JP2008139492A - Optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress occurrence of mutual electromagnetic interference, between a first driving means for driving a surface-emitting element and a second driving means for driving a surface that receives the element; while quality of high-speed signal is secured, on the assumption that an optical transmission medium is installed, in parallel with a substrate in the constitution. <P>SOLUTION: With a flexible printed board 10 wound around a support body 30, there are arranged, respectively on the rear of the first face 1a, a surface-emitting element 20 and a surface-receiving element 21; on the front of the second face 1b, a first drive IC 22, connected adjacent to the surface-emitting element 20; and on the front of the third face 1c, a second drive IC 23 connected adjacent to the surface-receiving element 21. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical module that includes an optical element such as a laser diode or a photodiode and is used for optical communication processing or optical information processing, and more particularly to an optical module that includes a planar optical element as an optical element.

  A surface-emitting laser that emits light in a direction perpendicular to the light-emitting surface is capable of higher integration of array arrangements and the like than conventional edge-emitting lasers. Recently, it has been attracting attention as a key part used for optical information processing and the like that require high integration lasers and high integration.

  Hereinafter, the main configuration of the conventional optical module will be sequentially described with reference to FIGS. In the optical modules shown in FIG. 11 to FIG. 13, for convenience of illustration, the surface light emitting element and the surface light receiving element are collectively shown as a surface type optical element. These positional relationships are similarly provided.

  When a surface type optical element is mounted on a substrate and an optical module that makes light incident on an optical transmission medium such as an optical fiber is manufactured, especially when a special optical system that deflects light such as a mirror is not used, FIG. As shown in FIG. 3, the optical fiber 202 is arranged perpendicular to the substrate 201 so as to be aligned above the surface optical element 203. As described above, when the optical fiber is arranged perpendicular to the substrate, the mountability is inferior and it is not suitable for realizing a thin optical module. Therefore, it is desirable to arrange the optical fiber in parallel with the substrate.

  This situation is the same not only for the optical system of the surface light emitting element but also for the photodiode as the light receiving element. In other words, since a general photodiode has a planar light receiving structure, when receiving light from an optical fiber or waveguide disposed on the same substrate, an optical system that deflects the light in a generally perpendicular direction is required. It becomes.

  As an example of an optical module provided with an optical system that deflects light in a right angle direction, for example, as shown in FIG. 12, light emitted from a planar optical element 203 provided on a substrate 201 is deflected in a substantially right angle direction. The structure which provides the slanting mirror 204 which couple | bonds and couple | bonds with the optical fiber 204 (or optical waveguide) is disclosed (for example, refer patent documents 1-3).

  However, since the oblique mirror is required to have high accuracy such as high flatness and low surface roughness, it is not easy to form an oblique mirror having a sufficient function as an optical module. In order to actually realize these configurations, as shown in FIG. 12, the light from the surface optical element 203 is converged by the lens 205, reflected by the inclined mirror 204, and coupled to the optical fiber 202. It is necessary to precisely align the optical axis of the lens 205 and the position of the reflection point of the inclined mirror 204, which is not always a realistic configuration.

  Patent Document 4 discloses a method in which a planar optical element is mounted horizontally on a substrate, and light emitted perpendicularly to the substrate is received by a special optical fiber array having a 45 ° inclination. Yes. However, when this method is used, there are many problems that are extremely difficult to realize, such as oblique processing of the optical fiber array, precise positioning of the optical fiber array to the guide, and surface roughness of the mirror, which is not practical in production.

  Therefore, in order to realize a configuration in which an optical transmission medium such as an optical fiber is easily mounted so as to be horizontal with the substrate, as shown in FIG. 13, the planar optical element 203 is attached to a flexible substrate, for example, a flexible substrate 206. A configuration to be implemented is considered. In this case, since the flexible substrate 206 can be bent at a right angle so that the light receiving and emitting surface of the surface optical element 203 is parallel to the substrate, the light can be deflected at a right angle relatively easily.

For example, Patent Document 5 discloses a configuration in which an optoelectronic die is mounted on a flexible circuit. In this technology, the flexible circuit can be fixed to the heat sink carrier with an adhesive, and when the flexible circuit is fixed to the heat sink carrier, the flexible circuit is bent by 90 °, and the direction of light reception / emission of the planar optical element is relative to the substrate. Parallel.
Also in Patent Document 6, a planar optical element is mounted in a direction perpendicular to the substrate in the same manner as in Patent Document 5, and the light receiving and emitting directions are parallel to the substrate.

JP-A-62-35304 JP-A-5-88029 JP 2000-564081 A JP 2003-207694 A JP 2001-242358 A JP 2005-55885 A

  As described above, a planar optical element is mounted on a flexible substrate, and the flexible substrate is bent at a right angle to mount the planar optical element in a direction perpendicular to the flexible substrate. A configuration has been devised that facilitates coupling with transmission media.

In an optical module, it is actually necessary to provide a surface light-emitting element and a surface light-receiving element as surface optical elements, but the above-described configuration has the following problems.
In the optical module, in order to ensure the signal quality of the high-speed signal, it is necessary to arrange the surface light emitting element and the first driving IC, and the surface light receiving element and the second driving IC close to each other. On the other hand, it is not preferable to bring the first driving IC and the second driving IC close to each other because electromagnetic interference occurs between them.

  In the above configuration, the driving IC for the surface light emitting element (first driving IC) and the driving IC for the surface light receiving element (second driving IC) are mounted in the same plane. Is taken. However, assuming this form, the first driving IC and the second driving IC must be brought close to each other, and the generation of electromagnetic interference must be accepted.

  The present invention has been made in view of the above problems, and presupposes a configuration in which an optical transmission medium is provided so as to be horizontal with the substrate, assuming that the optical transmission medium is provided so as to be horizontal with the substrate. Thus, while ensuring the signal quality of the high-speed signal, the generation of mutual electromagnetic interference between the first driving means for driving the surface light emitting element and the second driving means for driving the surface light receiving element is suppressed, It is an object of the present invention to provide a highly reliable optical module that realizes further miniaturization and reduction of the occupied area on the substrate surface.

An optical module according to the present invention includes a surface light emitting element that emits light in a direction perpendicular to the light emitting surface, a first driving unit that drives the surface light emitting element, and a surface light receiving element that receives light in a direction perpendicular to the light receiving surface. When,
Second planar driving means for driving the planar light receiving element, the planar light emitting element and the planar light receiving element are both mounted in a first plane, and the first driving means The second drive unit is mounted in a third surface different from both the first surface and the second surface. The second drive unit is mounted in a second surface different from the first surface. ing.

  According to the present invention, on the premise that the optical transmission medium is provided so as to be horizontal to the substrate, the first driving means for driving the surface light emitting element and the surface light receiving can be ensured while ensuring the signal quality of the high-speed signal. A highly reliable optical module that suppresses the generation of mutual electromagnetic interference with the second driving means for driving the element and enables further miniaturization and reduction of the occupied area on the substrate surface is realized.

-Basic outline of the present invention-
In the present invention, the following (1) to (3) are realized together on the premise that the optical transmission medium is provided so as to be horizontal to the substrate in the optical module.
(1) Both the surface light emitting element and the surface light receiving element are arranged close to each other in the same plane.
(2) The surface light-emitting element and the first driving means are arranged close to each other, and the surface light-receiving element and the second driving means are arranged close to each other.
(3) The first drive means and the second drive means are spaced apart as much as possible.

In the present invention, both the surface light emitting element and the surface light receiving element are mounted in the first surface, the first driving means is mounted in a second surface different from the first surface, and the second driving is performed. A configuration is adopted in which the means is mounted in a third surface different from both the first surface and the second surface.
By mounting both the surface light emitting element and the surface light receiving element in the first surface, light emission and light reception with respect to the optical transmission medium can be efficiently performed. By mounting the first driving means in a second surface different from the first surface and the second driving means in a third surface different from both the first surface and the second surface, Both forms 1) and (2) are realized. With this configuration, although the signal quality of the high-speed signal is ensured, mutual electromagnetic interference is generated between the first driving means for driving the surface light emitting element and the second driving means for driving the surface light receiving element. Deterred.

  Specifically, a three-dimensional support having at least four side surfaces installed on the substrate is used, and the first, second, and third surfaces are defined on the support. Here, a description will be given taking an example of a support body having a rectangular parallelepiped shape as the above three-dimensional shape. In the four side surfaces of the rectangular parallelepiped support, a surface light emitting element and a surface light receiving element are arranged adjacent to each other on the first side surface, and the first side surface is a second side surface orthogonal to the first side surface. The second driving means is arranged on the third side surface, which is the other side surface orthogonal to the first side surface. The second side surface and the third side surface are parallel surfaces. In this case, the surface light-emitting element and the first driving means exist on the surfaces orthogonal to each other, and therefore can be disposed close to each other. Similarly, the surface light-receiving element and the second driving means are on the surfaces orthogonal to each other. Can be placed in close proximity to each other. In addition, since the first driving means and the second driving means exist on the planes parallel to each other, they are spaced apart from each other, that is, separated from each other by the thickness of the rectangular parallelepiped support.

More specifically, with respect to this configuration, the surface light emitting element, the first driving means, the surface light receiving element, and the second driving means are mounted on a single flexible substrate, and the flexible substrate is a rectangular parallelepiped. It is preferable to fix it so as to be wound around the surface of the shaped support.
In addition, a configuration in which the surface light emitting element, the first driving unit, the surface light receiving element, and the second driving unit are directly joined to the surface of a rectangular parallelepiped support may be employed.

-Specific embodiments to which the present invention is applied-
Hereinafter, specific embodiments of an optical module to which the present invention is applied will be described in detail with reference to the drawings.

(First embodiment)
1A and 1B show a flexible substrate as a component of the optical module according to the first embodiment, wherein FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line II ′ of FIG. It is.
FIGS. 2A and 2B show a support that is a component of the optical module according to the first embodiment, in which FIG. 2A is a front view and FIG. 2B is a side view.
FIGS. 3A and 3B show a state in which the flexible substrate is wound around and integrated with the support, wherein FIG. 3A is a front view and FIG. 3B is a side view.
FIG. 4 is a side view showing a state where the optical connector is attached to the optical module according to the first embodiment.

  As shown in FIGS. 1 to 3, the optical module according to the present embodiment is configured by winding a flexible printed board 10 that is a flexible board around a support body 30 that is a molded body having a substantially rectangular parallelepiped shape.

  As shown in FIG. 1A, the flexible printed board 10 is a flexible board that can be bent, wound, and the like. The first surface 10a which is a narrow surface by being bent along the fold lines A1 and A2, and the second surface 10b and the third surface 10c which are wide surfaces on the left and right sides of the first surface 10a, In the lower end portion, a wiring portion 11 formed with a plurality of wirings 11a and terminal electrodes 11b corresponding thereto is foldably provided.

  As shown in FIG. 1B, the flexible printed circuit board 10 is mounted with, for example, a 4-channel array surface light emitting element 20 on the back surface side of the first surface 10a. A first driving IC 22 for driving the surface light emitting element 20 that is close to and electrically connected to the surface light emitting element 20 is mounted on the front surface side. Similarly, for example, a 4-channel array-shaped surface light-receiving element 21 is mounted on the back surface side of the first surface 10a in the vicinity of the surface light-emitting element 20, and the surface-type light receiving device is mounted on the surface side of the third surface 10c. A second driving IC 23 for driving the surface light receiving element 21 that is in close proximity to and electrically connected to the element 21 is mounted. Here, the surface light emitting element 20, the first driving IC 22, the surface light receiving element 21, and the second driving IC 23 are mounted by, for example, flip chip bonding or die bonding.

  As shown in FIG. 1B, the surface light emitting element 20 is bonded and fixed to the back surface of the flexible printed circuit board 10 with bumps 27 so as to be aligned with the light emission opening 10 </ b> A formed in the flexible printed circuit board 10. Thus, light is emitted in the vertical direction from the surface of the first surface 10a through the light emitting opening 10A. Similarly, the surface light receiving element 21 is not shown in the figure, but is bonded and fixed to the back surface of the flexible printed circuit board 10 by bumps 27 so as to be aligned with the light receiving opening formed in the flexible printed circuit board 10. Light incident from the surface of the first surface 10a is received through the opening for use. In this configuration, the positional deviation when the surface light emitting element 20 and the surface light receiving element 21 are mounted on the flexible printed circuit board 10 is determined by the distance from the back surface of the flexible printed circuit board 10, that is, the width of the bumps 27. Since this width is an extremely small value, the surface light-emitting element 20 and the surface light-receiving element 21 can be mounted on the flexible printed board 10 relatively easily with high positional accuracy.

  These heat sinks 25 are provided on the lower surfaces of the surface light emitting element 20 and the surface light receiving element 21 and on the upper surfaces of the first driving IC 22 and the second driving IC 23, respectively. Further, a decoupling capacitor 26 is provided in the vicinity of the first driving IC 22 and the second driving IC 23. Here, the heat sink 25 and the decoupling capacitor 26 are mounted by, for example, flip chip bonding or die bonding.

  Further, the flexible printed circuit board 10 has a plurality of positioning holes 13 for fixing to the support 30 and a fitting hole 14 used for fitting and fixing a fixing pin for an optical connector, which will be described later, respectively. Alternatively, it is formed by etching.

  As shown in FIGS. 2A and 2B, the support body 30 is a substantially rectangular parallelepiped molded body having a pedestal 31 for fixing on the substrate 100. Since the support 30 is made of an injection molding method using a resin or a metal material, a complicated shape can be easily produced. In the present embodiment, the support 30 is illustrated as having a substantially rectangular parallelepiped shape, but may be any shape having four or more side surfaces, for example, a shape having five, six, or more side surfaces. The support 30 may be produced.

  The support 30 includes an insertion hole 33 into which a fixing pin of the optical connector is inserted through the fitting hole 14 on the first side surface 30a which is a narrow surface among the four side surfaces, and a flexible print. When the substrate 10 is fixed, fitting grooves 34 and 35 in which the surface light emitting element 20 and the surface light receiving element 21 mounted on the flexible printed board 10 are accommodated are formed.

  Further, the support 30 corresponds to the positioning hole 13 of the flexible printed circuit board 10 on the second side surface 30b and the third side surface 30c which are wide surfaces orthogonal to the first side surface 30a among the four side surfaces. Positioning protrusions 32 are provided.

  As shown in FIGS. 3A and 3B, the flexible printed board 10 configured as described above is wound around the support 30, and the positioning protrusions of the support 30 are placed in the positioning holes 13 of the flexible printed board 10. 32 is fitted and fixed by an adhesive, a metal ring, or the like, and the wiring portion 11 of the flexible printed circuit board 10 is fixed so as to cover the base 31 of the support 30, thereby forming the optical module according to the present embodiment. Here, the first surface 10 a of the flexible printed circuit board 10 overlaps with the first side surface 30 a of the support 30 to form the first surface 1 a. Similarly, the second surface 10b overlaps with the second side surface 30b, and the third surface 10c overlaps with the third side surface 30c to form the second surface 1b and the third surface 1c, respectively.

  In the optical module according to the present embodiment, the surface light-emitting element 20 and the surface light-receiving element 21 are disposed in the fitting grooves 34 and 35 of the support 30 on the back surface of the first surface 1a, and the second surface 1b. The first driving IC 22 connected to the surface of the surface light emitting element 20 is adjacent to the surface of the second surface, and the second driving IC 22 is connected to the surface of the third surface 1c adjacent to the surface light receiving element 21. Each of the driving ICs 23 is arranged. In this case, the surface light-emitting element 20 and the first driving IC 22 are disposed close to each other on a plane orthogonal to each other, and similarly, the surface light-receiving element 21 and the second driving IC 23 are orthogonal to each other. Closely placed to stay on top. In addition, since the first driving IC 22 and the second driving IC 23 exist on the surfaces parallel to each other, only the separation distance between both surfaces, that is, the thickness of the support 30 (and the thickness twice that of the flexible printed circuit board 10). Placed apart.

  As shown in FIG. 4, an optical connector 40, which is an optical transmission medium, is fixed to the optical module according to the present embodiment. Specifically, the fixing pin 41 of the optical connector 40 is inserted into the insertion hole 33 of the support 30 through the fitting hole 14 of the flexible printed circuit board 10, and the optical fiber array 40a of the optical connector 40 is replaced with a surface light emitting element. In this state, the optical connector 40 is fixed to the optical module with high accuracy so that the light emitting surface 20 and the optical fiber array 40b of the optical connector 40 are aligned with the light receiving surface of the surface light receiving element 21, respectively. Is done. Here, the gap between the flexible printed board 10 and the optical connector 40 is filled with a predetermined optical adhesive and cured.

  As described above, according to the present embodiment, on the assumption that the optical connector 40 is provided so as to be horizontal with the substrate 100, the surface light emitting element 20 is driven while ensuring the signal quality of the high-speed signal. Generation of mutual electromagnetic interference between the first driving IC 22 and the second driving IC 23 for driving the surface light receiving element 21 is suppressed, and further miniaturization and reduction of the occupied area on the surface of the substrate 100 are achieved. A highly reliable optical module capable of realizing the above is realized.

(Second Embodiment)
5A and 5B show a flexible substrate that is a component of the optical module according to the second embodiment. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along the line I-I ′ in FIG. It is.
6A and 6B show a support body that is a component of the optical module according to the second embodiment, in which FIG. 6A is a front view and FIG. 6B is a side view.
FIG. 7 shows a state in which the flexible substrate is wound around and integrated with the support, wherein (a) is a front view and (b) is a side view.
FIG. 8 is a side view showing a state in which the optical connector is attached to the optical module according to the second embodiment.

  As shown in FIG. 5 to FIG. 7, the optical module according to the present embodiment is configured by winding a flexible printed board 50 that is a flexible board around a support body 60 that is a molded body having a substantially rectangular parallelepiped shape.

  As shown in FIG. 5A, the flexible printed board 50 is a flexible board that can be bent, wound, and the like. The first surface 50a which is a narrow surface by being bent along the fold lines A1 and A2, and the second surface 50b and the third surface 50c which are wide surfaces on the left and right of the first surface 50a In the lower end portion, a wiring portion 11 formed with a plurality of wirings 11a and terminal electrodes 11b corresponding thereto is foldably provided.

  As shown in FIG. 5B, for example, a 4-channel array surface light emitting element 51 is mounted on the flexible printed circuit board 50 on the surface side of the first surface 50 a. A first driving IC 22 for driving the surface light emitting element 51 that is in close proximity to and electrically connected to the surface light emitting element 51 is mounted on the front surface side. Similarly, for example, a 4-channel array-shaped surface light-receiving element 52 is mounted on the surface side of the first surface 50a in the vicinity of the surface light-emitting element 51, and the surface-type light reception is performed on the surface side of the third surface 50c. A second driving IC 23 for driving the surface light receiving element 52 that is in proximity to and electrically connected to the element 52 is mounted. Here, the surface light emitting element 51, the first driving IC 22, the surface light receiving element 52, and the second driving IC 23 are mounted by, for example, flip chip bonding or die bonding.

  As shown in FIG. 5B, the surface light emitting element 51 is bonded and fixed to the surface of the flexible printed board 50, and emits light in the vertical direction from the surface of the first surface 50a. Similarly, the surface light receiving element 52 is bonded and fixed to the surface of the flexible printed board 50 and receives light incident from the surface of the first surface 50a.

  These heat sinks 25 are provided on the lower surfaces of the surface light emitting element 51 and the surface light receiving element 52 and on the upper surfaces of the first driving IC 22 and the second driving IC 23, respectively. Further, a decoupling capacitor 26 is provided in the vicinity of the first driving IC 22 and the second driving IC 23. Here, the heat sink 25 and the decoupling capacitor 26 are mounted by, for example, flip chip bonding or die bonding.

  Further, the flexible printed circuit board 50 has a plurality of positioning holes 13 for fixing to the support body 60 and a fitting hole 14 used for fitting and fixing a fixing pin of an optical connector described later, respectively. Alternatively, it is formed by etching.

As shown in FIGS. 6A and 6B, the support body 60 is a molded body having a substantially rectangular parallelepiped shape having a pedestal 31 for fixing on the substrate 100. Since the support 60 is made by an injection molding method using a resin or a metal material, a complicated shape can be easily made. In the present embodiment, the support body 60 is illustrated as having a substantially rectangular parallelepiped shape, but may be any shape having four or more side surfaces, for example, a shape having five, six, or more side surfaces. The support 60 may be produced.
The support body 60 is formed with an insertion hole 33 into which the fixing pin of the optical connector is inserted through the fitting hole 14 on the first side surface 60a which is a narrow surface among the four side surfaces. Yes.

  The support body 60 corresponds to the positioning hole 13 of the flexible printed circuit board 50 on the second side surface 60b and the third side surface 60c, which are wide surfaces orthogonal to the first side surface 60a, among the four side surfaces. Positioning protrusions 32 are provided.

  As shown in FIGS. 7A and 7B, the flexible printed circuit board 50 configured as described above is wound around the support body 60, and the positioning protrusions of the support body 60 are inserted into the positioning holes 13 of the flexible printed circuit board 50. 32 is fitted and fixed by an adhesive, a metal ring, or the like, and the wiring portion 11 of the flexible printed circuit board 50 is fixed so as to cover the base 31 of the support 60, thereby forming the optical module according to the present embodiment. Here, the first surface 50 a of the flexible printed circuit board 50 overlaps with the first side surface 60 a of the support body 60 to form the first surface 2 a. Similarly, the second surface 50b overlaps with the second side surface 60b, and the third surface 50c overlaps with the third side surface 60c to form the second surface 2b and the third surface 2c, respectively.

  In the optical module according to the present embodiment, the surface light emitting element 51 and the surface light receiving element 52 are disposed on the surface of the first surface 2a, and the surface of the second surface 2b is connected adjacent to the surface light emitting element 51. The first driving IC 22 thus formed is disposed on the surface of the third surface 2c, and the second driving IC 23 connected adjacent to the surface light receiving element 52 is disposed. In this case, the surface light-emitting element 51 and the first driving IC 22 are disposed close to each other on a surface orthogonal to each other, and similarly, the surface light-receiving element 52 and the second driving IC 23 are orthogonal to each other. Closely placed to stay on top. In addition, since the first driving IC 22 and the second driving IC 23 exist on the surfaces parallel to each other, only the separation distance between both surfaces, that is, the thickness of the support 60 (and the thickness twice that of the flexible printed board 50). Placed apart.

  Further, in this configuration, since the surface light emitting element 51 and the surface light receiving element 52 are mounted on the surface side of the 0 first surface 50a by the flexible printed circuit board 5, each heat sink 25 provided on the upper surface thereof is provided with the first heat sink 25. 1 is exposed to the outside from the surface 2a. Therefore, each heat sink 25 can provide excellent heat dissipation not only for the first driving IC 22 and the second driving IC 23 but also for the surface light emitting element 51 and the surface light receiving element 52.

  And as shown in FIG. 8, the optical connector 40 which is an optical transmission medium is fixed to the optical module by this embodiment. Specifically, the fixing pin 41 provided with the spacer 42 is inserted into the insertion hole 33 of the support body 60 through the fitting hole 14 of the flexible printed board 50, and the optical fiber array 40 a of the optical connector 40 emits surface light. The light emitting surface of the element 51 and the optical fiber array 40b of the optical connector 40 are positioned accurately and accurately so that they are aligned with the light receiving surface of the surface light receiving element 52. In this state, the optical connector 40 is attached to the optical module. Fixed. Here, the gap between the flexible printed board 50 and the optical connector 40 is filled with a predetermined optical adhesive and cured.

  The thickness of the spacer 42 is defined so as to correspond to the thickness in a state where the light emitting unit 40a (light receiving unit 40b) and the surface light emitting element 51 (surface light receiving element 52) are connected. The fixing pin 41 is inserted and fixed in the insertion hole 33 in the interposed state, so that the light emitting part 40a (light receiving part 40b) and the surface light emitting element 51 (surface type light receiving element 52) are accurately connected. Thus, the optical connector 40 is fixed to the optical module.

  As described above, according to the present embodiment, on the assumption that the optical connector 40 is provided so as to be horizontal with the substrate 100, the surface light emitting element 51 is driven while ensuring the signal quality of the high-speed signal. The generation of mutual electromagnetic interference between the first driving IC 22 and the second driving IC 23 that drives the surface light receiving element 52 is suppressed, and further miniaturization and reduction of the occupied area on the surface of the substrate 100 are achieved. A highly reliable optical module capable of realizing the above is realized.

(Third embodiment)
FIG. 9 shows an optical module according to the third embodiment, wherein (a) is a front view, (b) is a side view, and (c) is a bottom view.
FIG. 10 is a side view showing a state in which the optical connector is mounted on the optical module according to the third embodiment.

  As shown in FIG. 9, the optical module according to the present embodiment has a surface light emitting element 71, a first drive IC 22, a surface light receiving element 72, and a surface light receiving element 72 on the surface of a support body 60 that is a substantially rectangular parallelepiped molded body. The second driving IC 23 and the like are directly mounted.

  As shown in FIGS. 9A and 9B, the support body 70 is a substantially rectangular parallelepiped molded body having a pedestal 31 for fixing on the substrate 100. Here, the narrow surface which is one of the four side surfaces of the support 70 is defined as the first surface 3a, and the wide surfaces orthogonal to the first surface 3a are defined as the second side surface 3b and the third side surface 3c. And

  Since the support 70 is made of an injection molding method using a resin or a metal material, a complicated shape can be easily produced. In the present embodiment, the support body 70 is illustrated as having a substantially rectangular parallelepiped shape, but may be any shape having four or more side surfaces, for example, a shape having five, six, or more side surfaces. The support body 70 may be produced.

  In the present embodiment, as shown in FIGS. 9B and 9C, the plurality of wirings 71a and the wirings 73a are connected to the second side surface 3b and the third side surface 3c of the support body 70, respectively. A terminal electrode 73b is formed to form a wiring portion 73. In order to form the wiring 73a and the terminal electrode 73b, first, for example, a Cu thin film is formed on the entire surfaces of the second side surface 3b and the third side surface 3c by electroless plating. Then, for example, a Cu thin film is processed by a laser beam to form a plurality of terminal electrodes 73b, and for example, electroplating is performed in the order of copper, nickel, and gold to form a wiring 73a connected to the terminal electrode 73b.

  The support body 70 is formed with an insertion hole 33 into the first surface 3a for inserting a fixing pin for the optical connector. Then, a surface light emitting element 71 having, for example, a 4-channel array shape is mounted on the first surface 3a, and the surface light emitting element 71 is in proximity to and electrically connected to the second surface 3b. A first driving IC 22 for driving the mold light emitting element 71 is mounted. Similarly, for example, a 4-channel array-shaped surface light receiving element 72 is mounted on the first surface 3 a in the vicinity of the surface light emitting element 71, and the surface light receiving element 72 in the vicinity of the third surface 3 c. A second driving IC 23 for driving the surface light receiving element 72 electrically connected thereto is mounted. Here, the surface light emitting element 71, the first driving IC 22, the surface light receiving element 72, and the second driving IC 23 are mounted by, for example, flip chip bonding or die bonding.

The surface light emitting element 71 emits light in the vertical direction from the surface of the first surface 3a. The surface light receiving element 72 receives light incident from the surface of the first surface 3a.
These heat sinks 25 are provided on the lower surfaces of the surface light emitting element 71 and the surface light receiving element 72 and on the upper surfaces of the first driving IC 22 and the second driving IC 23, respectively. Further, a decoupling capacitor 26 is provided in the vicinity of the first driving IC 22 and the second driving IC 23. Here, the heat sink 25 and the decoupling capacitor 26 are mounted by, for example, flip chip bonding or die bonding.

  In the optical module according to the present embodiment, the surface light-emitting element 71 and the surface light-receiving element 72 are arranged on the first surface 3 a, and the second surface 3 b is connected adjacent to the surface light-emitting element 71. One driving IC 22 is arranged on the third surface 3c, and a second driving IC 23 connected to the surface type light receiving element 72 is adjacent thereto. In this case, the surface light emitting element 71 and the first driving IC 22 are disposed close to each other on the surface orthogonal to each other, and similarly, the surface light receiving element 72 and the second driving IC 23 are orthogonal to each other. Closely placed to stay on top. In addition, since the first driving IC 22 and the second driving IC 23 exist on planes parallel to each other, they are arranged apart from each other by the distance of the both sides, that is, the thickness of the support 70.

  Further, in this configuration, since the surface light emitting element 71 and the surface light receiving element 72 are mounted on the first surface 3a, the respective heat sinks 25 provided on the upper surface are exposed to the outside from the first surface 3a. It becomes a shape. Therefore, each heat sink 25 can provide excellent heat dissipation not only for the first driving IC 22 and the second driving IC 23 but also for the surface light emitting element 71 and the surface light receiving element 72.

  And as shown in FIG. 10, the optical connector 40 which is an optical transmission medium is fixed to the optical module by this embodiment. Specifically, the fixing pin 41 provided with the spacer 42 is inserted into the insertion hole 33 of the support 70, and the optical fiber array 40 a of the optical connector 40 includes the light emitting surface of the surface light emitting element 71 and the light of the optical connector 40. The fiber array 40b is positioned accurately and accurately so as to be aligned with the light receiving surface of the surface light receiving element 72, and the optical connector 40 is fixed to the optical module in this state. Here, the gap between the flexible printed board 50 and the optical connector 40 is filled with a predetermined optical adhesive and cured.

  The thickness of the spacer 42 is defined so as to correspond to the thickness of the state where the light emitting unit 40a (light receiving unit 40b) and the surface light emitting element 71 (surface type light receiving element 72) are connected. When the fixing pin 41 is inserted and fixed in the insertion hole 33 in the interposed state, the light emitting part 40a (light receiving part 40b) and the surface light emitting element 71 (surface type light receiving element 72) are accurately connected. Thus, the optical connector 40 is fixed to the optical module.

  As described above, according to the present embodiment, on the assumption that the optical connector 40 is provided so as to be horizontal with the substrate 100, the surface light emitting element 71 is driven while ensuring the signal quality of the high-speed signal. Generation of mutual electromagnetic interference between the first driving IC 22 and the second driving IC 23 that drives the surface light-receiving element 72 is suppressed, and further miniaturization and reduction of the occupied area on the surface of the substrate 100 are achieved. A highly reliable optical module capable of realizing the above is realized.

  Hereinafter, various aspects of the present invention will be collectively described as supplementary notes.

(Supplementary note 1) a surface light emitting device that emits light in a direction perpendicular to the light emitting surface;
First driving means for driving the surface light emitting element;
A surface light-receiving element that receives light in a direction perpendicular to the light-receiving surface;
Second driving means for driving the surface light-receiving element,
The surface light emitting element and the surface light receiving element are both mounted in the first surface,
The first driving means is mounted in a second surface different from the first surface;
The optical module, wherein the second driving means is mounted in a third surface different from both the first surface and the second surface.

(Appendix 2) One flexible substrate on which the surface light emitting element, the first driving means, the surface light receiving element, and the second driving means are mounted;
A rectangular parallelepiped support,
The optical module according to claim 1, wherein the flexible substrate is fixed to the side surface of the support, and the first, second, and third surfaces are defined on the support.

(Supplementary Note 3) The flexible substrate has at least one first fitting hole formed therein,
The support is formed with a fitting projection corresponding to the first fitting hole,
The optical module according to appendix 2, wherein the flexible substrate is fixed to a surface of the support body by fitting the fitting protrusion into the first fitting hole.

(Appendix 4) The flexible substrate is formed with at least one second fitting hole,
A third fitting hole corresponding to the second fitting hole is formed in the support,
Has been
In a state where the flexible substrate is fixed to the side surface of the support body, a part of the optical transmission medium is fitted into the third fitting hole through the second fitting hole, 4. The optical module according to appendix 2 or 3, wherein the optical transmission medium is connected to the surface light emitting element and the surface light receiving element existing on the first surface.

(Supplementary Note 5) In the flexible substrate, the first driving means and the second driving means are provided on the front surface, and the surface light emitting element and the surface light receiving element are provided on the back surface,
A pair of recesses corresponding to the surface light emitting element and the surface light receiving element are formed in the support,
The optical module according to any one of appendices 2 to 4, wherein the surface light emitting element is accommodated in one of the recesses, and the surface light receiving element is accommodated in the other recess.

  (Appendix 6) The flexible substrate is characterized in that the first driving means and the second driving means, the surface light emitting element and the surface light receiving element are both provided on the surface. The optical module according to any one of appendices 2 to 4.

(Supplementary note 7) Further includes a three-dimensional support having at least four side surfaces,
Appendix 1 characterized in that the surface light emitting element, the first driving means, the surface light receiving element, and the second driving means are directly joined to the side surface of the support. The optical module as described.

It is a schematic diagram which shows the flexible substrate which is a component of the optical module by 1st Embodiment. It is a schematic diagram which shows the support body which is a component of the optical module by 1st Embodiment. In the optical module by 1st Embodiment, it is a schematic diagram which shows a mode that the flexible substrate was wound around the support body and integrated. It is a side view which shows a mode that the optical connector was mounted | worn with the optical module by 1st Embodiment. It is a schematic diagram which shows the flexible substrate which is a component of the optical module by 2nd Embodiment. It is a schematic diagram which shows the support body which is a component of the optical module by 2nd Embodiment. In the optical module by 2nd Embodiment, it is a schematic diagram which shows a mode that the flexible substrate was wound around the support body and integrated. It is a side view which shows a mode that the optical connector was mounted | worn with the optical module by 2nd Embodiment. It is a schematic diagram which shows the optical module by 3rd Embodiment. It is a side view which shows a mode that the optical connector was mounted | worn with the optical module by 3rd Embodiment. It is a schematic diagram which shows the main structure of the conventional optical module. It is a schematic diagram which shows the main structure of the conventional optical module. It is a schematic diagram which shows the main structure of the conventional optical module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a, 10a 1st surface 1b, 10b 2nd surface 1c, 10c 3rd surface 10 Flexible printed circuit board 10A Light emission opening 11, 73 Wiring part 11a, 73a Wiring 11b, 73b Terminal electrode 13 Positioning hole 14 For fitting Holes 20, 51, 71 Surface light-emitting elements 21, 52, 72 Surface light-receiving element 22 First driving IC
23 Second driving IC
25 Heat sink 26 Decoupling capacitor 27 Bumps 30, 60, 70 Supports 30a, 60a First side surface 30b, 60b Second side surface 30c, 60c Third side surface 31 Base 32 Positioning projection 33 Insertion holes 34, 35 Fitting groove 40 Optical connector 40a Optical fiber array 41 Fixing pin 42 Spacer 100 Substrate

Claims (5)

A surface light emitting device that emits light in a direction perpendicular to the light emitting surface;
First driving means for driving the surface light emitting element;
A surface light-receiving element that receives light in a direction perpendicular to the light-receiving surface;
Second driving means for driving the surface light-receiving element,
The surface light emitting element and the surface light receiving element are both mounted in the first surface,
The first driving means is mounted in a second surface different from the first surface;
The optical module, wherein the second driving means is mounted in a third surface different from both the first surface and the second surface. A flexible substrate on which the surface light emitting element, the first driving means, the surface light receiving element, and the second driving means are mounted;
A rectangular parallelepiped support,
The optical module according to claim 1, wherein the flexible substrate is fixed to the side surface of the support, and the first, second, and third surfaces are defined on the support. . In the flexible substrate, the first driving means and the second driving means are provided on the front surface, and the surface light emitting element and the surface light receiving element are provided on the back surface,
A pair of recesses corresponding to the surface light emitting element and the surface light receiving element are formed in the support,
The optical module according to claim 2, wherein the surface light emitting element is housed in one of the recesses, and the surface light receiving element is housed in the other recess.   3. The flexible substrate, wherein the first driving unit and the second driving unit, the surface light emitting element, and the surface light receiving element are both provided on a surface. Or the optical module of 3. A solid support having at least four side surfaces;
2. The surface light emitting element, the first driving unit, the surface light receiving element, and the second driving unit are directly joined to the side surface of the support. The optical module as described in.

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