination with the optical socket 118 shown in FIG. The basic structure of the optical plug 150a shown in FIG. 13 is the same as that of the optical plug 150 shown in FIG. 12, and the base 156a and the lens 162a are integrally formed, and the base 156a and the upper plate are formed. The difference is that the fiber clad 154 of the tape fiber 152 is sandwiched by 158a. By adopting such a structure, it is possible to reduce the number of components and thereby simplify the manufacturing process.

  Further, in the above-described embodiment, as an application example of the optical module according to the present invention, an opto-electric hybrid circuit and a circuit board (an opto-electric hybrid circuit board) configured to include the circuit have been illustrated. The scope of application of the optical module is not limited to this, and it is applied to an optical transceiver (optical communication device) that is included in various electronic devices and used for optical communication between the devices. Is also possible.

It is a figure explaining the structure of the optical module of 1st Embodiment. It is a figure explaining the structural example in the case of providing the member for preventing the position shift of an optical plug more reliably. It is a figure explaining the manufacturing process of the optical module of an Example. It is a figure explaining the manufacturing process of the optical module of an Example. It is a figure explaining the structure of the optical module of 2nd Embodiment. It is a figure explaining the structure of the optical module of 3rd Embodiment. It is a figure explaining the structure of the optical module of 4th Embodiment. It is a figure explaining the structure of the optical module of 5th Embodiment. It is a figure explaining the structural example of the circuit board containing a photoelectric mixed integrated circuit and the said integrated circuit. It is a figure explaining the other structural example of a circuit board containing a photoelectric mixed integrated circuit and the said integrated circuit. It is a figure explaining the structural example of the optical socket in the case of positioning an optical plug with a projection part. It is a figure explaining the structural example of an optical plug. It is a figure explaining the other structural example of an optical plug.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Transparent substrate 10, 12 ... Optical element, 14 ... Electronic circuit, 16 ... Wiring film, 18 ... Optical socket, 20 ... Lens, 22 ... Reflection part, 50 ... Optical socket, 52 ... Tape fiber

Claims (10)

An optical plug is attached to one end of the optical transmission path, and is an optical module for transmitting and receiving signal light through the optical transmission path to perform information communication,
A transparent substrate having optical transparency with respect to the wavelength of the signal light used;
An optical socket disposed on one side of the transparent substrate and to which the optical plug is attached;
The signal light is arranged on the other surface side of the transparent substrate and emits the signal light to one surface side of the transparent substrate in accordance with the supplied electric signal, or the signal light supplied from the one surface side of the transparent substrate. An optical element that generates an electrical signal according to the intensity;
The signal light that is disposed on one side of the transparent substrate, changes the path of the signal light emitted from the optical element by approximately 90 degrees, is guided to the optical transmission line, or the signal light emitted from the optical transmission line A reflector that changes the course by approximately 90 degrees and leads to the optical element;
The signal light that is formed in the optical socket and collects the signal light emitted from the optical element and guides it to the reflection part, or condenses the signal light that is emitted from the optical transmission path and reflected by the reflection part. A first lens that leads to the optical element;
An optical module comprising:   The optical module according to claim 1, wherein the reflection portion is formed in the optical socket.   The signal light emitted from the optical element and reflected by the reflecting portion is collected and guided to the optical transmission path, or the signal light emitted from the optical transmission path is condensed and reflected on the reflecting portion. The optical module according to claim 1, further comprising a second lens for guiding.   The optical module according to claim 6, wherein the second lens is formed on the optical plug.   The optical module according to claim 6, wherein the second lens is formed in the optical socket.   The first lens condenses the signal light emitted from the optical element to be substantially parallel light, and the second lens condenses the signal light emitted from the optical transmission path. The optical module according to claim 3, wherein substantially parallel light is used.   An optical communication apparatus comprising the optical module according to claim 1.   An opto-electric hybrid integrated circuit comprising the optical module according to claim 1.   A circuit board comprising the optical module according to claim 1. An electronic device comprising the optical module according to claim 1.

Images