KR100651258B1 - 유기 박막 증착 공정용 멀티 노즐 도가니 장치 - Google Patents

유기 박막 증착 공정용 멀티 노즐 도가니 장치 Download PDF

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Publication number
KR100651258B1
KR100651258B1 KR1020040080960A KR20040080960A KR100651258B1 KR 100651258 B1 KR100651258 B1 KR 100651258B1 KR 1020040080960 A KR1020040080960 A KR 1020040080960A KR 20040080960 A KR20040080960 A KR 20040080960A KR 100651258 B1 KR100651258 B1 KR 100651258B1
Authority
KR
South Korea
Prior art keywords
crucible
nozzle
thin film
organic
substrate
Prior art date
Application number
KR1020040080960A
Other languages
English (en)
Korean (ko)
Other versions
KR20060031965A (ko
Inventor
황창훈
Original Assignee
두산디앤디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 두산디앤디 주식회사 filed Critical 두산디앤디 주식회사
Priority to KR1020040080960A priority Critical patent/KR100651258B1/ko
Priority to PCT/KR2005/000249 priority patent/WO2006041239A1/en
Priority to JP2007535591A priority patent/JP4545797B2/ja
Publication of KR20060031965A publication Critical patent/KR20060031965A/ko
Application granted granted Critical
Publication of KR100651258B1 publication Critical patent/KR100651258B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020040080960A 2004-10-11 2004-10-11 유기 박막 증착 공정용 멀티 노즐 도가니 장치 KR100651258B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020040080960A KR100651258B1 (ko) 2004-10-11 2004-10-11 유기 박막 증착 공정용 멀티 노즐 도가니 장치
PCT/KR2005/000249 WO2006041239A1 (en) 2004-10-11 2005-01-28 Multi-nozzle crucible assembly for oled deposition process
JP2007535591A JP4545797B2 (ja) 2004-10-11 2005-01-28 有機発光ダイオード蒸着工程用のマルチノズルるつぼ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040080960A KR100651258B1 (ko) 2004-10-11 2004-10-11 유기 박막 증착 공정용 멀티 노즐 도가니 장치

Publications (2)

Publication Number Publication Date
KR20060031965A KR20060031965A (ko) 2006-04-14
KR100651258B1 true KR100651258B1 (ko) 2006-11-29

Family

ID=36148515

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040080960A KR100651258B1 (ko) 2004-10-11 2004-10-11 유기 박막 증착 공정용 멀티 노즐 도가니 장치

Country Status (3)

Country Link
JP (1) JP4545797B2 (ja)
KR (1) KR100651258B1 (ja)
WO (1) WO2006041239A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100980729B1 (ko) * 2006-07-03 2010-09-07 주식회사 야스 증착 공정용 다중 노즐 증발원
KR100878295B1 (ko) * 2006-12-27 2009-01-13 세메스 주식회사 박막 증착용 면 증발장치 및 이를 구비하는 박막 증착 장치
KR100805323B1 (ko) * 2006-12-28 2008-02-20 세메스 주식회사 유기 박막 증착 장치
JP5247239B2 (ja) * 2008-05-22 2013-07-24 日立造船株式会社 真空蒸着装置の放出部構造
US8506715B2 (en) 2010-12-23 2013-08-13 United Technologies Corporation Coating deposition apparatus and method therefor
KR102218677B1 (ko) * 2014-01-03 2021-02-23 삼성디스플레이 주식회사 증착원
SG10201608496UA (en) 2016-10-11 2018-05-30 Au Optronics Corp Crucible
CN109023246B (zh) * 2017-12-08 2020-08-14 深圳龙图腾创新设计有限公司 一种高效oled蒸镀设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55160422A (en) * 1979-05-31 1980-12-13 Matsushita Electric Ind Co Ltd Method and device for thin film growth
JPS613990A (ja) * 1984-06-18 1986-01-09 株式会社神戸製鋼所 ウオ−キングビ−ム型加熱炉におけるスケ−ル排出装置
JPH03294474A (ja) * 1990-04-11 1991-12-25 Mitsubishi Electric Corp 膜形成装置
JP2603296Y2 (ja) * 1992-08-21 2000-03-06 日新電機株式会社 半導体製造装置用サセプター
JP4312289B2 (ja) * 1999-01-28 2009-08-12 キヤノンアネルバ株式会社 有機薄膜形成装置
EP1041169B1 (de) * 1999-03-29 2007-09-26 ANTEC Solar Energy AG Vorrichtung und Verfahren zur Beschichtung von Substraten durch Aufdampfen mittels eines PVD-Verfahrens
JP2001294852A (ja) * 2000-04-14 2001-10-23 Tdk Corp 蛍光体とその製造方法、薄膜の製造装置、およびｅｌ素子
ATE497028T1 (de) * 2000-06-22 2011-02-15 Panasonic Elec Works Co Ltd Vorrichtung und verfahren zum vakuum-ausdampfen
KR100461283B1 (ko) * 2000-12-30 2004-12-14 현대엘씨디주식회사 유기전기발광소자 제조장치용 유기물증발보트구조
JP2003222472A (ja) * 2002-01-30 2003-08-08 Toyota Industries Corp ルツボ
KR100358727B1 (ko) * 2002-04-01 2002-10-31 에이엔 에스 주식회사 기상유기물 증착방법과 이를 이용한 기상유기물 증착장치

Also Published As

Publication number Publication date
JP4545797B2 (ja) 2010-09-15
JP2008516389A (ja) 2008-05-15
KR20060031965A (ko) 2006-04-14
WO2006041239A1 (en) 2006-04-20

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