JP2007073664A - Optical transceiver module and optical communication device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized optical transceiver module and an optical communication device capable of reducing cross talk without complicating an electric conductive pattern. <P>SOLUTION: The optical transceiver module 1 has a stem 10A consisting of disk-like metal. In the stem 10A, electrode pins 11A-11C of a transmitting system and electrode pins 11D-11F of a receiving system are arranged in different regions via a division line B formed by pin holders 12A and 12B consisting of an insulation material. An LD 13 is connected to the electrode pins 11B and 11C of the transmitting system, and a line excepting the power supply of a PD 14 and an IC 21 is connected to the electrode pins 11D-11F of the receiving system. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical transmission / reception module and an optical communication apparatus that include a light emitting element and a light receiving element to perform bidirectional optical communication.

  Conventionally, light-emitting elements such as light-emitting diodes (LEDs) and surface-emitting lasers (VCSELs) and light-receiving elements such as photodiodes (PDs) are mounted as low-cost optical transmission devices, and bidirectionally transmitted through optical fibers. An optical transmission / reception module that performs optical communication is known. In such an optical transceiver module, reducing crosstalk between the transmission system and the reception system is important in terms of transmission reliability, and various proposals have been made conventionally (for example, (See Patent Documents 1 to 3.)

  In the conventional example described in Patent Document 1, a light receiving side ground terminal and a light emitting side ground terminal are formed on a single substrate, and the light receiving element and the like are formed by a first metal shell. A semiconductor device for optical communication in which a light-emitting element or the like is shielded by a second metal shell.

  The conventional example described in Patent Document 2 is an optical transmission / reception module in which a ground layer in a substrate on which a transmission circuit and a reception circuit are mounted is separated by a transmission system and a reception system, and only the transmission circuit side is shielded by a shield member. .

  The conventional example described in Patent Document 3 is an optical transmission module in which a light receiving element module is mounted on one side of a double-sided printed circuit board and a light emitting element module is mounted on the other side to separate a transmission system and a reception system. .

On the other hand, an optical transmission / reception module in which a light emitting element and a light receiving element are accommodated in the same package is conventionally known (for example, see Patent Document 4).
Japanese Patent Laid-Open No. 03-063240 JP 2003-264471 A JP 05-335617 A JP 2003-329892 A

  However, as described in Patent Documents 1 and 2, the transmission system and the reception system are individually or shielded on one side, or as described in Patent Document 3, the transmission system and the reception system are separated on both sides of the printed circuit board. In such a structure, the light emitting element and the light receiving element are separated from each other, and therefore, there is a problem in that the size of the optical coupling unit coupled to the optical fiber is increased when one-core bidirectional communication is performed.

  Further, according to the conventional example of Patent Document 2, there is a problem that the conductive pattern becomes complicated if the ground layer is separated in the transmission system and the reception system in the substrate.

  According to the conventional example of Patent Document 4, the optical coupling unit coupled to the optical fiber can be reduced in size, but noise and EMI (unwanted radiation) are generated because the pins of the transmission system and the reception system are mixed. There is a problem that it is easy.

  Accordingly, an object of the present invention is to provide an optical transmission / reception module and an optical communication apparatus that are small in size and can reduce crosstalk without complicating a conductive pattern.

  In order to achieve the above object, a first aspect of the present invention is an optical transceiver module in which a light emitting element and a light receiving element are accommodated in the same package, and three or more terminals are led out from the package. The optical transceiver module, wherein the terminals of the light emitting element and the terminals of the light receiving element are arranged in different regions via a linear dividing line.

  According to the optical transceiver module, the terminals related to the light emitting elements and the terminals related to the light receiving elements are arranged separately via the linear dividing line, so that the transmission / reception is performed in comparison with the case where the terminals are mixed. Crosstalk is less likely to occur. Further, by accommodating the light emitting element and the light receiving element in the same package, it is possible to reduce the size of the optical coupling portion such as an optical waveguide coupled to the optical fiber.

  “Terminals related to light-emitting elements” include signal terminals for driving light-emitting elements, signal terminals for driving ICs that drive light-emitting elements, and ground terminals. Includes a signal terminal for deriving the output signal of the light receiving element, a signal terminal for deriving the output signal of the amplifier IC for amplifying the output signal of the light receiving element, a ground terminal, and the like. Note that the “terminal associated with the light emitting element” may not include the power supply terminal of the amplification IC.

  The three or more terminals include a combination of one or more terminals related to the light emitting element and two or more terminals related to the light receiving element, two or more terminals related to the light emitting element and one or more related to the light receiving element. There are terminal combinations. The plurality of terminals may be rod-shaped, plate-shaped, thin-film shaped, and the shape is not limited.

  The distance between the terminal related to the light emitting element and the terminal related to the light receiving element is preferably longer than the minimum distance between the plurality of terminals. By arranging the terminal related to the light emitting element and the terminal related to the light receiving element separately and further separating the terminal related to the light emitting element and the terminal related to the light receiving element, crosstalk hardly occurs between transmission and reception.

  In addition, even if the distance between the terminal related to the light emitting element and the terminal related to the light receiving element is shorter than the minimum inter-terminal distance of the plurality of terminals, the terminal between the light emitting element and the terminal related to the light receiving element are insulated. By interposing a body, a shield plate, etc., it becomes possible to suppress the occurrence of crosstalk between transmission and reception.

  The terminal related to the light emitting element and the terminal related to the light receiving element can be configured such that at least the tip end portions are arranged in different rows with a predetermined distance.

  The predetermined distance may correspond to a thickness of a circuit board to which the plurality of terminals are connected. Thereby, when the optical transceiver module is mounted from the side surface direction of the circuit board, the circuit board can be interposed between the terminals related to the light emitting elements and the terminals related to the light receiving elements arranged in different rows, so that The occurrence of crosstalk can be suppressed.

  The terminal related to the light emitting element and the terminal related to the light receiving element may each have a ground terminal. By separating the ground terminal between the transmission system and the reception system, the occurrence of crosstalk can be further suppressed.

  The package may include a mounted portion made of metal, and the light emitting element and the light receiving element may be mounted on the mounted portion. Noise and crosstalk from the side opposite to the surface of the mounted portion on which the light emitting element and the light receiving element are mounted can be reduced.

  The mounted portion includes first and second regions made of insulated metal, the light emitting element is mounted on the first region, and the light receiving element is mounted on the second region. It can be configured. For example, the occurrence of crosstalk between transmission and reception can be suppressed by grounding the first and second regions separately.

  The terminal related to the light emitting element may be arranged in the first region via an insulating member, and the terminal related to the light receiving element may be arranged in the second region via an insulating member. .

  The terminal related to the light emitting element and the terminal related to the light receiving element each have a ground terminal, and the ground terminal related to the light emitting element is electrically connected to the first region, and the terminal related to the light receiving element The ground terminal can be configured to be electrically connected to the second region. By separately grounding the first and second regions via the ground terminal, it is possible to suppress the occurrence of crosstalk between transmission and reception.

  The package includes a mounting portion made of metal, and a cap made of metal that is attached to the mounting portion and has a light transmission window that transmits an optical signal and covers the light emitting element and the light receiving element. It can be. As a result, external noise and crosstalk can be reduced.

  In addition to the light emitting element and the light receiving element, the package transmits an optical signal from the optical transmission signal through an optical transmission medium, and transmits the optical signal transmitted through the optical transmission medium to the light receiving element. It is possible to provide a structure in which a single-core bidirectional communication is possible by providing an optical waveguide leading to the above on the mounted portion. By using an optical waveguide as the optical coupling portion, the optical transceiver module can be reduced in size.

  By disposing a refractive index matching agent between the optical waveguide and the light transmission window, the optical coupling efficiency is increased.

  In addition to the light emitting element and the light receiving element, the package may have a configuration in which an amplification IC that amplifies an output signal from the light receiving element is provided on the mounted portion. It is possible to prevent noise from being mixed between the light receiving element and the amplification IC and from the amplification IC to the subsequent signal output line.

  In addition to the light emitting element and the light receiving element, the package may include a driving IC that drives the light emitting element on the mounted portion.

  According to a second aspect of the present invention, in order to achieve the above object, the light emitting element and the light receiving element are accommodated in the same package, and three or more terminals are led out from the package. The terminal includes: an optical transceiver module in which a terminal related to the light emitting element and a terminal related to the light receiving element are arranged in different regions via a linear dividing line; a base material made of an insulating material; and a first of the base material The first conductive pattern formed on the surface of the substrate and the second conductive pattern formed on the second surface of the substrate opposite to the first surface, and the optical transmission / reception module has a side surface A circuit that is mounted from the direction, a terminal related to the light emitting element is connected to one of the first and second conductive patterns, and a terminal related to the light receiving element is connected to the other of the first and second conductive patterns Equipped with a substrate To provide an optical communication apparatus according to symptoms.

  According to the optical communication device, since the circuit board is interposed between the terminal related to the light emitting element and the terminal related to the light receiving element, crosstalk between transmission and reception can be reduced. Further, by mounting the optical transmission / reception module from the side surface direction of the circuit board, the apparatus can be miniaturized.

  The terminal related to the light emitting element and the terminal related to the light receiving element each have a ground terminal, and the first and second conductive patterns each include a ground pattern connected to the ground terminal. Can do. By separating the ground terminal between the transmission system and the reception system, the occurrence of crosstalk can be further suppressed.

  The circuit board may be configured to be thinner than a distance between a terminal related to the light emitting element and a terminal related to the light receiving element.

  According to the present invention, the crosstalk can be reduced without complicating the conductive pattern.

[First Embodiment]
FIG. 1 shows an optical transceiver module according to a first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. In FIG. 1, the upper portion is removed from the light emitting element and the light receiving element.

  This optical transceiver module 1 has a stem 10A as a mounted portion made of a disk-shaped metal in which a pair of through holes 10a and 10b are formed, and includes transmission-system electrode pins 11A to 11C and reception-system electrode pins. 11D to 11F are arranged in two through-holes 10a and 10b through different regions, ie, pin holding portions 12A and 12B made of an insulating member, via a linear dividing line B. The distance between the transmission system electrode pins 11A to 11C and the reception system electrode pins 11D to 11F is the distance between the transmission system electrode pins 11A to 11C and the reception system electrode pins 11D to 11F. The distance is longer than the distance.

  The optical transceiver module 1 also has a submount for positioning a laser diode (LD) 13 as a light emitting element, a photodiode (PD) 14 as a light receiving element, and an optical waveguide 16 in addition to the LD 13 and PD 14 on the stem 10A. 15A, an optical waveguide 16 whose lower end surface is optically coupled to the LD 13 and the PD 14, and an IC 21 for amplifying an output signal from the PD 14 are disposed.

  The optical transceiver module 1 has a circular opening 18a and is fixed to the stem 10A with a conductive adhesive, and a cap 18 made of metal for sealing each member on the stem 10A, and the opening 18a from the lower side. A transmission window 19 attached to the cap 18 so as to be closed, a refractive index matching agent 17 disposed between the upper end surface of the optical waveguide 16 and the transmission window 19, the electrode pins 11 (11A to 11F), the LD 13 and And a plurality of bonding wires 20 for connecting the PDs 14 and the like.

  The stem 10A and the cap 18 constitute a metal package that accommodates optical parts such as LD13 and PD14. The stem 10A and the cap 18 are made of aluminum, stainless steel, or copper alloy in order to reduce external noise and crosstalk. It is formed from metals such as.

  As for the electrode pins 11A to 11C of the transmission system in the pin holding unit 12A, the left electrode pin 11A is for power, the center electrode pin 11B is for GND (ground), and the right electrode pin 11C is for drive signals. In the electrode pins 11D to 11F of the receiving system in the pin holding unit 12B, the left electrode pin 11D is for GND, and the center and right electrode pins 11E and 11F are for output signals.

  The LD 13 is a planar optical element that includes a light emitting unit 13a that emits an optical signal on the upper surface and a mounting surface that is mounted on the stem 10A on the lower surface. For example, the LD 13 includes two electrodes on the upper surface. As such an LD 13, a VCSEL having a wavelength of 850 nm can be used. The LD 13 may have electrodes on the upper surface and the lower surface. In this case, the electrode on the lower surface can be directly grounded to the stem 10A.

  The PD 14 is a planar optical element that includes a light receiving portion 14a that receives an optical signal on the upper surface and a mounting surface that is mounted on the stem 10A on the lower surface. For example, the PD 14 has two electrodes on the upper surface. As such a PD 14, a GaAs PIN photodiode can be used.

  The optical waveguide 16 is, for example, a polymer optical waveguide, and is formed with a toroidal light guide portion 16a made of a core material such as acrylic resin, epoxy resin, or polyimide resin, and around the light guide portion 16a than the core material. A clad made of a fluorine-based polymer or the like having a low refractive index is formed. Such an optical waveguide 15 can be produced, for example, as disclosed in Japanese Patent Application Laid-Open No. 2004-226941. That is, a recess formed on the surface of a mold made of a curable resin is filled with an ultraviolet curable resin or a core-forming curable resin made of a thermosetting resin, and a clad film base material is bonded to the mold surface, After the forming curable resin is cured to form a core, the mold is peeled off, and a clad layer is formed on the core forming surface side of the clad film base material, thereby producing a polymer optical waveguide. In addition, the pattern of the light guide part 16a is not limited to the above-mentioned T shape, and other patterns such as a Y shape can be used depending on the combination of optical elements.

  The refractive index matching agent 17 has a refractive index comparable to that of the optical waveguide 16 and the transmission window 19 and is made of a transparent material. For example, a silicone resin, an ultraviolet curable adhesive, or the like is used. Can do.

  The transmission window 19 is made of a plastic material such as polymethyl methacrylate, polycarbonate, amorphous polyolefin, or inorganic glass.

  FIG. 3 shows the submount 15A. In the submount 15A, a through hole 15a having a shape corresponding to the outer shape when the optical waveguide 16 is disposed on the LD 13 and the PD 14 is formed. The submount 15A can be formed by, for example, resin molding or reactive ion etching (RIE) using a silicon material. The submount 15A may be formed with a through hole for positioning the LD 13 and the PD 14 and a recess for positioning the lower end surface of the optical waveguide 16. Moreover, you may have a recessed part which positions LD13 and PD14, and a recessed part which positions the lower end surface of the optical waveguide 16. FIG.

(Method for manufacturing optical communication device)
Next, an example of a method for manufacturing an optical communication device will be described. The submount 15A and the IC 21 are fixed to a predetermined position on the stem 10A having the electrode pins 11 by an adhesive, and the LD 13 and the PD 14 are fitted into the through holes 15a of the submount 15A, and the mounting surfaces of the submount 15A and the IC 21 are adhered to the stem 10A by an adhesive. Secure to.

  Next, the power supply electrode pins 11A and IC21, the transmission system electrode pins 11B, 11C and LD13 are connected by bonding wires 20, respectively, and the PD14 and IC21, and the reception system electrode pins 11D to 11F and IC21 are respectively bonded by bonding wires 20. The GND electrode pin 11D and the stem 10A are connected by the bonding wire 20. In the present embodiment, the power supply of the reception system IC 21 is taken from the transmission system electrode pin 11A, but the transmission system noise is rarely mixed into the reception system via the power supply line.

  Next, the optical waveguide 16 is fitted into the through hole 15a of the submount 15A so that the lower end surface is in contact with the LD 13 and the PD 14, and the optical waveguide 16 is fixed to the submount 15A with an adhesive. The lower end surface of the light guide unit 16a is optically coupled to the light emitting unit 13a of the LD 13 and the light receiving unit 14a of the PD 14, respectively.

  Next, the refractive index matching agent 17 is applied to the upper end surface of the light guide portion 16a of the optical waveguide 16, and the cap 18 having the transmission window 19 is fixed to the stem 10A with a conductive adhesive. The upper end surface of the light guide portion 16 a and the transmission window 19 are optically coupled via the refractive index matching agent 17.

  The optical transmission / reception module 1 is mounted by penetrating the electrode pins 11A to 11F of the optical transmission / reception module 1 thus manufactured through connection holes (pinholes) formed in the circuit board 50. Next, the housing 31 having the lens portion 31a and the optical fiber holding portion 31b is fitted to the cap 18, the optical fiber 30 is held by the optical fiber holding portion 31b, the housing 31 is positioned, and then the housing 31 is attached to the cap 18. Fix with epoxy resin. In this way, the optical communication device is manufactured.

(Operation of optical communication device)
Next, the operation of the optical communication device will be described. When an optical signal is sent from the optical fiber 30, the optical signal enters the upper end surface of the light guide part 16 a of the optical waveguide 16 through the lens part 31 a, the transmission window 19, and the refractive index matching agent 17, and is guided. The light is guided to the light receiving part 14a of the PD 14 by the part 16a. The PD 14 converts the optical signal received from the light guide unit 16a into an electrical signal and outputs the electrical signal to the IC 21. The IC 21 amplifies the electric signal from the PD 14 and transmits it to the circuit board 50 via the terminal pins 11E and 11F of the receiving system.

  When a drive signal for the LD 13 is input from the circuit board 50 to the LD 13 via the terminal pin 11C of the transmission system, the LD 13 generates an optical signal from the light emitting unit 13a. The optical signal is incident on the lower end surface of the light guide portion 16a of the optical waveguide 16, and then sequentially passes through the refractive index matching agent 17, the transmission window 19, and the lens portion 31a through the branch portion of the light guide portion 16a. Is sent out. As described above, single-core bidirectional communication is performed.

(Effects of the first embodiment)
According to the first embodiment, the electrode pins 11 of the optical transmission / reception module 1 are arranged at different positions in the transmission system and the reception system via the linear dividing line B, and the transmission system electrode pins 11A. 11C and the electrode pins 11D to 11F of the reception system are made longer than the minimum inter-pin distance, so that the occurrence of crosstalk between the transmission system and the reception system can be suppressed. Further, since the LD 13, PD 14, and IC 21 are accommodated in a metal package, noise and crosstalk from the outside can be blocked. Furthermore, since the LD 13 and the PD 14 are accommodated in the same package, the optical waveguide 16 can be reduced in size.

[Third Embodiment]
4A and 4B show an optical communication apparatus according to a second embodiment of the present invention, in which FIG. 4A is a front view, and FIG. 4B is a plan view.

  The optical communication device 100 includes the optical transceiver module 1 according to the first embodiment described above, and a circuit board 40 on which the optical transceiver module 1 is mounted from the side surface direction.

  The circuit board 40 is formed on the base material 41 made of an insulating material, the first conductive pattern 42A formed on the surface (first surface) of the base material 41, and the back surface (second surface) of the base material 41. The second conductive pattern 42 </ b> B and various electronic components such as a driving IC for driving the LD 13, a capacitor, and a resistor are omitted. The base material 41 has a thickness substantially equal to the distance between the electrode pins 11A to 11C on the pin holding part 12A side of the optical transceiver module 1 and the electrode pins 11D to 11F on the pin holding part 12B side.

  When the optical transceiver module 1 is mounted on the circuit board 40, as shown in FIG. 4B, the transmission-system electrode pins 11A to 11C are used as the first conductive pattern 42A, and the reception-system electrode pins 11D to 11F are used. After being inserted while sandwiching the circuit board 40 in the middle so as to overlap the second conductive pattern 42B, as shown in FIGS. 4A and 4B, the tip portions of the electrode pins 11A to 11F are connected to the conductive pattern 42A. , 42B are connected by solder 43 at predetermined positions.

(Effect of the second embodiment)
According to the second embodiment, the electrode pins 11 of the optical transceiver module 1 are connected to the conductive patterns 42A and 42B on the front side and the back side of the circuit board 40 separately for the transmission system and the reception system. Even without forming a complicated conductive pattern, crosstalk between the transmission system and the reception system can be reduced. In addition, since the GND electrode pins 11B and 11D are connected to the GND pattern of the circuit board 40 separately for the transmission system and the reception system, crosstalk can be further reduced. The circuit board 40 may be a multilayer board, and a shield layer may be provided in the intermediate layer. Thereby, crosstalk can be further reduced.

[Third Embodiment]
FIG. 5 shows an optical transceiver module according to the third embodiment of the present invention. This third embodiment is insulated from the transmission side metal region 10d and the transmission side metal region 10d as the first region divided by the dividing line B as a stem in the first embodiment of FIG. In addition, a stem 10B including a resin main body portion 10c having a receiving-side metal region 10e on the upper surface as a second region is used, and the light emitting portion 13a of the LD 13 and the light receiving portion 14a of the PD 14 are connected to the electrode pins 11A to 11C and 11D to 11F. It is arranged on a line orthogonal to the arrangement direction, and the other embodiments are the same as the first embodiment.

  In the third embodiment, the optical waveguide 16 is installed at a position rotated by 90 degrees with respect to the first embodiment. Further, the GND electrode pin 11B for the transmission system is also connected to the transmission side metal region 10d by the bonding wire 20.

  FIG. 6 is a cross-sectional view of a main part for explaining the structure of the stem 10B. In the stem 10B, the above-described transmission-side metal region 10d and reception-side metal region 10e are formed on the resin main body 10c. As shown in FIGS. 5 and 6, the transmitting metal region 10 d has an opening 10 a ′, and the receiving metal region 10 e has an opening 10 b ′ as shown in FIGS. 5 and 6.

  FIG. 7 shows a submount 15B of the third embodiment. The submount 15B is formed of the same material as the submount 15A of the first embodiment, and has a shape corresponding to the outer shape when the optical waveguide 16 is disposed on the LD 13 and the PD 14 disposed at the position shown in FIG. Through-holes 15b are formed.

  According to the third embodiment, the GND pin 11B for the transmission system and the electrode pin 11D for the reception system GND are connected to the insulated transmission side metal region 10d and the reception side metal region 10e, respectively. As a result, crosstalk can be further reduced.

  The LD 13 may have an electrode on the upper surface and the lower surface. In this case, the lower electrode can be directly grounded to the transmitting metal region 10d.

[Fourth Embodiment]
FIG. 8 shows an optical transceiver module according to the fourth embodiment of the present invention, and FIG. 9 shows a state where the optical transceiver module of FIG. 8 is mounted on a circuit board. FIG. 8 is a view as seen from the lower surface side of the stem. In the fourth embodiment, in the first embodiment shown in FIG. 1, six electrode pins 11A to 11F are divided into a transmission system and a reception system by a dividing line B on a disc-shaped stem 22 made of metal. The electrode pins 11A to 11F are arranged at 60 ° intervals with respect to the center of the stem 22 by the pin holding portions 12 made of an insulating material, and the other configurations are the same as those in the first embodiment.

  When the optical transceiver module 1 is mounted on the circuit board 40, as shown in FIG. 9, the center electrode pin 11B of the transmission system electrode pins 11A to 11C and the center of the reception system electrode pins 11D to 11F are centered. The electrode 11E is bent so that the distance between the tips of the transmission system electrode pins 11A to 11C and the reception system electrode pins 11D to 11F is substantially equal to the thickness of the circuit board 40. The electrode pins 11B and 11E may be bent in advance.

  Next, the transmission system electrode pins 11A to 11C are overlapped with the first conductive pattern 42A, and the reception system electrode pins 11D to 11F are overlapped with the second conductive pattern 42B, and the circuit board 40 is sandwiched between them. After that, the tips of the electrode pins 11A to 11F are soldered.

  According to the fourth embodiment, even when the plurality of electrode pins 11 are concentrically arranged on the stem 22, the electrode pins 11 are divided into a transmission system and a reception system, and circuit boards 40 are respectively provided. By connecting to the electrode patterns 42A and 42B on the front and back surfaces, crosstalk can be reduced.

[Fifth Embodiment]
FIG. 10 shows an optical transceiver module according to the fifth embodiment of the present invention, and FIG. 11 shows a state where the optical transceiver module of FIG. 10 is mounted on a circuit board. In addition, FIG. 10 is the figure which looked at the stem from the lower surface side. The fifth embodiment is the same as the fourth embodiment of FIG. 8 except that the electrode pin 11E is omitted and the five electrode pins 11A to 11D and 11F are arranged concentrically. This is the same as the fourth embodiment. Here, among the five electrode pins 11A to 11D and 11F, it is assumed that 11A to 11C are a transmission system and 11D and 11F are a reception system, but the reverse is also possible.

  When the optical transceiver module 1 is mounted on the circuit board 40, as shown in FIG. 11, the center electrode pin 11B among the electrode pins 11A to 11C of the transmission system is bent and the electrode pins 11D and 11F of the reception system are bent. The distance between the tip portions of the transmission system electrode pins 11A to 11C and the reception system electrode pins 11D and 11F is set to a length substantially equal to the thickness of the circuit board 40. The electrode pins 11B, 11D, and 11F may be bent in advance.

  Next, the transmission system electrode pins 11A to 11C are inserted into the first conductive pattern 42A, and the reception system electrode pins 11D and 11F are overlapped with the second conductive pattern 42B, and the circuit board 40 is sandwiched between them. After that, the tips of the electrode pins 11A to 11D and 11F are soldered.

  According to the fifth embodiment, similarly to the fourth embodiment, even if the odd-numbered electrode pins 11 are arranged concentrically on the stem 22, the electrode pins 11 are connected to the transmission system. Crosstalk can be reduced by dividing into receiving systems and connecting them to the conductive patterns 42A and 42B of the circuit board 40, respectively.

[Other embodiments]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. In addition, the constituent elements of each embodiment can be arbitrarily combined without departing from the spirit of the present invention.

  In the said embodiment, although the case where the electrode pins 11 were five and six was shown, it is not limited to this structure, Four or seven or more structures may be sufficient.

  In the above embodiment, the amplification IC is housed in addition to the LD 13 and the PD 14 in the package, but the amplification IC may be disposed on the circuit board side without being housed in the package. Further, in addition to the LD 13 and the PD 14, a driving IC for the LD 13 may be accommodated in the package, and in addition to the LD 13 and the PD 14, an amplification IC and a driving IC may be accommodated.

It is a top view which shows the optical transmission / reception module which concerns on the 1st Embodiment of this invention. It is the sectional view on the AA line of FIG. It is a top view of the submount which concerns on the 1st Embodiment of this invention. The optical communication apparatus which concerns on the 2nd Embodiment of this invention is shown, (a) is a front view, (b) is a top view. It is a top view which shows the optical transmission / reception module which concerns on the 3rd Embodiment of this invention. It is principal part sectional drawing for demonstrating the structure of the stem which concerns on the 3rd Embodiment of this invention. It is a top view of the submount which concerns on the 3rd Embodiment of this invention. It is a top view which shows the optical transmission / reception module which concerns on the 4th Embodiment of this invention. It is principal part sectional drawing which shows the optical communication apparatus which mounted the optical transmission / reception module which concerns on the 4th Embodiment of this invention in the circuit board. It is a top view which shows the optical transmission / reception module which concerns on the 5th Embodiment of this invention. It is principal part sectional drawing which shows the optical communication apparatus which mounted the optical transmission / reception module which concerns on the 5th Embodiment of this invention on the circuit board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical transmission / reception module 10A, 10B Stem 10a, 10b Through-hole 10a ', 10b' Opening 10c Resin main-body part 10d Transmission side metal area | region 10e Reception side metal area | region 11A-11C Transmission system electrode pin 11D-11F Transmission system electrode pin 12 , 12A, 12B Pin holder 13 LD (Laser Die Toad)
13a Light emitting part 14 PD (photodiode)
14a Light receiving part 15A, 15B Submount 15a, 15b Through hole 16 Optical waveguide 16a Light guiding part 17 Refractive index matching agent 18 Cap 18a Opening 19 Transmission window 20 Bonding wire 21 IC
22 stem 30 optical fiber 31 housing 31a lens part 31b optical fiber holding part 40, 50 circuit board 41 base material 42A first conductive pattern 42B second conductive pattern 43 solder B dividing line

Claims (17)

In an optical transceiver module in which a light emitting element and a light receiving element are accommodated in the same package, and three or more terminals are led out from the package to the outside,
The optical transmission / reception module, wherein the plurality of terminals are arranged in different regions where a terminal related to the light emitting element and a terminal related to the light receiving element are arranged through a linear dividing line.   The optical transceiver module according to claim 1, wherein a distance between a terminal related to the light emitting element and a terminal related to the light receiving element is longer than a minimum distance between the plurality of terminals.   The optical transmission / reception module according to claim 1, wherein the terminal related to the light emitting element and the terminal related to the light receiving element are arranged in different rows with at least a tip portion having a predetermined distance.   The optical transceiver module according to claim 3, wherein the predetermined distance corresponds to a thickness of a circuit board to which the plurality of terminals are connected.   The optical transmission / reception module according to claim 1, wherein a terminal related to the light emitting element and a terminal related to the light receiving element each have a ground terminal. The package includes a mounted portion made of metal,
The optical transceiver module according to claim 1, wherein the light emitting element and the light receiving element are mounted on the mounted portion. The mounted portion is composed of first and second regions made of insulated metal,
The light emitting element is mounted in the first region;
The optical transceiver module according to claim 6, wherein the light receiving element is mounted in the second region. The terminal according to the light emitting element is disposed in the first region via an insulating member,
The optical transmission / reception module according to claim 7, wherein a terminal related to the light receiving element is disposed in the second region via an insulating member. The terminal related to the light emitting element and the terminal related to the light receiving element each have a ground terminal,
The ground terminal according to the light emitting element is electrically connected to the first region,
The optical transceiver module according to claim 8, wherein the ground terminal of the light receiving element is electrically connected to the second region.   The package includes a mounted portion made of metal, and a cap made of metal that is attached to the mounted portion and has a light transmission window that transmits an optical signal and covers the light emitting element and the light receiving element. The optical transceiver module according to claim 1.   In addition to the light emitting element and the light receiving element, the package transmits an optical signal from the optical transmission signal through an optical transmission medium, and transmits the optical signal transmitted through the optical transmission medium to the light receiving element. The optical transmission / reception module according to claim 10, further comprising: an optical waveguide guided to the mounting portion on the mounted portion, enabling single-core bidirectional communication.   The optical transceiver module according to claim 11, wherein a refractive index matching agent is disposed between the optical waveguide and the light transmission window.   The optical transmission / reception according to claim 10, wherein the package includes an amplifier IC for amplifying an output signal from the light receiving element on the mounted portion in addition to the light emitting element and the light receiving element. module.   The optical transceiver module according to claim 10 or 13, wherein the package includes a driving IC for driving the light emitting element on the mounted portion in addition to the light emitting element and the light receiving element. The light emitting element and the light receiving element are accommodated in the same package, and three or more terminals are led out from the package, and the plurality of terminals are a terminal related to the light emitting element and a terminal related to the light receiving element. Are arranged in different regions via a straight dividing line, and
A base material made of an insulating material; the first conductive pattern formed on the first surface of the base material; and a second surface formed on the second surface opposite to the first surface of the base material. The optical transmission / reception module is mounted from the side, the terminal related to the light emitting element is connected to one of the first and second conductive patterns, and the terminal related to the light receiving element is the first An optical communication device comprising: a circuit board connected to the other of the first and second conductive patterns. The terminal related to the light emitting element and the terminal related to the light receiving element each have a ground terminal,
The optical communication device according to claim 15, wherein the first and second conductive patterns each include a ground pattern connected to the ground terminal.   The optical communication device according to claim 15, wherein the circuit board is thinner than a distance between a terminal related to the light emitting element and a terminal related to the light receiving element.