CN1655322A - Substrate treating apparatus - Google Patents
Substrate treating apparatus Download PDFInfo
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- CN1655322A CN1655322A CNA2005100068984A CN200510006898A CN1655322A CN 1655322 A CN1655322 A CN 1655322A CN A2005100068984 A CNA2005100068984 A CN A2005100068984A CN 200510006898 A CN200510006898 A CN 200510006898A CN 1655322 A CN1655322 A CN 1655322A
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- substrate
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- board treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides a substrate treatment apparatus by which the influence of a treatment unit for carrying out prescribed treatment is reliably removed from a substrate which does not require the prescribed treatment. As the carrying paths of the substrate, the substrate treatment apparatus 1 is provided with a main carrying path MTR via an etching unit 50 and a peeling unit 51, a sub carrying path STR1 (conveyer 30) by-passing the etching unit 50, and a sub carrying path STR2 (buffer 41) by-passing the peeling unit 51. In addition, the substrate treatment apparatus 1 is provided with a carrying robot 20 or 22 for receiving and delivering the substrate between the main carrying path MTR and the sub carrying paths STR1 and STR2. For example, the substrate which is not to be etched is by-passed to carry the etching unit 50 by selecting the sub carrying path STR1 by a control unit 80 and carrying the substrate to the conveyer 30 by the carrying robot 20.
Description
Technical field
The present invention relates to a kind of substrate board treatment that when getting rid of the inner influence of processing unit that has, transports substrate to substrate.
Background technology
Proposed a kind of scheme of substrate board treatment in the prior art, in substrate manufacturing process, the processing unit that a succession of processing is carried out in the path setting that transports along substrate transports the path along this and transports substrate, is handled by those processing units simultaneously.For example, patent documentation 1 is being put down in writing this substrate board treatment.
In patent documentation 1 in the substrate board treatment of record, substrate transport only one in path, all substrates all use identical path to transport.Thereby, even want to get rid of the substrate (not carrying out the substrate of this processing) of the processing that the particular processor unit of transporting on the path carries out, also must be transported to this processing unit.At this moment, in existing substrate board treatment, transported the processing unit of not wishing the substrate handled, this substrate is not handled and transported, thereby prevented that substrate is not had the predetermined processing of not wanting.
But, there was such problem in the former device, since promptly be transported in the processing unit, then be difficult to the complete non-processor of substrate not to be processed is transported.For example, in the processing unit of the wet processed of carrying out soup, inner transport portion or adhesion has soup, or become the high state of solvent composition concentration of internal environment.When substrate being transported in such processing unit, transport substrate even do not carry out the processing of processing unit itself, also have because soup and problem that the substrate that does not originally need to handle is exerted an influence.
And when even one of them of transporting processing unit on the path can not be transported substrate, all substrates all become can not shipping situation, has at the unnecessary substrate that carries out the processing of this processing unit also to produce the problem of this influence.
Summary of the invention
The present invention makes in view of the above problems, and its purpose is to provide a kind of substrate board treatment, for the substrate that does not need predetermined process, can reliably get rid of the influence of the processing unit generation of carrying out this predetermined processing.
In order to address the above problem, the invention of (1) is that a kind of substrate board treatment is handled the substrate that is dropped into, and it is characterized in that having: at least 1 processing unit that substrate is carried out predetermined process; The master who substrate is transported into, transports above-mentioned processing unit transports the path; Walk around the pair of above-mentioned processing unit and transport the path; Transport the conveyer that path and above-mentioned pair are transported handing-over substrate between the path above-mentioned master; Device is determined in the path, and its selection is to transport the path or transport the path by above-mentioned pair and transport the above-mentioned substrate that is dropped into by above-mentioned master, determines the path of transporting of aforesaid substrate; Control device, it controls above-mentioned conveyer corresponding to the path of transporting of being determined aforesaid substrate that device is determined by above-mentioned path.
In addition, the invention of (2) is,, it is characterized in that above-mentioned conveyer is the transportation manipulator that can transport substrate on above-below direction in the lifting as (1) described substrate board treatment, and above-mentioned pair is transported path configurations is transported the path above-mentioned master top.
In addition, the invention of (3) is,, it is characterized in that also having the buffering storage facility as (1) described substrate board treatment, its can and above-mentioned conveyer between carry out the handing-over of substrate, temporarily accumulate substrate simultaneously.
In addition, the invention of (4) is, as (3) described substrate board treatment, it is characterized in that, above-mentioned buffering storage facility can be accumulated in the above-mentioned processing unit can simultaneous maximum numbers or the substrate of its above number.
In addition, (5) invention is, as (1) described substrate board treatment, it is characterized in that, in the aforesaid substrate processing unit, drop under the situation of a plurality of substrates, and transporting the substrate of discharging in the path from above-mentioned master and when above-mentioned pair was transported the substrate of discharging in the path and clashed, above-mentioned control device priority treatment was transported the substrate that discharge in the path from above-mentioned master.
In addition, (6) invention is, as (1) described substrate board treatment, it is characterized in that, it is to be connected with rightabout return road towards the afore mentioned rules direction towards the outlet of prescribed direction and to be set up in parallel that above-mentioned master transports the path, above-mentioned pair is transported the midway reception substrate of path from above-mentioned outlet, sends aforesaid substrate midway in above-mentioned return road.
In addition, the invention of (7) is, as (6) described substrate board treatment, it is characterized in that, it is buffer store that above-mentioned pair is transported the path, and it also is provided with the 1st peristome of facing above-mentioned outlet and the 2nd peristome of facing above-mentioned return road when temporarily accumulating substrate.
In addition, the invention of (8) is, to it is characterized in that above-mentioned pair is transported the path can transport substrate as (6) described substrate board treatment on twocouese.
In addition, the invention of (9) is,, it is characterized in that also having whirligig as (1) described substrate board treatment, and it makes the substrate rotation of sending from the aforesaid substrate processing unit form the posture of regulation.
In addition, the invention of (10) is, to it is characterized in that above-mentioned processing unit is handled by predetermined process liquid transporting next substrate as (1) described substrate board treatment.
In (1) to (10) described invention, by selecting is to transport the path or transport the path by pair and transport the substrate that is dropped into by main, determine the path of transporting of substrate, thereby, walk around processing unit and transport for the substrate that does not carry out the processing of processing unit.Thereby, can in the influence of getting rid of processing unit reliably, transport substrate.
In (2) described invention, pair is transported the path and is configured in main top of transporting the path, so can suppress area occupied.
In (3) described invention, by also have can and conveyer between carry out the handing-over of substrate, simultaneously temporarily accumulate the buffering storage facility of substrate, it is poor to absorb the shipping time that causes because of the difference of transporting the path in a plurality of substrates.For example, when processing unit is in the maintenance, substrate is made a concession.And then transporting surmounting of substrate of can realizing in advance to transport at the substrate that drop into the back etc.
In (4) described invention, can accumulate in the processing unit by the buffering storage facility can simultaneous maximum numbers or the substrate of the number more than it, transport thereby can realize using pair to transport surmounting of path reliably.
In (5) described invention, by in substrate board treatment, dropping under the situation of a plurality of substrates, and transporting the substrate of discharging in the path and when pair is transported the substrate of discharging in the path and clashed from main, priority treatment is from the main substrate that transports the path discharge, thereby the substrate that is transported in the processing unit is waited for, so can prevent from this substrate is carried out processing more than the necessary number of times.
In (6) described invention, transport the path from the main substrate of reception midway that transports the outlet in path by pair, main return road of transporting the path send substrate midway, shorten thereby the secondary substrate that transports the path transports distance.So transporting the substrate that transports in the path by pair can transport at a high speed.
In (7) described invention, it is buffer store that pair is transported the path, and it also is provided with in the face of the 1st peristome in outlet with in the face of the 2nd peristome in return road when temporarily accumulating substrate, does not transport the structure of transporting substrate on the path so do not need to be arranged on pair.Need not transport buffer store is set between the road in addition in main path and the pair of transporting.Thereby, apparatus structure is oversimplified.
In (8) described invention, pair is transported the path can transport substrate on twocouese, so the secondary path of transporting is not only as the path of transporting of walking around the processing unit that is configured on the outlet, and, also can be also used as the path of transporting of walking around the processing unit that is configured on the return road.
In (9) described invention, have and make the substrate rotation of sending from substrate board treatment form the whirligig of the posture of regulation, so, send after also being adjusted into identical posture even transport the different substrate in path.Thereby, can unify the posture of the substrate sent.
In (10) described invention, processing unit is handled by predetermined process liquid transporting next substrate, so compared with former device, can get rid of the influence of processing unit especially effectively.
Description of drawings
Fig. 1 is the structure of expression substrate board treatment 1 of the present invention and transports the view in the path of substrate.
Fig. 2 is the view of structure that the expression two sides has the buffer store of peristome.
Fig. 3 is that the explanation substrate transports the view of the substrate posture of path when transporting in pair.
Fig. 4 is the explanation substrate at the main view that transports the substrate posture of path when transporting.
Fig. 5 be expression the 2nd form of implementation substrate board treatment structure and transport the view in the path of substrate.
Fig. 6 be expression the 3rd form of implementation substrate board treatment structure and transport the view in the path of substrate.
Fig. 7 be expression the 4th form of implementation substrate board treatment structure and transport the view in the path of substrate.
Embodiment
Below, the best form of implementation that present invention will be described in detail with reference to the accompanying.
1, the 1st form of implementation
Fig. 1 is the structure of expression substrate board treatment 1 of the present invention and transports the view in the path of substrate.Substrate board treatment 1 has check code reader (ベ リ コ one De リ one ダ) 10, transportation manipulator 20～22, conveyer belt 30,31, buffer store (バ ッ Off ア) 40,41, etching unit 50, separative element 51, rotary unit 60, inspection unit 70 and control part 80.
In Fig. 1, transportation manipulator 20,21 is expressed as side view.Conveyer belt 30 and etching unit 50 be with same plane diagram arranged side by side, but in fact conveyer belt 30 is configured in the top of etching unit 50, and these have formed the structure of 2 layers of structure.By such configuration conveyer belt 30, substrate board treatment 1 can prevent the increase of area occupied.
For illustrated convenience, Fig. 1 only illustrates 1 control part 80, but in fact substrate board treatment 1 has the control part 80 that each formation such as check code reader 10, transportation manipulator 20～22 can be moved by one's own efforts.Those a plurality of control parts 80 interconnect by not shown cable, when the information of being undertaken by communication is transmitted, can control each independently and constitute.Below, especially the control part 80 with verification code reader 10 is called control part VCRC, and the control part 80 of transportation manipulator 20～22 is called control part RBC1～RBC3, with the suitably difference and describing of other control parts 80.
In Fig. 1, the path of representing with solid arrow is that the master transports path MTR, and the path of representing with dotted arrow is that pair is transported path STR1, STR2, that is, the substrate board treatment 1 of this form of implementation has 2 pairs to transport path STR1, STR2.
1.1, the main path of transporting
The substrate that check code reader 10 will be put into substrate board treatment 1 remains on the position that transportation manipulator 20 receives.Not shown optical system reads in the cognizance code (check code (Veri Code)) that prints on this substrate assigned position.And according to the cognizance code that is read, control part VCRC makes information substrate.So-called information substrate is the general name of the information made at each substrate, for example, is made of substrate identifier, a plurality of information of handling resume, predetermined processing, priority etc.
Control part VCRC sends to the information substrate of making the control part RBC1 of transportation manipulator 20 in the moment that the action that substrate is remained on assigned position is finished.
Particularly because secondary transporting in the movable range that path STR1 is arranged on transportation manipulator 20,21, transportation manipulator 20,21 can transport and joins substrate between the STR1 of path in main path MTR and the pair of transporting.Equally, because secondary transporting in the movable range that path STR2 is arranged on transportation manipulator 21,22, transportation manipulator 21,22 can transport and joins substrate between the STR2 of path in main path MTR and the pair of transporting.
As described above, transportation manipulator 21～22 is owing to having elevating mechanism, so also can transport substrate on above-below direction.Thereby as the substrate board treatment 1 of this form of implementation, pair is transported path STR1 and is arranged on main top of transporting path MTR, even those are situations of 2 layers of structure, also can join substrate.
Which substrate which each transportation manipulator 20～22 regularly receive at, which the substrate that receives is transported to transports the destination, and by control part RBC1～RBC3 decision, the back is described in detail.
1.2, pair transports the path
Pair is transported path STR1 and is passed through conveyer belt 30 up to the path of transportation manipulator 21 from transportation manipulator 20, and main composition is to walk around the path of etching unit 50.Transport the substrate that path STR1 transports by pair,, be not transported to etching unit 50 during transporting from substrate board treatment 1 (conveyer belt 31).That is, it is not simple because transport the reason of configuration design in path or the reason of the situation of processing sequence that pair is transported path STR1, STR2, and the path that is provided with in order temporarily to avoid specific unit.
Pair is transported path STR2 and is passed through buffer store 41 up to the path of transportation manipulator 22 from transportation manipulator 21, and main composition is to walk around the path of separative element 51.That is, transport the substrate that path STR2 transports, in substrate board treatment 1, also be not transported to separative element 51 later on, and transport from substrate board treatment 1 by pair.
Fig. 2 is the side view of expression buffer store 41 and transportation manipulator 21,22.Buffer store 41 and buffering container 40 have a plurality of shelves that keep substrate in inside equally.In the side of buffer store 41, be provided with to a plurality of peristomes 411 of transportation manipulator 21 (main transport path MTR outlet side) opening with to a plurality of peristomes 412 of transportation manipulator 22 (main return road side of transporting path MTR) opening.
That is, each shelf of buffer store 41 can carry out being transported into and transporting of substrate by any of transportation manipulator 21 and transportation manipulator 22.Thereby, transporting the substrate that is transported into by transportation manipulator 21 by transportation manipulator 22, buffer store 41 has the function of transporting path STR2 as the pair of walking around separative element 51.
1.3, action specification
One example of action of the substrate board treatment 1 of this form of implementation with such formation then, is described.
At first, when dropping into substrate in substrate board treatment 1, check code reader 10 reads the identifier of this substrate and makes information substrate, simultaneously this substrate is remained on assigned position.The control part VCRC of check code reader 10 sends the information substrate of this substrate to the control part RBC1 of transportation manipulator 20, thus the receivable form of transferring substrates.
When the control part RBC1 of transportation manipulator 20 receives information substrate from control part VCRC,, determine the path of transporting of substrate that this information substrate is represented according to the information substrate that is received.For example, according to the information that is comprised in the information substrate, judge the processing of whether this substrate being scheduled to etching unit 50 about " predetermined processing ".According to this result of determination, for the substrate of the processing of being scheduled to etching unit 50, select the main path MTR that transports, the master is transported the path of transporting that path MTR is defined as this substrate.On the other hand,, select pair to transport path STR1, pair is transported the path of transporting that path STR1 is defined as this substrate for the substrate that does not have predetermined this processing.
As the reception destination of the substrate of transportation manipulator 20, there are check code reader 10 and buffering container 40.Thereby there is such situation: come the reception of the substrate of self-checking code reader 10 to require and the timing that the storage of storage in the buffer store 40 is transported to the downstream is clashed.At this moment, " priority " that is comprised in the information substrate of control part RBC1 with reference to each substrate, arm is transported in control, receives " priority " high substrate.In addition, if the substrate of identical " priority ", then arm is transported in control, the preferential substrate (being stored in the substrate in the buffer store 40) that drops into earlier that receives.But the control of transporting of substrate also is not limited to such situation.
Arm is transported in control part RBC1 control, and the main path MTR that transports is become the substrate that transports the path and is transported to etching unit 50, and pair is transported path STR1 to be become the substrate that transports the path and be transported to conveyer belt 30.Also there is the substrate that side is downstream transported temporarily to be transported to situation about accumulating in the buffer store 40.
Like this, be transported to the main substrate that transports path MTR by transportation manipulator 20 and carry out the soup processing, at the circuit forming surface figure by etching unit 50.
On the other hand, do not carry out the substrate of etch processes, be transported to pair with conveyer belt 30 and transport on the STR1 of path, walk around etching unit 50 and transport.Like this, in the substrate board treatment 1 of this form of implementation, the substrate (substrate of in other words, forbidding etch processes) that does not carry out etch processes is not transported to etching unit 50.Thereby, can reliably get rid of the influence that on such substrate, produces etching unit 50.
Also have, the unit that is bypassed can be the unit that carries out any processing.But, using soup to carry out in such unit, the etching unit 50 of wet processed, when transporting the substrate of the not imaginary soup that touches use, big to the influence of this substrate.Thereby, when as the substrate board treatment 1 of this form of implementation, having the unit that carries out wet processed, transport the path with pair the substrate that does not carry out this cell processing is walked around, effective especially.
Like this, as the substrate that does not carry out etch processes in the substrate of putting into substrate board treatment 1, can imagine that the stage of the coating resist before having for example in putting into substrate board treatment 1 applies bad substrate etc.That is, for being judged to be the bad substrate of coating, the circuitous pattern that forms certainly when carrying out etch processes is also bad.Thereby such substrate is handled with applying device after must removing coated resist again.Yet,, will carry out substrate after the etch processes and return to and handle again with being difficult because etch processes is the processing of etch substrate.Therefore, put in the substrate board treatment 1, do not carry out etch processes, only be judged to be the separating treatment that applies bad resist film, after transporting from substrate board treatment 1, apply processing again with separative element 51.That is, imagination with substrate board treatment 1 as the situation of the use of equipment again etc.
Control part RBC1 from receive the information of this unit state of expression at the determined control part 80 that transports the device (conveyer belt 30, etching unit 50) that is positioned at the downstream the path, transports substrate according to this information.For example, if etching unit 50 can not receive the state of substrate, then, temporarily be transported in the buffer store 40 and accumulate for transporting path MTR as the substrate that transports the path with main.Etching unit 50 becomes the state that receives substrate, when the control part of etching unit 50 requires to transport substrate, takes out these substrates from buffering container 40, is transported to etching unit 50.
Like this, because the substrate board treatment 1 of this form of implementation has buffer store 40, for example, when processing unit is in the maintenance, substrate is avoided.
Even etching unit 50 can not receive under the state of substrate, if the substrate that receives from check code reader 10 is to be transported to the substrate that pair is transported path STR1, then arm is transported in control part RBC1 control, and substrate is transported to conveyer belt 30.
In the device in the past, because irrelevant with the processing to substrate, transporting the path is one, so the unit that transports on the path is in the time of can not receiving the state of substrate, to become the state that whole substrates can not be transported to the downstream.Yet, the substrate board treatment 1 of this form of implementation, owing to make a part of two-wayization of transporting the path, for the substrate that does not carry out the processing of etching unit 50, the processing that do not stop can be transported path STR1 with pair and is transported to the downstream.That is,, can get rid of the influence of etching unit 50 treatment states for the substrate that does not need to carry out etch processes.
Can not use in etching unit 50 and can not recover the time etc., control part RBC1 is for determining that the main path MTR that transports as transporting the substrate in path, can change and transport the path, determines that pair transports path STR1 conduct and transport the path.That is, the substrate that can will put in the substrate board treatment 1 transports rapidly.Like this, because the control part RBC1 of transportation manipulator 20 determines the path of transporting of each substrate, thereby substrate board treatment 1 can be tackled according to various situations with adjusting to changed conditions.
Control part RBC1, when receiving the high substrate of relative importance value, arm is transported in control, the high substrate of this relative importance value is preferentially transported, simultaneously, the information substrate of this substrate is sent to the control part RBC2 of transportation manipulator 21, thereby the advisory that will transport preferential substrate is given control part RBC2.Thus, in the downstream, preferential substrate is also than other substrate priority treatment.
When the processing of etching unit 50 finished, the control part 80 of etching unit 50 was by sending the information substrate of the substrate of processing end to transportation manipulator 21, and the substrate that can transport in the notice etching unit 50 all set.The control part 80 of conveyer belt 30 has arrived stage of conveyer belt 30 outlet sides at the substrate that transports, and sends to transportation manipulator 21 by the information substrate with this substrate, and the substrate that notice can transport all set.
The action of the transportation manipulator 21 when receiving such notice (substrate transports requirement) and the action of transportation manipulator 20 are roughly the same, but take place from the notice of conveyer belt 30 and the situation of coming the notice of self etching unit 50 almost to carry out simultaneously.At this moment, the control part RBC2 of transportation manipulator 21 makes the notice of self etching unit 50 preferential.
That is, when the requirement in conveyer belt 30 and etching unit 50 clashed, transportation manipulator 21 will preferentially be transported than the substrate that is kept by conveyer belt 30 by the substrate that etching unit 50 keeps.Carry out between the substrate that such priority treatment is also accumulated in substrate that the processing of etching unit 50 finishes and buffering container 41.At this moment, arm is transported in control part RBC2 control, the preferential substrate that is kept by etching unit 50 that receives.
Thus, the substrate board treatment 1 of this form of implementation can prevent because substrate is parked in the etching unit 50, and produces the influence to the etch processes surplus of the substrates that exist in the etching unit 50 etc.
In substrate board treatment 1, it is separative element 51 that the selected master of control part RBC1 of transportation manipulator 21 transports path MTR, and it is buffer store 41 that pair is transported path STR2.The substrate that transportation manipulator 21 is received is transported to and mainly transports path MTR and secondary method of transporting path STR2 and secondary situation of transporting path STR20 is roughly the same.
That is, control part RBC2 is with reference to " priority " that comprised in the information substrate, thereby accumulates the low substrate of priority in the substrate that clashes in buffer store 41, and the substrate that priority is high is transported to the downstream earlier.That is, substrate board treatment 1 is owing to have buffer store 41, so transporting surmounting of substrate of can realizing that the back substrate of input transports earlier etc.
Particularly when the control part RBC1 from transportation manipulator 20 receives the notice that preferential substrate exists (at that time, in etching unit 50, exist N to open substrate at most), control part RBC1 will be from the etching unit 50 substrates that receive be transported to the buffer store 41 no matter it transports the path and accumulate.And, in the moment in that preferential substrate arrives, make this preferential substrate have precedence over the substrate of in buffer store 41, accumulating and be transported to the downstream.Like this and since buffer store 41 can keep can be in etching unit 50 substrate of simultaneous maximum number N or the number more than it, so substrate board treatment 1 also can surmount reliably and transport for transporting the substrate that transport in the path identical.
In substrate board treatment 1, pair is transported path STR2 and is made of buffer store 41.That is, pair is transported path STR2 and is not only substrate is transported to the mechanism that the downstream is used, and is also used as and accumulates the mechanism that substrate is used.Thereby the substrate that needs identification to be transported to buffer store 41 is to transport substrate (with the suitable substrate of substrate that is transported to conveyer belt 30 by transportation manipulator 20) that path STR2 transports, or only accumulate and the substrate (with the suitable substrate of substrate that is transported to buffer store 41 by transportation manipulator 20) waited in order by pair.
The control part RBC2 of the substrate board treatment 1 of this form of implementation, at the substrate of only in buffer store 41, accumulating, the control part RBC3 of transportation manipulator 22 is not carried out substrate transport requirement, only carry out this substrate and transport requirement at transporting substrate (said so in more detail and transported substrate regularly) that path STR2 transports by pair.And, only be configured in pair and transport the control part RBC3 of the transportation manipulator 22 in STR2 downstream, path and received the substrate that substrate transports requirement and received and transport from buffering container 41.Thus, control part RBC3 does not receive the substrate that substrate transports requirement and continues to be accumulated in the buffer store 41, for example, prepares this substrate is transported to main when transporting path MTR at transportation manipulator 21, can receive these substrates from buffering container 41.
In the substrate board treatment 1, transporting the substrate of path MTR (etching unit 50) via the master and transporting via pair between the substrate of path STR1 (conveyer belt 30), it is poor to produce on the shipping time.Thereby, even can imagine and not wish to carry out the surmounting when transporting of substrate, by short transporting the substrate that transports in the path and also can surmount of shipping time by the long situation of transporting the substrate that transports in the path of shipping time., the substrate board treatment 1 of this form of implementation even the substrate that drop into the back under such situation arrives transportation manipulator 21 earlier, by accumulating this substrate in buffer store 41, thereby can absorb because of transporting the poor of shipping time that the path difference causes.Thereby for example, if comprise the information of transporting that keeps in line in the information substrate, then substrate board treatment 1 can be observed the order that drops into and be discharged substrate.
Like this, be transported to the main substrate that transports path MTR, carry out separating treatment by separative element 51 with transportation manipulator 21.Be transported to pair and transport the substrate of path STR2, walk around separative element 51 and be transported to the downstream, so can get rid of the influence of the processing of separative element 51.
When the processing of separative element 51 finished, the control part 80 of separative element 51 was by sending the information substrate of handling the substrate that is through with to transportation manipulator 22, and the substrate that notice can transport in separative element 51 all set.In addition, the control part RBC2 of transportation manipulator 21, by pair being transported the stage of path STR2 as the substrate that transports the path with buffer store 41 handing-over, send the information substrate (be equivalent to send substrate and transport requirement) of this substrate to the control part RBC3 of transportation manipulator 22, thereby the substrate that notice can transport all set in buffer store 41.
Receive these whens notice, arm is transported in the control part RBC3 control of transportation manipulator 22, receive ready substrate.When these notices clash, in " priority " that in reference to each information substrate, comprises etc., the preferential substrate that receives of decision.Transportation manipulator 22 is configured in main transport path MTR and secondary transporting on the position that path STR2 converges, but because only exist in the downstream and mainly to transport path MTR, so the unnecessary path of transporting of determining the substrate that received of control part RBC3.But, when having the substrate that should preferentially transport etc., the situation that this substrate is transported to temporary transient standby in the buffer store 41 is arranged than substrate from separative element 51 receptions.
The substrate that transportation manipulator 22 will be transported to the downstream is transported in the rotary unit 60.
In the substrate board treatment 1,,, produce the different situation of each substrate posture because it transports the difference in path because transport substrate in the different paths of transporting.Fig. 3 is the different plane graph of the posture of these substrates of explanation with Fig. 4.In Fig. 3 and Fig. 4, the stain of each square substrate W surface expression is represented corresponding mutually same position, so that the posture of each substrate W that easy to understand transports successively.
As shown in Figure 3, substrate W being transported to pair when transporting path STR2, with not joining substrate W to transportation manipulator 21 as the front with the direction of stain, is the center half-twist with a P, is transported to buffer store 41.This substrate W is received by transportation manipulator 22, is the center half-twist with a Q, is transported to rotary unit 60.Thereby at this moment, the substrate W that rotary unit 60 receives becomes and will not have the posture of stain one side's end as the front of carriage direction.
On the other hand, as shown in Figure 4, substrate W being transported to main when transporting path MTR, giving the substrate W of transportation manipulator 21 with identical with situation shown in Figure 3 towards handing-over, is center Rotate 180 ° with a P, is transported to separative element 51.Separative element 51 does not rotate the substrate that is received, and handles in order, transports to transportation manipulator 22.Handling the substrate W that is through with at separative element 51 and received by transportation manipulator 22, is center Rotate 180 ° with a P, is transported to rotary unit 60.Thereby at this moment, the posture of the substrate W that rotary unit 60 receives is to have the posture of stain one side's end as the front of carriage direction.
The substrate board treatment 1 of this form of implementation, the control part 80 by rotary unit 60 is judged the posture of this substrate according to substrate and the information substrate that received, rotates this substrate and is transported to inspection unit 70 after becoming the posture of regulation.That is, received with posture shown in Figure 3 under the situation of substrate at rotary unit 60, rotary plate not, and be transported to inspection unit 70.On the other hand, receiving under the situation of substrate 180 ° of substrates that rotation is received and after becoming the posture identical, be transported to inspection unit 70 with situation shown in Figure 3 with posture shown in Figure 4.
Thus, substrate board treatment 1 can prevent because of transporting the different different situations of substrate posture that transport that make in path.That is, the substrate of sending from substrate board treatment 1 all is identical posture, so the posture of the unnecessary consideration substrate of the device of back operation.
The substrate of having adjusted posture with rotary unit 60 is transported to inspection unit 70, after the inspection of accepting to stipulate, is transported to conveyer belt 31, transports from substrate board treatment 1.
As described above, because having the pair that the master that substrate was transported into, transported processing unit (etching unit 50 and separative element 51) transports path MTR and walk around those processing units, the substrate board treatment 1 of this form of implementation transports path STR1, STR2, transport by walking around processing unit, can in the influence of getting rid of processing unit reliably, transport substrate.
Pair is transported path STR1 owing to be configured in main top of transporting path MTR, so can suppress area occupied.
Owing to have buffer store 40,41, so in a plurality of substrates, can absorb the poor of shipping time of causing because of the difference of transporting the path with 20～22 accessible whiles of transportation manipulator, temporary transient memory substrate.In addition, for example when processing unit is in the maintenance, can substrate be avoided in the upstream.And that can realize that the substrate that drops into the back transports earlier etc. transports surmounting of substrate.
Transporting substrate that path MTR discharges and when pair is transported substrate that path STR1 discharges and clashed from main, control part 80 (control part RBC1) transports the substrate that path MTR discharges by priority treatment from the master, the substrate that is transported to etching unit 50 is waited for, can be prevented to carry out necessary above etch processes.
Main transport path MTR and connect, be set up in parallel towards the outlet of prescribed direction with towards the rightabout return road of prescribed direction, pair is transported the midway reception substrate of path STR2 from the outlet, send substrate in the return road, thereby the secondary distance of transporting of transporting the substrate of path STR2 shortens.Thereby, can transport at a high speed with pair and transport the substrate that path STR2 transports.
Pair is transported path STR2 and is when temporarily accumulating substrate, is provided with towards the 1st peristome 411 in outlet with towards the buffer store 41 of the 2nd peristome 412 in return road, so unnecessary setting is transported substrate to the secondary mechanism that transports path STR2.Owing to transport path MTR and pair is transported the unnecessary buffer store that is provided with in addition between the STR2 of path main, so apparatus structure is oversimplified.
Make the substrate rotation of sending from substrate board treatment 1 form the rotary unit 60 of the posture of regulation owing to have, so, send after also being adjusted to identical posture even transport the different substrate in path.Thereby, can unify the posture of the substrate sent.
In substrate board treatment 1, rotary unit 60 and inspection unit 70 are the processing units that can not walk around, but substrate board treatment 1 also can have such processing unit.
2, the 2nd form of implementation
In the 1st form of implementation, illustrated that substrate board treatment has the example of a plurality of processing units, but number of processing units also can be 1.
The formation of the substrate board treatment 2 of Fig. 5 the 2nd form of implementation that to be expression constitute according to such principle and transport the view in the path of substrate.In substrate board treatment 2, for the formation that has with the roughly the same function of the substrate board treatment 1 of the 1st form of implementation, use identical symbol, suitably omit explanation simultaneously.
Identical with the substrate board treatment 1 of the 1st form of implementation, be configured in the main path MTR that transports and transport the locational transportation manipulator 21 that path STR1 converges with secondary, be not provided with in the downstream and the secondary suitable path of path STR2 of transporting.Therefore, the control part RBC2 of transportation manipulator 21 does not determine the path of transporting of the substrate that received.But, carry out transporting surmounting of substrate time of transporting when adjusting at needs with substrate, the substrate that is received is transported to buffer store 42, in buffer store 42, temporarily accumulate this substrate.
If the action of the substrate board treatment 2 that constitutes like that more than the simple declaration at first, is read cognizance code and when making information substrate, this substrate is remained on assigned position at check code reader 10.Transportation manipulator 20 receives this substrate, as illustrating in the 1st form of implementation, determines the path of transporting of this substrate.
Specifically, transportation manipulator 20 will need the substrate of etch processes to be transported to the main path MTR (etching unit 50) that transports, and the substrate of not wanting etch processes is transported to pair transport path STR1 (conveyer belt 30).
Be transported to the main substrate that transports path MTR with etching unit 50 etch processes after, transportation manipulator 21 is given in handing-over.On the other hand, be transported to after pair transports the outlet side that the substrate of path STR1 arrives conveyer belt 30, transportation manipulator 21 is given in handing-over.
As described above, according to the substrate board treatment 2 of the 2nd form of implementation,, also can obtain the effect same with the substrate board treatment 1 of the 1st form of implementation even processing unit is 1.That is,, can get rid of the dizzy sound of etching unit 50 for the substrate of not wanting etch processes.At this moment, substrate board treatment 2 has the function that this substrate is transported to the conveyer that assigned position handles.
3, the 3rd form of implementation
In above-mentioned form of implementation, illustrated that substrate board treatment has 1 or 2 pairs and transports the example in path, but secondary quantity of transporting the path also can be more.
The formation of the substrate board treatment 3 of Fig. 6 the 3rd form of implementation that to be expression constitute according to such principle and transport the view in the path of substrate.In substrate board treatment 3, for the formation that has with substrate board treatment 1 said function of the 1st form of implementation, in addition identical symbol suitably omits explanation.
Substrate board treatment 3 has etching unit 52,54 and separative element 53 as the processing unit of treatment substrate.The substrate board treatment 3 of this form of implementation has aluminium etcher as etching unit 52, as the chromium etcher of etching unit 54, etching unit 52,54 separately is as using different soups to carry out the processing unit of etch processes and constituting.
It mainly is the path of transporting of walking around etching unit 52 that pair is transported path STR3, and it mainly is the path of transporting of walking around separative element 53 that pair is transported path STR4.It mainly is the path of transporting of walking around etching unit 54 that pair is transported path STR5.
Constituting these pairs transports conveyer belt 33～driving-belt 35 of path STR3～STR5 and has conveyer belt 30 identical functions and structure with the 1st form of implementation respectively.That is be to transport, to join to outlet side at the substrate of entrance side handing-over, to function at the transportation manipulator (being respectively transportation manipulator 23,24,26) of outlet side configuration.Conveyer belt 33～conveyer belt 35 separately is configured in the top of the processing unit of walking around and 2 layers of structure of conveyer belt 30 same formation of the 1st form of implementation respectively.
Buffer store the 43, the 44th has and cushions the same function of container 40 and the buffer store of structure, respectively only can be by transportation manipulator 23,26 accesses.The buffer store 41 of buffer store 41 and the 1st form of implementation is identical, can carry out access by any of the transportation manipulator 24,25 that is configured in both sides.But buffer store 41 is not to transport the path and the buffer store that uses as the pair of walking around processing unit, constitutes the main path MTR that transports.
Transportation manipulator 23～26 all has the structure same with transportation manipulator 20.
Transportation manipulator 23 transports path STR3 (conveyer belt 33) and receives substrate from main path MTR (etching unit 52) or the pair of transporting, the path is transported in information substrate decision according to the substrate that is received, be transported to separative element 53 the master is transported path MTR as the substrate that transports the path, be transported to conveyer belt 34 as the substrate that transports the path pair being transported path STR4.
Transportation manipulator 24 transports path STR4 (conveyer belt 34) and receives substrate from main path MTR (separative element 53) or the pair of transporting, and the substrate that is received is transported to buffer store 41.That is, transportation manipulator 24 there is no need to determine the path of transporting of the substrate that transports.
Transportation manipulator 25 receives substrate from buffering container 41, the substrate that received of decision transport the path, be transported to etching unit 54 the master is transported path MTR as the substrate that transports the path, be transported to conveyer belt 35 as the substrate that transports the path pair being transported path STR5.
Transportation manipulator 26 transports path STR5 (conveyer belt 35) and receives substrate from main path MTR (etching unit 54) or the pair of transporting, and the substrate that is received is transported to inspection unit 70.That is, transportation manipulator 26 there is no need to determine the path of transporting of the substrate that transports.
As previously discussed, transport in the substrate board treatment 3 in path having, also can obtain the effect same with the substrate board treatment 1,2 of above-mentioned form of implementation than 1, the 2 more pairs of the substrate board treatment shown in the above-mentioned form of implementation.
4, the 4th form of implementation
In above-mentioned form of implementation, pair is transported the path and is only transported substrate on 1 direction, but secondary transport the path and do not limit such function.
The formation of the substrate board treatment 4 of Fig. 7 the 4th form of implementation that to be expression constitute according to such principle and transport the view in the path of substrate.Have the formation with the same function of above-mentioned form of implementation in the formation for substrate board treatment 4, in addition identical symbol suitably omits explanation.
The formation of conveyer belt 36 is, drives by positive and negative conversion ground and transports the driving mechanism that substrate is used, and also can transport substrate on the either direction of the left and right sides of Fig. 7.
Below, the action of simple declaration substrate board treatment 4, but in substrate board treatment 4, carry out the substrate of all processing (etch processes and separating treatment) because transport successively, so omit explanation main transporting on the MTR of path.
For the substrate that only carries out etch processes, be positioned at the transportation manipulator 27 that drops into the position and receive this substrate from check code reader 10, be transported to the main path MTR (etching unit 55) that transports.And when the etch processes end of etching unit 55, transport this substrate from etching unit 55 with transportation manipulator 28, be transported to pair and transport path STR6 (conveyer belt 36).
Be transported to pair and transport the substrate of path STR6, to transporting, take out with transportation manipulator 27 with the left of conveyer belt 36 in Fig. 7.Transport transportation manipulator 27 that path STR6 received substrate from pair and move to and transport the position, give conveyer belt 31 this substrate delivery/reception.Like this, handing-over transports for the substrate of conveyer belt 31 from substrate board treatment 4 by conveyer belt 31, finish the processing of substrate board treatment 4.
On the other hand, for the substrate that only carries out separating treatment, the transportation manipulator 27 that is positioned at the input position is transported to pair with substrate and transports path STR6 (conveyer belt 36).Be transported to pair and transport the substrate of path STR6, the right in Fig. 7 is transported, and takes out with transportation manipulator 28.Transport the transportation manipulator 28 that path STR6 has received substrate from pair, this substrate is transported to buffer store 41.
The substrate that is transported to buffer store 41 takes out with transportation manipulator 29, is transported to separative element 56, carries out separating treatment by separative element 56.
When separating treatment finished, transportation manipulator 27 moved to and transports the position, took out this substrate from separative element 56, and conveyer belt 31 is given in handing-over simultaneously.Like this, the substrate of conveyer belt 31 is given in handing-over, transports from substrate board treatment 4 with conveyer belt 31, finishes the processing of substrate board treatment 4.
Usually the formation of etching unit 55 is to arrange multiple arrangements such as cleaning device, Etaching device and drying device on prescribed direction.At separative element 56, on prescribed direction, arrange cleaning device, Etaching device and drying device etc. too and constitute.Therefore, etching unit 55 and separative element 56 all are the unit that can only receive substrate from prescribed direction.Usually these devices of configuration make it possible to transport path MTR along the master that Fig. 7 represents and come treatment substrate, so can only receive substrate on the main substrate carriage direction that transports path MTR.Thereby for example, even only carry out the substrate of separating treatment, transportation manipulator 27 is transported to separative element 56 after can not moving to and transporting the position.Yet the substrate board treatment 4 of this form of implementation owing to have the conveyer belt 36 that can transport substrate on twocouese, so can transport substrate as described above, even only carry out the substrate of separating treatment, can not handled by etching unit 55 yet.
As mentioned above, the substrate board treatment 4 of the 4th form of implementation also can obtain the effect same with the substrate board treatment 1～3 of above-mentioned form of implementation.
Constitute the secondary conveyer belt 36 that transports path STR6 and have the function of on twocouese, transporting substrate,, apparatus structure is oversimplified so under the situation about using even select 2 processing units, the also unnecessary pair that is provided with is respectively transported the path.
Also dispose in addition on the position that can in Fig. 7, dot in the transportation manipulator, the buffer store used of handing-over substrate (buffer store same with buffering container 41) is set between this transportation manipulator 27 and transportation manipulator 27.At this moment, mechanism and buffering container 45,46 that transportation manipulator 27 is moved can make apparatus structure oversimplify more.
5, variation
More than, form of implementation of the present invention has been described, but the present invention is not limited to above-mentioned form of implementation, can carry out various distortion.
For example, transport the number of processing units of walking around in the path by 1 pair and be not limited to 1, also can walk around a plurality of processing units that carry out a succession of processing simultaneously.
Path selection and scheduling about substrate are not limited to the example shown in the above-mentioned form of implementation, according to the processing that substrate is implemented, also can adopt other control methods.
In the substrate board treatment 1～4 of above-mentioned form of implementation, illustrated that pair is transported the path and the master transports the structure that the path together becomes 2 layers of structure, but pair is transported the position that the path also can be arranged on and the master transports the roughly the same height in path.
Claims (10)
1. a substrate board treatment is handled the substrate that is dropped into, and it is characterized in that having:
Substrate is carried out at least 1 processing unit of predetermined process;
The master who substrate is transported into, transports above-mentioned processing unit transports the path;
Walk around the pair of above-mentioned processing unit and transport the path;
Transport the conveyer that path and above-mentioned pair are transported handing-over substrate between the path above-mentioned master;
Device is determined in the path, and its selection is to transport the path or transport the path by above-mentioned pair and transport the above-mentioned substrate that is dropped into by above-mentioned master, determines the path of transporting of aforesaid substrate;
Control device, it controls above-mentioned conveyer corresponding to the path of transporting of being determined aforesaid substrate that device is determined by above-mentioned path.
2. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned conveyer is the transportation manipulator that can transport substrate on above-below direction in the lifting,
Above-mentioned pair is transported path configurations is transported the path above-mentioned master top.
3. substrate board treatment as claimed in claim 1 is characterized in that,
Also have the buffering storage facility, its can and above-mentioned conveyer between carry out the handing-over of substrate, temporarily accumulate substrate simultaneously.
4. substrate board treatment as claimed in claim 3 is characterized in that,
Above-mentioned buffering storage facility can be accumulated in the above-mentioned processing unit can simultaneous maximum numbers or the substrate of its above number.
5. substrate board treatment as claimed in claim 1 is characterized in that,
In the aforesaid substrate processing unit, drop under the situation of a plurality of substrates, and transporting the substrate of discharging in the path from above-mentioned master and when above-mentioned pair was transported the substrate of discharging in the path and clashed, above-mentioned control device priority treatment was transported the substrate that discharge in the path from above-mentioned master.
6. substrate board treatment as claimed in claim 1 is characterized in that,
It is to be connected with rightabout return road towards the afore mentioned rules direction towards the outlet of prescribed direction and to be set up in parallel that above-mentioned master transports the path,
Above-mentioned pair is transported the midway reception substrate of path from above-mentioned outlet, sends aforesaid substrate midway in above-mentioned return road.
7. substrate board treatment as claimed in claim 6 is characterized in that,
It is buffer store that above-mentioned pair is transported the path, and it also is provided with the 1st peristome of facing above-mentioned outlet and the 2nd peristome of facing above-mentioned return road when temporarily accumulating substrate.
8. substrate board treatment as claimed in claim 6 is characterized in that,
Above-mentioned pair is transported the path can transport substrate on twocouese.
9. substrate board treatment as claimed in claim 1 is characterized in that,
Also have whirligig, it will form the posture of regulation from the substrate rotation that the aforesaid substrate processing unit is sent.
10. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned processing unit is handled by predetermined process liquid transporting next substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004036232A JP4566574B2 (en) | 2004-02-13 | 2004-02-13 | Substrate processing equipment |
| JP2004036232 | 2004-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1655322A true CN1655322A (en) | 2005-08-17 |
| CN100338732C CN100338732C (en) | 2007-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100068984A Expired - Fee Related CN100338732C (en) | 2004-02-13 | 2005-02-05 | Substrate treating apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4566574B2 (en) |
| KR (1) | KR100633809B1 (en) |
| CN (1) | CN100338732C (en) |
| TW (1) | TWI255501B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101192055B (en) * | 2006-11-28 | 2010-12-01 | 东京毅力科创株式会社 | Control device and control method for substrate processing device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8960099B2 (en) | 2002-07-22 | 2015-02-24 | Brooks Automation, Inc | Substrate processing apparatus |
| US7959395B2 (en) | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
| JP5458633B2 (en) * | 2008-06-20 | 2014-04-02 | 株式会社Ｉｈｉ | Processing equipment and transfer control method |
| US8602706B2 (en) | 2009-08-17 | 2013-12-10 | Brooks Automation, Inc. | Substrate processing apparatus |
| TWI497226B (en) * | 2011-01-05 | 2015-08-21 | Tokyo Electron Ltd | Coating, developing device, coating, developing method and memory medium |
| TWI574342B (en) * | 2015-06-12 | 2017-03-11 | 漢民科技股份有限公司 | Automatic processing method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5679843U (en) * | 1979-11-22 | 1981-06-29 | ||
| JPH07228346A (en) * | 1993-12-22 | 1995-08-29 | Hitachi Ltd | Conveyer, conveying processor and processed object conveyance processing method |
| JPH0817894A (en) * | 1994-06-27 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | Substrate surface treatment device |
| JP3522912B2 (en) * | 1994-08-01 | 2004-04-26 | 東京エレクトロン株式会社 | Cleaning treatment apparatus and control method therefor |
| JP3734294B2 (en) * | 1995-09-04 | 2006-01-11 | 大日本スクリーン製造株式会社 | Substrate transfer device |
| JP4045008B2 (en) * | 1998-03-26 | 2008-02-13 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP2914949B1 (en) * | 1998-02-16 | 1999-07-05 | 株式会社カイジョー | Substrate processing equipment |
| JP3960761B2 (en) * | 2001-07-16 | 2007-08-15 | 大日本スクリーン製造株式会社 | Substrate processing apparatus schedule creation method and program thereof |
| JP2003188229A (en) * | 2001-12-18 | 2003-07-04 | Hitachi Kasado Eng Co Ltd | System and method for manufacturing wafer |
| JP2004015022A (en) * | 2002-06-11 | 2004-01-15 | Dainippon Screen Mfg Co Ltd | Substrate handling device |
-
2004
- 2004-02-13 JP JP2004036232A patent/JP4566574B2/en not_active Expired - Fee Related
- 2004-12-27 TW TW093140811A patent/TWI255501B/en not_active IP Right Cessation
-
2005
- 2005-01-25 KR KR1020050006731A patent/KR100633809B1/en not_active IP Right Cessation
- 2005-02-05 CN CNB2005100068984A patent/CN100338732C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101192055B (en) * | 2006-11-28 | 2010-12-01 | 东京毅力科创株式会社 | Control device and control method for substrate processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200527527A (en) | 2005-08-16 |
| TWI255501B (en) | 2006-05-21 |
| JP4566574B2 (en) | 2010-10-20 |
| KR100633809B1 (en) | 2006-10-13 |
| JP2005228917A (en) | 2005-08-25 |
| CN100338732C (en) | 2007-09-19 |
| KR20050081172A (en) | 2005-08-18 |
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