KR100633809B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR100633809B1
KR100633809B1 KR1020050006731A KR20050006731A KR100633809B1 KR 100633809 B1 KR100633809 B1 KR 100633809B1 KR 1020050006731 A KR1020050006731 A KR 1020050006731A KR 20050006731 A KR20050006731 A KR 20050006731A KR 100633809 B1 KR100633809 B1 KR 100633809B1
Authority
KR
South Korea
Prior art keywords
substrate
board
path
unit
processing apparatus
Prior art date
Application number
KR1020050006731A
Other languages
English (en)
Korean (ko)
Other versions
KR20050081172A (ko
Inventor
기무라요시카즈
야마모토사토시
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20050081172A publication Critical patent/KR20050081172A/ko
Application granted granted Critical
Publication of KR100633809B1 publication Critical patent/KR100633809B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020050006731A 2004-02-13 2005-01-25 기판 처리 장치 KR100633809B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004036232A JP4566574B2 (ja) 2004-02-13 2004-02-13 基板処理装置
JPJP-P-2004-00036232 2004-02-13

Publications (2)

Publication Number Publication Date
KR20050081172A KR20050081172A (ko) 2005-08-18
KR100633809B1 true KR100633809B1 (ko) 2006-10-13

Family

ID=34908357

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050006731A KR100633809B1 (ko) 2004-02-13 2005-01-25 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP4566574B2 (ja)
KR (1) KR100633809B1 (ja)
CN (1) CN100338732C (ja)
TW (1) TWI255501B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
US7959395B2 (en) 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
JP2008135517A (ja) * 2006-11-28 2008-06-12 Tokyo Electron Ltd 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体
JP5458633B2 (ja) * 2008-06-20 2014-04-02 株式会社Ｉｈｉ 処理設備及び搬送制御方法
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
TWI497226B (zh) * 2011-01-05 2015-08-21 Tokyo Electron Ltd Coating, developing device, coating, developing method and memory medium
TWI574342B (zh) * 2015-06-12 2017-03-11 漢民科技股份有限公司 自動化處理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5679843U (ja) * 1979-11-22 1981-06-29
JPH07228346A (ja) * 1993-12-22 1995-08-29 Hitachi Ltd 搬送装置、搬送処理装置及び被処理物搬送処理方法
JPH0817894A (ja) * 1994-06-27 1996-01-19 Dainippon Screen Mfg Co Ltd 基板表面処理装置
JP3522912B2 (ja) * 1994-08-01 2004-04-26 東京エレクトロン株式会社 洗浄処理装置およびその制御方法
JP3734294B2 (ja) * 1995-09-04 2006-01-11 大日本スクリーン製造株式会社 基板搬送装置
JP4045008B2 (ja) * 1998-03-26 2008-02-13 大日本スクリーン製造株式会社 基板処理装置
JP2914949B1 (ja) * 1998-02-16 1999-07-05 株式会社カイジョー 基板処理装置
JP3960761B2 (ja) * 2001-07-16 2007-08-15 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP2004015022A (ja) * 2002-06-11 2004-01-15 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
TW200527527A (en) 2005-08-16
TWI255501B (en) 2006-05-21
JP4566574B2 (ja) 2010-10-20
CN1655322A (zh) 2005-08-17
JP2005228917A (ja) 2005-08-25
CN100338732C (zh) 2007-09-19
KR20050081172A (ko) 2005-08-18

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