JP4516499B2 - Organic vapor deposition equipment - Google Patents

Description

  The present invention relates to an organic vapor deposition apparatus for forming an organic thin film such as an organic semiconductor element. More specifically, the present invention can be applied to a large substrate by forming an organic thin film by depositing an organic substance while the substrate is standing almost vertically. The present invention relates to an organic vapor deposition apparatus capable of forming an organic thin film having a uniform thickness.

  In general, an organic thin film of an organic semiconductor device including an organic light emitting device (OLED) has a method of forming an organic thin film by evaporating a low molecular weight organic material from a vacuum, and a high molecular organic material as a solvent. And a method of forming an organic thin film by using spin coating, dip coating, ductor plating, ink jet printing and the like.

  When a thin film made of a low molecular weight organic material is manufactured in a vacuum, a shadow mask pattern having an opening having a shape to be formed is aligned in front of the substrate. By depositing an organic material on the substrate, an organic thin film is formed on the substrate.

  Examples of a method for producing an organic thin film made of such a low molecular organic material include a method using a point-type organic material vapor deposition source and a method using a linear organic material vapor deposition source.

  However, when an organic thin film is formed on a large substrate using a point-type or linear-type organic source deposition source as described above, the distance between the substrate and the evaporation source increases together. An increase in the distance between the substrate and the evaporation source causes a decrease in the uniformity of the organic thin film formed on the substrate.

  In addition, when the distance between the substrate and the evaporation source is increased, the organic material evaporated from the evaporation source is deposited in a vacuum chamber other than the substrate, and the loss of the organic material is increased. Considering that the cost is high, there is a problem that the manufacturing cost increases.

  In order to ensure the uniformity of the organic thin film, the organic thin film can be formed such that the shadow mask pattern and the evaporation source form a predetermined angle. At this time, if the shadow mask pattern and the evaporation source form a predetermined angle, there is a problem that it is difficult to obtain an organic thin film having a desired shape due to a shadow effect caused by the shadow mask pattern.

  Further, since the evaporation source and the injection nozzle are integrated, there is a problem that the substrate and the mask pattern are deformed by heat.

  Further, in the case of a large substrate, there is a problem that the uniformity of the thin film at the central portion and the edge portion of the substrate is different due to the sagging phenomenon of the substrate.

  Further, the conventional organic vapor deposition apparatus adopts a method in which the substrate moves for uniform vapor deposition of the organic material. However, when such a substrate moves, there is a problem that the size of the chamber becomes very large.

  Further, in the case of the conventional organic matter vapor deposition apparatus, when the organic substance vapor deposition apparatus is used, organic substance particles enter the gaps between the constituent elements and the organic substance leaks. If contamination of the heater is caused by such organic leakage, there is a problem that the heater is short-circuited.

  When the heater is replaced due to a short circuit of the heater, the heater is integrated with the organic vapor deposition source, so that there is a difficulty in replacement, and the replacement work takes a long time. There's a problem.

  An object of the present invention is to solve the above-mentioned problems of the prior art, and the present invention is applied to a large-sized substrate by forming an organic thin film by depositing an organic substance while the substrate is standing almost vertically. It is an object of the present invention to provide an organic vapor deposition apparatus capable of forming an organic thin film having a uniform thickness.

  In addition, the present invention can be applied to a large-sized substrate by depositing an organic material with the substrate standing upright substantially to form an organic thin film, and can form an organic thin film having a uniform thickness. An object of the present invention is to provide an organic material vapor deposition apparatus in which the storage unit and the organic material injection nozzle are separated to minimize the deformation of the substrate and the mask pattern.

  Another object of the present invention is to provide an organic vapor deposition apparatus that includes a heater that can be separated independently and a nozzle unit integrated with a splash prevention plate.

  In order to achieve the above object, an organic material deposition apparatus according to the present invention comprises a chamber that forms a body and maintains the substrate at an angle of 70 ° to 110 ° with respect to the ground, an organic material storage portion, and an organic material guide path. An organic material deposition source for forming an organic thin film by depositing an organic material on the substrate, and a vertical movement of the organic material deposition source. And an organic vapor deposition source transfer device.

  The organic material storage unit is preferably divided into a number of cells.

  It is preferable that the organic substance guide path is a moving path of organic particles evaporated from the organic substance storage unit.

  Preferably, the organic substance guide path maintains an angle of −20 ° to + 20 ° with respect to the ground in the final moving direction of the organic particles.

  It is preferable that the heater is provided outside the organic substance storage unit and the organic substance guide path to heat the organic substance storage part and the organic substance guide path.

  It is preferable that the internal heat reflecting plate is provided outside the heater.

  Preferably, the external cooling plate is located outside the internal heat reflecting plate to prevent the heat inside the organic material evaporation unit from being conducted to the outside, and the external cooling plate uses a refrigerant. It is preferable to cool the external heat reflecting plate.

  Preferably, the organic material vapor deposition source further includes a measurement sensor that is positioned at a tip of the organic material injection nozzle portion in the organic material injection direction and measures a vapor deposition rate and a vapor deposition thickness of the organic material vapor deposited on the substrate.

  A means for doping impurities into the organic material may be further provided.

  The organic vapor deposition apparatus of the present invention forms a thin film by forming a body and a chamber for maintaining the substrate at an angle of 70 ° to 110 ° with respect to the ground, and depositing a material on the substrate. , A vapor deposition material storage unit, a vapor deposition material guide path, a heater for heating the vapor deposition material storage unit and the vapor deposition material guide path, an interior formed outside the vapor deposition material storage unit and the vapor deposition material guide path to reflect heat A heat reflecting plate, an external cooling plate that is provided outside the internal heat reflecting plate and cools the internal heat reflecting plate, a plurality of organic material vapor deposition sources including a vapor deposition material injection nozzle, and the vapor deposition source is moved in the vertical direction. And an organic vapor deposition source transfer device.

  The plurality of vapor deposition sources can include the same organic material to form a uniform organic thin film on a substrate, particularly a large substrate.

  The plurality of vapor deposition sources may include a first vapor deposition source and a second vapor deposition source, and more preferably, the first vapor deposition source is a raw material vapor deposition source of a thin film on a substrate, and the second vapor deposition source The source is preferably an impurity deposition source for including impurities for improving the characteristics of the thin film in the thin film.

  The plurality of different organic vapor deposition sources are preferable because the injection angle can be adjusted.

  Also, the organic vapor deposition apparatus of the present invention is connected to a chamber that forms a body, supports a substrate, stores an organic substance, an organic substance storage part that is partially opened, and an opened part of the organic substance storage part. The structure includes a nozzle portion for injecting organic matter, a housing configured to cover the organic matter storage portion, and at least one organic vapor deposition source including a heater portion interposed between the organic matter storage portion and the housing.

  The organic vapor deposition source may further include an organic vapor deposition source transfer device capable of moving the organic vapor deposition source in the vertical direction.

  At least one of the organic substance storage unit and the nozzle unit is preferably made of graphite.

  The nozzle part may include an organic substance injection nozzle that injects organic substance particles onto the substrate, and a splash prevention film that prevents the organic substance in the organic substance storage part from splashing.

  It is preferable that the heater section includes a heat ray of a heat source and a heat ray support that prevents dripping of the heat ray.

  The organic vapor deposition source may further include an internal heat reflecting plate attached to the inner wall of the housing.

  The organic vapor deposition source may further include a heat blocking unit attached to an outer surface of the nozzle unit in the substrate direction.

  The organic vapor deposition source may further include a cooling device provided on the outer wall of the housing.

  In addition, the organic material deposition apparatus of the present invention includes a chamber that supports the substrate, includes a chamber, an organic material storage unit that stores an organic material, and a part of the organic material storage unit that is open, and is connected to an opened part of the organic material storage unit. An organic matter vapor deposition source comprising a nozzle portion for injecting organic matter, a housing configured to cover the organic matter storage portion, a heater portion interposed between the organic matter storage portion and the housing, and the organic matter deposition source in a vertical direction And a structure including an organic vapor deposition source transfer device that can be moved.

  Preferably, the heater unit has a heater tunnel structure including a heat source of a heat source and a heat ray support for preventing the heat ray from sagging and covering the organic substance storage unit.

  As described above, according to the present invention, an organic thin film can be formed by depositing an organic substance while the substrate is substantially upright to form an organic thin film having a uniform thickness. In addition, an organic material deposition apparatus in which the organic material storage unit and the organic material injection nozzle are separated to minimize the deformation of the substrate and the mask pattern can be provided.

  In addition, the present invention can be applied to a large-sized substrate by depositing an organic material with the substrate standing upright substantially to form an organic thin film, and can form an organic thin film having a uniform thickness. It is possible to provide an organic material vapor deposition apparatus in which the storage unit and the organic material injection nozzle are separated to minimize the deformation of the substrate and the mask pattern.

  Moreover, this invention can provide the organic vapor deposition apparatus provided with the heater part which can be isolate | separated independently, and the nozzle part integrated with the splash prevention board.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  The same reference numerals in the drawings represent the same components.

(First embodiment)
FIG. 1 is a schematic diagram for explaining an organic material vapor deposition apparatus according to a first embodiment of the present invention.

  Referring to FIG. 1, an organic material vapor deposition apparatus 100 according to the present embodiment includes a chamber 110 forming a body, an organic material vapor deposition source 120 for injecting organic particles onto a substrate S on which the organic material is vapor-deposited, and the organic material vapor deposition source. And an organic vapor deposition source transfer device 130 capable of moving 120 in the vertical direction.

  The chamber 110 keeps the substrate S on which the organic material is to be deposited substantially vertical, preferably at an angle of 70 ° to 110 ° with the ground. The chamber 110 is preferably a vacuum chamber.

    As shown in FIG. 2, the organic material deposition source 120 includes an organic material storage unit 121 that receives an organic material to be deposited on the substrate S, an organic material injection nozzle unit 122 that ejects the organic material evaporated from the organic material storage unit 121 onto the substrate S, and an organic material storage device. The connection line 123 which becomes the movement path | route of the organic substance evaporated by connecting the part 121 and the organic substance injection nozzle part 122, and the measuring apparatus 124 which measures the organic substance vapor deposition rate deposited on the board | substrate S and the thickness of an organic substance are provided.

  The organic matter vapor deposition source transfer device 130 includes a moving unit that can move at least the organic matter injection nozzle part 122 in the organic matter vapor deposition source 120 in the vertical direction. At this time, the organic vapor deposition source transfer device 130 is a vertical transfer device suitable for use in the chamber 110 in which a vacuum state is maintained so that the moving speed of at least the organic material injection nozzle part 122 in the organic vapor deposition source 120 can be adjusted. Further, a transfer speed adjusting mechanism (not shown) can be further provided.

  In FIG. 1, a symbol M is a mask pattern that determines the shape of an organic material to be deposited on the substrate S.

  2 and 3 are schematic views for explaining the organic material vapor deposition apparatus according to the first embodiment of the present invention, and are limited to the substrate on which the organic material is vapor deposited and the organic material vapor deposition source. .

Referring to FIGS. 2 and 3, organic deposition source 120 of the organic material deposition apparatus 100 according to the first embodiment of the present invention, at least one organic storage locations 121a for accommodating the organic substances to be deposited on a substrate S The organic substance storage part 121 (FIG. 3 shows two examples of the organic substance storage part 121a), the organic substance injection nozzle part 122 for injecting the organic substance deposited on the substrate S, the organic substance injection nozzle part 122, and the organic substance storage part 121 are connected. And a measuring device 124 for measuring the deposition rate of the organic substance deposited on the substrate S and the thickness of the organic substance.

  The organic substance storage unit 121 includes at least one organic substance storage 121a for storing an organic substance to be deposited on the substrate S. The organic matter storage unit 121 is a part that heats the organic matter storage unit 121 a to evaporate it into organic particles. The organic matter storage unit 121 is generally located inside the chamber 110, but the organic matter storage unit 121 is outside the chamber 110. You may arrange in. That is, the organic substance storage unit 121 can be arranged inside or outside the chamber 110.

  The organic matter injection nozzle unit 122 is a part that injects organic particles evaporated from the organic matter storage unit 121 onto the substrate S, and although not shown, a heater for preventing condensation of organic particles, and injection of organic particles And a nozzle having a uniform structure. Further, the organic material injection nozzle unit 122 does not completely evaporate in the organic material evaporated from the organic material storage unit 121, and the organic material that maintains the cluster form in which a large number of organic material particles are solidified is further dispersed in the organic material particle state. In addition, a partition for making the size of the organic particles sprayed on the substrate S uniform may be further provided.

  The connection line 123 is a part that connects the organic matter storage unit 121 and the organic matter injection nozzle unit 122 and transfers organic particles evaporated from the organic matter storage unit 121 to the organic matter injection nozzle unit 122. The connection line 123 is configured such that the temperature can be controlled to prevent the organic particles evaporated from the organic storage unit 121 from condensing. It is also possible to individually control more than two regions in order to minimize the condensation of organic particles. In addition, when the organic matter storage unit 121 is located outside the chamber 110, the connection line 123 that connects the organic matter storage unit 121 and the organic matter injection nozzle unit 122 is connected to the outside of the chamber 110. Moreover, it is preferable that the connection line 123 is a bellows-like flexible tube so that the organic substance injection nozzle part 122 can move in the vertical direction.

  The measuring device 124 measures the vapor deposition rate and the thickness of the organic substance deposited on the substrate S, and is positioned at the tip of the organic substance injection nozzle part 122 in the organic substance injection direction. It is integrated. The measuring device 124 moves with the organic material injection nozzle unit 122 when the organic material injection nozzle unit 122 moves to form an organic thin film on the substrate S, and measures the deposition rate of the organic material deposited on the substrate S to store the organic material. The amount of organic matter evaporation in the unit 121 is controlled.

  A method for forming an organic thin film using the organic vapor deposition apparatus 100 as described above is as follows.

  First, as shown in FIG. 1, the substrate S is mounted in the chamber 110 of the organic vapor deposition apparatus 100 so as to be substantially perpendicular to the ground, and preferably maintained at an angle of 70 ° to 110 ° with the ground.

  Next, the organic matter storage unit 121 that is located inside or outside the chamber 110 and includes at least one organic matter storage unit 121a that stores the organic matter is heated to evaporate the organic matter in the form of organic particles.

  The evaporated organic substance particles move to the organic substance injection nozzle part 122 through the connection line 123 of the organic substance storage part 121 and the organic substance injection nozzle part 122 and are injected onto the substrate S through the organic substance injection nozzle part 122.

  At that time, in the organic matter evaporating from the organic matter storage unit 121, the organic matter that does not completely evaporate in a particle state and maintains a cluster form in which a large number of organic matter particles are hardened collides with the partition wall of the organic matter injection nozzle part 122, and further organic matter particles The size of the organic particles sprayed on the substrate S is made uniform by collapsing into a state and dispersing.

  In addition, the organic substance storage unit 121 and the connection line 123 of the organic substance injection nozzle part 122 and the organic substance injection nozzle part 122 are heated via an auxiliary heater so that the evaporated organic substance particles are not condensed.

  Further, at least the organic substance injection nozzle unit 122 is moved in the organic substance vapor deposition source 120 via the organic substance vapor deposition source transfer device 130, and organic substance particles are uniformly ejected onto the substrate S to form a uniform organic thin film on the substrate S. can do.

(Second Embodiment)
FIG. 4 is a schematic diagram for explaining an organic material vapor deposition apparatus according to the second embodiment of the present invention, and is illustrated only on a substrate on which an organic material is vapor-deposited and an organic material vapor deposition source.

  Referring to FIG. 4, the organic deposition apparatus according to the second embodiment of the present invention is similar to the organic deposition apparatus illustrated in FIGS. 1, 2, and 3. However, only the structure in which the organic material vapor deposition source 200 of the organic material vapor deposition apparatus is composed of a large number of organic material storage units 210 and a large number of organic material injection nozzle units 220 is different.

  That is, the organic material vapor deposition source 200 of the organic material vapor deposition apparatus according to the second embodiment of the present invention includes at least one organic material storage unit that stores the organic material to be deposited on the substrate S. A plurality of organic substance storage units 210 located outside (this example shows three cases), a large number of organic substance injection nozzle parts 220 respectively corresponding to the organic substance storage parts 210, and each organic substance injection nozzle part 220 and the organic substance storage part 210 is connected to a plurality of connection lines 230 (this example shows three cases), and the organic material deposition nozzle section 220 is provided at the tip of the organic material ejection direction to deposit the organic material on the substrate S. It consists of a structure comprising a measuring device 240 for measuring.

  The organic deposition source 200 of the organic deposition apparatus as described above includes a large number of organic storage units 210 and a plurality of organic spray nozzles 220, and thus does not include a moving unit for moving the organic spray nozzles 220. However, organic substances can be deposited on a large substrate that stands substantially vertically, and when the moving means is provided, the organic substances can be deposited more uniformly.

(Third embodiment)
FIG. 5 is a schematic diagram for explaining an organic material vapor deposition apparatus according to a third embodiment of the present invention, and is illustrated only on a substrate on which an organic material is vapor deposited and an organic material vapor deposition source.

  Referring to FIG. 5, the organic deposition apparatus according to the third embodiment of the present invention is similar to the organic deposition apparatus illustrated in FIGS. However, the organic material vapor deposition source 300 of the organic material vapor deposition apparatus is different only in a structure including at least one organic material storage unit 310 and a large number of organic material injection nozzles 320 corresponding to any one of the organic material storage units 310.

  That is, the organic vapor deposition source 300 of the organic vapor deposition apparatus according to the third embodiment of the present invention includes at least one organic substance storage for receiving the organic substance to be vapor deposited on the substrate, and is located inside or outside the organic vapor deposition apparatus. An organic substance storage unit, a large number of organic substance injection nozzle parts for injecting organic particles onto the substrate, a large number of connection lines connecting the organic substance injection nozzle part and the organic substance storage part, and an organic substance injection direction of each organic substance injection nozzle part A measuring apparatus is provided that measures the deposition rate of an organic substance that is provided at the tip and is deposited on the substrate.

  In the organic material vapor deposition apparatus as described above, two or more organic material injection nozzles correspond to one organic material storage.

  That is, a large number of organic matter injection nozzles correspond to one organic matter storage, and the organic thin film is formed by vapor-depositing the organic matter on a substantially upright substrate.

  As described above, the organic deposition apparatus according to the embodiment of the present invention as shown in FIGS. 1 to 5 is a large-sized substrate by forming organic thin films by spraying organic particles while the substrate is standing upright. In this case, since the drooping shape of the substrate is prevented, it can be applied to a large substrate.

  In addition, the organic substance storage part and the organic substance injection nozzle part can be separated to prevent deformation of the substrate and the mask pattern due to heat, and an organic thin film having a uniform organic substance particle distribution can be formed on the substrate.

  In addition, it is possible to inject impurities for improving the characteristics of the organic thin film by using substances different from the organic substances stored in a large number of organic substance storage units.

  In addition, in the current trend of using a fine metal mask as a mask for forming an organic thin film, since organic substances are injected almost perpendicularly to the substrate S, uniform step coverage is ensured. There is an advantage that can.

  In addition, since the organic matter deposition sources 120, 200, and 300 are moved via the organic matter deposition source transfer device 130 to deposit the organic matter on the substrate S, there is no conventional organic matter deposition source transfer device, and the organic matter deposition that moves the substrate S is performed. The size of the chamber 110 can be reduced to about 75% as compared with the case where an organic substance is deposited using the apparatus 100.

(Fourth embodiment)
6 and 7 are views for explaining an organic material vapor deposition apparatus according to a fourth embodiment of the present invention, and FIG. 6 is a longitudinal sectional view of an organic material vapor deposition source of the organic material vapor deposition apparatus. FIG. 2 is a cross-sectional view of an organic vapor deposition source of the organic vapor deposition apparatus.

  Referring to FIGS. 6 and 7, the organic material vapor deposition source 400 of the organic material vapor deposition apparatus according to the fourth embodiment of the present invention includes an organic material storage unit 410, an organic material induction path 420, a heater 430, an internal heat reflector 440, an external device. It consists of a cooling plate 450, an organic matter injection nozzle unit 460 and a measuring device 470.

  The organic substance storage unit 410 is a part for storing an organic substance of the material of the organic thin film formed on the substrate S, and preferably includes a crucible divided into at least one cell 410a.

  The organic substance guide path 420 performs a role of transferring organic particles evaporated from the organic substance storage unit 410 to the organic substance injection nozzle unit 460 and determines a moving path of the organic substance particles. More specifically, since the organic particles evaporate upward from the organic material storage unit 410 and the organic material is deposited on the substrate S upright in the vertical direction, the final movement path of the organic particles must be substantially horizontal. The end of the organic material guide path 420 must maintain an angle of -20 ° to 20 ° with the ground. That is, the final movement path of the organic particles is guided to maintain an angle of −20 ° to 20 ° with the ground. In addition, an intermediate portion of the organic matter guide path 420 is formed so as to be inclined at a predetermined angle, and a part of the cluster type organic matter in the organic matter evaporated from the organic matter storage unit 410 collides with the inner wall of the guide path. As a result, the organic material in the form of clusters is smoothly mixed evenly in the organic material guiding path 420, and the organic material is prevented from being solidified and deposited on the substrate S.

  The heater 430 is provided outside the organic matter storage unit 410 and the organic matter guide path 420 and serves to heat the organic matter storage unit 410 and the organic matter guide path 420. That is, the organic substance storage unit 410 is heated to evaporate the organic substance in the form of organic particles, and the evaporated organic substance particles are heated so as not to be condensed inside the organic substance guide path 420.

  The internal heat reflection plate 440 is provided outside the heater 430 to increase the thermal efficiency of the organic vapor deposition source 400, and is configured in multiple stages so as to absorb the heat capacity inside the organic vapor deposition source 400. Yes.

  The external cooling plate 450 is located outside the internal heat reflection plate 440 and prevents the heat inside the organic material deposition source 400 from being conducted to the outside. The external cooling plate 450 cools the internal heat reflecting plate 440 using a refrigerant.

  The organic material injection nozzle unit 460 evaporates from the organic material storage unit 410 and injects the organic material particles flowing through the organic material guiding path 420 onto the substrate S standing almost vertically, and the organic material particles are deposited and distributed on the substrate S. Perform the role of determining the form. In addition, it is preferable that the organic material injection nozzle unit 460 has a configuration in which an injection angle can be adjusted when organic particles are injected. Since the form in which the organic matter particles are ejected can be adjusted by the form in which the organic matter injection nozzle unit 460 is opened, the organic matter in the organic matter reservoir 410 can be controlled to be uniformly vaporizable.

  The measuring device 470 performs a role of measuring a deposition rate and a thickness of an organic material deposited on the substrate S standing at an angle of 70 ° to 110 ° on the ground. In addition, the measuring device 470 is located at the tip of the organic matter injection nozzle part 460 in the organic matter injection direction, and is integrated with the organic matter injection nozzle part 460.

  On the other hand, as shown in FIG. 7, the organic substance storage unit 410 is divided into at least one cell 410a, and the organic substance is stored in each cell 410a. Further, the heaters 430 are evenly distributed around the organic substance storage unit 410.

  This is because when the organic matter storage unit 410 is made to evaporate, if the organic matter storage unit 410 is composed of one cell, a difference in the organic matter evaporation rate depending on the position occurs due to the temperature distribution difference inside the organic matter storage unit 410. The difference in evaporation rate depending on the position lowers the uniform impurity injection and the uniformity of the organic thin film. However, by dividing the organic material storage unit 410 into a large number of cells 410a, The organic matter evaporation rate can be made uniform.

  A method for forming an organic thin film using an organic vapor deposition apparatus having an organic vapor deposition source according to another embodiment of the present invention is as follows.

  First, the substrate S is mounted in the chamber of the organic vapor deposition apparatus 100 so as to be substantially perpendicular to the ground, preferably maintaining an angle of 70 ° to 110 with the ground.

  Next, the organic material storage unit 410 that receives the organic material of the organic material vapor deposition source 400 is heated via the heater 430.

  At this time, the organic matter received in each cell in the crucible of the organic matter storage unit 410 via the heater 430 evaporates into an organic matter state.

  The evaporated organic particles flow into the organic material injection nozzle unit 460 through the organic material guide path 420. At this time, the movement path of the organic particles is determined by the shape of the organic material guide path 420. Since the end of the organic substance guide path 420 maintains an angle of −20 ° to 20 ° with the ground, the final movement path of the organic particles in the organic vapor deposition source 400 maintains an angle of −20 ° to 20 ° with the ground. In addition, the organic substance guide path 420 does not completely evaporate in the organic substance evaporating from the organic substance storage unit 410, and the organic substance that maintains the cluster form in which a large number of organic particles are solid collides with the inner wall of the organic substance guide path 420. Thus, the size of the organic particles sprayed onto the substrate S is made uniform by being crushed into an organic particle state. In addition, the heater 430 outside the organic substance guiding path 420 prevents the organic particles evaporated in the organic substance guiding path 420 from condensing.

  The organic particles flowing into the organic matter injection nozzle unit 460 are deposited on the substrate S through the organic matter injection nozzle unit 460 to form an organic thin film. At this time, the organic deposition source 400 moves in the vertical direction via the organic deposition source transfer device 130, and organic particles are deposited on the substrate S maintaining an angle of 70 ° to 110 with the ground to form an organic thin film. In addition, since the final movement path of the organic particles maintains an angle of −20 ° to 20 ° with respect to the ground, when the organic particles are sprayed onto the substrate S through the organic spray nozzle unit 460, the organic particles are separated from the ground. It is injected at an angle of 20 ° to 20 °. Further, when the organic particles are vapor-deposited on the substrate S, the form of the organic particles deposited on the substrate S is adjusted by the shape of the opening of the organic substance injection nozzle unit 460.

  On the other hand, the measuring device 470 provided at the tip of the organic material injection nozzle unit 460 in the organic material injection direction determines the vapor deposition rate and the organic material deposition thickness of the organic material deposited on the substrate S while the organic material is deposited on the substrate S. taking measurement. Therefore, the reproducibility of the uniform thickness of the organic thin film can be realized by controlling the vapor deposition rate and the organic vapor deposition thickness of the organic particles while forming the organic thin film using the measuring device 470.

(Fifth embodiment)
FIG. 6 is a schematic view for explaining an organic material vapor deposition apparatus according to the fifth embodiment of the present invention.

  Referring to FIG. 8, the organic deposition apparatus according to the fifth embodiment of the present invention includes a plurality of organic deposition sources 120 as shown in FIG. 1, and an organic deposition source for moving each organic deposition source vertically. It consists of a structure with a transfer device.

  For example, a plurality of different deposition sources include a first organic deposition source 400A and a second organic deposition source 400B, and the first organic deposition source 400A and the second organic deposition source 400B contain the same organic matter and have a predetermined distance from each other. Can move apart and deposit a uniform organic thin film on the substrate. In particular, it is more advantageous when an organic thin film is deposited using a large substrate.

  Alternatively, a plurality of different organic deposition sources may include a first organic deposition source 400A and a second organic deposition source 400B, and one of the first organic deposition source 400A and the second organic deposition source 400B, For example, the first organic deposition source 400A is an organic deposition source that injects an organic material, which is a raw material of the organic thin film, onto the substrate S, and the second organic deposition source 400B converts impurities for improving the characteristics of the organic thin film into the organic thin film. Organic source for inclusion.

  At this time, the first organic material deposition source 400A and the second organic material deposition source 400B are adjusted to be mixed in a certain region before the material is deposited on the substrate S in order to include the organic material in the organic thin film. Is possible.

  Impurities on the substrate S can be obtained by providing a measuring device capable of measuring the deposition rate and deposition thickness of the organic matter at the tip of the jet direction of the jet nozzle of the first organic matter deposition source 400A and the second organic matter deposition source 400B. During the formation of the organic thin film containing, the deposition rate and the thickness of the organic substance can be controlled, and the impurity content contained in the organic thin film can be controlled.

  As described above, as shown in FIGS. 6, 7, and 8, the organic material deposition apparatus according to the fourth and fifth embodiments of the present invention uses the organic material via the internal heat reflecting plate 440 and the external cooling plate 450. By preventing the heat from being released to the outside excluding the spray nozzle portion 460, the thermal effect on the substrate S and the mask pattern M can be minimized. That is, the deformation of the substrate S and the mask pattern M due to heat can be prevented.

(Sixth embodiment)
FIGS. 9 to 12 are views for explaining an organic deposition source of the organic deposition apparatus according to the sixth embodiment of the present invention. FIG. 9 is a longitudinal sectional view of the organic deposition source of the organic deposition apparatus. FIG. 10 is a diagram limited to an organic substance storage unit, a nozzle part and a heater part of an organic substance vapor deposition apparatus according to another embodiment of the present invention, and FIG. 11 is another example of the present invention. FIG. 12 is a view limited to the housing of the organic matter deposition apparatus according to the embodiment, and FIG. 12 is a view limited to the cooling device of the organic matter deposition apparatus.

  Referring to FIGS. 9 to 12, an organic material deposition source 500 of an organic material deposition apparatus 100 according to the fifth embodiment of the present invention stores an organic material storage unit 510 that stores an organic material and is partially opened, and an organic material storage unit 510. A nozzle portion 520 that is connected to the opened portion of the nozzle and sprays organic matter, a housing 530 that covers the organic matter storage portion 510, and a heater portion 540 that is interposed between the organic matter storage portion 510 and the housing 530. Prepare.

  The organic substance storage unit 510 is a part for storing the organic substance of the raw material of the organic thin film to be deposited on the substrate S, and generally comprises a crucible. In addition, the organic material storage unit 510 may be made of graphite having excellent thermal conductivity or an equivalent thereof, but is not limited to the material in the present invention.

  The nozzle unit 520 ejects organic particles evaporating from the organic material storage unit 310 onto the substrate S upright substantially vertically, and determines the form in which the organic particles are deposited and distributed on the substrate S. At this time, the nozzle unit 520 does not evaporate the organic matter particles evaporated from the organic matter storage unit 510 onto the substrate S, and the organic matter injection unit 521 does not evaporate from the organic matter storage unit 510 to the organic matter particles. The splash prevention film 525 that prevents the splash is integrated. In addition, the nozzle part 520 may be made of graphite having excellent thermal conductivity or an equivalent thereof, but is not limited to the material in the present invention. In addition, since the form in which the organic particles are ejected can be adjusted by the form in which the swell part 520 is opened, it is possible to control the organic substance in the organic substance storage part 510 to be uniformly evaporated.

  The housing 530 is configured to cover the organic material storage unit 510 and performs a function of isolating the organic material storage unit 510 from the external environment.

  The heater unit 540 is interposed between the organic material storage unit 510 and the housing 530 to heat the organic material in the organic material storage unit 510 in an evaporable manner. At this time, the heater section 540 has a heat source 541 that can evaporate organic matter and a form of a kind of rib (Rib), and includes a heat wire support 545 that prevents the heat wire 541 from dripping and receives it. In other words, the heater portion 540 has a kind of heater tunnel structure including a heat wire 541 and a heat wire support 545, and the heater tunnel covers the organic material storage portion 510. Accordingly, the heater unit 540 is not integrated with the other components, particularly the organic material storage unit 510, or attached to the other components in the organic vapor deposition source 500, and can be separated and replaced independently. is there.

  In addition, the organic vapor deposition source 500 may further include an internal heat reflecting plate 550 attached to the inner wall of the housing 530. The internal heat reflecting plate 550 is for reflecting the heat generated from the heater section 540 and increasing the thermal efficiency of the heater section 540.

  In addition, the organic deposition source 500 may further include a heat blocking unit 560 attached to the external surface in the direction of the substrate S of the nozzle unit 520. The heat blocking means 560 prevents heat from being released through the nozzle portion 520 and affecting the substrate S.

  The organic vapor deposition source 500 may further include a cooling device 570 provided on the outer wall of the housing 530. The cooling device 570 prevents heat generated from the heater unit 540 from being released to the outside through the housing 530.

  Meanwhile, although not shown in the drawing, the organic vapor deposition source 500 may further include a measuring device that performs the role of measuring the vapor deposition rate and the organic vapor deposition thickness of the organic vapor deposited on the substrate S.

  As described above, the organic material deposition source 500 of the organic material deposition apparatus as illustrated in FIGS. 9 to 12 includes the organic material storage unit 510 via the heater tunnel 540 having a heater tunnel structure. The nozzle portion 520 is inserted into the opened portion, and the heater portion 540 is inserted into the housing 530. The organic matter storage portion 510, the nozzle portion 520, and the heater portion 540 are easily disassembled and assembled. Yes.

  On the other hand, a method for forming an organic thin film using the organic vapor deposition apparatus 100 including the organic vapor deposition source 500 is as follows.

  First, the substrate S is mounted in the chamber 110 of the organic material vapor deposition apparatus 100 so as to be substantially perpendicular to the ground, and preferably maintained at a 70 ° to 110 ° angle with the ground.

  Next, the organic matter storage unit 510 that receives the organic matter to be deposited on the substrate S of the organic matter deposition source 500 is heated via the heater unit 540. At that time, the organic substance stored in the organic substance storage unit 510 is heated through the heater unit 540 and is evaporated in an organic particle state.

  The evaporated organic particles flow into the nozzle unit 520 and are ejected through the nozzle unit 520 to be deposited on the substrate S. At this time, the shape of the organic particles deposited on the substrate S is determined by the mask pattern M.

  At this time, the organic material deposition source 500 is transported through the transport device 130, and the organic material is deposited on the substrate S, so that more uniform organic material can be deposited.

  On the other hand, since the organic substance injection nozzle 521 and the splash preventing plate 525 are integrated in the nozzle part 520, the organic substance in the cluster form can be prevented from jumping without being evaporated from the organic substance storage part 510 to the organic substance particles.

  Further, the nozzle part 520 is made of a material having excellent thermal conductivity such as graphite, and the condensation of organic particles injected through the nozzle part 520 is prevented without installing a separate heating device. be able to.

  Further, the form of the organic particles deposited on the substrate S is adjusted by the form of the organic material injection nozzle unit 520 opening the organic material injection nozzle 321 when the organic particles are deposited on the substrate S.

  On the other hand, the organic vapor deposition source further includes a measuring device (not shown) to measure the vapor deposition rate and the organic vapor deposition thickness of the organic vapor deposited on the substrate S while the organic vapor is deposited on the substrate S. be able to. Therefore, the reproducibility of the uniform thickness of the organic thin film can be realized by controlling the vapor deposition rate and the organic vapor deposited thickness of the organic particles while forming the organic thin film using the measuring device 580.

  It should not be understood that the descriptions and drawings which form part of the disclosure of the above-described embodiments limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

It is the schematic for demonstrating the organic substance vapor deposition apparatus which concerns on the 1st Embodiment of this invention. It is the schematic for demonstrating the organic substance vapor deposition apparatus which concerns on the 1st Embodiment of this invention. It is the schematic for demonstrating the organic substance vapor deposition apparatus which concerns on the 1st Embodiment of this invention. It is the schematic for demonstrating the organic substance vapor deposition apparatus which concerns on the 2nd Embodiment of this invention. It is the schematic for demonstrating the organic substance vapor deposition apparatus which concerns on the 3rd Embodiment of this invention. It is drawing for demonstrating the organic substance vapor deposition apparatus which concerns on the 4th Embodiment of this invention. It is drawing for demonstrating the organic substance vapor deposition apparatus which concerns on the 4th Embodiment of this invention. It is the schematic for demonstrating the organic substance vapor deposition apparatus which concerns on the 5th Embodiment of this invention. It is a longitudinal cross-sectional view of the organic vapor deposition source of the organic vapor deposition apparatus which concerns on the 6th Embodiment of this invention. It is drawing which limitedly illustrated to the organic substance storage part, the nozzle part, and the heater part of the organic vapor deposition apparatus which concerns on the 6th Embodiment of this invention. 6 is a drawing limited to a housing of an organic matter vapor deposition apparatus according to a sixth embodiment of the present invention. It is drawing which limited and illustrated to the cooling device of the organic substance vapor deposition apparatus which concerns on the 6th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Organic substance vapor deposition apparatus 110 Chamber 120, 200, 300, 400, 400A, 400B, 500 Organic substance vapor deposition source S Substrate M Mask pattern

Claims (1)

A chamber forming a fuselage and supporting a substrate;
An organic substance storage part that stores an organic substance, a part of which is opened, a nozzle part that is connected to the opened part of the organic substance storage part and injects the organic substance, a housing that covers the organic substance storage part, and the organic substance An organic vapor deposition source comprising a heater portion interposed between the storage portion and the housing;
An organic vapor deposition source transfer device capable of moving the organic vapor deposition source in the vertical direction;
The nozzle part is
An organic matter injection nozzle for injecting organic matter particles onto the substrate;
A splash preventing film for preventing the organic matter in the organic matter storage unit from splashing;
The organic matter injection nozzle and the nozzle splash prevention film are integrated,
The nozzle splash prevention film is interposed between the organic substance storage unit and the organic substance injection nozzle,
The heater section is
An organic vapor deposition apparatus comprising a heater tunnel structure including a heat ray of a heat source and a heat ray support for preventing dripping of the heat ray, and covering the organic substance storage unit.

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