JP2009053281A - Optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module which is significantly reduced in size and is manufactured at a low cost, and in which both of optical connection and electric connection are detachably achieved perpendicularly to a wiring board face. <P>SOLUTION: The optical module is equipped with: an upper structure 5 including an optical transmission body 7 forming a continuous optical transmission path in which the optical axis on an external side and the optical axis on an optical element side are perpendicular to each other, and a holding member 6 holding the optical transmission body 7; an optical element mounting substrate 30 placed on a wiring board 70 and electrically detachably connected to the wiring board 70 in a perpendicular direction; and an attachment body 50 disposed on the wiring board 70 for detachably attaching the upper structure 5 in a perpendicular direction and optically connecting the optical transmission path of the upper structure 5 to the optical element 40 on the optical element mounting substrate 30 by attaching the upper structure 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical module.

  In the field of optical communication using light as an information transmission medium, an optical module including an optical element that mutually converts an optical signal and an electrical signal is used to receive or transmit an optical signal transmitted through an optical fiber or the like. ing. A surface emitting element typified by a vertical cavity surface-emitting laser (VCSEL) is used for the conversion from an electrical signal to an optical signal, and a PIN is used for the conversion from an optical signal to an electrical signal. A surface light receiving element typified by a photodiode is used. These optical elements are electrically connected to the substrate, and optical fibers and the like are optically connected to the optical elements.

  Such an optical module has an optical transmission body such as an optical fiber from the viewpoint of workability when optical wiring such as an optical fiber is performed on a wiring board (printed wiring board or board), and ease of maintenance and replacement. It is desirable to be detachable via a connector.

  In addition, when an optical fiber or the like is attached to or detached from the optical element, a structure for attaching or detaching the optical fiber or the like around the component on which the optical element is mounted should be provided if it is configured to be attached or detached horizontally with respect to the wiring board. Since it cannot be obtained, there is a problem that other parts cannot be mounted in the space, and the mounting density cannot be increased. Therefore, it is desirable that the optical fiber or the like can be attached and detached in the direction perpendicular to the wiring board.

Conventionally, in order to meet such demands, an optical element is mounted so that its light emitting / receiving surface is horizontal with respect to the wiring board, and a reflection mirror is provided on the end face of an optical fiber or the like to make the optical axis vertical. There has been proposed an optical module that optically connects an optical fiber or the like and an optical element detachably in a vertical direction by using a connector converted into (see Patent Document 1).
JP 2006-65358 A

  The optical element is mounted on the wiring board as a whole component such as a substrate or a package on which a driver integrated circuit device or the like is mounted together. As a general form of electrically connecting such components to pads on a wiring board, there is connection by reflow of solder balls such as BGA (Ball Grid Array). In the connection method, when it is necessary to repair and replace a component on which an optical element is mounted on a wiring board on which many other components are mounted, it is difficult to replace the component or the replacement work is complicated. There was a problem of becoming.

  Thus, from the viewpoints of workability for maintenance and replacement and securing of mounting density on the wiring board, not only optical connection but also electrical connection can be attached to and detached from the wiring board vertically, and a structure that can be easily attached and detached is desired. It was. Furthermore, further miniaturization of the optical module itself is desired from the viewpoint of improving the mounting density, and it is also desired to produce a product that satisfies these requirements at a low cost.

  The present invention has been made in view of the circumstances as described above, and is greatly reduced in size, and both optical connection and electrical connection can be attached to and detached from the surface of the wiring board perpendicularly. It is an object to provide an optical module that can be manufactured at low cost.

  The present invention is characterized by the following in order to solve the above problems.

  1stly, the optical module of this invention optically connects the optical transmission line which transmits an optical signal, and the optical element which converts an optical signal into an electrical signal, or converts an electrical signal into an optical signal. An optical transmission body that forms a continuous optical transmission path in which the optical axis on the external side and the optical axis on the optical element side are perpendicular to each other, and an upper structure including a holding member that holds the optical transmission body, The optical element mounting substrate disposed on the wiring board and electrically connected to the wiring board in a detachable manner in the vertical direction, and provided on the wiring board, so that the upper structure is detachable in the vertical direction. It is equipped with the mounting body by which the optical transmission path of an upper structure is optically connected with respect to the optical element of an optical element mounting board | substrate by mounting | wearing and mounting an upper structure.

  Second, in the first optical module, the mounting body is a fitting member that holds the upper structure with an elastic downward pressing force by fitting the upper structure from above. To do.

  Third, in the second optical module, a plurality of positioning pins are erected on the optical element mounting substrate, and a plurality of positioning holes into which the positioning pins are inserted are provided in the upper structure. When the upper structure is mounted on the side surface portion of the fitting member, the horizontal position of the upper structure is regulated by contacting the outer periphery of the holding member, whereby the positioning pin is placed in the positioning hole of the upper structure. A side plate portion for positioning the inserted optical element mounting substrate with respect to the wiring substrate is provided.

  Fourth, the second or third optical module is characterized in that a protrusion that contacts the wiring board is provided on the lower surface of the fitting member.

  Fifthly, any one of the first to fourth optical modules includes an anisotropic conductive sheet disposed between the optical element mounting substrate and the wiring substrate.

  Sixth, in any one of the first to fourth optical modules, an electrical connector disposed between the optical element mounting substrate and the wiring substrate is provided.

  Seventhly, in any one of the first to sixth optical modules, the optical transmission body of the upper structure has a structure bent in an arc shape, and an optical axis and an optical element on the outer side of the optical transmission body The optical axes on the side are perpendicular to each other.

  Eighth, in any one of the first to sixth optical modules, a light reflecting surface for vertically converting the optical axis of the optical transmission path is provided in the vicinity of the end surface of the optical transmission body of the upper structure. It is characterized by.

  According to the first aspect of the invention, the optical axis of the optical transmission line of the upper structure is converted from the horizontal direction on the outer side to the vertical downward direction on the optical element side, and is attached to and detached from the mounting member on the wiring board in the vertical direction. The optical device mounting substrate is mounted on the wiring board, and the upper structure is mounted on the mounting member so that the upper structure is placed on the optical device mounting substrate mounted on the wiring substrate. The body is positioned and the optical transmission path of the upper structure and the optical element of the optical element mounting substrate are optically connected.

  Therefore, both optical connection and electrical connection can be attached and detached perpendicular to the wiring board surface, and can be disconnected both optically and electrically during maintenance replacement, etc., so that maintenance replacement is easy. Furthermore, it is not necessary to provide a work space for attachment / detachment around the optical element mounting board, and the mounting density on the wiring board can be increased, and the components are mounted at a high density. The user can improve the selectivity and expandability of the place where the user places the optical module on the wiring board. Moreover, with the above structure, the optical module can be significantly reduced as a whole, and the optical module can be manufactured at low cost.

  According to the second aspect of the invention, the upper structure is held by the downward pressing force due to the elasticity of the fitting member by fitting the upper structure into the fitting member fixed on the wiring board from above. In addition to the effects of the first invention, the upper structure can be mounted in a form that is appropriately positioned in the vertical direction so as to be optically connected to the optical element mounting substrate. By pressing the optical element mounting substrate against the wiring substrate via the upper structure, the optical element mounting substrate and the wiring substrate can be electrically connected. Further, the optical structure can be easily separated by pulling the upper structure upward from the fitting member, and then the electrical element can be easily separated by taking the optical element mounting substrate upward from below. .

  According to the third aspect of the invention, in addition to the effect of the second aspect of the invention, by inserting the positioning pin erected on the optical element mounting substrate into the positioning hole provided on the lower surface of the upper structure, The optical transmission path of the upper structure and the optical element of the optical element mounting substrate are aligned with appropriate accuracy in the horizontal direction, and these can be optically connected, and the outer periphery of the holding member of the upper structure is fitted. By restricting the horizontal position of the upper structure by abutting against the side plate portion of the member, the optical element mounting board is indirectly positioned in the horizontal direction with respect to the wiring board. Directional positioning can also be performed with appropriate accuracy.

  According to the fourth aspect of the invention, the protrusion is provided on the lower surface portion of the fitting member, and the lower surface of the fitting member and the wiring board surface are separated from each other by contacting the wiring board with the protrusion portion. Therefore, in addition to the effects of the second and third inventions, the influence of signal reflection on the wiring board such as electrical reflection and noise by the fitting member formed of a conductive material such as metal is suppressed. The operational performance of the optical module can be improved.

  According to the fifth invention, the anisotropic conductive sheet is disposed between the optical element mounting substrate and the wiring substrate, and these are electrically connected via the anisotropic conductive sheet. In addition to the effects of the first to fourth inventions, the optical element mounting board can be easily separated from the wiring board, the thickness of the optical module in the vertical direction can be reduced, and the mounting density of the optical element mounting board can be reduced. The optical module can be reduced in size by raising it. Moreover, good electrical connection can be achieved with a simple and low-cost configuration in which the anisotropic conductive sheet is brought into a state of conducting in the vertical direction by downward pressing by the fitting member.

  According to the sixth aspect of the invention, the electrical connector is disposed between the optical element mounting substrate and the wiring substrate, and these are electrically connected via the electrical connector. In addition to the effects of the invention, the optical element mounting board can be easily separated from the wiring board, the vertical thickness of the optical module can be reduced, and the mounting density of the optical element mounting board is increased to reduce the size of the optical module. Can be

  According to the seventh invention, since the optical transmission body of the upper structure is bent in an arc shape, the optical axis on the external side and the optical axis on the optical element side are converted vertically, In addition to the effects of the first to sixth inventions, the upper structure can be further reduced in size, and an optical module can be manufactured at a low cost since no separate optical member such as a lens is required.

  According to the eighth aspect of the invention, since the light reflecting surface for converting the optical axis of the optical transmission line to be perpendicular is provided in the vicinity of the end face of the optical transmission member of the upper structure, the effects of the first to sixth aspects of the invention are provided. In addition, the optical axis on the external side and the optical axis on the optical element side can be appropriately converted vertically.

  In this specification, the “optical transmission body” includes an optical fiber made of glass or resin, an optical waveguide made of resin, or the like. In the following embodiment, an example using an optical fiber will be described. However, the optical transmission body applied in the present invention is not limited to this, and various types of optical transmission lines such as an optical waveguide can be configured. Things can be applied.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are perspective views showing an optical module according to an embodiment of the present invention. FIG. 1 shows a state in which optical connection and electrical connection are disconnected, and FIG. 2 shows a state in which optical connection and electrical connection are made. Yes.

  As shown in FIG. 1, the optical module 1 of this embodiment includes an upper structure 5 in which an optical fiber 7 is held by a holding member 6, an optical element mounting substrate 30 on which an optical element 40 is mounted, and anisotropic conductivity. A sheet 60 and a fitting member 50 fixed on a wiring board 70 (printed wiring board or board) are provided.

  In this optical module 1, an anisotropic conductive sheet 60 is disposed in an opening 51 in a fitting member 50 on a wiring substrate 70, an optical element mounting substrate 30 is disposed thereon, and an upper structure is further formed thereon. 2 is fitted vertically as shown in FIG. 2, and the optical fiber 7 of the upper structure 5 and the optical element 40 of the optical element mounting substrate 30 are optically connected, and the optical element mounting substrate 30 and the wiring are connected. The substrate 70 is electrically connected via the anisotropic conductive sheet 60. The mounted optical module 1 shown in FIG. 2 constitutes a compact module having a width of 10 mm × 10 mm and a thickness of 6.4 mm, for example.

  3A is a top view of the upper structure 5, FIG. 3B is a bottom view, and FIG. 3C is a side view. In the upper structure 5, a tape fiber 8 in which a plurality of (in this embodiment, 12) optical fibers 7 are arranged in parallel enters the holding member 6 from the back surface of the resin-made holding member 6. Thus, the optical fiber 7 is bent into an arc shape, and the end surface 7a of the optical fiber 7 is vertically exposed from the lower surface of the holding member 6 as shown in FIG.

  A pair of shoulder portions 12 forming a tapered surface along the peripheral edge portion are provided on both peripheral edge portions parallel to the optical fiber 7 on the upper surface of the holding member 6, and are fitted into the fitting member 50 of FIG. 1. The pair of protrusions 52 provided on the upper portion of the fitting member 50 abuts against the shoulder 12 of the holding member 6 and presses downward.

  Further, as shown in FIG. 3B, two positioning holes 11 are provided on the front side of the lower surface of the holding member 6 at symmetrical positions on both side surfaces of the holding member 6. When the optical element mounting substrate 30 is fitted and fitted into the member 50, the positioning pins 42 erected on the optical element mounting substrate 30 are inserted into the positioning holes 11 of the holding member 6 so that the upper structure 5 and the optical element mounting substrate 30 are horizontal. It is positioned in the direction.

  The holding member 6 includes an upper member 10 and a lower member 20 as shown in FIGS. 4A and 4B, and the optical fiber 7 is sandwiched between the upper member 10 and the lower member 20. It comes to hold. As shown in FIG. 4B, guide grooves 14 having a V-shaped cross section, for example, are provided in parallel on the curved surface corresponding to the arc shape of the optical fiber 7 on the lower surface side of the upper member 10. One optical fiber 7 is arranged and guided in each of the guide grooves 14.

  On the other hand, as shown in FIG. 4A, an optical fiber holding surface 22 having a curved surface corresponding to the arc shape of the optical fiber 7 is provided on the upper surface side of the lower member 20, and the upper member 10 and the lower side By sandwiching the optical fiber 7 by the member 20, the optical fiber 7 is held in a state of being bent in an arc shape between the guide groove 14 of the upper member 10 and the optical fiber holding surface 22 of the lower member 20. ing.

  When assembling the upper structure 5, two engaging claws 21 provided on both side surfaces of the lower member 20 are engaged with two engaging holes 13 provided on both side surfaces of the upper member 10. After the upper member 10 and the lower member 20 are fixed to each other, the tip end portion exposed from the tape fiber 8 of the optical fiber 7 and separated into one piece is inserted along the guide groove 14 of the upper member 10. The end face 7a of the optical fiber 7 is aligned using a jig or the like and fixed with an adhesive. FIGS. 5A and 5B show the arrangement of the upper member 10, the optical fiber 7, and the lower member 20 of the upper structure 5 thus manufactured.

  As shown in FIG. 5 (b), the optical fiber 7 held by the holding member 6 is bent into an arc shape, so that the optical axis moves from the horizontal external optical axis 65a downward to the optical element side optical axis 65b. The direction has been changed. The radius of curvature R of the arc portion is as small as, for example, 1 to 3 mm, the vertical direction of the upper structure 5 is reduced in height, and the horizontal direction is also reduced in size.

  Thus, in order to reduce the radius of curvature R of the arc portion of the optical fiber 7, a glass fiber having a diameter of 80 μm is used as the optical fiber 7. The diameter of a glass fiber that is generally used is 125 μm, but leakage of signal light to the outside can be suppressed by using such a thin glass fiber. Further, in order to ensure the strength of the optical fiber 7 and suppress the deviation, a resin coating having a thickness of 22.5 μm is provided on the outer peripheral portion of the glass fiber.

  FIG. 6 is a top perspective view of the optical element mounting substrate 30. The optical element mounting substrate 30 shown in the figure includes a box-shaped ceramic substrate 31 having a wall portion 32 erected along the outer periphery, and the optical fiber 7 and the optical fiber 7 are positioned on the front side of the ceramic substrate 31. The same number of optical elements 40 are mounted side by side. The plurality of optical elements 40 includes a VCSEL as a surface light emitting element and a PIN photodiode as a surface light receiving element. The upper surface 32a of the wall portion 32 forms an optical reference surface, and the end surface 7a of the optical fiber 7 and the optical element 40 are positioned in the vertical direction by contacting the lower surface of the upper structure 5.

  A driver integrated circuit device 41 of the optical element 40 is mounted behind the optical element 40 on the ceramic substrate 31, and the optical element 40 and the driver integrated circuit device 41 are connected by a bonding wire. In addition, other electronic components are mounted on the ceramic substrate 31, and the electronic components on the ceramic substrate 31 are connected to the printed wiring 33 and the like through a through hole that passes through the ceramic substrate 31 (not shown). The electrode is electrically connected to a pad electrode having a pitch of 500 μm, a diameter of 300 to 350 μm, and a height of 10 μm provided on the back surface of the ceramic substrate 31.

  A pair of positioning pins 42 having a protruding height of 2 mm and a protruding portion diameter of 0.7 mm are erected at positions on both sides of the optical element 40 on the ceramic substrate 31, and these positioning pins 42 serve as the upper structure 5. The optical element mounting substrate 30 and the upper structure 5 are positioned in the horizontal direction by being inserted into the positioning holes 13.

  7A is a perspective view of the fitting member 50 as viewed from above, FIG. 7B is a perspective view as viewed from below, FIG. 8A is a top view, and FIG. 8B is a bottom surface. FIG. The fitting member 50 is made of a material having rigidity and elasticity such as metal, and a substantially square opening 51 is provided at the bottom thereof. The left and right sides of the opening 51 are bent vertically and extend upward, and a protrusion 52 projecting inward is formed at the upper end of the opening 51.

  On the side surface portion of the fitting member 50, a side plate portion 53 that is bent vertically from the central portion of each of the four sides of the opening 51 and extends upward is provided. These side plate parts 53 abut against the outer peripheral part of the holding member 6 when the upper structure 5 is mounted, thereby restricting the horizontal position of the upper structure 5, and thereby the positioning pins of the optical element mounting substrate 30. 42 is inserted into the positioning hole 11 of the upper structure 5 so that the optical element mounting substrate 30 positioned relative to the upper structure 5 is indirectly mounted in the horizontal direction with respect to the wiring substrate 70. Positioning is performed with an appropriate accuracy in which the back electrode of the substrate 30 and the pad of the wiring substrate 70 overlap, for example, an accuracy of 50 to 100 μm or less.

  Protrusions 54 are provided on the lower surface of the fitting member 50 at symmetrical positions in the vicinity of the four corners. The fitting member 50 abuts against the wiring board 70 at the projections 54 to apply an insulating adhesive or the like. It is fixed using. Thereby, the lower surface of the fitting member 50 and the upper surface of the wiring board 70 are separated by a predetermined interval, for example, about 150 μm or more. When the fitting member 50 formed of a conductive material such as metal is fixed to the wiring board 70 by surface contact, the signal transmission on the wiring board 70 is affected by electrical reflection, noise, etc. Although the operation performance of the module 1 may be affected, it is possible to avoid these influences by providing the protrusion 54 and separating the lower surface of the fitting member 50 from the upper surface of the wiring board 70.

  The anisotropic conductive sheet 60 shown in FIG. 1 ensures electrical conduction in the vertical direction by pressurization, and various types can be used without particular limitation. For example, an insulating material having elasticity such as silicone rubber can be used. A substrate in which conductive particles such as metal are dispersed or a conductive wire is embedded can be used. You may make it use what provided the electroconductive pad on the insulating base material. The thickness of the anisotropic conductive sheet 60 is, for example, 0.1 to 1 mm.

  When assembling the optical module 1 having the above configuration from the state where the optical connection and the electrical connection are disconnected as shown in FIG. 1 to the state where the optical connection and the electrical connection are made as shown in FIG. An anisotropic conductive sheet 60 is disposed in the opening 51 of the fitting member 50 fixed on the substrate 70. Next, the optical element mounting substrate 30 is disposed thereon, and the upper structure 5 is vertically fitted into the fitting member 50 from above.

  At this time, the positioning pins 42 of the optical element mounting substrate 30 are inserted into the positioning holes 11 of the upper structure 5, and the upper structure 5 is in a horizontal direction with respect to the optical element mounting substrate 30 with a predetermined accuracy, for example 3 to 5 μm. In addition, the side surface of the holding member 6 is regulated by the side plate portion 53, and the optical element mounting substrate 30 is indirectly positioned in the horizontal direction with respect to the wiring substrate 70. Solder bumps having a pitch of 500 μm, a diameter of 300 to 350 μm, and a height of 100 μm are formed on the wiring board 70. A pitch of 500 μm and a diameter of the solder bumps provided on the lower surface of the optical element mounting substrate 30 are formed. A back electrode having a thickness of 300 to 350 μm and a height of 10 μm is aligned.

  Then, the upper structure 5 is pressed downward by the elasticity of the fitting member 50, whereby the anisotropic conductive sheet 60 is pressurized and becomes conductive. Thereby, the back electrode of the optical element mounting substrate 30 and the solder bump on the wiring substrate 70 are electrically connected via the anisotropic conductive sheet 60.

  Further, when the positioning pins 42 of the optical element mounting substrate 30 are inserted into the positioning holes 11 of the upper structure 5, the end surface 7 a of the optical fiber 7 and the optical element 40 are horizontally aligned as shown in the sectional view of FIG. 9. In addition to the positioning of the direction, the lower surface 6a of the holding member 6 and the upper surface 32a of the wall portion 32 of the optical element mounting substrate 30 come into contact with each other, whereby the end surface 7a of the optical fiber 7 and the optical element 40 are perpendicular to each other. Once positioned, they are optically connected.

  In this way, the optical module 1 is electrically and optically connected in the vertical direction in the state shown in FIG. 2 and is capable of transmitting and receiving optical signals transmitted to the outside through the optical fiber 7. .

  For example, during maintenance replacement, the optical connection can be easily disconnected by pulling out the upper structure 5 vertically from the fitting member 50, and then the optical element mounting substrate 30 is removed from the anisotropic conductive sheet 60. Electrical connection can be easily disconnected by taking out vertically.

  The present invention has been described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the upper structure 5 is detachably mounted in the vertical direction using the fitting member 50, and the optical transmission path of the upper structure 5 is connected to the optical element 40 of the optical element mounting substrate 30. As a mounting body having such a function, for example, a fitting hole is provided in the wiring board 70 and a latch structure is provided in the upper structure 5 so that the latch structure of the upper structure 5 is provided. May be fitted into a fitting hole of the wiring board 70 which is a mounting body.

  In the upper structure 5, the optical axis of the optical transmission path is converted into a vertical structure. As shown in FIG. 10, a light reflecting surface 71 having an angle of 45 degrees is disposed on the end surface 7 a of the optical fiber 7 held horizontally. Then, the external optical axis 65a and the optical element side optical axis 65b may be converted vertically by reflecting the signal light on the light reflecting surface 71.

  As the optical element 40, a surface light emitting element other than a VCSEL such as a laser diode may be used, or a surface light receiving element other than a PIN photodiode may be used.

FIG. 1 is a perspective view showing an optical module according to an embodiment of the present invention, and shows a state where an optical connection and an electrical connection are disconnected. FIG. 2 is a perspective view showing a state where optical connection and electrical connection are made in the optical module of FIG. 3A and 3B are views showing the upper structure, in which FIG. 3A is a top view, FIG. 3B is a bottom view, and FIG. 3C is a side view. 4A and 4B are diagrams showing an upper member and a lower member of the holding member, wherein FIG. 4A is a perspective view of the upper surface side, and FIG. 4B is a perspective view of the lower surface side. FIGS. 5A and 5B are views showing the arrangement of the upper member, the optical fiber, and the lower member of the upper structure, in which FIG. 5A is a perspective view and FIG. FIG. 6 is a perspective view of the optical element mounting substrate. 7A and 7B are views showing the fitting member, in which FIG. 7A is a perspective view seen from the upper side, and FIG. 7B is a perspective view seen from the lower side. 8A and 8B are diagrams showing the fitting member, where FIG. 8A is a top view and FIG. 8B is a bottom view. FIG. 9 is a cross-sectional view showing a state where the upper structure and the optical element mounting substrate are optically connected. FIG. 10 is a cross-sectional view showing another embodiment of the upper structure according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical module 5 Superstructure 6 Holding member 6a Lower surface 7 Optical fiber 7a End surface 8 Tape fiber 10 Upper member 11 Positioning hole 12 Shoulder part 13 Engaging hole 14 Guide groove 20 Lower member 21 Engaging claw 22 Optical fiber holding surface 30 Optical device mounting substrate 31 Ceramic substrate 32 Wall portion 32a Upper surface 33 Printed wiring 40 Optical device 41 Driver integrated circuit 42 Positioning pin 50 Fitting member 51 Opening portion 52 Projection portion 53 Side plate portion 54 Protrusion portion 60 Anisotropic conductive sheet 65a External Side optical axis 65b Optical element side optical axis 70 Wiring board 71 Light reflecting surface

Claims (8)

  An optical module that optically connects an optical transmission line that transmits an optical signal and an optical element that converts the optical signal into an electrical signal or converts the electrical signal into an optical signal, and the optical axis on the external side and the light An optical transmission body that forms a continuous optical transmission path that is perpendicular to the optical axis on the element side, and an upper structure that includes a holding member that holds the optical transmission body, and a wiring board that is disposed on the wiring board. An optical element mounting board that is electrically connected to the vertical direction in a detachable manner and a wiring board. The upper structure is detachably attached in the vertical direction, and the upper structure is attached. An optical module comprising: a mounting body in which an optical transmission line of the upper structure is optically connected to the optical element of the optical element mounting substrate.   The optical module according to claim 1, wherein the mounting body is a fitting member that holds the upper structure with a downward pressing force due to elasticity by fitting the upper structure from above.   A plurality of positioning pins are erected on the optical element mounting substrate, a plurality of positioning holes into which the positioning pins are inserted are provided in the upper structure, and an upper structure is formed on a side surface of the fitting member. When the is mounted, the horizontal position of the upper structure is restricted by contacting the outer periphery of the holding member, whereby the optical element mounting board in which the positioning pin is inserted into the positioning hole of the upper structure is attached to the wiring board. The optical module according to claim 2, further comprising a side plate portion for positioning.   The optical module according to claim 2, wherein a protrusion that abuts on the wiring board is provided on a lower surface portion of the fitting member.   The optical module according to claim 1, further comprising an anisotropic conductive sheet disposed between the optical element mounting substrate and the wiring substrate.   The optical module according to any one of claims 1 to 4, further comprising an electrical connector disposed between the optical element mounting substrate and the wiring substrate.   2. The optical transmission body of the upper structure has a structure bent in an arc shape, and an optical axis on the outer side and an optical axis on the optical element side of the optical transmission body are perpendicular to each other. 7. The optical module according to any one of items 1 to 6.   7. The optical module according to claim 1, wherein a light reflecting surface for converting the optical axis of the optical transmission path to a vertical direction is provided in the vicinity of the end face of the optical transmission body of the upper structure.

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