CN1743495B - Organic matter vaporization plating device - Google Patents
Organic matter vaporization plating device Download PDFInfo
- Publication number
- CN1743495B CN1743495B CN200510096608XA CN200510096608A CN1743495B CN 1743495 B CN1743495 B CN 1743495B CN 200510096608X A CN200510096608X A CN 200510096608XA CN 200510096608 A CN200510096608 A CN 200510096608A CN 1743495 B CN1743495 B CN 1743495B
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- China
- Prior art keywords
- organism
- organic matter
- matter vaporization
- vaporization plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR67259/04 | 2004-08-25 | ||
KR1020040067259A KR100579406B1 (en) | 2004-08-25 | 2004-08-25 | Vertical Moving Type Apparatus for Depositing Organic Material |
KR84884/04 | 2004-10-22 | ||
KR1020040084884A KR100646514B1 (en) | 2004-10-22 | 2004-10-22 | Apparatus for Depositing Organic Material |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1743495A CN1743495A (en) | 2006-03-08 |
CN1743495B true CN1743495B (en) | 2011-09-14 |
Family
ID=36139016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510096608XA Active CN1743495B (en) | 2004-08-25 | 2005-08-25 | Organic matter vaporization plating device |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100579406B1 (en) |
CN (1) | CN1743495B (en) |
Families Citing this family (75)
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KR100600357B1 (en) * | 2005-01-05 | 2006-07-18 | 삼성에스디아이 주식회사 | Apparatus for sealing the driving shaft for the effusion cell in the deposition system and deposition system having it |
KR100964224B1 (en) * | 2008-02-28 | 2010-06-17 | 삼성모바일디스플레이주식회사 | Evaporating apparatus and method for forming thin film |
KR101499228B1 (en) * | 2008-12-08 | 2015-03-05 | 삼성디스플레이 주식회사 | Vapor deposition apparatus and vapor deposition method |
KR101155905B1 (en) | 2009-03-04 | 2012-07-03 | 삼성모바일디스플레이주식회사 | Atomic Layer Deposition device and fabricating method of atomic layer using the same |
US20100279021A1 (en) | 2009-05-04 | 2010-11-04 | Samsung Mobile Display Co., Ltd. | Apparatus for depositing organic material and depositing method thereof |
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US8882921B2 (en) | 2009-06-08 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
US8802200B2 (en) | 2009-06-09 | 2014-08-12 | Samsung Display Co., Ltd. | Method and apparatus for cleaning organic deposition materials |
US9174250B2 (en) | 2009-06-09 | 2015-11-03 | Samsung Display Co., Ltd. | Method and apparatus for cleaning organic deposition materials |
KR101097311B1 (en) | 2009-06-24 | 2011-12-21 | 삼성모바일디스플레이주식회사 | Organic light emitting display apparatus and apparatus for thin layer deposition for manufacturing the same |
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JP5328726B2 (en) | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same |
US8486737B2 (en) | 2009-08-25 | 2013-07-16 | Samsung Display Co., Ltd. | Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same |
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US8696815B2 (en) | 2009-09-01 | 2014-04-15 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
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JP5452178B2 (en) * | 2009-11-12 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | Vacuum deposition apparatus, vacuum deposition method, and organic EL display device manufacturing method |
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KR20140118551A (en) | 2013-03-29 | 2014-10-08 | 삼성디스플레이 주식회사 | Deposition apparatus, method for manufacturing organic light emitting display apparatus and organic light emitting display apparatus |
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KR102107104B1 (en) | 2013-06-17 | 2020-05-07 | 삼성디스플레이 주식회사 | Apparatus for organic layer deposition, and method for manufacturing of organic light emitting display apparatus using the same |
KR102108361B1 (en) | 2013-06-24 | 2020-05-11 | 삼성디스플레이 주식회사 | Apparatus for monitoring deposition rate, apparatus for organic layer deposition using the same, method for monitoring deposition rate, and method for manufacturing of organic light emitting display apparatus using the same |
KR102162797B1 (en) | 2013-12-23 | 2020-10-08 | 삼성디스플레이 주식회사 | Method for manufacturing of organic light emitting display apparatus |
CN104004995A (en) * | 2014-06-05 | 2014-08-27 | 上海和辉光电有限公司 | Vapor plating device, vapor plating equipment and vapor plating method |
CN107761056A (en) * | 2016-08-19 | 2018-03-06 | 合肥欣奕华智能机器有限公司 | A kind of evaporation source, evaporated device and the control method for putting evaporation source |
US20240084439A1 (en) * | 2021-02-16 | 2024-03-14 | Applied Materials, Inc. | Crucible, evaporation source, evaporation method, evaporation system, and method of manufacturing a device |
KR20220126152A (en) | 2021-03-08 | 2022-09-15 | 주식회사 선익시스템 | Thin film deposition apparatus |
KR102648127B1 (en) * | 2021-08-30 | 2024-03-15 | 주식회사 야스 | Vertical Evaporation Point Nozzle Source |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003347047A (en) * | 2002-05-28 | 2003-12-05 | Sony Corp | Organic film forming device |
CN1468972A (en) * | 2003-06-04 | 2004-01-21 | 深圳市创欧科技有限公司 | Evaporating and coating apparatus for making organic electroluminescent display |
-
2004
- 2004-08-25 KR KR1020040067259A patent/KR100579406B1/en active IP Right Grant
-
2005
- 2005-08-25 CN CN200510096608XA patent/CN1743495B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347047A (en) * | 2002-05-28 | 2003-12-05 | Sony Corp | Organic film forming device |
CN1468972A (en) * | 2003-06-04 | 2004-01-21 | 深圳市创欧科技有限公司 | Evaporating and coating apparatus for making organic electroluminescent display |
Also Published As
Publication number | Publication date |
---|---|
KR20060018745A (en) | 2006-03-02 |
KR100579406B1 (en) | 2006-05-12 |
CN1743495A (en) | 2006-03-08 |
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