TWI255501B - Substrate processing apparatus - Google Patents

Abstract

The present invention provides a substrate treatment apparatus by which the influence of a treatment unit for carrying out prescribed treatment is reliably removed from a substrate which does not require the prescribed treatment. As the carrying paths of the substrate, the substrate treatment apparatus 1 is provided with a main carrying path MTR via an etching unit 50 and a peeling unit 51, a sub carrying path STR1 (conveyer 30) by-passing the etching unit 50, and a sub carrying path STR2 (buffer 41) by-passing the peeling unit 51. In addition, the substrate treatment apparatus 1 is provided with a carrying robot 20 or 22 for receiving and delivering the substrate between the main carrying path MTR and the sub carrying paths STR1 and STR2. For example, the substrate which is not to be etched is by-passed to carry the etching unit 50 by selecting the sub carrying path STR1 by a control unit 80 and carrying the substrate to the conveyer 30 by the carrying robot 20.

Description

1255501 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a technique of transporting a substrate while eliminating the influence of a processing unit provided inside on a substrate. [Prior Art] In the manufacturing process of the substrate, a processing unit that performs the continuation processing along the substrate transport path is proposed, and a substrate processing apparatus that performs processing by the processing unit while transporting the substrate along the transport path is proposed. For example, Patent Document 1 describes such a substrate processing apparatus. In the substrate processing apparatus described in Patent Document 1, only one substrate transport path is provided, and all the substrates are transported in the same path. Therefore, even if it is desired to remove the substrate processed by the specific processing unit (the substrate which is not subjected to the processing), it is necessarily transported to the processing unit. In such a case, in the prior substrate processing apparatus, the processing unit of the substrate which is not desired to be processed is transported, and the substrate is not processed and transported to prevent unneeded processing of the substrate. [Patent Document 1] JP-A-2000-1 830 19 SUMMARY OF THE INVENTION [In the prior art device, the substrate and the processed substrate are completely transported without processing as long as they are transported to the processing unit; Then, the transfer part of the (four) part is attached to the ring: the state in which the concentration of the solvent component of U is high. The substrate is sent to the mobile*, and there is a problem that the base that is not required to be treated is affected by the production of the 222 soil. 98568.doc 1255501, go to:,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The problem is: "In view of the above-mentioned problems, the second substrate is provided at the substrate: it can reliably exclude the processing unit processed by the 仃 亥 亥 对于 对于For the purpose of the influencing person, the above-mentioned problem is as follows: the request item k invention system, the substrate processing device: the substrate for processing the input, characterized in that it comprises: at least one processing is performed 7C' a main transport path, wherein the substrate is carried in and out of the processing unit, the sub-transport path bypasses the processing unit, and the transport means transfers the substrate between the main transport path and the sub-transport path; The method of selecting the transfer substrate "transported by the main transport path" or "transporting the sub-transport path" to determine the transport path of the substrate; and the control means The substrate transporting path determined by the path determining means controls the transporting means. The invention of claim 2, wherein the substrate processing apparatus of the invention of claim 1 wherein the transport means is capable of moving the substrate up and down The transfer robot "the above-described sub-transport path" is disposed in the upper portion of the main transport path. The invention of claim 3 relates to the substrate processing of the invention of the request item. According to the invention of claim 4, the invention relates to a substrate processing 98568.doc 1255501 device of the invention of claim 3, wherein the buffer means is provided by the method of transferring the substrate between the transfer means. The substrate h capable of accumulating the maximum number of sheets or more in the unit is present in the above-mentioned second invention system, and the substrate processing of the invention of claim ι and the case where a plurality of substrates are input by the one-pass substrate processing apparatus , the substrate to be discharged = discharged, and the main moving by the sub-transporting path, the above control means, priority treatment The substrate that has been discharged from the main air transport path. The invention of the second item is the substrate processing procedure of the invention of claim 1 and the cable routing path of the disk 2, which are connected and provided with the above-mentioned outward route in a specific direction. On the way, the above-mentioned sub-transportation path of the scholastic smuggler is taken over, and the substrate is picked up. The substrate is traversed on the way of the above-mentioned return journey. The invention of the item 7 is related to the substrate processing material of the invention of claim 6. Facing the sub-transport path, the substrate is temporarily stored, and the first opening of the above-mentioned outward path and the buffer of the second opening of the return path are formed. The invention of Item 8 is the invention of the request. In the substrate processing, the sub-transport holder can transport the substrate in both directions. The invention of the item 9 is the substrate processing of the invention of claim 1 and the step rotation means is processed by the substrate: Set: The substrate is rotated in a specific posture. (2) The invention of the invention of claim 1 is the substrate processing of the invention of claim 1 : the processing unit of the above-mentioned processing unit is a specific processing liquid for the substrate to be transported. 98568.doc 1255501 In the invention of claim 1 or 10, the substrate to be loaded is selected to be transported by the main transport: π迖 or transported by the brake transport path, and the substrate on which the substrate transport path 1 is not processed by the X processing unit is determined. Then it is transferred around the processing unit. Therefore, the invention of the substrate moving length item 2 can be reliably excluded from the influence of the processing unit, and is disposed on the main transport path by the sub transport path.卩 can suppress the footprint (Footprint). -In the invention of the present invention, the substrate can be transferred between the transport means, and the buffer can be absorbed in the plurality of substrates by the buffer means for storing the substrate, which is caused by the difference in the transport path. In addition, for example, in the case of the maintenance of the single T, the substrate can be retracted from the upstream. Further, the substrate to be transferred can be transported first, and the substrate can be transported by overtaking. In the buffer means, the substrate can be stored in the same number of sheets as the maximum number of sheets that can be stored in the processing, and the overtaking of the sub-transporting path can be reliably realized. When the processing apparatus is loaded with a plurality of substrates, the substrate discharged from the main transport path competes with the substrate that is pinched by the sub transport path, and the substrate that is discharged by the main transport path # is preferentially processed to prevent the transfer to the processing. The substrate of the unit is forced to wait, and the substrate needs to be processed as described above. In the invention of claim 6, the sub-transport path is removed from the main transport path. In the middle of the process, the substrate is delivered: the transport distance of the substrate of the short 4 moving path. The substrate that can be transported by the high speed is transported at high speed. ~路98568.doc 1255501 The invention of claim 7 has the first open area facing the way. It is not necessary to provide a configuration in which the substrate is transported to the main transport path and the sub-transfer device. The sub-portal lithium circuit temporarily stores the substrate, and a mechanism for buffering the second opening of the circuit to the field. Moreover, it is not necessary to set a buffer between the t paths. Therefore, it can be sent through the request item 8, and the _j撼1 can be used to move the board in both directions to not only make the sub-transport path as a wrap. A transport path can also be used for & the transfer path of the processing unit placed in the way to the processing unit of the circuit is moved to the invention of #9, and the F詈付Ψ ♦ * j , Suspected to change the slave, the system is rotated by the base nucleus ^ ^, bamboo 疋 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The invention of the item 1 is carried out with a specific treatment liquid To eliminate the influence of processing by the processing unit of the processing unit of the transport system for feeding the substrate, 'as compared with the previous apparatus, can be particularly effective [Embodiment

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. <Different Form of the Brother 1> The diagram showing the construction of the substrate processing apparatus 1 of the present invention and the path of the transport substrate is shown. The substrate processing apparatus 1 includes a two-dimensional barcode reader 10, carriers 20 to 22, a transfer machine 3, 31, a buffer 4, 41, an etching unit 50, a peeling unit 5, a rotating unit 60, and an inspection. Unit 7〇 and control unit 80 〇98568.doc -10- 1255501 Furthermore, in Fig. 1, the transport robots 20 and 21 are shown in side view. Further, although the transport unit 30 and the etching unit 50 are shown in the same plane shape in parallel, the actual transport unit 30 is disposed on the upper portion of the etching unit 5, and these two-layer structures are formed. By arranging the conveyor 30 in this manner, the substrate processing apparatus i can prevent an increase in the occupied area. Further, in the convenience of the illustration, only one control unit 8A is illustrated in FIG. i, but the shell IV and the upper substrate processing apparatus 1 have a two-dimensional barcode reader 1 〇 and transport robots 20 to 22, respectively. The control unit 8 that can operate independently. Further, the plurality of control units 80 are configured to independently control the respective configurations by transmitting information while communicating with each other without a cable shown in the drawing. Hereinafter, in particular, the control unit 8 of the two-dimensional bar code reader 1 is referred to as a control unit, and the control units 80 of the transport robots 20 to 22 are respectively referred to as control units 灿^ to RBC3', which are appropriately distinguished from other control units. Description. In Fig. 1, the path indicated by the arrow is the main transport path, and the path indicated by the dashed arrow is the sub-transport path STR1, STR2. In other words, the substrate processing apparatus of the present embodiment has two sub-transport paths stri and str2. The substrate processing apparatus 1 is a device that performs a series of processing on which a substrate for masking a circuit pattern by coating, exposure, and development processing of a resist liquid is subjected to an etching treatment, and then the anti-gu film is peeled off and the inspection result is checked. Constitute. <1·1 Main Transport Path> The substrate processing apparatus 1 includes a main transport path MTR that is further passed by the two-dimensional barcode reader 10 via the etching unit 50 and the peeling unit 51, and further passes through the rotating unit 60 and the inspection unit 70. To the conveyor 31. The path of each processing unit provided in the main transport path is the same as that of all the previous devices. 98556.doc 11 1255501 The path of each processing unit included in the substrate transporting and unloading of the substrate processing device corresponds to the path through which all the substrates of the previous device pass. Further, the main transfer path MTR is connected to the circuit of the two-dimensional bar code reader through the etching unit % to the off unit 51 and the loop by the stripping unit 51 via the rotating unit 6 and the inspection unit 7G to the conveyor 31. The composition. Hereinafter, the main configuration of the main transport path of the substrate processing apparatus 丨 of the present embodiment will be described. The two-dimensional bar code reader 10 holds the substrate placed in the substrate processing apparatus 位置 at a position that the transfer robot 20 can pick up. Further, the optical system not shown in the figure reads an identification code (Veri Code) printed at a specific position on the substrate. Then, based on the read identification code, the control unit creates a general name for the information on each substrate produced by the substrate asset TL substrate δί1, and is composed of, for example, a plurality of pieces of information such as a substrate identification code, a processing history, a predetermined process, and a priority order. The control unit VCRC transmits the created substrate information to the control unit RBC1 of the transport robot 2 at the time when the operation of holding the substrate at the specific position is completed. Each of the transport robots 20 to 22 is disposed on the main transport path MTR, and includes a transport arm for holding the substrate, a lift mechanism for moving the arm up and down, and a drive mechanism for moving the arm forward and backward in the horizontal direction, and controlling the control unit ( Control unit RBC1 to control unit RBC3). With such a configuration, the robots 20 to 22 can be transported to receive the substrate held in the movable range of the transport arm, and similarly transferred to a specific position of the movable range of the transport arm. In particular, since the sub-transporting path STR1 is provided in the movable range of the transport robots 2〇 and 2ι, the transport robots 2〇 and 2丨 can be transferred between the main transport path Mtr, 98568.doc 12 1255501 and the sub-transport path stR1. Substrate. Similarly, the sub-transport path STR2 is provided in the movable range of the transport robots 21 and 22, and the transport robots 21 and 22 can transport the substrates between the main transport path MTR and the sub-transport path. Further, as described above, the transport robots 2A to 22 can be transported in the vertical direction by providing the elevating mechanism. Therefore, in the substrate processing apparatus 1 of the present embodiment, the sub-transport path STR1S is above the main transport path r, and in the case of the two-layer structure, the substrate can be transferred. The transport robot 20 is disposed at a position where the main transport path MTR and the sub transport path are different. The transport arm of the transport robot 2G is controlled by (4) 4RBC1 to receive the substrate by the dimensional barcode reader 1 (), and transport it to the conveyor 3 constituting the sub-transport path ST R1 or the etching unit 5 constituting the main transport path MTR. 0. Further, the transfer robot 20 can temporarily transport the substrate conveyed to the conveyor 3 or the etching unit 5 to the buffer 4G, and then transfer it to the conveyor 3 or the etching unit 50 1 'the transfer robot 2 The source of the substrate is two, the quasi-bar code 26 takes the machine 1G or the buffer zone 4, and the substrate is transported to the conveyor 30, the buffer 40 or the etching unit 5〇. The transport robot 21 is disposed at a position where the main transport path MTR and the sub transport path STR1 merge, and the main transport path #Mtr and the sub transport path π" are different. The transport robot 21 transports the arm system by the conveyor 3 () or (4) The unit picks up the substrate and transports it to the buffer constituting the sub-transport path lamp or the stripping unit 51 that constitutes the main transport path MTR. Further, the transport robot 21 can transport the substrate to the stripping unit 51 98568.doc After the 1255501 is accumulated in the buffer zone 4 1 , it is re-transferred to the stripping unit 5 . That is, the conveyor 21 picks up the source conveyor 3 〇 of the substrate, the etching unit 5 〇 or the buffer zone 41 , and the transfer direction of the substrate The buffer 41 or the peeling unit 51. The transport robot 22 is disposed at a position where the main transport path MTR and the sub transport path STR2 merge. The transport robot 22 transports the arm, receives the substrate from the buffer 41 or the peeling unit 51, and transports it to Further, the transfer robot 22 can temporarily transport the substrate received by the peeling unit 51 to the buffer zone 41, and then take it out and transport it to the rotating mechanism 60, that is, the transporter. 22, the source buffer of the substrate is picked up, or the substrate is transported to the buffer zone 41 or the rotating mechanism 6 剥离. The transfer robots 20 to 22, at which timing, which substrate is picked up, the substrate is connected. The transfer direction of the substrate transfer is determined by each of the control units RBC1 to rbc3, but will be described later in detail. The buffer 40 is provided with a plurality of cabinets for holding the substrate, and can be accessed by the transfer robot 20. The substrate that is transported by the transport robot (9) is held in the cabinet, and has a function of temporarily storing the substrate. Further, in FIG. 1, the buffer 40 is disposed between the transport robot 2 and the time unit 5? The position of the buffer zone is not limited to the position where the transfer robot 20 can be carried in and out. The etching unit 50 is wet-processed with a specific chemical solution by a substrate having a mask circuit pattern such as a resist film. Specifically, the substrate is etched by the specific chemical solution, and a circuit pattern is formed on the surface of the substrate. Further, in the etching unit 50 of the embodiment, the maximum number of sheets can be simultaneously present. Substrate N. 98568.doc 14 1255501 Peeling the early 兀51 series' means for removing unwanted substances (resist film, oxide film, etc.) adhering to the surface of the substrate. For example, etching the substrate by etching unit % requires The resist film of the mask which is formed in advance is removed. Therefore, the substrate is processed by the stripping unit 51 and removed into a useless anti-money film.

The rotating unit 60 is a unit having a function of rotating the attached substrate only by a specific angle. The control unit 8G of the rotating unit 6G determines the position of the substrate (the fourth side) and the position of the substrate (including the face), and adjusts the posture of the substrate by only (four) the required angle. By providing such a rotating unit 60, even if the substrates having different transport paths are different, the same posture can be adjusted to be delivered. Therefore, in the processing apparatus 1 of the present embodiment, the posture of the substrate to be delivered can be unified. The inspection unit 70 checks the substrate processed by the substrate processing apparatus L, and determines the substrate of the substrate in accordance with the inspection result. Material inspection unit 7 broke into ^

The inspection may be performed, for example, by micro-inspection, pattern matching inspection, line width measurement inspection, or the like. <12 sub-transportation path> The sub-transportation path STR1 is a path in which the transport robot is transported by the conveyor 30J. Mainly as a path to bypass the (4) unit 5〇. The substrate system transported by the sub transport path STR1 is not transported to the surname unit 50 until it is carried out by the substrate 31 (transporter 31). In other words, the conveyance paths STR1 and STR2 are not only the arrangement of the conveyance path but also the convenience of the processing sequence, and the path conveyor 30 is provided to temporarily avoid the unit, and the main sentence is only 4 women. To hold the member, it is to hold the substrate in a direction and drive mechanism that transports the substrate in a particular direction. The conveyor % conveys the substrate picked up by the transfer robot 20 to the advance direction of the sub-transport path STR1 (the direction in front of the broken line), and stops at the position where the transfer robot 2 1 can receive the substrate. Further, as the mechanism for realizing the transportation (4), a roller transport mechanism or a shuttle transport mechanism is proposed, and of course, it is not limited to such a mechanism. The transmission path STR2 is transmitted by the transport robot 2! via the buffer 41 to the path of the transport robot 22. The substrate system that is transported by the sub-transport path 2 is mainly disposed as a path that bypasses the path of the peeling unit 51. The substrate processing apparatus 1 is not transported to the peeling unit 51, and is carried out by the substrate processing apparatus. FIG. 2 is a side view showing the buffer 41 and the transfer robots 21 and 22. The buffer area 41 has a plurality of cabinets holding the substrate inside, similarly to the buffer zone 40. On the side of the buffer zone 41, a plurality of openings 411 that open to the transport robot 21 (the forward side of the main transport path MTR) and a plurality of openings 412 that open to the transport robot 22 (the return side of the main transport path MTR) are provided. . In other words, in each of the cabinets of the buffer zone 41, any of the transport robot 21 and the transport robot 22 can carry in and out the substrate. Therefore, the substrate carried in the transport robot 21 is carried out by the transport robot 22, and the buffer zone "has a function of bypassing the sub transport path STR2 of the stripping unit 51. Further, the buffer zone 41 can be accumulated and can exist at the same time. The number of cabinets of the maximum number of sheets N or more in the etching unit 5 is determined, and the number of cabinets is determined. Thus, the substrate processing apparatus 1 can surely realize the overtaking conveyance using the sub-transporting path STR]. .doc • 16-1255501 <1.3 Operational Description> Next, an example of the operation of the substrate processing apparatus 1 of the present embodiment having the above configuration is performed. ^Shi Baixian' is placed on the substrate in the substrate processing apparatus. The two-dimensional barcode reader reads the identification information of the two substrates to prepare the substrate information, and holds the substrate at the special position. The control unit of the two-dimensional barcode reading machine is controlled by the moving machine. The control unit takes the information of the substrate of the substrate and transmits the substrate to the state in which it can be accessed. α U Du; The control unit RBc of the person 20 receives the substrate of the control unit vcRC, and determines the transport path of the substrate displayed on the substrate information in response to the received substrate information. For example, based on the information included in the substrate information "predetermined processing", it is determined whether or not the processing of the substrate is predetermined. Based on the result of the judgment, the main transport path is selected for the substrate which is scheduled to be processed by the surname unit %, and the main transport path is determined to be the transport path of the substrate. On the other hand, the sub-transporting path STR1 is selected for the substrate which is not scheduled for the processing, and the sub-transporting path is determined to be the transport path of the substrate. In the case of the transfer robot 2 (), there is a source of pick-up as a substrate: the barcode reader 10 and the buffer 4 〇. Therefore, there is a case where the substrate access request is read by the two-dimensional bar code, and the substrate stored in the buffer zone is transported to the lower side of the machine. In this case, the control unit is included in the reference. The "priority order" of the substrate's substrate is controlled, and the transfer arm is controlled to receive the substrate with a higher priority. In the case of the substrate of the same "priority order", the substrate for controlling the transfer of the arm is controlled to be placed on the substrate of the buffer (98568.doc -17-1255501 substrate). However, the substrate transfer control is not limited to this. Further, in the control unit RBC, the transfer arm is controlled, the substrate on which the main transport path MTr is the transport path is transported to the etching unit 5, and the substrate on which the sub transport path STR1 is the transport path is transported to the transport unit 3A. Further, there is a case where the substrate is transported to the downstream side and temporarily transported to the buffer zone 40. In this manner, the transfer robot 20 transports the substrate to the main transfer path, and the etching process is performed by the etching unit 50 (etching process) to form a circuit pattern or the like on the surface. On the other hand, the substrate that is not etched is transported to the field by the conveyor 3! 1 Transfer path STR1, bypass (4) unit % transfer. Thus, the substrate processing apparatus of this embodiment! The substrate which is not subjected to the button processing (in other words, the substrate which prohibits the surging process) is not transported to the silver engraving unit %. Therefore, it can be surely excluded from the shadowing of such a substrate due to the unit 50. Furthermore, any unit that has been bypassed can perform any processing. However, since the unit of the surname unit 5 is wet-processed using a chemical solution, it is highly influential to transport the substrate of the liquid medicine which is not expected to be used. Therefore, the substrate processing apparatus according to the present embodiment is provided with the condition that the wet processing unit is subjected to the material (4).如此Into the substrate of the substrate processing apparatus 1 as described above, as a substrate which is not subjected to the etching treatment, it is expected that the substrate is coated with a poor coating agent before the application of the substrate processing device L. In other words, if the substrate which is determined to be poorly coated is subjected to I-insect, the circuit pattern formed by n L and J will be deteriorated. Therefore, such a substrate needs to be removed after the resist of the soil cloth is applied by applying a 98568.doc -18-1255501 cloth device. However, since the etching treatment is a process of etching the substrate, it is difficult to restore the substrate after the etching treatment to the processing. In this case, the substrate processing apparatus 1 is put into the substrate processing apparatus 1 and the peeling process is performed by the peeling unit 5, and the peeling process of the resist film which is determined to be a coating failure is carried out, and the substrate processing apparatus 1 is carried out, and then the coating process is performed again. That is, the case where the substrate processing apparatus 1 is used as a rework apparatus is expected.

The control unit RBC1 receives information indicating the state of the device from the control unit 8 of the device (conveyor 30 or etching unit 50) located on the downstream side in the determined transport path, and carries out the information in response to the information. For example, when the etching unit 5 is in a state in which it cannot be picked up, the substrate having the main transport path mtr as the transport path is temporarily transported to the buffer 4G. Then, the _ unit 50 is in a state in which the substrate can be picked up, and when the substrate is requested by the (4) portion 8 () of the _ unit 5G, the substrate is taken out from the buffer 4 and transported to the (4) unit 5A. As described above, in the substrate processing apparatus i of the present embodiment, by providing the buffer 40', for example, when the processing unit is under maintenance, the substrate can be evacuated. Even if the (4) unit 5G is in a state in which the substrate cannot be picked up, The barcode 5 pick-up machine 1 picks up the substrate to be fed by the sub-transport path, and the control unit RBC1 controls the transport unit 3〇. Hand f will move the board

In the previous device, the transport path was not related to the transport path. Therefore, the substrate (8) in the embodiment was not able to be picked up because it was only in the - state. The substrate on which the Γ= part of the double dicing treatment is carried out can be transported to the boring side by the sub transport path STR1 without causing the process 98568.doc -19-!2555〇1 to be stagnant. That is, the substrate which is not subjected to the etching treatment can be excluded from the processing state of the etching unit 5

ring. Further, in the case where the etching unit 50 is incapable of being used, the control unit RBC1 may change the transport path to determine the substrate to be transported by the main transport path. The path STR1 serves as a transport path. In other words, the substrate that has been placed in the substrate processing apparatus can be quickly carried out. In this manner, the transport path of each substrate is determined by the control unit RBC1 of the transport robot 2, and the substrate processing apparatus! It can respond to various situations in a variety of situations. Further, when receiving the substrate having a high priority, the control unit RBC1 controls the transfer arm so that the substrate of the priority 优先 is preferentially transported, and transmits the substrate information of the substrate to the control unit RBC2 of the transfer robot 21. The notification control unit RBC2 has a priority substrate feed. Thereby, the priority substrate is processed preferentially on the downstream side as compared with other substrates. When the processing of the etching unit 50 is completed, the control unit 8 of the etching unit 5 is notified of the substrate information of the substrate which has been processed by the transfer robot 21, and the etching unit 50 is notified that the substrate that can be carried out is prepared. Further, the control unit 80 of the conveyor 3 transmits the substrate information of the substrate to the transfer robot 21 at the stage of the conveyance of the substrate to the exit side of the conveyor 3, and notifies that the substrate that can be carried out is prepared. The operation of the transport robot 21 that receives such notification (substrate transport request) is substantially the same as the operation of the transport robot 20, but the notification by the transporter 30 and the notification by the etching unit 5 are substantially simultaneously performed. 98568.doc -20- 1255501 In this case, the control unit RBC2 of the transport robot 21 is preferentially notified by the etching unit 50. That is, when the conveyor 30 competes with the requirements of the etching unit 50, the transport robot 21 carries the substrate held in the residual unit 5〇 out of the substrate held by the conveyor. Such priority processing is performed on the substrate which is processed by the etching unit 50, and also between the substrates accumulated in the buffer region 41. In this case, the control unit RBC2 also controls the transporting hand f to preferentially pick up the substrate held by the money order 兀50. As a result, in the substrate processing apparatus 1 of the present embodiment, it is possible to prevent the substrate from being stagnated in the etching unit 50, thereby causing an influence of excessive etching treatment on the substrate existing in the etching unit 50. In the substrate processing apparatus 丨, the main transport path MTR selected by the control unit RBCl of the transport robot 21 is the stripping unit 51, and the sub transport path lamps are the buffer areas 41. The method of transporting the substrate picked up by the transport robot 21 to the main transport path MTR or the sub-transport path STR2 is substantially the same as the case of the transport robot 2〇. In other words, the control unit RBC2 accumulates the substrate having the lower priority among the competing substrates in the buffer area by referring to the "priority order" included in the substrate information. The substrate is sequentially transferred to the downstream side. In other words, by providing the buffer unit 41, the substrate processing apparatus 1 can carry out the overtaking of the substrate by carrying out the substrate which is later loaded. In particular, the case where the control unit RBC1 of the transfer robot 2 receives the notification of the presence of the priority substrate (in this case, the substrate having the maximum number of sheets in the remaining unit 5), the control unit RBC1 is connected by the etching unit 5. Take the substrate regardless of 98568.doc -21 - 1255501 and send the path to the buffer 41 to accumulate. Then, the priority substrate _ point 'the priority substrate is prioritized over the substrate that is accumulated in the buffer area. The buffer area 41 can be kept at the maximum of the etching unit 5 同时 at the same time. Since the number of sheets of N or more is the number of substrates, the substrate processing apparatus and the substrate on the same transport path can surely realize overtaking. In the substrate processing apparatus 1, the sub transport path STR2 is constituted by the buffer 41. The sub-transport path STR2 is not only used as a mechanism for transporting the substrate to the downstream side, but also serves as a mechanism for storing the substrate. Therefore, it is necessary to recognize whether or not the substrate is transported to the buffer 41 by the sub-transport path § Ding & The substrate to be transported (corresponding to the substrate that is transported to the conveyor 3 by the transport robot 2), or the substrate that is stored in a waiting order (corresponding to the substrate that the transfer robot transports to the buffer 40). In the control unit RBC2 of the substrate processing apparatus 1 of the form, the substrate that is stored in the buffer 41 is not required to be transported to the control unit RBC3 of the transport robot 22, and only The substrate to be conveyed by the sub-transporting path STR2 (more specifically, the substrate to be transported) is requested to be transported by the substrate. Then, the control unit RBC3 of the transport robot 22 disposed on the side of the sub-transporting path STR2 is provided only The substrate for receiving the substrate transfer is picked up and transported by the buffer 41. The substrate that has not received the substrate transfer request by the control unit rbC3 is continuously stored in the buffer 41, for example, the transfer robot 2 is to be transported. When the main transfer path MTR is reached, the substrate can be picked up from the buffer zone 41. The substrate processing apparatus 1 passes through the main transfer path of the 98568.doc-22·1255501 substrate (etching unit 5〇) and via There is a difference in the transport time between the substrates of the sub-transporting path STR1 (conveyor 30). Therefore, even if the substrate is not overtaken, the substrate transported by the transport path with a short transport time can be expected to be overtaken. In the case of a substrate transported by a transport path having a long time, the substrate processing apparatus according to the embodiment of the present invention is even after the case: When the transfer robot 21 arrives at the buffer 41, the difference in the transport time due to the transport path can be absorbed. Therefore, for example, the information on the prohibition of overtaking is included in the substrate information, and the substrate processing apparatus 1 The substrate is discharged in the order of the input. In this manner, the substrate "transferred by the transfer robot 21 to the main transfer path" is peeled off by the peeling unit 51. Then, the substrate transferred to the sub-transport STR2 is Since the peeling unit 51 is conveyed around the downstream side, it can be excluded from the influence of the processing of the peeling unit 51. When the processing of the peeling unit 51 is finished, the control unit of the peeling unit 51 is processed by the transfer robot 22 to terminate the substrate. The substrate information is passed through, and the substrate 51 is prepared with a substrate that can be carried out. In addition, the control unit rBC2 of the transfer robot u transfers the substrate information of the substrate to the control unit RBC3 of the transfer robot 22 by the stage of transferring the substrate having the sub-transport path #STR2 as the transfer path to the buffer 41. The transfer substrate transfer request is made, and the notification buffer 4 1 is prepared for the substrate that can be carried out. When the control unit RBC3 of the transport robot 22 receives the notification, it controls the substrate on which the arm is picked up. Furthermore, in the case of such notices, the tea photos are included in the "priority order" of each substrate information, and the priority board is determined. Further, the transport robot 22 is disposed in the main transport path MTR and the sub-98568.doc -23 - 1255501 transport path via the flow path 2, and the heart (4) RB (10) has the main transport path. However, there is a case where there is a board, and there is a base shape of the substrate. "The robot 22 transports the substrate transported to the downstream side to the rotating unit = processing device", and the substrate is moved by the difference of the different substrates. Fig. 3 and Fig. 4 are diagrams showing the postures of the substrates. The black dots on the surfaces of the non-angular substrates w in Fig. 3 and the second substrate are used to sequentially transport the substrates. The position of W is easy to understand and indicates the position corresponding to each other. As shown in Fig. 3, the substrate is transported by the sub-transport STR2, and the substrate is delivered to the transfer robot 21 in the direction without the black dot. The center is rotated by 9G. The hand is transferred to the buffer zone. The substrate is then picked up by the transport robot 22 and rotated 9G around the point Q. It is transported to the rotating unit 60. Therefore, 'this (four)' rotating unit 6() The substrate % taken up is in a posture in which the end portion to which the black dot is not attached is the head before the transport direction. On the other hand, as shown in FIG. 4, the substrate W is transported by the main transport path Mtr, and The situation shown in Figure 3 is transferred to the base of the transport robot in the same direction. W is rotated 180 by the point p, and is sent to the peeling unit 5 1. The peeling unit 51 does not rotate the picked-up substrate in order, and carries it out to the transport robot. The peeling unit 51 processes the finished substrate... The robot is transported. The pick is rotated 180° around the point Q. It is transported to the rotating unit 6〇. Therefore, 98568.doc -24- 1255501 In this case, the posture of the substrate w taken by the rotating unit 6G is attached. In the substrate processing apparatus according to the present embodiment, the substrate processing apparatus of the present embodiment picks up the substrate by the control unit 80 of the rotating unit (9), and determines the basis of the substrate information received. In the case where the posture is in a specific posture, the substrate is rotated and transported to the inspection unit 70. That is, the rotation unit 6 接 picks up the substrate in the posture shown in FIG. 3, and the substrate is not rotationally conveyed to the inspection unit 7A. On the other hand, in the case where the substrate is unsatisfied in Fig. 4, it is in the same situation as that as viewed in Fig. 3. The substrate to be picked up is first rotated by 18 。 and then transferred to the inspection unit 7 〇. This, substrate processing equipment丨, it is possible to prevent the substrate that is carried out by the difference in the transport path from being different in safety. That is, the substrate that is delivered by the substrate processing apparatus 由于 does not need to consider the posture of the substrate of the post-process apparatus because all of the substrates are in the same state. The substrate that has been adjusted in the posture by the rotation unit 60 is transported to the inspection unit 7A, and after the document is specifically inspected, it is transported to the conveyor 31 to carry out the substrate processing apparatus. As described above, in the substrate processing apparatus of the present embodiment, The main transport path MTR includes a main transport path of the substrate loading/unloading processing unit (10) engraving unit 50 and the stripping unit 51), and a sub transport path S TR2 bypassing the special processing unit. By moving around the processing unit, the substrate can be reliably removed by the influence of the processing unit. Further, the sub-transport path STR1 can be disposed on the upper portion of the main transport path MTR to suppress the occupied area. Moreover, the transport paths 20 to 22 can be accessed by the transport robots 20 to 22, and the buffers 4〇 and 41 having the temporary storage and storage substrates can be absorbed in the plurality of substrates, and the transport paths of the 98568.doc -25-1255501 can be absorbed differently. The difference in delivery time. Further, for example, in the case where the processing unit is under maintenance, the substrate can be retracted from the upstream. Further, it is possible to realize the overtaking of the substrate by transferring the substrate or the like which is first transferred to the rear. In the buffer zone 41, the overtaking conveyance using the sub-transport path STR1 can be surely realized by accumulating the substrate which can have the maximum number of sheets N or more in the unit of the engraving unit 5'. In addition, the base of the line transfer path MTR is reversed, and the sub-transport path is available! In the case where the discharged substrate competes with the control unit 8G (the control unit is configured to preferentially process the substrate discharged from the main transport path MTR, it is possible to prevent the substrate from being transferred to the insect-injecting unit 50 from being forced to wait, and The above-mentioned processing is required for the substrate. In addition, the main material (4) is fed to the direction of (4), and the disk is oriented in the opposite direction to the specific direction, and the 彳 彳 彳 , , , , , , , , , STR STR STR STR STR STR In the middle of the return route, the substrate is removed, and the substrate can be transported by the substrate of the short sub-transporting path STR2. The substrate is transported by the substrate. The sub-transfer and the sub-transporting path STR2 temporarily accumulate the substrate. The first opening of the above-mentioned departure, and the buffer 4 λ-°°° of the buffer 412 of the first mouth of the returning path, ", must be set in the sub-transport path STR2 The mechanism for transporting the substrate to the sub-transporting path, and the door of the MTR and the sub-transporting path STR2 is made up of ice, ', ", and the arranging device. The buffer is provided, so that it can be provided with : Rotating means 6〇, set the base for surrender The substrate in the posture is rotated by the substrate processing method, and even if the substrate having the transport path different from 98568.doc -26 · 1255501 can be adjusted to be placed in the same posture, the substrate can be uniformly delivered. Further, in the substrate processing apparatus 1, the rotating unit 60 and the inspection unit 70 are processing units that cannot be bypassed, but the substrate processing apparatus 丨 can also have such a processing port σ. A single 兀. (Embodiment) In the first embodiment, the substrate processing apparatus includes an example of a plurality of processing units. The number of processing units may be one. Fig. 5 shows the substrate processing of the second embodiment constructed according to such a principle. The configuration of the device 2 and the path of the substrate are transferred. The substrate processing device 2 has the same functions as those of the substrate processing device according to the second embodiment, and the same reference numerals will be used, and description thereof will be appropriately omitted. The substrate processing apparatus 2 is provided with a buffer 42 instead of the buffer zone 41, and the conveyor 32 is disposed on the downstream side of the transporter 2 1. The main transport path MTR of the substrate processing apparatus 2 is In the same manner as the substrate processing apparatus i of the first embodiment, the substrate is placed at a position where the main transport path MTR and the sub transport path STR1 merge. The robot 2 1 ' does not have a path on the downstream side of the sub-transporting path STR2. Therefore, the control unit RBC2 of the transport robot 2 determines the transport path of the substrate to be picked up. However, the superimposed transport of the substrate or the adjustment transport is required. In the case of the time of the substrate, the picked-up substrate is transferred to the buffer 42 and the substrate is temporarily stored in the buffer 42. The buffer 42 is not 98568.doc which is opened on both sides as in the buffer 4 of the first embodiment - The 27-1255501 structure has a structure that is side-to-side with the buffer zone and can only be accessed by the transport robot 21. Further, the conveyor 32 carries out the substrate picked up by the transfer robot 2 from the substrate processing apparatus 2. The operation of the substrate processing apparatus 2 configured as described above will be briefly described. First, the two-dimensional barcode reader 10 reads the identification code to create the substrate information, and holds the substrate at a specific position. The transport robot 2 picks up the substrate, and as described in the first embodiment, determines the transport path of the substrate.

Specifically, the transfer robot 2b transports the substrate that needs to be processed to the UTR (m彳 unit 5〇), and transports the substrate that does not need to be processed to the sub-transport path STR1 (conveyor 3). The substrate conveyed to the main conveyance path MTR is inspected by the money engraving unit and delivered to the transfer robot 21. On the other hand, the transfer to the job light #^ The earth plate leads to the exit side of the conveyor 30, and then transfers it to the transfer robot magic transfer robot, and transfers the picked substrate to the buffer g 42' or transports the substrate to the transport. Machine 32.

As described above, in the substrate processing apparatus 2 of the second embodiment, the substrate processing apparatus according to the first embodiment can be obtained even if the processing unit is one. The same effect 1 ' can be excluded for the substrate without the (four) engraving. In this case, the substrate processing apparatus 2 functions as a transport apparatus that transports the substrate to the position of the substrate. <3. Third Embodiment> The embodiment will be described as an example in which one or two sub-transport paths are processed by a substrate, and a plurality of transport paths may be used. Fig. 6 is a view showing the configuration of the substrate device 98568.doc -28-1255501 and the substrate transfer path in the third embodiment which is constructed according to such a principle. The substrate processing apparatus 3 has a configuration that is substantially the same as that of the substrate processing apparatus 1, and the same reference numerals are used, and description thereof will be appropriately omitted. The substrate processing apparatus 3 is provided as a processing unit for processing the substrate, and includes etching electrodes 52 and 54 and a peeling unit 53. The substrate processing apparatus 3 of the present embodiment includes an aluminum etching machine as an etching unit 52 and a chrome etching machine as an etching sheet.

The crucible 54 is configured as a processing unit in which each of the etching units 52 and 54 is etched using a dissimilar chemical liquid. X

s sub-transport path STR3, mainly bypassing the transport path of the etching unit 52, the field iJ transport path STR4, mainly bypassing the transport path of the stripping unit brother, and the sub-path STR5 is 'mainly bypassing the surname unit 54 Road. The conveyors 33 to the trains constituting the sub-transport paths STR3 to STR5 have the same In the embodiment, the conveyor 3 is transported to the exit side by the substrate that is transferred to the inlet side, and is transferred to the transfer robot (each transfer robot U, Μ, 26) on the f side and the exit side:

Further, each of the conveyors 33 to 35 is disposed in the same manner as the conveyor 30 of the first embodiment, and is disposed in the same two-layer structure as that of the conveyor 30 in the first embodiment. The r area 43 44 has the same function and structure as the buffer area 4, and can be accessed only by the respective transfer robots 23 and 26. X, buffer Μ, structure As in the buffer 41 of the i-th embodiment, the transport apparatuses arranged on both sides are accessible. However, the buffer zone 41 is not only used as a buffer for bypassing the processing unit, but also constitutes the same structure as the transport robot 2〇. 98568.doc -29- 1255501 The transport robot 23 picks up the substrate from the STR3 (conveyor 33) by the main transport path MTR (etching unit 52) or the sub-transport path, and determines the transport path based on the board information of the board to be picked up. The substrate on which the main transport path MTR is the transport path is transported to the peeling unit 53 , and the substrate on which the sub transport path STR 4 is the transport path is transported to the conveyor 34 . The transport robot 24 picks up the substrate from the main transport path MTR (peeling unit 53) or the sub transport path STR4 (conveyor 34), transports the picked-up substrate to the buffer area 4, and transports the robot 24, and does not need to transport the substrate. The transfer path. The transport robot 25' picks up the substrate from the buffer zone 41, determines the transport path of the picked-up substrate, transports the substrate with the main transport path MTR as the transport path, and uses the sub transport path #STR5 as the transport path. The substrate is transferred to the conveyor 35. The transport robot 2 6 picks up the substrate from the main transport path MT R (10) engraving unit 5 4 ) or the sub-transfer = diameter STR 5 (conveyor 35), and transports the picked-up substrate to the inspection, and the transfer robot 26 does not need to be transported. The substrate is transported by. As described above, the substrate processing apparatus 3 having the sub-transporting paths more than the substrate processing apparatuses 丨, 2 shown in the above embodiments can obtain the same effects as those of the substrate processing apparatuses 1 and 2 which are described above. <4. Fourth embodiment> In the above embodiment, the sub-transporting path is described in which the substrate is transported only in the w direction, but the function of the sub-transporting path is not limited thereto. Fig. 7 is a view showing the configuration of the substrate of the fourth embodiment which is not constructed according to such a principle. 98568.doc -30-1255501 The configuration of the device 4 and the substrate transport path. In the configuration of the substrate processing device 4, the same functions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be appropriately omitted. The substrate processing apparatus 4 is provided as a processing unit for processing the substrate, and includes a money engraving unit 55 and a peeling unit 56. The transport robot 27 can access the position of the two-dimensional barcode reader ι, the transport, the buffer 45, and the etching unit 55 (shown in solid lines in FIG. 7 as the "input position" The position of the transportable conveyor 3, the buffer_zone 46, and the stripping unit 56 (the position indicated by a broken line in Fig. 7, hereinafter referred to as the "lifting position") is moved. The conveyor 36 is configured to transfer the substrate in the right and left direction of Fig. 7 by switching the drive mechanism for transporting the substrate forward and backward. In the following, the operation of the substrate processing apparatus 4 will be described in the following, and the substrate processing unit 4 performs the processing (etching and peeling processing) on the substrate, and the substrate is transported in the main transport path MTR. For the substrate to be etched only, the transfer robot #27 at the input position picks up the substrate by the two-dimensional barcode reader 1 and transports it to the main transport path MTR (surname unit 55). Then, when the processing of the money engraving unit 55 is completed, the field substrate is carried out by the transport unit 5 8 by the etching unit 5 5 and transported to the sub transport path STR6 (conveyor 36). The substrate that has been transported to the sub-transporting path STR6 is transported in the left-hand direction of FIG. 7 by the conveyor %, and is taken out by the transport robot 27. The transfer robot 27 that picks up the substrate from the sub-transport path moves to the carry-out position to transfer the substrate. Transmitter 3 1. In this manner, the substrate transferred to the conveyor 3 is transported by the conveyor 98568.doc -31 - 1255501, and the processing by the substrate processing apparatus 4 is terminated. The other surface is transferred to the sub-transport path STR6 (conveyor 36) for the substrate on which only the peeling treatment is performed. The substrate sent by Z to the sub-transporting path STR6 is transported to the right in Fig. 7, and taken out by the machine S28. The substrate transporter port 28 is picked up by the sub transport path coffee, and the substrate is transported to the buffer zone 41. The substrate moved to the (four) zone 41 is taken out by the transfer robot π, transported to the off-cell 56, and stripped by the peeling process unit (10). When the field processing is completed, the transfer robot 27 moves to the carry-out position, and the substrate is carried out by the peeling unit 56 and delivered to the transport scent. In this manner, the substrate that has been transferred to the conveyor 31 is transported by the substrate processing apparatus 4 by the conveyor 31, and the substrate processing apparatus 4 is processed in winter. The general engraved unit 55' includes: a cleaning device, a surname device, and a post device, arranged in a specific direction. Further, the peeling unit 56 similarly includes a plurality of devices such as a cleaning device, a peeling device, and a drying device, and is arranged in a specific direction. Therefore, the unit (45) and the stripping unit %' are units that can only pick up the substrate from a specific direction. Then, usually, the devices are arranged so that the substrate can be processed along the main transport path shown in Fig. 7, so that the substrate can be picked up only in the substrate transport direction of the main transport path. Therefore, even if the substrate subjected to the (fourth) processing is moved to the carry-out position, the transfer robot can be transported to the peeling unit 56. However, in the substrate of the present embodiment, the substrate can be transported in the above-described manner, and the substrate can be transported as described above. Even if the substrate is subjected to the peeling treatment, the substrate can be removed without passing through the etching unit 55. deal with. 98568.doc -32-1255501 As described above, in the substrate processing apparatus 4 of the fourth embodiment, the same effects as those of the substrate processing apparatuses 丨 to 3 of the above-described embodiment can be obtained. Further, by the fact that the conveyor constituting the sub-transporting path STR6 has the function of transporting the substrate in both directions, even if two processing units are selected, it is necessary to provide an individual sub-transporting path, which simplifies the apparatus configuration. In addition, a transfer buffer (a buffer similar to the buffer 41) may be provided between the transfer robot and the transfer robot 27 at the position indicated by the broken line in Fig. 7 . The composition. The mechanism of the robot 27 and the buffer "Μ" can be added to the heart. <5·Modifications> However, the present invention is not limited to the above

The embodiment of the present invention has been described above. The number of various types of deformation processing units in the embodiment is not limited to the one of the plural processing units that are connected, for example, 'one bypassed by one sub-transport path'. It can also be configured to be bypassed at the same time. The conventional program and the time course of the substrate are not in the above-described embodiments, and other control methods may be employed for the processing of the substrate. In the above-mentioned embodiment, the county is set to 1 to 4, and the sub-transport path and the path are both described in a two-layer structure. However, the sub-transport path may be provided at a position substantially equal to the height of the main transport path. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a path of a substrate processing apparatus board according to the present invention. 98568.doc -33 - 1255501 Fig. 2 is a view showing the structure of a buffer having openings on both sides. Fig. 3 is a view showing the posture of the substrate in the case where the substrate is transported by the sub-transport path. Fig. 4 is a view showing the posture of the substrate in the case where the substrate is transported by the main transport path. Fig. 5 is a view showing a configuration of a substrate processing apparatus according to a second embodiment of the present invention and a path of a substrate to be transported. Fig. 6 is a view showing a configuration of a substrate processing apparatus according to a third embodiment of the present invention and a path of a substrate to be transported. Fig. 7 is a view showing a configuration of a substrate processing apparatus according to a fourth embodiment of the present invention and a path of a substrate to be transported. [Main component symbol description] 1, 2, 3, 4 substrate processing apparatus 10 one-dimensional barcode reader 20 to 29 transport robot 30, 32 to 36 conveyor 31 conveyor 40, 42 to 46 buffer 41 buffer 411, 412 Openings 50, 52, 54 , 55 Etching unit (processing unit) 51 , 53 , 56 Stripping unit (processing unit ) 60 Rotating unit ( rotating means ) 70 Inspection unit 98568.doc 34- 1255501 80 Control unit (path determination means Control means) VCRC control unit RBC1, RBC2, RBC3 Control unit MTR Main transport path STR1 to STR6 Sub-transport path

98568.doc -35-

Claims (1)

1255501 X. Patent application scope: 1 · A substrate processing device, which throws λ々A^ /, the substrate you put into the input, is characterized by: at least one processing unit, which is specific to the substrate The main transport path is configured to carry the substrate into and out of the processing unit; the transport path bypasses the processing unit; and the transport unit is coupled between the main transport path and the sub transport path a path determining means for selecting the substrate to be loaded to be transported by the main transport path, or transporting the substrate by the sub transport path, and determining a transport path of the substrate; and a technical means for determining the path by the path The transport path of the substrate is determined to control the transport means. 2. The substrate processing apparatus according to claim 1, wherein the transport means is a transport robot that can elevate and transport the substrate in the vertical direction, and the sub transport path is disposed above the main transport path. The substrate processing apparatus according to claim 1, further comprising: a buffering means for transferring the substrate between the transfer means and temporarily storing the substrate. 4. The substrate processing apparatus according to claim 3, wherein the buffer means stores a substrate which can be simultaneously present in the processing unit in a maximum number of sheets or more. 5. The substrate processing apparatus of claim 1, wherein 98568.doc!2555〇l: the substrate processing apparatus is loaded with a plurality of substrates:::: the substrate discharged by the path and the reverse of the sub-transport path The above-mentioned control means preferentially processes the substrate discharged by the above-mentioned main moving path. 6. The substrate processing apparatus according to claim 1, wherein the main transport path is connected and provided with a path to a specific direction and a circuit opposite to the specific direction; and the sub-transfer sequence + μ is taken from the path of the path. The above substrate is paid on the way of the above circuit. The substrate processing apparatus according to claim 6, wherein the sub-transporting path temporarily stores the substrate, and is provided with a first opening portion facing the outward path and a buffer opening 8 facing the second opening portion of the circuit. In the substrate processing apparatus, the sub-transporting path can transport the substrate in both directions. The substrate processing apparatus according to the item 1, wherein the substrate processing apparatus further includes a rotation means for rotating the substrate paid by the substrate processing apparatus so as to be in a specific posture. The substrate processing apparatus according to claim 1, wherein the processing unit performs processing on the substrate to be transported with a specific processing liquid. 98568.doc