KR101877908B1 - An evaporation source for an organic material, a device having an evaporation source for an organic material, and a method for depositing an organic material - Google Patents

Abstract

An evaporation source 100 for depositing a source material on a substrate 10 is described. The evaporation source is an evaporation furnace (104) - the evaporation furnace is configured to evaporate the source material; A dispensing unit (130) having one or more outlets (212) - the dispensing unit is in fluid communication with the evaporation crucible, and one or more outlets configured to provide source material to the substrate in the deposition direction (101) ; A first cooling shield arrangement (201) provided with one or more openings (221); Includes a heated shield array 202 provided at a predetermined distance from a first cooling shield array 201 and the heated shield array 202 includes one or more apertures 222. In one embodiment, The first cooling shield arrangement 201 is arranged between the distribution unit 130 and the heated shield arrangement 202 and the evaporation source 100 is arranged in the deposition direction 101 with one or more outlets 212 ) Through one or more openings (221) and one or more apertures (222) to define a path for the source material to the substrate.

Description

An evaporation source for an organic material, a device having an evaporation source for an organic material, and a method for depositing an organic material

[0001] Embodiments of the present disclosure relate to deposition of organic materials, materials, such as systems for depositing organic materials, sources for organic materials, and deposition devices for organic materials. In particular, the embodiments of the present disclosure relate to evaporation sources for organic materials, for example evaporation devices and / or manufacturing systems for manufacturing devices, in particular devices containing organic materials therein .

Organic vaporizers are tools for making organic light-emitting diodes (OLEDs). OLEDs are special types of light emitting diodes in which the emissive layer comprises a thin film of certain organic compounds. OLEDs (organic light emitting diodes) are used for the production of television screens, computer monitors, mobile phones and other portable devices for displaying information. OLEDs can also be used for general spatial illumination. Possible viewing angles, brightness, and range of colors with OLED displays are greater than those of traditional LCD displays because OLED pixels emit light directly and do not require a backlight. Therefore, the energy consumption of OLED displays is significantly less than the energy consumption of traditional LCD displays. The fact that OLEDs can be fabricated on flexible substrates also results in additional applications. A typical OLED display may, for example, comprise layers of organic material between two electrodes, all of which form a matrix display panel with individually energizable pixels Lt; / RTI > substrate. OLEDs are generally positioned between two glass panels and the edges of the glass panels are sealed so as to encapsulate the OLEDs within the glass panels.

[0003] There are many challenges faced in the manufacture of such display devices. OLED displays or OLED lighting applications include, for example, stacks of various organic materials evaporated in vacuum. Organic materials are deposited in a subsequent fashion through shadow masks. For the manufacture of high efficiency OLED stacks, two or more materials, such as co-deposition or co-deposition of a host and a dopant, leading to mixed / doped layers, Co-evaporation is advantageous. It should also be noted that there are various process conditions for the evaporation of highly sensitive organic materials.

[0004] In order to deposit the material on the substrate, the material is heated until the material evaporates. The pipes lead the vaporized material to the substrates through the nozzles. In the last few years, for example, the precision of the deposition process has been increased to provide even smaller pixel sizes. In some processes, the masks are used to define pixels as the vaporized material passes through the mask openings. However, the shadowing effects of the mask, the spread of the evaporated material, etc., make it difficult to further increase the predictability and precision of the evaporation process.

[0005] In view of the above, it is advantageous to increase the precision and predictability of the evaporation processes to produce devices with high quality and precision.

[0006] In view of the above, there is provided an evaporation source, a deposition apparatus, and a method for depositing a vaporized material on a substrate, according to independent claims. Additional advantages, features, aspects, and details are readily apparent from the dependent claims, the description, and the drawings.

[0007] According to one aspect of the present disclosure, an evaporation source for depositing a material on a substrate is provided. The evaporation source is the evaporation furnace - the evaporation furnace is configured to evaporate the material; A dispensing unit with one or more outlets - the dispensing unit is in fluid communication with the evaporation crucible, one or more outlets configured to provide material to the substrate in the deposition direction; A first cooling shield arrangement provided with one or more openings; Wherein the heated shield arrangement comprises one or more apertures, wherein the first shielded shield arrangement comprises a first shielded shield arrangement comprising a distribution unit and a heated shield arrangement, Wherein the evaporation source is configured to define a path for material to the substrate through one or more openings and one or more apertures from one or more outlets in the deposition direction.

[0008] According to another aspect of the present disclosure, there is provided a deposition apparatus comprising one or more evaporation sources in accordance with the embodiments described herein.

[0009] According to another aspect of the present disclosure, there is provided a deposition apparatus comprising one or more evaporation sources according to the embodiments described herein. The evaporation source is the evaporation furnace - the evaporation furnace is configured to evaporate the material; A dispensing unit with one or more outlets - the dispensing unit is in fluid communication with the evaporation crucible, one or more outlets configured to provide material to the substrate in the deposition direction; A first cooling shield arrangement provided with one or more openings; Wherein the heated shield arrangement comprises one or more apertures, wherein the first shielded shield arrangement comprises a first shielded shield arrangement comprising a distribution unit and a heated shield arrangement, Wherein the evaporation source is configured to define a path for material to the substrate through one or more openings and one or more apertures from one or more outlets in the deposition direction.

[0010] According to a further aspect of the present disclosure, a method of depositing a material on a substrate is provided. The method includes the steps of evaporating the material and applying the evaporated material to the substrate, wherein applying the evaporated material to the substrate comprises: depositing the evaporated material through one or more outlets of the dispensing unit in a deposition direction And passing the vaporized material through one or more apertures of the first cooling arrangement and one or more apertures of the heated shield arrangement.

[0011] The present disclosure also relates to an apparatus for performing the disclosed methods, including apparatus parts for performing the disclosed methods. The method may be performed by hardware components, by a computer programmed by appropriate software, by any combination of the two, or in any other manner. In addition, the present disclosure also relates to methods of operation of the described apparatus. This includes a method for performing all the functions of the apparatus.

[0012] In the manner in which the recited features of the present disclosure can be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below.
BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1 shows a schematic view of an evaporation source in accordance with embodiments herein;
[0014] FIG. 2 shows a schematic view of a vapor source in accordance with further embodiments of the disclosure;
[0015] Figures 3a and 3b show schematic diagrams of portions of an evaporation source according to embodiments described herein;
[0016] FIG. 3c shows a schematic view of another evaporation source in accordance with the embodiments described herein;
[0017] Figures 4A and 4B illustrate schematic side views of an evaporation source in accordance with embodiments herein;
[0018] FIG. 5 shows a schematic top view of an evaporation source in accordance with further embodiments of the disclosure;
[0019] FIG. 6 depicts a schematic top view of an evaporation source in accordance with still further embodiments of the disclosure;
[0020] FIG. 7 shows a schematic plan view of a deposition apparatus for depositing a source material in a vacuum chamber in accordance with embodiments described herein;
[0021] Figures 8a and 8b illustrate schematic block diagrams illustrating a method of depositing a source material onto a substrate in accordance with embodiments described herein.

[0022] Reference will now be made in detail to the various embodiments of the present disclosure, and one or more examples of various embodiments are illustrated in the drawings. In the following description of the drawings, like reference numerals refer to like components. In the following, only differences for the individual embodiments are described. Each example is provided as an illustration of the present disclosure and is not meant as a limitation of the present disclosure. Further, the features illustrated or described as part of one embodiment may be used with other embodiments, or may be used for other embodiments, to create further embodiments. The detailed description is intended to cover such modifications and variations.

[0023] In this disclosure, the term "source material" can be understood as a material which is evaporated and deposited on the surface of the substrate. For example, in the embodiments described herein, the evaporated material deposited on the surface of the substrate may be an organic source material. Non-limiting examples of organic materials include: one or more of ITO, NPD, Alq ₃ , quinacridone, Mg / AG, starburst materials, and the like.

[0024] In this disclosure, the term "fluid communication" is understood to mean that two elements in fluid communication can exchange fluid through a connection, allowing fluid to flow between the two elements . In one example, the fluid communicating elements may include a hollow structure, and the fluid may flow through the hollow structure. According to some embodiments, at least one of the fluid communicating elements may be a pipe-like element.

[0025] In this disclosure, the term "evaporation source" can be understood as an arrangement that provides a source material to be deposited on a substrate. In particular, the evaporation source may be configured to provide a source chamber to be deposited on the substrate in a vacuum chamber, for example, a vacuum deposition chamber of a deposition apparatus. According to some embodiments described herein, the evaporation source may be configured to evaporate the source material to be deposited on the substrate. For example, the evaporation source may comprise an evaporator or crucible for evaporating the source material to be deposited on the substrate, and in particular a dispensing unit for discharging the evaporated source material in a direction toward the substrate, e.g., through one or more outlets .

[0026] In this disclosure, the term "crucible" can be understood as a reservoir or device that provides or includes a source material to be deposited. Typically, the crucible may be heated to evaporate the source material to be deposited on the substrate. According to embodiments herein, the crucible can be in fluid communication with a dispensing unit through which the source material evaporated by the crucible can be delivered.

[0027] A "dispensing unit" or "dispense pipe" may be a unit for providing a vaporized source material. In particular, the dispensing unit may be configured to provide the evaporated source material from the crucible to the substrate through one or more outlets. A "dispensing unit" or "dispensing pipe" may include one or more outlets. The "distribution unit" or "distribution pipe" may be a elongate tube, for example, such that the outlet is farther away, or not immediately adjacent to the crucible.

[0028] In the present disclosure, the term "cooling shielding arrangement" can be understood as a shielding arrangement configured to be actively cooled. In particular, the cooling shield arrangement as described herein can be configured to cool to the condensation temperature of the source material to be deposited on the substrate, as described herein. For example, a cooling shield arrangement as described herein may be configured to cool to a temperature of less than 50 ° C, particularly less than 40 ° C, more particularly less than 30 ° C, for example, approximately 20 ° C.

[0029] In the present disclosure, the term "heated shield arrangement" can be understood as a shield arrangement configured to be actively heated. In particular, the heated shield arrangement as described herein can be configured to actively heat to a temperature corresponding to the evaporation temperature of the source material to be deposited on the substrate, as described herein. It should be appreciated that the heated shield arrangement as described herein may also be configured to be actively heated to a temperature above the evaporation temperature of the source material to be deposited on the substrate.

[0030] In this disclosure, the term "deposition direction" can be understood as the predominant direction of discharge of the evaporated source material provided through one or more outlets of the distribution unit as described herein. In particular, the deposition direction as described herein can be understood as a direction with +/- 20 degrees to horizontal.

[0031] FIG. 1 shows a schematic diagram of an evaporation source 100 in accordance with embodiments of the present disclosure. In particular, as illustrated illustratively in FIG. 1, the evaporation source 100 includes an evaporation crucible 104 configured to evaporate the source material. In addition, the evaporation source 100 includes a dispensing unit 130 having one or more outlets 212. The dispensing unit 130 is in fluid communication with the evaporation crucible 104. One or more of the outlets 212 of the dispensing unit 130 are configured to provide a source material in the deposition direction 101 to the substrate 10. Additionally, the evaporation source 100 includes a first cooling shield arrangement 201 comprising one or more openings 221. 1, the evaporation source 100 further includes a heated shield arrangement 202 provided at a predetermined distance from the first cooling shield arrangement 201. As shown in FIG. The heated shield array 202 includes one or more apertures 222. A first cooling shield array 201 is arranged between the distribution unit 130 and the heated shield array 202. 1, the evaporation source 100 may have one or more openings 212 from one or more outlets 212 in the deposition direction 101. In one embodiment, Through the one or more apertures 221 and the one or more apertures 222 to define the path for the source material to the substrate 10.

[0032] Thus, by providing an evaporation source according to embodiments described herein, the angle of incidence of evaporated source material, eg, provided to the substrate through a mask, is limited to reduce the effects of the new effects of the mask A predetermined emission angle may be provided behind the heated shield arrangement in the deposition direction. Thus, improved resolution of the deposited source material on the substrate can be achieved. Advantageously, the evaporation source according to the embodiments described herein also provides for preventing or even avoiding clogging of one or more apertures of the heated shield arrangement and one or more outlets of the dispensing unit , Whereby stable deposition process conditions can be maintained over a long period of time. This means that the evaporated source material that does not pass through one or more of the apertures of the heated shield arrangement is scattered back to the first cooled shield arrangement to which the evaporated source material is condensed, This is because the scattered source material can be collected on the first cooling shield arrangement. Thus, one or more of the apertures of the heated shield arrangement and one or more outlets of the dispensing unit are kept clean throughout the deposition process.

1, one or more of the apertures 222 of the heated shield array 202 are connected to one or more of the outlets 212 of the distribution unit 130. [0033] (&Amp;thetas;) of the evaporated source material provided through the openings. Thus, in accordance with the embodiments described herein, a heated shield arrangement 202 is configured to range a dispense cone or plume 318 of vaporized source material that is dispensed toward the substrate 10 It should be understood. In particular, the heated shield array 202 is configured to block at least a portion of the evaporated source material, as exemplarily shown by the dotted arrows reflected from the heated shield array 202 in Figure 1 . Typically one or more of the apertures 222 of the heated shield array 202 are aligned in the deposition direction 101 with one or more outlets 212 of the distribution unit 130 Lt; / RTI > In particular, one or more of the apertures 222 of the heated shield array 202 may be located behind the heated shield array 202, i.e., when the evaporated source material has one or more apertures 222 , A predetermined emission angle [theta] can be provided. In other words, the heated shield area arrangement 202 is configured to provide a substantially uniform flow of vaporized source material (also referred to herein as a deposition direction) in the main emission direction of evaporated source material provided from any one of the one or more outlets 212 of the distribution unit 130 Quot;) from the vaporized source material having a predetermined emission angle [theta] greater than 30 [deg.], Especially greater than 40 [deg.], E.g., greater than 45 [ Thus, by providing an evaporation source in accordance with the embodiments described herein, new imaging effects caused by the mask provided prior to the substrate can be reduced, thereby improving the resolution of the deposited source material on the substrate Can be achieved.

[0034] According to embodiments that may be combined with any of the other embodiments described herein, the heated shield array 202 is configured to be heated to a first temperature. In particular, the first temperature at which the heated shield array 202 can be heated may correspond to the evaporation temperature of the source material to be deposited. For example, the heated shield array 202 may include heating elements. The heating elements may be mounted or attached to the heated shield arrangement. Additionally or alternatively, the heating elements may be arranged in the heated shield arrangement. For example, the heating elements may be thermoelectric heating devices. Thus, by providing a heated shield arrangement that is heated to or above the evaporation temperature of the source material to be deposited, molecules of the evaporated source material leaving the one or more outlets, e.g., nozzles, under a large angle, It strikes a wall around one or more of the apertures of the arrangement, but it can not stick to the heated shield arrangement. As a result, one or more apertures of the heated shield array can be kept clean throughout the deposition process, and clogging of one or more apertures of the heated shield array can be avoided.

[0035] According to the embodiments described herein, the heated shield arrangement can be configured to heat to an evaporation temperature of from about 100 [deg.] C to about 600 [deg.] C, particularly from about 150 [deg.] C to about 450 [deg.] C. In some embodiments, the heated shield arrangement may include, for example, a material that is chemically inert with respect to the evaporated organic material. According to some embodiments, the heated shield arrangement may comprise at least one material selected from the group consisting of stainless steel, quartz crystal glass, Ta, Ti, Nb, DLC, and graphite, or at least one of the named materials One of which can be used. Thus, accumulation of evaporated source material on the heated shield arrangement can be prevented.

[0036] According to embodiments that may be combined with any of the other embodiments described herein, as illustrated by way of example in FIG. 1, a first cooling shield arrangement 201 includes a distribution unit 130 And laterally surrounds one or more of the outlets 212 of the outlet opening 212. [ In particular, the first cooling shield array 201 can be configured to actively cool to the condensation temperature of the source material to be deposited. Thus, the first cooling shield arrangement is configured to collect the backscattered evaporated source material from the heated shield arrangement. In addition, advantageously, one or more outlets of the dispensing unit are kept clean throughout the deposition process so that stable deposition process conditions can be maintained for a long time and clogging of one or more outlets of the dispensing unit is avoided .

[0037] According to some embodiments that may be combined with other embodiments described herein, the first cooling shield arrangement 201 may include a cooling fluid, such as air, nitrogen, water, or other suitable cooling fluid By means of one or more metal plates having conduits for the < Desc / Clms Page number 7 > For example, conduits for the cooling fluid may be attached to the first cooling shield arrangement, or may be provided within the first cooling shield arrangement. Additionally or alternatively, the first cooling shield arrangement may comprise a thermoelectric cooling device or any other cooling device suitable for the first cooling shield arrangement. According to some embodiments, the first cooling shield arrangement may comprise at least one material selected from the group consisting of copper (e.g., Ni-plated), Ta, Ti, Nb, DLC, and graphite Or may include a coating having at least one of the named materials.

[0038] According to embodiments that may be combined with any of the other embodiments described herein, one or more outlets 212 of the dispensing unit 130, as exemplarily shown in FIG. 1 May be provided in the heated wall 135 of the dispensing unit. For example, the heated wall 135 may include heating elements. The heating elements may be mounted or attached to the heated wall 135. Additionally or alternatively, the heating elements may be arranged in the heated wall 135 of the distribution unit. For example, the heating elements may be thermoelectric heating devices. In particular, the heated wall 135 is configured to be heated to a second temperature substantially corresponding to the first temperature at which the heated shield arrangement is heated. Thus, the heated wall and the heated shield arrangement can be configured to have substantially the same thermal expansion, whereby one or more outlets of the dispensing unit, which can be connected to the heated wall, are connected to one of the heated shield arrangements throughout the deposition process Or < / RTI > more apertures.

[0039] According to some embodiments that may be combined with any of the other embodiments described herein, the heated shield portion arrangement 202 and the heated wall 135 of the dispensing unit 130 may have substantially the same thermal expansion . For example, the heated shield array 202 and the heated wall 135 of the dispensing unit 130 may be made of the same material. Additionally or alternatively, as described above, the heated shield portion arrangement 202 and / or the heated wall 135 of the dispensing unit 130 may be formed by thermal expansion of the heated shield portion arrangement 202, Lt; RTI ID = 0.0 > 135 < / RTI > For example, if the heated shield array 202 is made of a material having a higher thermal expansion than the material from which the heated wall 135 is made, the heated wall 135 of the distribution unit 130 may be heated to provide the same thermal expansion, May be heated to a higher temperature than the heated shield array 202. Thus, advantageously, the position of one or more outlets of the dispensing unit, which can be connected to the heated wall, is maintained in alignment with the position of one or more apertures of the heated shield arrangement throughout the deposition process.

2, according to embodiments that may be combined with any of the other embodiments described herein, the heated shield array 202 of the evaporation source 100 includes a connection element (not shown) 232 to the heated wall 135 of the dispensing unit 130. Thus, the alignment of the position of one or more of the apertures of the heated shield arrangement and the position of one or more outlets of the dispensing unit can be improved.

[0041] According to some implementations, the coupling element 232 can be configured to adjust the distance between the heated wall 135 of the distribution unit 130 and the heated shield array 202. For example, the connecting element 232 may be configured to move the heated shield arrangement 202 relative to the heated wall 135. [ It is therefore understood that by adjusting the distance between the heated wall 135 of the dispensing unit 130 and the heated shield arrangement 202 the emission angle of the evaporated source material behind the heated shield arrangement can be adjusted . For example, by increasing the distance between the heated wall 135 of the distribution unit 130 and the heated shield array 202, the emission angle [theta] of the evaporated source material behind the heated shield collection can be reduced. Thus, the new shadowing effects of the mask provided between the heated shield array and the substrate can be reduced, resulting in improved resolution of the deposited source material on the substrate.

[0042] According to embodiments that may be combined with any of the other embodiments described herein, the evaporation source 100 may include a second cooling shield arrangement (not shown), as exemplarily shown in FIG. 2 203). In particular, the second cooling shield array 203 may be arranged behind the heated shield array 202 in the deposition direction 101. 2, the second cooling shield array 203 is adapted to align with one or more of the apertures 222 of the heated shield array 202 in the deposition direction 101. As shown in FIG. And one or more openings 223 that are arranged. Thus, by providing a second cooling shield arrangement arranged behind the heated shield arrangement in the deposition direction, the heat load in the substrate 10 and / or the mask 20 can be reduced, It may be advantageous to achieve improved resolution of the source material.

[0043] According to embodiments that may be combined with any of the other embodiments described herein, one or more outlets 212 of the dispensing unit 130, as exemplarily shown in FIG. 2 May be one or more nozzles 125. In particular, one or more of the nozzles 125 may be arranged and configured to extend along the deposition direction 101. More specifically, one or more of the nozzles 125 may be arranged and configured to protrude from one or more of the openings 221 of the first cooling shield array 201. For example, one or more of the nozzles 125 may extend in a direction toward the substrate from one or more openings 221 of the first cooling shroud arrangement 201, for example, in the deposition direction 101 by 2 mm Or more, especially 4 mm or more, more particularly 5 mm or more. Thus, clogging of one or more outlets of the dispensing unit can be prevented or even eliminated so that stable deposition process conditions can be maintained over a long period of time.

[0044] Figures 3A-3C illustrate portions of an evaporation source in accordance with embodiments described herein. As shown in FIG. 3A, the evaporation source may include a distribution unit 130 or a distribution pipe 106, and an evaporation crucible 104. For example, the distribution unit 130 or the distribution pipe 106 may be a elongated tube having a heating unit 215. The evaporation crucible may be a storage vessel for the source material, e.g., an organic material, to be evaporated by the crucible heating element 225.

[0045] According to embodiments that may be combined with other embodiments described herein, the plurality of openings and / or outlets, eg, nozzles, may be arranged along the length of the evaporation source. In particular, the plurality of openings and / or outlets may be arranged along the longitudinal direction of the distribution unit or the distribution pipe. According to an alternative embodiment, one elongated opening may be provided which extends along the length of the dispensing unit, e.g., the dispensing pipe and / or the length of the evaporation source. For example, the elongated opening may be a slit.

[0046] According to some embodiments that may be combined with other embodiments described herein, the distribution unit, eg, the distribution pipe, extends essentially vertically in the longitudinal direction. For example, the length of the dispensing unit or dispensing pipe corresponds at least to the height of the substrate to be deposited in the deposition apparatus. In many cases, the length of the dispensing unit, and in particular the dispensing pipe, is at least 10% or even 20% greater than the height of the substrate to be deposited, which is sufficient for uniform deposition at the top end of the substrate and / .

[0047] According to some embodiments that may be combined with other embodiments described herein, the length of the dispensing unit, particularly the dispensing pipe, may be 1.3 m or more, such as 2.5 m or more. According to one configuration, the evaporation crucible 104 is provided at the lower end of the distribution unit 130 or the distribution pipe 106, as shown in Fig. 3A. Typically, the source material is evaporated in the evaporation furnace 104. The vaporized source material enters the bottom of the distribution pipe and is guided sideways essentially through a plurality of openings in the distribution pipe, e.g., toward an essentially vertically oriented substrate.

[0048] According to some embodiments that may be combined with other embodiments described herein, a plurality of outlets, eg, one or more outlets of the distribution unit, Direction. According to some specific embodiments, the main emission direction may be slightly upward directed, for example to be in the range of horizontal to 15 degrees upward, e.g., 3 to 7 degrees upward. Similarly, the substrate may be slightly inclined to be substantially perpendicular to the direction of evaporation, which may reduce the generation of unwanted particles.

[0049] FIG. 3B shows an enlarged schematic view of a portion of a distribution unit 130, eg, a distribution pipe 106, connected to an evaporation source, and in particular to a vaporizing crucible 104. A flange unit 233 configured to provide a connection between the evaporation crucible 104 and the distribution pipe 106 may be provided. For example, the evaporation crucible and the dispensing unit are provided as separate units, which can be separated, connected or assembled in the flange unit, for example, for operation of the evaporation source.

[0050] According to some embodiments that may be combined with other embodiments described herein, the distribution unit 130, e.g., the distribution pipe 106, has an inner hollow space 210. In addition, a heating unit 215 may be provided to heat the dispensing unit 130, and in particular the dispensing pipe 106. The dispensing unit 130 may be heated to a temperature such that the evaporated source material provided by the evaporation crucible 104 is not condensed in the interior portion of the wall of the distribution unit 130, e.g., the distribution pipe 106. Two or more heat shields 217 may be provided around the tube of the dispensing unit 130, as illustrated by way of example in FIG. 3B. The heat shields are configured to reflect the thermal energy provided by the heating unit 215 back toward the inner hollow space 210. Thus, because the heat shields 217 advantageously reduce heat losses, the energy to heat the distribution unit 130, e.g., the distribution pipe 106, i.e., the energy provided to the heating unit 215, . Heat transfer to other distribution units and / or to the mask or substrate may be reduced. According to some embodiments that may be combined with other embodiments described herein, the heat shields 217 may comprise two or more heat shield layers, such as five or more heat shield layers For example, ten heat shield layers.

[0051] Typically, as shown in FIG. 3B, the heat shields 217 include openings in the positions of the outlets 212 in the distribution unit 130, for example, the distribution pipe 106. The enlarged view of the evaporation source shown in Figure 3B shows four outlets. The outlets 212 may be provided along the longitudinal direction of the distribution unit 130 or the distribution pipe 106. The dispensing unit 130 or the dispensing pipe 106 may comprise a plurality of openings disposed within the dispensing unit 130 or the dispensing pipe 106 (also referred to herein as one or more outlets Quot;), in particular as a linear distribution pipe. For example, the dispensing pipe may have one outlet. For example, the distribution pipe may have more than 30 outlets arranged along the length of the distribution unit, for example 40, 50 or 54 outlets. According to the embodiments herein, the outlets may be spaced apart from one another. For example, the outlets may be spaced apart by a distance of 1 cm or more, e.g., a distance of 1 cm to 3 cm, such as a distance of 2 cm, for example.

[0052] A dispensing unit, eg, a dispensing pipe, as understood herein, has an enclosure, a hollow space, or a pipe, for example, from which material can be provided or guided from the evaporation crucible. The dispensing unit may have a plurality of openings (or elongated slits) so that the pressure in the dispensing unit is higher than at the exterior of the dispensing unit. For example, the pressure in the showerhead may be at least 10 times higher than the pressure outside the dispensing unit.

[0053] During operation, the distribution unit 130, for example, the distribution pipe 106, is connected to the evaporation crucible 104 in the flange unit 233. The evaporation crucible 104 is configured to receive the source material to be evaporated and to evaporate the source material. 3B shows a cross-section through the housing of the evaporation crucible 104. Fig. 3B, a refill opening is provided, for example, in the upper portion of the evaporation crucible, and the recharge opening is filled with a plug 252, a cover, a cover, and the like to close the enclosure of the evaporation crucible 104. [ Can be closed using a cover or the like.

3B, an outer crucible heating element 225 may be provided within the enclosure of the evaporation crucible 104. [0054] Referring to FIG. The outer crucible heating element 225 may extend at least along a portion of the wall of the evaporation crucible 104. According to some embodiments that may be combined with other embodiments described herein, additionally or alternatively, one or more central heating elements may be provided. Figure 3b shows two central heating elements. The first central heating element 226 and the second central heating element 228 may include a first conductor 229 and a second conductor 230, respectively, to provide power to the central heating elements .

[0055] According to some embodiments described herein, heat shields, such as heat shield 217 and heat shield 227, may be provided at the evaporation source. The heat shields can reduce the energy loss from the evaporation source, which also reduces the total energy consumed by the evaporation source to evaporate the source material. However, as a further aspect, especially for the deposition of organic materials, the radiation originating from the evaporation source, in particular the heat radiation towards the substrate and mask during deposition, can be reduced. In particular, in the case of deposition of organic materials on masked substrates, and even in the case of display manufacture, the temperature of the mask and substrate need to be precisely controlled. Heat radiation originating from the evaporation source may be reduced or avoided by heat shields, such as, for example, heat shield 217 and heat shield 227.

[0056] These shields may include multiple shielding layers to reduce heat radiation outside the evaporation source. As a further option, the heat shields may comprise shielding layers, and the shielding layers are actively cooled by a fluid, e.g., air, nitrogen, water, or other suitable cooling fluids. According to further embodiments described herein, one or more heat shields may surround a portion of the evaporation source 104, such as a portion of the distribution pipe 106 and / or the evaporation crucible 104 surrounding the evaporation source 104, And may include sheet metals. According to embodiments herein, the sheet metals may have a thickness of from 0.1 mm to 3 mm and may comprise at least one material selected from the group consisting of ferrous metals (SS) and non-ferrous metals (Cu, Ti, Al) And / or may be spaced apart from one another by, for example, a gap of 0.1 mm or more.

[0057] In accordance with some embodiments described herein, and as exemplarily shown in FIGS. 3A and 3B, the evaporation crucible 104 is provided on the underside of the distribution unit 130. According to further embodiments that may be combined with other embodiments described herein, the vapor conduit 242 may be located in a central portion of the dispensing unit 130, or between the lower end of the dispensing unit and the upper end of the dispensing unit May be provided at other positions of the < RTI ID = 0.0 >

[0058] FIG. 3c illustrates an example of an evaporation source having a distribution pipe 106 and a vapor conduit 242 provided in a central portion of the distribution pipe. The vaporized source material produced in the evaporation crucible 104 is directed through the vapor conduit 242 to the central portion of the distribution pipes 106. The evaporated source material exits the dispensing pipe 106 through a plurality of outlets 212. The distribution pipe 106 is supported by a support 102 as described for other embodiments described herein. According to still further embodiments herein, two or more of the vapor conduits 242 may be provided at different positions along the length of the distribution pipe 106. [ Steam conduits 242 may be connected to one evaporation crucible or to several evaporation crucibles. For example, each vapor conduit 242 may have a corresponding evaporation furnace 104. Alternatively, the evaporation crucible 104 may be in fluid communication with two or more of the vapor conduits 242 connected to the distribution pipe 106.

[0059] As used herein, the term "distribution pipe" can be understood as a pipe for guiding and distributing the evaporated source material. In particular, the distribution pipe can guide the evaporated source material from the crucible to a plurality of outlets (e.g., openings) of the distribution pipe. As used herein, the term "plurality of outlets" typically includes at least two or more outlets. According to embodiments herein, the dispensing pipe may be a first, in particular a longitudinally extending, linear dispensing pipe. In the embodiments described herein, the longitudinal direction may typically refer to the longitudinal direction of the distribution pipe. In some embodiments, the distribution pipe may comprise a pipe having a cylindrical shape. The cylinder may have a round bottom shape or any other suitable bottom shape, e.g., triangular shape.

[0060] For example, the dispensing pipe may be a hollow cylinder. It is to be understood that the term "cylinder" is generally accepted to have a circular bottom shape and a circular top shape, and a curved surface area or shell connecting the upper and lower circles. According to further additional or alternative embodiments that may be combined with other embodiments described herein, the term cylinder further includes any bottom shape and the same top shape in the mathematical sense, It can be understood to have a curved surface area or shell connecting the features. The cylinder does not necessarily have a circular cross-section.

[0061] FIG. 4A shows a schematic side view of a portion of an evaporation source in accordance with embodiments of the present disclosure, which may be combined with any of the other embodiments described herein. 4A, one or more outlets 212 of the distribution unit 130 may be configured to provide a source material in the deposition direction 101, e.g., through the mask 20, to the substrate 10 . Additionally, a first cooling shield arrangement 201, including one or more openings 221, may be provided to the heated shield shield 202, which is provided at a predetermined distance from the first cooling shield arrangement 201, ) ≪ / RTI > The heated shield array 202 includes one or more apertures 222 to define an emission angle [theta] of the evaporated source material provided through one or more outlets 212 . Also provided is a second cooling shield arrangement 203 which is arranged behind the heated shield arrangement 202 in the deposition direction 101. The second cooling shield arrangement 203 may be provided by one or more metal plates having conduits for cooling fluid, e.g., air, nitrogen, water, or other suitable cooling fluids. For example, conduits for the cooling fluid may be attached to the second cooling shield arrangement, or may be provided in the second cooling shield arrangement. Additionally or alternatively, the second cooling shield arrangement may comprise a thermoelectric cooling device or any other cooling device suitable for the second cooling shield arrangement. The second cooling shield arrangement 203 is configured to align with one or more of the apertures 222 of the heated shield array 202 in the deposition direction 101 as illustrated by way of example in FIG. And one or more openings 223 that are arranged. 4A, the evaporation source 100 may have one or more openings 221 and one or more openings 221 from one or more outlets 212 in the deposition direction 101, And a portion of the evaporated source material provided from one or more outlets 212 is configured to define a path for the source material to the substrate through the passages 222. The portion of evaporated source material provided from one or more outlets 212 Is blocked by the heated shield arrangement 202 so that a predetermined emission angle [theta] from behind can be provided.

4b, according to some embodiments that may be combined with other embodiments described herein, at least one outlet of one or more of the outlets 212, in particular, For each of the one or more outlets, an individual heated shield array 202 and / or an individual second cooling shield array 203 may be provided. For example, one or more of the outlet (s) 212 may be one or more nozzles (s), and one or more nozzles (s) may be connected to the individual heated shield arrangement 202 and / An individual second cooling shield arrangement 203 may be provided in accordance with the embodiments described herein. For example, in FIG. 5, an exemplary embodiment is shown in which one outlet 212 is provided with an individual heated shield array 202 and an individual second cooling shield array 203. FIG.

[0063] FIG. 5 shows a schematic top view of an evaporation source in accordance with further embodiments of the present disclosure, which may be combined with any of the other embodiments described herein. To avoid unnecessary repetitions, only differences are described for the embodiments shown in Figures 1, 2, and 4. The evaporation source shown in Figure 5 includes a distribution unit 130, e.g., a distribution pipe 106, having a triangular-shaped lateral cross-section. The walls of the dispensing unit may be heated by heating elements 380 mounted or attached to the walls. To reduce thermal radiation from the interior of the dispensing unit to the outside of the dispensing unit, an outer shield 302 surrounding the dispensing unit may be provided. Typically, the outer shield 302 can be cooled. For example, the outer shield may be provided by metal plates having conduits for cooling fluid, e.g., water, attached to the outer shield or provided within the outer shield. Additionally or alternatively, a thermoelectric cooling device or other cooling device may be provided to cool the outer shield.

[0064] Referring to FIG. 5 by way of example, and in accordance with some embodiments that may be combined with other embodiments described herein, additional cooling shield arrays 211 may be provided. In particular, additional cooling shield arrays 211 may be provided at a predetermined lateral distance around the outlet of one or more of the outlets. In particular, as illustrated illustratively in FIG. 5, additional cooling shield arrays 211 may extend at least partially in deposition direction 101. For example, the additional cooling shield arrangement 211 may be L-shaped with a major portion extending in the deposition direction. Similar to the first cooling shield arrangement, the additional cooling shield arrangement 211 may be configured to cool to the condensation temperature of the source material to be deposited on the substrate, as described herein. Thus, the evaporated source material that does not pass through the apertures of the heated shield array can be introduced into the first cooling shield arrangement 201 where the evaporated source material is condensed and / or into the additional cooling shield arrangement 211 It is to be understood that the backscattered source material may be collected on the first cooling shield arrangement and / or on the additional cooling shield arrangement.

[0065] In some embodiments described herein, as illustrated by way of example in FIG. 5, a substrate may be coated with a vaporized source material deposited on a substrate 10 through a mask 20, such as a shadow mask . ≪ / RTI > For example, in the case of deposition at a high resolution of more than 800 pixels per inch, each pixel of the evaporated source material, which is formed on the surface of the substrate, is typically discharged from one of the outlets of the evaporation source And is formed by the evaporated source material. For example, evaporated source material from ten out of one or more outlets of the evaporation source can participate in the formation of each of the pixels formed on the surface of the substrate. It should be understood that the embodiments as described herein are particularly advantageous for the fabrication of high resolution displays. In particular, to limit the angle of emission ([theta]) of vaporized source material in the mask, the vaporized source material is configured to block the vaporized source material, depending on the angle of emission of the vaporized source material provided from one or more outlets By providing an evaporation source, the new drawing effects of the mask can be reduced, resulting in improved resolution of the deposited source material on the substrate.

[0066] In the embodiments described herein, the term "angle of the plume of vaporized source material from one or more outlets" may be varied by one of ordinary skill in the art from each of any number of outlets of the vapor source But should be understood to include the angle of the plume of vaporized material.

[0067] FIG. 6 shows a schematic top view of an evaporation source according to further embodiments of the present disclosure, which may be combined with any of the other embodiments described herein. To avoid unnecessary repetitions, only differences are described for the embodiment shown in FIG. Figure 6 shows an embodiment having three distribution units, for example three distribution pipes-disposed on an evaporator control housing 402 adjacent to the distribution units and connected to the distribution units via a thermal insulator 479 / RTI > The evaporator control housing is configured to maintain the atmospheric pressure in the evaporator control housing and includes at least one element selected from the group consisting of a switch, a valve, a controller, a cooling unit, a cooling control unit, a heating control unit, a power supply, . In the embodiments herein, a component for operating the evaporation source may be provided near the evaporation crucible and the dispensing unit under atmospheric pressure, and may be moved through the evaporation source with the evaporation source.

[0068] In the embodiments herein, one or more outlets may be distributed along the length of each of the distribution units, eg, distribution pipes 106, 107, 108, which may be configured as distribution pipes. Each dispensing unit is in fluid communication with an evaporation crucible (not shown in FIG. 6). Each of the plurality of openings of each distribution unit, e.g., distribution pipes 106, 107, 108, has a main discharge direction 101A, 101B, 101C for the evaporated source material. Because of the essentially triangular shape of the dispensing units, the evaporation cones or plumes originating from the three dispensing units are very close to one another, whereby mixing of the source materials from different dispensing units and outlets can be improved. The heated shield section arrangement 202 of the exemplary embodiment shown in Figure 6 may be used in a manner similar to that described above with respect to Figures 1, 2, 4 and 5 by means of distribution pipes, e.g., distribution pipes 106, 107 , 108, respectively, to the mask 20 and / or to the substrate 10, as will be appreciated by those skilled in the art.

[0069] In view of the above, it should be understood that embodiments of the evaporation source as described herein are configured to limit the angle of incidence of the evaporated source material provided on the substrate, for example, through a mask. In particular, a source of vaporized source material (e. G., A source material) is heated to or above the evaporation temperature of the source material to be deposited and has a predetermined emission angle (?) Of greater than 30 degrees, particularly greater than 40 degrees, For example, the angle of incidence of the evaporated source material provided to the substrate through the mask, may be limited to reduce the effects of the new shadowing of the mask. Thus, improved resolution of the deposited source material on the substrate can be provided. It is also possible to provide a first cooling shield arrangement arranged to cool to the condensation temperature of the source material to be deposited and arranged around and behind one or more outlets of the distribution unit, The source material can be collected so that clogging of one or more outlets of the dispensing unit can be prevented. Thus, molecules of the evaporated source material leaving the nozzle at a small angle will pass through the aperture. The molecules leaving one or more outlets, e.g., nozzles, at a large angle will strike a wall around one or more of the apertures of the heated shield array, but will not stick to the heated shield array, This is because the shielding arrangement is heated to or above the evaporation temperature of the source material to be deposited. Instead, the molecules will be backscattered and hit the first cooling shield arrangement disposed around the nozzles. Thus, the evaporated source material, e.g., the evaporated source material used for OLED fabrication, will be condensed into the first cooling shield arrangement. As a result, the backscattered evaporated source material is collected on the first cooled screen so that one or more apertures of the heated screening arrangement and one or more outlets of the dispensing unit are kept clean Whereby clogging can be prevented or even eliminated. Thus, embodiments such as those described herein provide stable process conditions over a long period of time.

[0070] Figure 7 illustrates a schematic plan view of a deposition apparatus 150 for depositing a source material in a vacuum chamber 110, including an evaporation source 100 according to any of the embodiments described herein. do. According to some embodiments that may be combined with other embodiments described herein, the evaporation source is configured for rotational and translational movement about an axis. According to exemplary embodiments herein, the evaporation source may have one or more evaporation crucibles and one or more distribution units, e.g., one or more distribution pipes. For example, the evaporation source shown in FIG. 7 includes two evaporation crucibles 104 and two distribution units 130. 7, a first substrate 121 and a second substrate 122 are provided in the vacuum chamber 110 to accommodate the evaporated source material.

[0071] According to embodiments herein, a mask assembly for masking a substrate may be provided between the substrate and the evaporation source. The mask assembly may include a mask and a mask frame for holding the mask in a predetermined position. In the embodiments herein, one or more additional tracks may be provided to support and displace the mask assembly. 7 includes a first mask 133 supported by a first mask frame 131 arranged between the evaporation source 100 and the first substrate 121 and a second mask 133 supported by the evaporation source 100. [ And a second mask 134, which is supported by a second mask frame 132 arranged between the first substrate 122 and the second substrate 122. The first substrate 121 and the second substrate 122 may be supported on respective transport tracks (not shown in the drawings) in the vacuum chamber 110.

[0072] FIG. 7 is a graphical representation of the evaporation rate of the evaporated source material after evaporation provided from one or more outlets in order to limit the angle of emission of the evaporated source material behind the heated shield arrangement in the deposition direction, Lt; / RTI > additionally illustrates a heated shield arrangement 202 according to embodiments of the present invention provided to shield the evaporated source material, in accordance with the ejection angle of the plume of the source material. In embodiments herein, for example, if masks are used to deposit material on a substrate in an OLED fabrication system, the mask may have pixel openings having a size of about 50 [mu] m x 50 [mu] m or less, For example, the smallest dimension of the cross-section) is about 30 占 퐉 or less, or about 20 占 퐉. In one example, the pixel mask may have a thickness of about 40 占 퐉. Taking into consideration the size of the pixel openings and the thickness of the mask, a new doping effect may occur where the walls of the pixel openings of the mask refresh the pixel opening. It should be appreciated that by providing a source of evaporation as described herein, the effectiveness of the new drawing can be reduced. Thus, improved resolution of the deposited source material on the substrate can be achieved.

[0073] According to the embodiments described herein, the substrates may be coated with the source material in an essentially vertical position. Typically, the dispensing unit provides an essentially vertically extending line source. In the embodiments described herein, which may be combined with other embodiments described herein, the term "essentially vertically" refers to the orientation of the substrate, particularly when it refers to the substrate orientation, , E. G., 10 degrees or less. This deviation can be provided, for example, because a substrate support having any deviation from the vertical orientation can result in a more stable substrate position. However, the substrate orientation that is essentially vertical during deposition of the source material is considered to be different from the horizontal substrate orientation. In particular, the surface of the substrate is coated by translational movement along a line source extending in one direction corresponding to one dimension of the substrate, and another direction corresponding to the other dimension of the substrate.

The evaporation source 100 shown in FIG. 7 is mounted on a track in the vacuum chamber 110 of the deposition apparatus 150, for example, on a looped track (not shown in the drawings) may be provided on a guide (120). The track or linear guide 120 is configured for translational movement of the evaporation source 100. According to different embodiments that may be combined with other embodiments described herein, a drive for translational movement may be provided in the evaporation source 100, in the track or linear guide 120, in a vacuum chamber 110), or a combination thereof.

[0075] Figure 7 additionally illustrates a valve 105, e.g., a gate valve. Valve 105 allows vacuum sealing for adjacent vacuum chambers (not shown in the figures). According to embodiments herein, the valve 105 may be open for transport of the substrate or mask into and / or out of the vacuum chamber 110.

[0076] According to some embodiments, which may be combined with other embodiments described herein, additional vacuum chambers, such as maintenance vacuum chambers 111, are provided adjacent to the vacuum chamber 110. The vacuum chamber 110 and the maintenance vacuum chamber 111 are connected by a valve 109. The valve 109 is configured to open and close the vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 111. According to the embodiments herein, the evaporation source 100 can be transferred to the maintenance vacuum chamber 111 while the valve 109 is in an open state. Thereafter, the valve may be closed to provide a vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 111. When the valve 109 is closed, the maintenance vacuum chamber 111 can be evacuated and opened for maintenance of the evaporation source 100 without breaking the vacuum of the vacuum chamber 110.

[0077] The described material deposition arrangements can be used for a variety of applications, including applications for manufacturing OLED devices including processing methods, wherein two or more such as, for example, two or more organic materials Are evaporated at the same time. In the example shown in Fig. 7, two or more distribution units and corresponding evaporation crucibles are provided side by side.

[0078] While the embodiment shown in FIG. 7 provides a deposition apparatus with a movable evaporation source, those skilled in the art will appreciate that the embodiments described above can also be applied to deposition systems in which the substrate is moved during processing have. For example, the substrates to be coated can be guided and driven along stationary material deposition arrangements.

[0079] The embodiments described herein are particularly directed to, for example, deposition on large area substrates of organic materials for OLED display fabrication. According to some embodiments, large area substrates or carriers supporting one or more substrates may have a size of at least 0.174 m 2. For example, the deposition system may be a fifth generation, corresponding to about 1.4 square meters substrates (1.1 mx 1.3 m), a 7.5 generation substrate corresponding to about 4.29 square meters (1.95 mx 2.2 m), about 5.7 square meters substrate Generation substrates corresponding to 8.5 generations, or even about 8.7 m 2 substrates (2.85 m x 3.05 m), corresponding to the substrate (2.2 m x 2.5 m). Even larger generations such as the eleventh and twelfth generations and corresponding substrate areas can similarly be implemented.

[0080] According to embodiments herein, which may be combined with other embodiments described herein, the substrate thickness may be 0.1 mm to 1.8 mm, and the holding arrangement for the substrate may be adapted for such substrate thicknesses . In particular, however, the substrate thickness may be about 0.9 mm or less, e.g., 0.5 mm or 0.3 mm, and the holding arrangements are adapted for such substrate thicknesses. Typically, the substrate may be made of any material suitable for material deposition. For example, the substrate may be a glass (e.g., soda-lime glass or borosilicate glass), a metal, a polymer, a ceramic, a compound material, a carbon fiber material , Or any other material or combination of materials.

[0081] Figure 8a shows a schematic block diagram illustrating a method 800 of depositing a source material onto a substrate in accordance with embodiments described herein. The method includes a step 810 of evaporating the source material and a step 820 of applying the evaporated source material to the substrate. In addition, applying 820 the evaporated source material to the substrate may include providing 821 the evaporated source material in the deposition direction through one or more outlets of the dispensing unit, (822) one or more apertures of the cooling shield arrangement and one or more apertures of the heated shield arrangement. In particular, embodiments of a method of depositing a source material as described herein are performed by employing an evaporation source in accordance with the embodiments described herein.

[0082] According to embodiments of the present invention, which may be combined with other embodiments described herein, a method of depositing a source material on a substrate may include depositing a heated shield arrangement on the evaporation temperature of the source material to be deposited, ≪ / RTI > Thus, accumulation of evaporated source material on the heated shield arrangement can be prevented. In particular, clogging of one or more of the apertures of the heated shield arrangement can be prevented or even eliminated.

[0083] Illustratively, referring to Figure 8b, according to further embodiments that may be combined with any of the other embodiments described herein, the method may comprise the steps of: intercepting by a heated shield arrangement on the first cooling arrangement And collecting (830) a portion of the evaporated source material. Thus, one or more outlets of the dispensing unit may be kept clean throughout the deposition process, so that clogging of one or more outlets of the dispensing unit may be avoided, or even so that stable deposition process conditions can be maintained for a long time, Can be removed.

[0084] Thus, in view of the foregoing, it will be appreciated that embodiments of the method of depositing the source material on a substrate as described herein may be applied to one or more of the apertures of the heated- It should be understood that it is possible to prevent or even eliminate the clogging of excess outlets, thereby allowing stable deposition process conditions over a long period of time to be achieved. Also, embodiments of the method of depositing the source material on a substrate as described herein can provide improved resolution of the deposited source material on the substrate, for example, for high resolution display fabrication, particularly for high resolution OLED displays, Lt; / RTI > effects.

This written description uses examples to describe the present disclosure, including the best mode, and also includes steps for making and using any devices or systems and performing any integrated methods, To enable those skilled in the art to practice the claimed subject matter. While various specific embodiments have been disclosed above, the mutually exclusive features of the described embodiments may be combined with one another. The patentable scope is defined by the claims, and other examples are intended to encompass both structural elements having claims that differ from the literal language of the claims, or claims having equivalent structural elements having minor differences from the words of the claims Are intended to be within the scope of the claims.

Claims (15)

An evaporation source (100) for depositing a source material on a substrate (10)
An evaporation crucible (104) configured to evaporate said source material;
A dispensing unit (130) having one or more outlets (212), said dispensing unit being in fluid communication with said evaporation crucible, said one or more outlets being adapted to deposit said source material In a direction (101);
A first cooling shield arrangement (201) comprising one or more openings (221); And
And a heated shield arrangement 202 provided at a predetermined distance from the first cooling shield arrangement 201. The heated shield arrangement 202 may include one or more apertures 222) and is heated to or above the evaporation temperature of the source material to be deposited,
The first cooling shield array 201 is arranged between the distribution unit 130 and the heated shield array 202,
The evaporation source 100 is configured to dispense the one or more openings 221 and one or more of the apertures 222 from the one or more outlets 212 in the deposition direction 101. [ Wherein the substrate is configured to define a path for the source material to the substrate,
A vapor source for depositing a source material on a substrate. The method according to claim 1,
Wherein the heated shield array 202 is configured to be heated to an evaporation temperature of the source material to be deposited,
A vapor source for depositing a source material on a substrate. 3. The method according to claim 1 or 2,
The first cooling shield arrangement (201) is configured to cool to a condensing temperature of the source material to be deposited.
A vapor source for depositing a source material on a substrate. 3. The method according to claim 1 or 2,
One or more of the apertures 222 of the heated shield array 202 are aligned in the deposition direction 101 with one or more outlets 212 of the distribution unit 130 Arranged,
A vapor source for depositing a source material on a substrate. 3. The method according to claim 1 or 2,
The first cooling shield arrangement 201 is configured to laterally surround one or more outlets 212 of the distribution unit 130. In one embodiment,
A vapor source for depositing a source material on a substrate. 3. The method according to claim 1 or 2,
One or more outlets (212) of the dispensing unit (130) are provided on a heated wall (135) of the dispensing unit,
A vapor source for depositing a source material on a substrate. The method according to claim 6,
Wherein the heated shield arrangement 202 and the heated wall 135 of the dispensing unit 130 are configured to exhibit the same thermal expansion,
A vapor source for depositing a source material on a substrate. 8. The method of claim 7,
The heated shield arrangement 202 is connected to the heated wall 135 of the distribution unit 130 via a connection element 232,
A vapor source for depositing a source material on a substrate. 9. The method of claim 8,
The connection element 232 is configured to adjust the distance between the heated wall 135 of the distribution unit 130 and the heated shield array 202. [
A vapor source for depositing a source material on a substrate. 3. The method according to claim 1 or 2,
Wherein a second cooling shield arrangement (203) is arranged behind the heated shield arrangement (202) in the deposition direction (101)
A vapor source for depositing a source material on a substrate. 11. The method of claim 10,
The second cooling shield arrangement 203 is configured to align one or more apertures 222 in the deposition direction 101 with one or more apertures 222 of the heated shield array 202. [ Lt; RTI ID = 0.0 > 223, <
A vapor source for depositing a source material on a substrate. 3. The method according to claim 1 or 2,
One or more outlets (212) of the dispensing unit (130) are arranged in the deposition direction (101), which protrudes from one or more openings (221) of the first cooling shield arrangement (201) , And one or more nozzles (125)
A vapor source for depositing a source material on a substrate. A deposition apparatus (150) for depositing a source material in a vacuum chamber,
The apparatus comprises one or more evaporation sources (100) according to claim 1 or 2,
Deposition apparatus. A method (800) for depositing a source material on a substrate,
Evaporating the source material (810); And
And applying (820) vaporized source material to the substrate,
Applying (820) the evaporated source material to the substrate,
Providing (821) the vaporized source material in one or more outlets of the dispensing unit in a deposition direction, and
(822) passing the evaporated source material through one or more apertures of the first cooling shield arrangement and one or more apertures of the heated shield arrangement, wherein the heated shield arrangement Is configured to be heated to or above the evaporation temperature of the source material to be deposited,
A method of depositing a source material on a substrate. 15. The method of claim 14,
Further comprising collecting (830), on the first cooling shield arrangement, a portion of the evaporated source material that is blocked by the heated shield arrangement.
A method of depositing a source material on a substrate.

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