WO2006041239A1 - Multi-nozzle crucible assembly for oled deposition process - Google Patents

Multi-nozzle crucible assembly for oled deposition process Download PDF

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Publication number
WO2006041239A1
WO2006041239A1 PCT/KR2005/000249 KR2005000249W WO2006041239A1 WO 2006041239 A1 WO2006041239 A1 WO 2006041239A1 KR 2005000249 W KR2005000249 W KR 2005000249W WO 2006041239 A1 WO2006041239 A1 WO 2006041239A1
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WO
WIPO (PCT)
Prior art keywords
crucible
deposition process
multi nozzle
oled deposition
cylinder type
Prior art date
Application number
PCT/KR2005/000249
Other languages
French (fr)
Inventor
Chang-Hun Hwang
Original Assignee
Doosan Dnd Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Dnd Co., Ltd. filed Critical Doosan Dnd Co., Ltd.
Priority to JP2007535591A priority Critical patent/JP4545797B2/en
Publication of WO2006041239A1 publication Critical patent/WO2006041239A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Definitions

  • the present invention to manufacture a thin film of OLED (Organic Light Emitting
  • Diodes relates to a crucible assembly that is installed inside of evaporation source employed for OLED deposition process, the crucible is heated to evaporate organic material during deposition process, and the resulting organic vapor is deposited uniformly on the substrate located opposite side from crucible.
  • FIG 1 shows general deposition method which used point source or point evaporation source, mainly the crucible (10) containing organic powder material is positioned at the bottom part of vacuum chamber with facing up and the substrate (20) is positioned at the top part of chamber with facing down. Organic vapor from the hot crucible is traveled to the substrate, condensed on the surface, and formed a thin film.
  • the point source crucible has been used extensively for research because it is easy to assemble, in the case of mass-production of the OLED substrate, organic vapor is deposited more at the center of substrate (20) than the edge of substrate that causes unfavorable convex type of a thin film with low uniformity (15 %).
  • the substrate (20) is set on the rotation assembly to be able to rotate, the point source in crucible (A) (11) is positioned at off set distance (X) apart from the central axis, and then deposition process is performed. At this time, the distance between crucible and substrate is kept a fixed height Y to maintain uniformity of a thin film.
  • the point source in other crucible (B) (12) is assembled in the position of certain distance apart from the center of substrate, or set at longer deposition height, and then the substrate is rotated to improve uniformity of a thin film .
  • the present invention multi nozzle crucible assembly employed for a evaporation source during OLED deposition process, is to solve the problems as described above, particularly, as it provides the structure of crucible used in OLED deposition process, to improve uniformity of the thin film's thickness during OLED deposition on the substrate located opposite side, and to improve efficiency of organic material consumption.
  • the present invention consists of multi nozzle part (40) that a cylinder type nozzles, determining the direction of organic vapor, are located uniformly, and a cylinder type crucible (50), having open structure on the top portion, that contains organic powder, and the invention describes how to induce organic vapor by heat transfer from multi nozzle part and crucible to organic powder.
  • Fig 1 shows a flow chart of an example of previous crucible employed in OLED deposition process.
  • Fig 2 shows a flow chart of another example of previous crucible employed in
  • FIG. 1a shows a flow chart of plain view structure of multi nozzle part employed in
  • FIG. 3b shows a flow chart of front view structure of multi nozzle part employed in
  • Fig 4 shows a flow chart of front view structure of cylinder type crucible employed in OLED deposition process.
  • Fig 5 shows a flow chart of three dimensional structure of multi nozzle crucible employed in OLED deposition process.
  • Fig 6 shows a flow chart of nozzle cap in multi nozzle crucible employed in OLED deposition process.
  • Fig 3 shows a cross sectional view of the multi nozzle part (40) in multi nozzle crucible assembly for OLED deposition process
  • Fig 4 shows a cross sectional view of a cylinder type crucible
  • Fig 5 shows a flow chart of an example of multi nozzle crucible.
  • the present invention has a technical distinctive feature of the combined structure between cylinder type multi nozzle part (40), which has open structure at the bottom portion, that small cone type multiple nozzles (41) are contained and one piece of large cylinder type crucible (50), which has open structure at the top portion, that the nozzle part described above is subjected to combine.
  • Fig 3a shows a plain view of multi nozzle part (40), multiple coner type nozzles are arranged uniformly along the cylinder type edge , and the grooves (42) in between nozzles are given to have maximum surface to absorb lots of heat from heating wire. Precisely, the multi nozzle part is kept higher temperature than that of crucible, and when organic vapor is ejected through nozzles, it prevents clogging by condensation in the nozzle wall. In general, organic materials are prone to condense at lower temperature than their evaporation temperature.
  • Fig 3b shows a cross sectional side view of the multi nozzle part (40), it shows grooves (42), as described above, which is excavated at the outside of multi nozzle part (40).
  • One side of cross sectional view of multi nozzle part is opened to combine with the top of cylinder type crucible.
  • Fig 4 shows a cross sectional view of cylinder type crucible (50), the top of crucible is opened to be able to contain organic powder material, and, in the bottom of crucible, a cylinder type fixed groove (51) for temperature detection line is installed facing the center of crucible and when the crucible is heated, the temperature detection line is pushed groove to contact the crucible, the surface temperature of crucible is detected so that the temperature signal is transferred to the heat controller, then the amount of heat supplied to crucible is controlled.
  • a cylinder type protrusion part (52) is installed facing upper-center of the crucible, and at inside of cylinder type crucible (50), to transfer heat to organic powder and evaporate equally.
  • FIG. 5 shows a combined plain view between the bottom of multi nozzle part (40) and the top of cone type crucible (50), and the junction between two parts is sealed completely by twisting projected hinges or screw caps to prevent leaking of organic material.
  • Multiple nozzles (41) in the multi nozzle part (40) are designed to connect through inside, and the angles between the central axis of individual nozzles and the central axis of multi nozzle part are subjected to have a value in the range of 0° to 90° with slant direction, and the angles and size of nozzles are differentiated, therefore the direction of organic vapor ejected from nozzles is controlled and the uniformity of the thin film thickness can be improved.
  • the size of nozzle is recommended to increase along the direction of length.
  • the operation principle how to accomplish uniformity of the thin film thickness by multi nozzle part (40) described above is explained below;
  • the selected nozzles in multi nozzle part (40) can be blocked by the nozzle cap (60) to control the direction and the amount of organic vapor, organic vapor is ejected through particular number of nozzles so that the deposition height (Y) between crucible and substrate is kept not too far, the off set distance (X) of crucible is controlled to keep not too far, and the uniform thickness of the thin film along entire substrate can be obtained, and the efficiency of organic material consumption also can be improved.
  • the present invention is about the multi nozzle crucible assembly employed as a evaporation source in the OLED deposition process, by the control of multi nozzle angles , magnitude, and number of nozzles, particularly, in the process of OLED substrate manufacture, the uniform thickness of the thin film deposited on the glass substrate is obtained, the efficiency of organic material consumption is improved significantly, and the deposition height and off set distance is kept not too far.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention relates to the crucible assembly used as a evaporation source in the OLED deposition process, particularly, when the crucible is heated, the organic material is evaporated and the resulting organic vapor is deposited on the substrate located at the opposite side to produce the OLED substrate, and to accomplish the uniform deposition of organic vapor, the multi nozzle part (40) which controls the direction and quantity of organic vapor material and the cylinder type crucible (50) which has open structure on the top portion are combined, particularly, in the process of OLED deposition process, is designed to improve the uniformity of the thin film significantly and is also to improve the efficiency of organic material consumption.

Description

Description
MULTI-NOZZLE CRUCIBLE ASSEMBLY FOR OLED
DEPOSITION PROCESS
Technical Field
[1] The present invention, to manufacture a thin film of OLED (Organic Light Emitting
Diodes), relates to a crucible assembly that is installed inside of evaporation source employed for OLED deposition process, the crucible is heated to evaporate organic material during deposition process, and the resulting organic vapor is deposited uniformly on the substrate located opposite side from crucible.
[2]
Background Art
[3] The conventional technique of OLED deposition process in organic EL display diode is performed under high vacuum condition, and to deposit and coat organic material on the substrate positioned opposite side from crucible, the crucible containing organic material is heated to evaporate and the resulting vapor is deposited on the glass substrate positioned upper side from crucible to produce a thin film, during the process, it is performed under high vacuum chamber to prevent con¬ tamination of organic material, to expand life time as well as to control proper deposition rate.
[4] Fig 1 shows general deposition method which used point source or point evaporation source, mainly the crucible (10) containing organic powder material is positioned at the bottom part of vacuum chamber with facing up and the substrate (20) is positioned at the top part of chamber with facing down. Organic vapor from the hot crucible is traveled to the substrate, condensed on the surface, and formed a thin film. Even though the point source crucible has been used extensively for research because it is easy to assemble, in the case of mass-production of the OLED substrate, organic vapor is deposited more at the center of substrate (20) than the edge of substrate that causes unfavorable convex type of a thin film with low uniformity (15 %).
[5] To improve these drawbacks, as shown in Fig 2, the substrate (20) is set on the rotation assembly to be able to rotate, the point source in crucible (A) (11) is positioned at off set distance (X) apart from the central axis, and then deposition process is performed. At this time, the distance between crucible and substrate is kept a fixed height Y to maintain uniformity of a thin film. To obtain high uniformity (less than 5 %) of a thin film , the point source in other crucible (B) (12) is assembled in the position of certain distance apart from the center of substrate, or set at longer deposition height, and then the substrate is rotated to improve uniformity of a thin film . However, the crucibles are too far from the central axis and the substrate, it generates drawbacks such as low consumption rate of organic material and large size of high vacuum chamber. [6] The present invention, multi nozzle crucible assembly employed for a evaporation source during OLED deposition process, is to solve the problems as described above, particularly, as it provides the structure of crucible used in OLED deposition process, to improve uniformity of the thin film's thickness during OLED deposition on the substrate located opposite side, and to improve efficiency of organic material consumption. [7]
Disclosure of Invention
Technical Solution [8] The present invention consists of multi nozzle part (40) that a cylinder type nozzles, determining the direction of organic vapor, are located uniformly, and a cylinder type crucible (50), having open structure on the top portion, that contains organic powder, and the invention describes how to induce organic vapor by heat transfer from multi nozzle part and crucible to organic powder. [9]
Brief Description of the Drawings [10] Fig 1 shows a flow chart of an example of previous crucible employed in OLED deposition process. [11] Fig 2 shows a flow chart of another example of previous crucible employed in
OLED deposition process. [12] Fig 3a shows a flow chart of plain view structure of multi nozzle part employed in
OLED deposition process. [13] Fig 3b shows a flow chart of front view structure of multi nozzle part employed in
OLED deposition process. [14] Fig 4 shows a flow chart of front view structure of cylinder type crucible employed in OLED deposition process. [15] Fig 5 shows a flow chart of three dimensional structure of multi nozzle crucible employed in OLED deposition process. [16] Fig 6 shows a flow chart of nozzle cap in multi nozzle crucible employed in OLED deposition process. [17]
Best Mode for Carrying Out the Invention [18] Detailed description of the examples of present invention is stated according to the supplementary diagrams as below; [19] Fig 3 shows a cross sectional view of the multi nozzle part (40) in multi nozzle crucible assembly for OLED deposition process, Fig 4 shows a cross sectional view of a cylinder type crucible, Fig 5 shows a flow chart of an example of multi nozzle crucible. The present invention has a technical distinctive feature of the combined structure between cylinder type multi nozzle part (40), which has open structure at the bottom portion, that small cone type multiple nozzles (41) are contained and one piece of large cylinder type crucible (50), which has open structure at the top portion, that the nozzle part described above is subjected to combine.
[20] Fig 3a shows a plain view of multi nozzle part (40), multiple coner type nozzles are arranged uniformly along the cylinder type edge , and the grooves (42) in between nozzles are given to have maximum surface to absorb lots of heat from heating wire. Precisely, the multi nozzle part is kept higher temperature than that of crucible, and when organic vapor is ejected through nozzles, it prevents clogging by condensation in the nozzle wall. In general, organic materials are prone to condense at lower temperature than their evaporation temperature.
[21] Fig 3b shows a cross sectional side view of the multi nozzle part (40), it shows grooves (42), as described above, which is excavated at the outside of multi nozzle part (40). One side of cross sectional view of multi nozzle part is opened to combine with the top of cylinder type crucible.
[22] Fig 4 shows a cross sectional view of cylinder type crucible (50), the top of crucible is opened to be able to contain organic powder material, and, in the bottom of crucible, a cylinder type fixed groove (51) for temperature detection line is installed facing the center of crucible and when the crucible is heated, the temperature detection line is pushed groove to contact the crucible, the surface temperature of crucible is detected so that the temperature signal is transferred to the heat controller, then the amount of heat supplied to crucible is controlled. In addition, a cylinder type protrusion part (52) is installed facing upper-center of the crucible, and at inside of cylinder type crucible (50), to transfer heat to organic powder and evaporate equally.
[23] Fig 5 shows a combined plain view between the bottom of multi nozzle part (40) and the top of cone type crucible (50), and the junction between two parts is sealed completely by twisting projected hinges or screw caps to prevent leaking of organic material.
[24] Multiple nozzles (41) in the multi nozzle part (40) are designed to connect through inside, and the angles between the central axis of individual nozzles and the central axis of multi nozzle part are subjected to have a value in the range of 0° to 90° with slant direction, and the angles and size of nozzles are differentiated, therefore the direction of organic vapor ejected from nozzles is controlled and the uniformity of the thin film thickness can be improved. At this process, the size of nozzle is recommended to increase along the direction of length. The operation principle how to accomplish uniformity of the thin film thickness by multi nozzle part (40) described above is explained below;
[25] In the case of general point source crucible, organic vapor passes through a narrow hole and disperses in a radial shape that the center is aligned to the hole direction of crucible. At this time, lots of organic vapor disperses to the direction aligned through hole than to the slant direction, as moves from the center to the edge of glass substrate, that the actual deposition occurs, the distance is getting far, and the angle between ejection direction of organic vapor and the surface of substrate is getting wide so that the thickness of the thin film is higher at the center of substrate than the edge of substrate, and it is difficult to obtain uniformity of the thin film thickness over the entire substrate. To improve uniformity of the thin film, the techniques such as rotating the substrate and/or slanting position of the point source are employed, however the efficiency of material consumption decreases significantly.
[26] As described in Fig 3, in the case of evaporation source which employs multi nozzle crucible assembly designed in the present invention, when the nozzles (41) in nozzle part (40) are assembled in the shape of cone or cylinder , it is able to control the direction and the amount of organic vapor depending on the angle and the size of nozzles, therefore lots of vapor is deposited on the edge of substrate, and because the effect of angle between the ejection direction of organic vapor and the substrate can control the thickness of the thin film in the center portion properly, as the point source crucible is used, uniform deposition of the thin film on the entire substrate can be obtained without rotation of substrate.
[27] As described in Fig 6, the selected nozzles in multi nozzle part (40) can be blocked by the nozzle cap (60) to control the direction and the amount of organic vapor, organic vapor is ejected through particular number of nozzles so that the deposition height (Y) between crucible and substrate is kept not too far, the off set distance (X) of crucible is controlled to keep not too far, and the uniform thickness of the thin film along entire substrate can be obtained, and the efficiency of organic material consumption also can be improved.
[28] The present invention, described until now, is about the multi nozzle crucible assembly employed as a evaporation source in the OLED deposition process, by the control of multi nozzle angles , magnitude, and number of nozzles, particularly, in the process of OLED substrate manufacture, the uniform thickness of the thin film deposited on the glass substrate is obtained, the efficiency of organic material consumption is improved significantly, and the deposition height and off set distance is kept not too far.
[29]

Claims

Claims
[1] Multi nozzle crucible assembly for OLED deposition process that is composed of the cylinder type of multi nozzle part (40), which has open structure at the bottom portion, that contains cylinder type multiple small nozzles (41), and the one piece of cylinder type of crucible (50), which has open structure at top portion, that is subjected to combine with the multi nozzle part.
[2] The device as set forth in claim 1, multi nozzle crucible assembly for OLED deposition process that is installed the cylinder type protrusion part (52) facing upper-center of crucible.
[3] The device as set forth in claim 1, multi nozzle crucible assembly for OLED deposition process that is composed of the multi nozzle part (40), which contains a cone or a cylinder type of multiple nozzles (41) aligned in the direction of slant line to connect inside and increased in the direction of length and located along the edge of cylinder.
[4] The device as set forth in claim 3, multi nozzle crucible assembly for OLED deposition process that contains a cylinder or a cone type of multiple nozzles (41) which have different diameters and located uniformly.
[5] The device as set forth in claim 3, multi nozzle crucible assembly for OLED deposition process that has the angles in the range of 0° to 90° between the center axis of multi nozzle part (40) and the central axis of a cylinder or a cone type of individual nozzles.
[6] The device as set forth in claim 1, multi nozzle crucible assembly for OLED deposition process that has a cylinder type fixed groove (51) for temperature detection line installed on the bottom of crucible facing the center of crucible.
[7] The device as set forth in claim 3, multi nozzle crucible assembly for OLED deposition process that can block selected nozzles in the multi nozzle part (40) by nozzle cap (60).
[8] The device as set forth in claim 3, multi nozzle crucible assembly for OLED deposition process that the grooves (42) are arranged uniformly along the cylinder type edge of multiple nozzle part (40).
PCT/KR2005/000249 2004-10-11 2005-01-28 Multi-nozzle crucible assembly for oled deposition process WO2006041239A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007535591A JP4545797B2 (en) 2004-10-11 2005-01-28 Multi-nozzle crucible device for organic light emitting diode deposition process

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Application Number Priority Date Filing Date Title
KR1020040080960A KR100651258B1 (en) 2004-10-11 2004-10-11 Multi-nozzle crucible assembly for OLED deposition process
KR10-2004-0080960 2004-10-11

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Publication Number Publication Date
WO2006041239A1 true WO2006041239A1 (en) 2006-04-20

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JP2008530372A (en) * 2006-07-03 2008-08-07 ワイ・エー・エス カンパニー リミテッド Multi-nozzle vaporizer for vacuum thermal evaporation
US8506715B2 (en) 2010-12-23 2013-08-13 United Technologies Corporation Coating deposition apparatus and method therefor
US10017848B2 (en) 2016-10-11 2018-07-10 Au Optronics Corporation Crucible
CN109023288A (en) * 2017-12-08 2018-12-18 常州市知豆信息科技有限公司 A kind of OLED evaporated device with efficient vapor deposition equipment

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JP4545797B2 (en) 2010-09-15
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JP2008516389A (en) 2008-05-15

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