KR100685431B1 - Vapor deposition source for organic material - Google Patents

Abstract

The present invention relates to an organic material deposition source for manufacturing an organic light emitting device, the organic material deposition source of the present invention is located inside the housing and the housing, the organic material is stored therein, the organic material leakage preventing member is coated And an organic material storage part having an open surface, a nozzle part connected to the open part of the organic material storage part to spray organic material, and a heating heater part interposed between the organic material storage part and the housing, and the organic material storage part and the nozzle part. By improving the material and coating the organic material leakage preventing member on the surface, it is to improve the thermal conductivity in the nozzle portion and the organic material storage portion and to prevent the leakage of organic material.

Description

Organic deposition source {Vapor deposition source for organic material}

1 is a schematic view showing an organic vapor deposition apparatus having an organic vapor deposition source of the present invention.

2 is a perspective view illustrating an organic material deposition source according to the present invention.

3 is a cross-sectional view taken along line AA of FIG. 2.

4 is an enlarged cross-sectional view of part B of FIG. 3.

FIG. 5 is an enlarged cross-sectional view of part C of FIG. 3.

** Description of the symbols for the main parts of the drawings **

100 ... Organic Deposition Equipment

300.Organic Deposition Source

310 ... Insulation member

320 ... Housing

330 ... heat reflector

340 ... Bobplate

350 nozzle part

353, 361 ... Leakproof member

360 ... organic storage

The present invention relates to an organic material deposition source for forming an organic film such as an organic light emitting device, and more particularly, to an organic material deposition source in which an organic material is stored and the organic material is evaporated.

In general, an organic film of an organic light emitting device (OLED) is largely a method of forming an organic film by evaporating a low molecular organic material in a vacuum, and dissolving a high molecular organic material in a solvent, followed by spin coating, There is a method of forming an organic thin film using dip coating, doctor blading, inkjet printing, or the like.

In particular, low molecular weight organic materials are sublimable and can be evaporated at relatively low temperatures of 200-400 ° C. Therefore, when forming a thin film made of such a low molecular weight organic material, a shadow mask pattern having a thin film-shaped opening is aligned in front of the substrate so that the organic film is formed on the substrate by depositing the organic material on the substrate. .

On the other hand, a method for producing an organic thin film made of a low molecular organic material includes a method using a point organic vapor deposition source, a method using a linear organic vapor deposition source and the like.

However, in the case of forming an organic thin film on a large substrate using such a point or linear organic material deposition source, the distance between the substrate and the deposition source is increased together. However, when the distance between the substrate and the deposition source is increased, there is a problem that the uniformity of the organic thin film formed on the substrate is lowered.

In addition, as the distance between the substrate and the deposition source increases, the organic matter evaporated from the deposition source is deposited in a vacuum chamber other than the substrate, which increases the loss of organic matter. It will increase the manufacturing cost.

In addition, in order to ensure uniformity of the organic thin film, the shadow mask pattern and the deposition source may be formed at a predetermined angle to form the organic thin film. However, in this case, when the shadow mask pattern and the deposition source form a predetermined angle, there is a problem in that a shadow effect is generated by the shadow mask pattern and thus it is difficult to obtain an organic thin film having a desired shape.

In addition, in the case of a conventional organic material deposition apparatus, organic material particles may penetrate into a gap between components of a deposition source in which organic material is stored, and leakage of organic material may occur. When leakage of such organic matter occurs, contamination of the heating heater occurs, thereby affecting the quality of the organic light emitting device, which ultimately lowers the yield.

In addition, when a short circuit of the heating heater occurs and the heating heater is replaced, since the heating heater is integrally formed with the organic material deposition source, the replacement of the heating heater is quite difficult, and thus the replacement work time is long.

An object of the present invention is to solve the above problems of the prior art, the present invention is to prevent the organic material from leaking from the organic material deposition source to prevent the loss of the composition of the deposition source by the leaked organic material It is for providing a deposition source.

Another object of the present invention related to the above object is to minimize the thickness and volume of each component of the organic material deposition source to further improve the thermal conductivity for evaporation of the organic material and the evaporation efficiency accordingly with the prevention of leakage of the organic material. To provide an organic material deposition source.

Another organic material deposition source to the present invention for achieving the above object is a housing that is open on one surface; An organic material storage unit located in the housing and having an organic material stored therein, coated with an organic material leakage preventing member, and having one surface opened; A nozzle unit connected to an opened portion of the organic material storage unit to spray organic materials; And a heating heater interposed between the organic storage and the housing.

Preferably, the organic material storage part is formed of graphite, and preferably, the organic material storage part is coated with an organic material leakage preventing member.

Also preferably, the organic material leakage preventing member may be coated on the inside or the outside of the organic storage.

Preferably, the nozzle portion is formed of graphite, and the nozzle portion is coated with an organic material leakage preventing member.

Also preferably, the organic material leakage preventing member may be coated on the inner or outer surface of the nozzle unit.

In addition, the organic material leakage preventing member may be any one of nickel, a high melting point metal such as tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium, titanium, or oxides, carbides, or nitrides. It can be either.

Another aspect of the organic material deposition source according to the present invention for achieving the above object is a housing having one surface open; An organic storage part disposed in the housing and having an organic material stored therein and having one surface opened; A nozzle unit connected to an open portion of the organic storage unit and having an organic spray nozzle configured to spray organic particles onto a substrate, and a splash prevention film to prevent the organic material from splashing in the organic storage unit; A heating heater part interposed between the organic material storage part and the housing; A heat reflection plate installed on an inner wall of the housing to reflect heat from the heating heater part to the organic material storage part; And a heat shield plate attached to an outer surface of the nozzle unit in the substrate direction.

Preferably the housing is provided with a thickness of 1-5mm, and the organic material storage part is provided with a thickness of 1-5mm.

Preferably, the organic material storage part is formed of graphite, and preferably, the organic material storage part is coated with an organic material leakage preventing member.

Also preferably, the organic material leakage preventing member may be coated on the inside or the outside of the organic storage.

Preferably, the nozzle portion is formed of graphite, and the nozzle portion is coated with an organic material leakage preventing member.

Also preferably, the organic material leakage preventing member may be coated on the inner or outer surface of the nozzle unit.

Also preferably, the organic material leakage preventing member may be made of nickel, tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium or titanium, or any one of an oxide, carbide, and nitride. Can be one.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

An organic material deposition apparatus provided with an organic material deposition source according to the present invention, as shown in FIG. 1, a chamber 200 constituting the body of the organic material deposition apparatus 100 and at least one for injecting organic particles onto the substrate S. The organic material deposition source 300 of the.

The chamber 200 is configured to maintain a vacuum inside the vacuum pump (not shown). In addition, an organic material deposition source transfer device 400 capable of moving the organic material deposition source 300 in the vertical direction is installed in the chamber 200 to move the organic material deposition source 300 in the deposition direction.

The organic material deposition source transport apparatus 400 is a vertical transport apparatus suitable for use in the chamber 200 maintained in a vacuum, and is capable of controlling the moving speed of the organic material deposition source 300 according to process conditions.

The configuration includes a ball screw 401 and a motor 403 for rotating the ball screw 401, and a guide 402 for guiding the organic material deposition source 300. In addition, the organic material deposition source transfer apparatus 400 may be implemented to drive at a constant speed using a linear motor in another embodiment.

On the other hand, the substrate (S) located inside the chamber 200 is located in a substantially vertical direction for the deposition of the organic material. Preferably at an angle of approximately 70 ° to 110 ° relative to the ground.

 In addition, a mask pattern M that determines a shape of an organic material to be deposited is disposed between the entire surface of the substrate S, that is, between the organic material deposition source 300 and the substrate S. Therefore, the organic material evaporated from the organic material deposition source 300 is deposited on the substrate S while passing through the mask pattern M so that an organic film having a predetermined shape is formed on the substrate S.

On the other hand, the organic material deposition source 300 accommodates the organic material to be deposited on the substrate (S) in the chamber 200, and heated and evaporated the received organic material and sprayed onto the substrate (S) substrate (S) The organic film is formed on the substrate.

2 is a perspective view of an organic material deposition source according to the present invention. 3 is a cross-sectional view A-A of the organic material deposition source according to FIG. 2.

As shown therein, the organic material deposition source 300 includes a housing 320 which stores an organic material and has an opening on one surface thereof, and the organic material storage part 360 (or “crucible”) is formed inside the housing 320. Is installed).

Here, the housing 320 is formed to a thickness T ₂ of approximately 1-5 mm. The housing 320 is formed to surround the organic material storage part 360, and serves to isolate the organic material storage part 360 from the external environment.

In addition, the organic storage unit 360 is smaller than the housing 320 to be installed in the housing 320, and secures an opening surface opened in the same direction as the opening surface of the housing 320.

In addition, the organic storage unit 360 stores an organic material which is a raw material of the organic thin film to be deposited on the substrate (S of FIG. 1). In addition, the organic storage unit 360 is formed of graphite having excellent thermal conductivity, so that the internal temperature of the organic storage unit 360 heated by the heating heater unit 370, which will be described later, is maintained uniformly. It also has the advantage. That is, thin film deposition by efficient heating of the organic material deposition source 300 is achieved by maintaining a uniform temperature together with rapid heating to the process temperature.

However, graphite is a hexagonal porous material and has excellent thermal insulation efficiency. Accordingly, the heating temperature inside the organic storage unit 360 may be stably maintained, but leakage of the organic material may occur.

In order to prevent this, the organic matter storage unit 360 is coated with the organic material leakage preventing member 361 as shown in FIG. 4. The organic leakage preventing member 361 may be coated on an inner surface, an outer surface, or both an inner surface and an outer surface of the organic storage unit 360. The coating surface of this organic substance leakage preventing member 361 can be selectively employed.

At this time, the organic material leakage preventing member 361 may be made of nickel or a high melting point metal. The high melting point metal refers to a metal having a melting point higher than that of iron, and the high melting point metal includes tungsten (melting point: 3,400 ° C), rhenium (3,147 ° C), tantalum (2,850 ° C), and molybdenum (2,620 ° C). ), Niobium (1,950 ° C), vanadium (1,717 ° C), hafnium (2,227 ° C), zirconium (1,900 ° C), titanium (1,800 ° C), and the like, and any one of them is employed in the present invention.

In addition, the organic material leakage preventing member 361 may use any one of oxide, carbide, and nitride. Oxides more precisely refer to compounds with elements other than fluorine.

In the present invention, both acid oxides and alkaline oxides may be employed, and acid oxides are preferably used. It does not dissolve well in liquids and has poor heat solubility. The carbide may be calcium carbide or other kinds, and the nitride may be a carbide compound.

Similar to the housing 320, the organic storage unit 360 has a thickness T ₄ having a thickness of about 1-5 mm. As such, the thickness of the housing 320 and the organic storage 360 may be 5 mm or less to further improve the thermal conductivity of the housing 320 and the organic storage 360.

In other words, the smaller the thickness of the housing 320 and the organic storage unit 360 is, the higher the thermal conductivity is. However, the thickness of 1mm or less is not durable, and is not easy to manufacture, it is not practical in practice.

And even if the thickness of the housing 320 and the organic storage unit 360 is small, as described above, since the leakage preventing member 361 is coated on the organic storage unit 360, leakage of organic matter is effectively blocked and at the same time, The thermal conductivity is further improved.

On the other hand, the inside of the open surface of the organic material storage unit 310 is provided with a nozzle unit 350 for injecting the organic material is evaporated and discharged in the organic material storage unit 360, the organic material storage unit 360 and the housing The heating heater 370 is interposed between the 320.

The nozzle unit 350 sprays the organic particles evaporated from the organic storage unit 360 onto the substrate S that is substantially vertical, and determines the form in which the organic particles are deposited and distributed on the substrate S. Perform.

In addition, the nozzle unit 350 includes an organic spray path 351 for spraying the organic particles evaporated from the organic storage unit 360 onto the substrate S, and a cluster without evaporating into the organic particles from the organic storage unit 360. A splash prevention film 352 for preventing splashing of organic material in the form of a cluster is formed in an integrated form. In addition, the nozzle unit 350 is made of graphite having excellent thermal conductivity.

In addition, the organic spray passage 351 is formed of a plurality of extending in the side of the injection direction, the organic spray passage 351 is formed more densely from the central portion of the nozzle portion 350 toward both sides of the substrate ( A uniform density of organic matter is sprayed and deposited on S).

On the other hand, graphite can maintain the temperature of the organic substance discharged as described above stably. In order to prevent the leakage of the organic material, as illustrated in FIG. 5, the nozzle part 350 is coated with the organic material leakage preventing member 353. The organic leakage preventing member 353 is coated with an organic leakage preventing member 353 on the inner surface, the outer surface, or both the inner surface and the outer surface of the nozzle unit 350.

The coating surface of the organic leakage preventing member 353 may be selectively employed, and the composition thereof is the same as that of the leakage preventing member 361 coated on the organic storage unit 360 described above. That is, any one of a high melting point metal, an oxide, a carbide, and a nitride can be used.

In addition, the nozzle unit 350 may control the shape in which the organic particles are sprayed according to the opened shape, and may control the uniform evaporation of the organic material in the organic storage unit 360.

On the other hand, the heating heater 370 is interposed between the organic storage unit 360 and the housing 320 serves to heat the organic material of the organic storage unit 310 to enable evaporation. At this time, the heating heater unit 370 is composed of a hot wire that is a heat source to enable the evaporation of the organic material, and a heat wire support that is formed in the form of a rib, but not shown in the figure to prevent the deflection of the hot wire.

That is, the heating heater 370 has a kind of heater tunnel structure consisting of a hot wire and a hot wire support, and a heater tunnel is formed to surround the organic material storage unit 360. Therefore, the heating heater 370 is not formed in the organic material deposition source 300 in the form of being integrated with other components, in particular, the organic matter storage unit 360, or attached to other components, separate and replace independently Is possible.

The organic material deposition source 300 may further include an internal heat reflection plate 330 attached to an inner wall of the housing 320. The internal heat reflection plate 330 reflects the heat generated by the heating heater 370 to increase the thermal efficiency of the heating heater 370. In addition, the thickness T ₃ of the internal heat reflection plate 33 is about 1-5 mm.

In addition, the organic material deposition source 300 may further include a heat shield plate 340 attached to the outer surface in the direction of the substrate (S) of the nozzle unit 350. The heat shield plate 340 prevents heat from being emitted through the nozzle unit 350 and affecting the substrate S.

In addition, the organic material deposition source 300 may further include a heat insulating member 310 installed on the outer wall of the housing 320. The heat insulating member 310 prevents heat generated from the heating heater 370 from being discharged to the outside through the housing 320. And the thickness T ₁ of this heat insulating member 310 is formed about 1-5 mm.

The heat reflection plate 330, the heat shield plate 340 and the heat insulating member 310 serves to further improve the thermal efficiency of the organic material deposition source 300.

Although the organic material deposition source 300 is not shown in the drawing, the organic material deposition source 300 may further include a measuring device that serves to measure the deposition rate of the organic material deposited on the substrate S and the deposition thickness of the organic material.

In the organic material deposition apparatus 100 as described above, the organic material storage unit 360 is interposed in the heating heater unit 370 having a heater tunnel structure, and the nozzle unit in the opened portion of the organic material storage unit 360. 350 is inserted, the heater heater 370 is inserted into the housing 320, the organic matter storage unit 360, the nozzle unit 350 and the heating heater unit 370 is easy to disassemble and assemble. It consists of a structure.

A method of forming an organic film using the organic material deposition apparatus 100 as described above will be described below.

First, the substrate S is mounted in the chamber 200 of the organic material deposition apparatus 100 so as to be approximately perpendicular to the ground, preferably 70 ° to 110 ° with the ground.

Then, the organic material storage unit 360 containing the organic material to be deposited on the substrate S of the organic material deposition source 300 is heated through the heating heater unit 370. At this time, the organic material stored in the organic matter storage unit 360 through the heating heater 370 is heated to evaporate to the organic matter particle state.

The evaporated organic particles flow into the nozzle unit 350, are sprayed through the nozzle unit 350, and are deposited on the substrate S. At this time, the organic particles deposited on the substrate S is determined by the mask pattern (M).

The organic material deposition source 300 may be transferred through the transfer device 400, and the organic material may be deposited on the substrate S to more uniformly deposit the organic material.

On the other hand, since the nozzle unit 350 is integrated with the organic material injection passage 351 and the splash prevention plate 352, the organic matter storage unit 360 does not evaporate into the organic particles, it is possible to prevent the organic matter in the form of clusters splashing. have.

In addition, since the nozzle unit 350 is made of a material having excellent thermal conductivity such as graphite, it is possible to prevent condensation of organic particles sprayed through the nozzle unit 350 even without a separate heating device.

In addition, when the organic particles are deposited on the substrate S, the shape of the organic particles deposited on the substrate S is adjusted according to the opened shape of the organic injection nozzle unit 350. In addition, when the organic material is deposited in the organic material deposition source 300, both the organic material storage unit 360 and the nozzle unit 350 are coated with the organic material leakage preventing members 361 and 353, thereby effectively preventing the organic material from leaking.

On the other hand, the organic material deposition source further comprises a measurement device (not shown in the figure), while the deposition rate of the organic material deposited on the substrate (S) and the deposition thickness of the organic material while the organic material is deposited on the substrate (S) Can be measured. The measuring device may employ a laser sensor or the like, and other various sensors, a data processing unit for processing measured data values of these sensors, and a display device for displaying a measurement state may be used.

Therefore, by using the measuring device, by controlling the deposition rate of the organic particles and the organic deposition thickness during the formation of the organic thin film, it is possible to realize the reproducibility of the uniform thickness of the organic thin film.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art various modifications and changes to the present invention without departing from the spirit and scope of the invention described in the claims described below You can do it. Therefore, it should be seen that all modifications included in the technical scope of the present invention are basically included in the scope of the claims of the present invention.

The organic material deposition source according to the present invention as described above to provide an organic material deposition apparatus having a separate heating heater and a nozzle unit integrated with the fry prevention plate, and further improve the thermal efficiency of the organic storage unit or the nozzle unit In addition, the organic material is prevented from leaking from the organic material storage part or the nozzle part, thereby preventing the components of the deposition source from being damaged by the organic material.

In addition, each component of the organic material deposition source of the present invention can minimize the thickness and volume of the organic material deposition source according to the dome so as to prevent the organic material leakage from the nozzle unit and the organic storage unit to improve the thermal conductivity of the organic material deposition source and thus the evaporation efficiency There is an effect that can be improved more.

Claims (43)

A housing having one surface open; An organic material storage unit located in the housing and having an organic material stored therein, coated with an organic material leakage preventing member, and having one surface opened; A nozzle unit connected to an opened portion of the organic material storage unit to spray organic materials; And a heating heater interposed between the organic material storage part and the housing. The organic material deposition source of claim 1, wherein the organic material storage part is made of graphite. delete The organic material deposition source of claim 1, wherein the organic material leakage preventing member is coated inside the organic material storage part. The organic material deposition source of claim 1, wherein the organic material leakage preventing member is coated on an outer surface of the organic material storage part. The organic material deposition source according to claim 1, wherein the organic material leakage preventing member is nickel. The organic material deposition source according to claim 1, wherein the organic material leakage preventing member is made of any one of high melting point metals such as tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium, and titanium. The organic material deposition source according to claim 1, wherein the organic material leakage preventing member is an oxide. The organic material deposition source according to claim 1, wherein the organic material leakage preventing member is carbide. The organic material deposition source according to claim 1, wherein the organic material leakage preventing member is nitride. The organic material deposition apparatus according to claim 1, wherein the nozzle portion is made of graphite. The organic material deposition source according to claim 11, wherein the nozzle unit is coated with an organic material leakage preventing member. The organic material deposition source according to claim 12, wherein the organic material leakage preventing member is coated inside the nozzle unit. The organic material deposition source of claim 12, wherein the organic material leakage preventing member is coated on an outer surface of the nozzle unit. The organic material deposition source according to claim 12, wherein the organic material leakage preventing member is nickel. The organic material deposition source according to claim 12, wherein the organic material leakage preventing member is made of any one of high melting point metals such as tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium, and titanium. The organic material deposition source according to claim 12, wherein the organic material leakage preventing member is an oxide. The organic material deposition source according to claim 12, wherein the organic material leakage preventing member is carbide. The organic material deposition source according to claim 12, wherein the organic material leakage preventing member is nitride. The organic material deposition apparatus according to claim 1, wherein the nozzle unit includes an organic material spray nozzle for injecting organic material particles onto the substrate, and a splash prevention film for preventing the organic material from splashing in the organic material storage part. The organic material deposition apparatus of claim 1, wherein the organic material deposition source further comprises an internal heat reflector attached to an inner wall of the housing. The organic material deposition apparatus of claim 1, wherein the organic material deposition source further includes a heat shield plate attached to an outer surface of the nozzle unit in the substrate direction. A housing having one surface open; An organic storage part disposed in the housing and having an organic material stored therein and having one surface opened; A nozzle unit connected to an open portion of the organic storage unit and having an organic spray nozzle configured to spray organic particles onto a substrate, and a splash prevention film to prevent the organic material from splashing in the organic storage unit; A heating heater part interposed between the organic material storage part and the housing; A heat reflection plate installed on an inner wall of the housing to reflect heat from the heating heater part to the organic material storage part; And a heat shield plate attached to an outer surface of the nozzle unit in the substrate direction. 24. The organic material deposition source according to claim 23, wherein the housing is 1-5 mm thick. The organic material deposition source according to claim 23, wherein the organic material storage part has a thickness of 1-5 mm. The organic material deposition source according to claim 23, wherein the organic material storage part is made of graphite. 24. The organic material deposition source of claim 23, wherein the organic material storage unit is coated with an organic material leakage preventing member. 28. The organic material deposition source of claim 27, wherein the organic material leakage preventing member is coated inside the organic material storage part. 29. The organic material deposition source of claim 27, wherein the organic material leakage preventing member is coated on an outer surface of the organic material storage part. The organic material deposition source according to claim 27, wherein the organic material leakage preventing member is nickel. The organic material deposition source according to claim 27, wherein the organic material leakage preventing member is made of any one of high melting point metals such as tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium, and titanium. The organic material deposition source according to claim 27, wherein the organic material leakage preventing member is an oxide. The organic material deposition source according to claim 27, wherein the organic material leakage preventing member is carbide. The organic material deposition source according to claim 27, wherein the organic material leakage preventing member is nitride. 24. The organic material deposition apparatus according to claim 23, wherein the nozzle portion is made of graphite. The organic material deposition source according to claim 35, wherein the nozzle part is coated with an organic material leakage preventing member. The organic material deposition source according to claim 36, wherein the organic material leakage preventing member is coated inside the nozzle unit. The organic material deposition source according to claim 36, wherein the organic material leakage preventing member is coated on an outer surface of the nozzle unit. The organic material deposition source according to claim 36, wherein the organic material leakage preventing member is nickel. The organic material deposition source according to claim 36, wherein the organic material leakage preventing member is made of any one of high melting point metals such as tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium, and titanium. The organic material deposition source according to claim 36, wherein the organic material leakage preventing member is an oxide. The organic material deposition source according to claim 36, wherein the organic material leakage preventing member is carbide. The organic material deposition source according to claim 36, wherein the organic material leakage preventing member is nitride.

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