CN1577739A - Coating method and coating device - Google Patents

Coating method and coating device Download PDF

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Publication number
CN1577739A
CN1577739A CNA2004100684619A CN200410068461A CN1577739A CN 1577739 A CN1577739 A CN 1577739A CN A2004100684619 A CNA2004100684619 A CN A2004100684619A CN 200410068461 A CN200410068461 A CN 200410068461A CN 1577739 A CN1577739 A CN 1577739A
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China
Prior art keywords
substrate
nozzle
coating
described substrate
scanning
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Granted
Application number
CNA2004100684619A
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Chinese (zh)
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CN100341113C (en
Inventor
河野幸弘
田中志信
大塚庆崇
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN1577739A publication Critical patent/CN1577739A/en
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Publication of CN100341113C publication Critical patent/CN100341113C/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

To safely conduct a coating work by scanning a nozzle at the height adjacent to an upper face or a surface to be treated of a substrate to be treated. A nozzle fault monitor 168 is comprised of a laser irradiating part 222 irradiating a laser beam LB almost horizontally across in a Y direction and a light reception part 224 arranged opposite to the laser irradiating part 222 in the Y direction across a substrate G on a stage 132 at the prescribed height near the upper face of the substrate loaded on the stage 132. When a resist coating is performed in a coating treatment part 136, the laser beam LB of the nozzle fault monitor 168 scans on the upper part of the substrate G in a X direction together with a resist nozzle 134 by a scanning drive of a scanning part 212 in a position anterior to the resist nozzle 134 and inspects whether an obstacle is found or not near the upper part of the substrate G.

Description

Coating process and apparatus for coating
Invention field
The present invention relates to coating liquid on processed substrate and form the coating process and the apparatus for coating of coated film.
Background technology
All the time, make in the photo-mask process of processing at LCD and semiconductor device etc., as in processed substrate (glass substrate, semiconductor wafer etc.) go up painting erosion resistant agent liquid and adopt a kind of mode of resist nozzle, for example, it is known that the spy opens the nozzle of disclosed long strip type that the slit-shaped ejiction opening arranged of flat 8-138991 or slit-type.
In the apparatus for coating that uses such slit-type resist nozzle, on mounting table or holding plate, set the minim gap below hundreds of μ m above the substrate of horizontal mounting between the ejiction opening of (processed face) and nozzle bottom, above substrate, with respect to the substrate level relatively move The resist nozzle and meanwhile above substrate ejection resist liquid.At this moment, in the nozzle bottom that moves horizontally, the resist liquid that spills on the substrate from ejiction opening flatly extends, and forms the coated film of resist liquid then on substrate with certain thickness.Like this, the nozzle lower end and above the substrate between the gap be the domination thickness of coated film and the important parameter of resist consumption, needing management or keeping this gap is certain value.
Therefore, in existing apparatus for coating, a plurality of vacuum suction mouths of self contained function separately are set on mounting table, on discrete a plurality of representative points of setting on the substrate, with gap sensor detect the nozzle lower end and above the substrate between the gap, the place plus-minus that set point is departed from the gap is adjusted near the vacuum adsorption force that is produced by the vacuum suction mouth it, so that proofread and correct the warpage and the distortion of substrate.This gap sensor, constitute as optical distance sensor, from the light-projecting component that for example constitutes by semiconductor laser or light-emitting diode, above substrate, penetrate light vertically downward, make light imaging on position detection device that reflection comes above substrate via collector lens, obtaining distance by this image space is the size in gap at interval.
Existing apparatus for coating as described above, to the warpage and the distortion of substrate itself, although can correct with vacuum adsorption force, however the foreign matter (particle that substrate is adhered to above, rubbish, fragment etc.) and to be clipped in that foreign matter between substrate and the mounting table handles safely be difficult.Promptly, as described above, above substrate, vacate hundreds of μ m with interior gap, when relatively moving the resist nozzle with respect to the substrate level, adhere on substrate near the size in gap or than its also big foreign matter, then the bottom of resist nozzle or ejection portion are situated between with above the foreign matter friction substrate.Perhaps, clip foreign matter between substrate and the mounting table, substrate is because bulge in its vicinity, and just there is the problem above the substrate of supporting and rub of bumping in the ejection portion of resist nozzle.The ejection portion of resist nozzle friction substrate is top like this, and not only substrate loses value of the product, and the high resist nozzle aspect of price also sustains damage or damages and can not use.
Also have, the each gap of detecting 1 place of the gap sensor of existing apparatus for coating, it is relatively more difficult to detect the foreign matter that indefinite place may exist on the substrate reliably.And, different with the situation of the warpage of substrate own, when making substrate warpage because of the foreign matter that clips between substrate and the mounting table, even in the mounting table side as where regulating near the vacuum adsorption force it, also can not make planarization above the substrate, be difficult to avoid dock between resist nozzle and the substrate or slip.
Summary of the invention
The present invention makes in view of such prior art problem points, and its main purpose provides on processed substrate or carries out the coating process and the apparatus for coating of the coating action that makes nozzle scan on approaching processed the height and position safely.
For reaching above-mentioned purpose, coating process of the present invention, supporting processed substrate with the 1st height and position approximate horizontal ground, make above above-mentioned substrate the nozzle of the position ejection coating fluid approaching carry out the scanning of moving with respect to above-mentioned substrate relative to horizontal direction from the top, on above-mentioned substrate, be coated with in the coating process of above-mentioned coating fluid, before the scanning of said nozzle, penetrate the high light beam of directionality from the light beam injection part, so that near crossing to the height and position approximate horizontal the 2nd above the above-mentioned substrate that is bearing in the above-mentioned the 1st height and position, to receive above-mentioned light beam and to be converted to the signal of telecommunication at light accepting part with above-mentioned light beam injection part opposed locations across above-mentioned substrate arrangement, based on above-said current signal from above-mentioned light accepting part output, about will above above-mentioned substrate, carrying out the said nozzle of above-mentioned scanning, judgement has or not the barrier in fact of the above-mentioned the 2nd height and position, according to above-mentioned result of determination, select to carry out, termination or interruption said nozzle are with respect to the scanning of above-mentioned substrate.
And apparatus for coating of the present invention has: the support of the processed substrate of height and position approximate horizontal ground supporting the 1st; Be used on by the above-mentioned substrate of above-mentioned support part supports from above the nozzle of approaching position ejection coating fluid; Be used for above above-mentioned substrate, carry out said nozzle to above-mentioned substrate relatively to the scanner section of horizontal direction motion scan; Penetrate the high outgoing beam of directionality, make the 2nd height and position approximate horizontal cross by the above-mentioned substrate of above-mentioned support part supports above near the light beam injection part; Be configured in across above-mentioned substrate and the opposed position of above-mentioned light beam injection part, receive above-mentioned light beam and be converted to the light accepting part of the signal of telecommunication; Based on above-said current signal,, judge at the actual detection unit that clear is arranged of the above-mentioned the 2nd height and position to above above-mentioned substrate, carrying out the said nozzle of above-mentioned scanning from above-mentioned light accepting part output; And, select to carry out, end or interrupt the scan control section of said nozzle to the scanning of above-mentioned substrate according to the result of determination of above-mentioned detection unit.
Among the present invention, before nozzle scan, with across opposed light beam injection part of processed substrate and light accepting part, accept to want approximate horizontal to cross near light beam above the substrate, based on the signal of telecommunication from light accepting part output, detection unit judges actual on the round of light beam clear arranged, and just carries out the scanning of nozzle when the result of determination that does not have when barrier is come out, when the result of determination of barrier existence is come out, just end or interrupt the scanning of nozzle.Therefore, near above the substrate, when there is barrier in the place ahead of nozzle scan direction, can enters in nozzle row and detect this barrier before reaching, stop nozzle scan, avoid nozzle to contact with the The barrier.
According to a scheme of the present invention,, support light beam injection part and light accepting part and nozzle in nozzle front side position along the nozzle scan direction and relatively move with respect to substrate together for the end to end from substrate does not carry out the barrier inspection with above-mentioned light beam with omitting.In this case, when drawing by detection unit that there is the result of determination of practical obstacle thing in the place ahead of nozzle in the scanning, can interrupt the nozzle horizontal direction with scanner section at once and move.Perhaps, possess the elevating mechanism that is used to make the nozzle lifting moving, detection unit has drawn in scanning when there is the result of determination of practical obstacle thing in nozzle the place ahead, and also can by means of the The elevating mechanism nozzle be risen at once move to the specified altitude position.Rise to move by this, even nozzle is proceeded moving of horizontal direction in the same old way, also can avoid The hinder thing and moving above it, can avoid colliding or CONTACT WITH FRICTION.
Generally, near barrier is the foreign matter that is attached to above the substrate above the substrate in the nozzle scan as described above, and the situation of bump is a lot of on the substrate, and the protuberance of substrate takes place when clipping foreign matter between substrate and mounting table (support) easily.So, carry out for before handling in coating above substrate and below or the cleaning of removing foreign matter above the mounting table be best.
According to a scheme of apparatus for coating of the present invention,, the 1st cleaning part that applies pull of vacuum above the substrate before the coating coating fluid is set in order to attract to remove the foreign matter that is attached to above the substrate.And, in order to attract to remove the foreign matter that adheres to below of substrate, the 2nd cleaning part that applies pull of vacuum below coating coating fluid substrate before is set.And, in order to attract to remove the foreign matter that is attached to mounting table, the 3rd cleaning part that the mounting table before the mounting substrate is applied pull of vacuum is set.In the 1st or the 2nd cleaning part, by be configured in the roller of being located at coating handling part leading portion transport the path about, substrate transports by the next door of cleaning part with roller when, have the ground of omission and implement with vacuum attraction and clean from the end to end of substrate.In each cleaning part, be involved in order not make surrounding air, preferably around the place of working of pull of vacuum, the gas supply device of supplying with clean gas is set.
Scheme according to apparatus for coating of the present invention, support has the substrate float mechanism, there are a plurality of gas squit holes in this mechanism, applies the pressure of the gas that sprays upward from these gas squit holes below substrate, and the height and position the 1st floats substrate approximate horizontal ground.If adopt such substrate float mechanism, be coated with processing under the floating state of substrate aloft, thereby can avoid contacting of the nozzle that causes because of foreign matter under the substrate and substrate.And, even substrate above adhere to foreign matter, contact with substrate through this foreign matter nozzle, because the extruding force from nozzle side also can make the substrate displacement downwards of come-up state, so cause both sides' damage quite slight because of contact.
According to a scheme of apparatus for coating of the present invention, be provided with image pickup part of making a video recording above the substrate after the coating fluid coating and the detection unit that whether exists with the actual spot of coated film (irregular) of image recognition judgement on substrate according to the picture signal that obtains by this image pickup part.Generally, when spot takes place,, by checking in coating to handle on the coated film of back whether have spot, the coating fluid ejection function of checking nozzle in membranous can checked on coated film owing to major part is that the eyelet of nozzle stops up the situation that becomes reason.So, preferably, merge to be provided for nozzle implemented and handle so that the nozzle recovery portion of the coating fluid of nozzle ejection functional recovery normal condition and the recovery control part that on detection unit is made in substrate, makes nozzle recovery portion recover to handle during the result of determination of physical presence spot.
According to coating process of the present invention or apparatus for coating, by formation and effect as described above,, carry out the coating action of scan nozzle safely near above the processed substrate or processed height and position, just can guarantee the fail safe of substrate and nozzle.
Description of drawings
Fig. 1 is the vertical view that the applicable coating developing system of expression the present invention constitutes.
Fig. 2 is the end view that the heat treatment portion of the coating developing system of expression execution mode constitutes.
Fig. 3 is the flow chart of processing sequence of the coating developing system of expression execution mode.
Fig. 4 is that the coating of the coating developing system of expression execution mode adds the top view that the Ministry of worker constitutes.
Fig. 5 is the block diagram that the coating of expression execution mode adds each control system formation of the Ministry of worker.
Fig. 6 is the side elevation in partial section of the formation of cleaner and following substrate cleaner above the substrate of expression one embodiment.
Fig. 7 is the objective table mechanism of expression one embodiment and the stereogram that the objective table cleaner constitutes.
Fig. 8 is the coating handling part of expression one embodiment and the stereogram that nozzle obstacle monitor constitutes.
Fig. 9 is the side elevation in partial section of the nozzle obstacle monitor effect of expression embodiment.
Figure 10 is the sectional side view of across obstacle action (nozzle is dodged action) example of expression embodiment.
Figure 11 is the sectional side view of across obstacle action (nozzle is dodged action) example of expression embodiment.
Figure 12 is the block diagram that the coated film inspection portion of expression embodiment constitutes.
Figure 13 is the stereogram that the image pickup part of the coated film inspection portion of expression embodiment constitutes.
Figure 14 is the figure that the nozzle recovery portion of expression one embodiment constitutes.
Figure 15 is the side elevation in partial section that the objective table mechanism of the other embodiment of expression constitutes.
Embodiment
Below, with reference to description of drawings preferred forms of the present invention.
Fig. 1 represents as the coating developing system that can use a configuration example of coating process of the present invention and apparatus for coating.This is coated with developing system 10, be located in the dust free room, be processed substrate for example with the LCD substrate, LCD make the cleaning carried out in the processing in the photo-mask process, resist-coating, prebake, development and after a succession of processing of curing etc.Exposure-processed is used in abutting connection with the outside exposure device 12 of this treatment system setting and is carried out.
This is coated with developing system 10, at the horizontal wide processing station (P/S) 16 of central part configuration, at configuration box stations, its length direction (directions X) both ends (C/S) 14 and interface station (I/F) 18.
Box station (C/S) 14, the box that is system 10 is taken out of inlet, but possess multilayer can be accommodated overlappingly a plurality of square glass substrate G box C in the horizontal direction for example the Y direction be aligned to 4 and the box objective table 20 of mounting and the conveyer 22 that carries out substrate G access with respect to the box C on this objective table 20.Conveyer 22 has the mechanism that can keep substrate G and for example transports arm 22a, can on X, Y, Z, θ 4, move, can with processing station (P/S) 16 sides of adjacency with carry out the handing-over of substrate G.
Processing station (P/S) 16 on the parallel and direction pair of opposite assembly line A that extends along system length direction (directions X), B, disposes each handling part with work flow or process sequence.More detailed point says, from box station (C/S) 14 1 sides towards the production line A of the upstream portion of interface station (I/F) 18, a horizontal row ground disposes the 24, the 1st heat treatment portion 26 of the Ministry of worker that adds of cleaning, coating adds the Ministry of worker 28, reaches the 2nd heat treatment portion 30.On the other hand, from interface station (I/F) 18 1 sides towards the production line B of the downstream portion of box station (C/S) 14, a horizontal row ground disposes the 2nd heat treatment portion 30, develop add the Ministry of worker 32, decolouring adds the Ministry of worker 34, reaches the 3rd heat treatment portion 36.In this pipeline scheme, the 2nd heat treatment portion 30 is positioned at the end of the production line A of upstream side, and is positioned at the position, front of the production line B in downstream, across between two assembly line As, B.
The auxiliary space 38 of transporting is set between two production line A, B, can with 1 be the unshowned driving mechanism of conveyer 40 usefulness figure of the horizontal mounting substrate G of unit, can go up two-way mobile in streamline direction (directions X).
In the production line A of upstream portion, cleaning adds the Ministry of worker 24 and comprises scouring unit (SCR) 42, is cleaning place configuration excimers UV illumination units (e-UV) 41 of box station (C/S) 10 adjacency in unit (SCR) 42 with this.Clean the cleaning part in the unit (SCR) 42, by roller transport or conveyer belt transport with horizontal attitude to assembly line A direction transport substrate G on one side, top (the processed face) of substrate G applied that flushing is cleaned or blowing is cleaned on one side.
Add the 1st heat treatment portion 26 of the downstream adjacency of the Ministry of worker 24 with cleaning, at central part longitudinal type conveyer 46 is set along production line A, both sides are being provided with before and after it, a plurality of one chip baking ovens unit carried out with the transfer unit of substrate handing-over usefulness multilayer laminated configuration forms, multilevel-cell portion or baking oven tower (TB) 44,48.
For example, as shown in Figure 2, in the baking oven tower (TB) 44 of upstream side, stack gradually the transfer unit (PASS that substrate is moved into usefulness from following L) 50, the heating unit (DHP) 52,54 and the coherent unit (AD) 56 of usefulness cured in dehydration.Here, transfer unit (PASS L) 50 be provided for moving into space in the 1st heat treatment portion 26 from cleaning substrate G that unit (SCR) 42 clean are over.In the baking oven tower (TB) 48 in downstream, stack gradually the transfer unit (PASS that substrate is taken out of usefulness from following R) 60, the cooling unit (COL) 62,64 of underlayer temperature adjustment usefulness and coherent unit (AD) 66.Here, transfer unit (PASS R) 60 be provided for adding the space of the Ministry of worker 28 finished coating that required heat treated substrate G relocates to the downstream in the 1st heat treatment portion 26.
In Fig. 2, conveyer 46 has: the lifting of moving along guide rail 68 liftables that extend is in vertical direction transported body 70, is transported on the body 70 and can rotate or the rotation of rotation is transported body 72, transported body 72 upper support substrate G and can be at fore-and-aft direction advance and retreat or flexible arm or the tweezers 74 of transporting in rotation to the θ direction in this lifting.Be used to drive lifting and transport the base portion side that the drive division 76 of body 70 liftings is located at vertical guide rail 68, be used to drive rotation and transport the drive division 78 of body 72 rotations and be installed in lifting and transport body 70, be used to drive the drive division 80 that transports arm 74 advance and retreat and be installed in rotation and transport body 72.Each drive division 76,78,80 for example can be made of motor etc.
Conveyer 46 fast liftings of Gou Chenging or rotatablely move as described above can be visited among the two adjacent baking oven towers (TB) 44,48 unit arbitrarily, also can with the auxiliary conveyer 40 handing-over substrate G that transport space 38 sides.
The coating that is adjacent to the downstream of the 1st heat treatment portion 26 adds the Ministry of worker 28, as shown in Figure 1, disposing along production line A one: move into unit (IN) 81 with being listed as, resist-coating unit (CT) 82, drying under reduced pressure unit (VD) 84, edge remover (エ Star ジ リ system one バ) unit (ER) 86 and take out of unit (OUT) 87.The formation that coating adds in the Ministry of worker 28 describes in detail later on.
Has the same formation in abutting connection with the 2nd heat treatment portion 30 in downstream that coating adds the Ministry of worker 28 with above-mentioned the 1st heat treatment portion 26, at two production line line A, the conveyer 90 of longitudinal type is set between the B, in production line A side (end) a baking oven tower (TB) 88 is set, another baking oven tower (TB) 92 is set in production line B side (front).
Though diagram is omitted, however for example, at the baking oven tower (TB) of production line A side) in 88, move into the transfer unit (PASS of usefulness at orlop configuration substrate L), and, can overlapping thereon for example 3 layers of heating unit (PREBAKE) that prebake is used.And in the baking oven tower (TB) 92 of production line B side, can dispose the transfer unit (PASS that substrate is taken out of usefulness at orlop R), the cooling unit (COL) of overlapping thereon for example 1 layer of underlayer temperature adjustment usefulness, overlapping thereon more for example 2 layers of heating unit (PREBAKE) that prebake is used.
Conveyer 90 in the 2nd heat treatment portion 30 is by two baking oven tower (TB) 88,92 transfer unit (PASS separately L), (PASS R) can not only be that unit and coating add the Ministry of worker 28 and development adds the 32 handing-over substrate G of the Ministry of worker with 1, and can be the handing-over substrate G of unit with 1 with auxiliary conveyer 40 and interface described later station (I/F) 18 of transporting in 38.
In the production line B of downstream portion, developing adds the Ministry of worker 32, transports the developing cell (DEV) 94 of so-called advection (advection) mode that substrate G carries out a series of development treatment operation on one side comprise horizontal appearance shape on one side.
Clip decolouring in the downstream that development adds the Ministry of worker 32 and add 34 configurations the 3rd heat treatment portion 36 of the Ministry of worker.Decolouring adds the Ministry of worker 34 to be possessed and is used for i ray UV illumination unit (i-UV) 96 that processed of substrate G irradiation i ray (wavelength 365nm) decoloured and handle.
The 3rd heat treatment portion 36 has the same formation with above-mentioned the 1st heat treatment portion 26 and the 2nd heat treatment portion 30, is provided with longitudinal type conveyer 100 and a pair of baking oven tower (TB) 98,102 of both sides before and after it along production line B.
Though diagram is omitted, yet for example, in the baking oven tower (TB) 98 of upstream side, settle substrate to move into the transfer unit (PASS of usefulness at orlop L), and can be overlapping for example cure the heating unit (POBAKE) of usefulness thereon after 3 layers.And, in the baking oven tower (TB) 102 in downstream, can after settling, cure orlop the heating unit (POBAKE) of usefulness, and the transmission cleaning unit (PASS of usefulness is taken out of and cooled off to overlapping thereon 1 layer of substrate RCOL), cure the heating unit (POBAKE) of usefulness after overlapping thereon again 2 layers.
Conveyer 100 in the 3rd heat treatment portion 36 is by the transfer unit (PASS of two multi-level unit portions (TB) 98,102 L) and transmit cleaning unit (PASS RCOL) can not only with 1 be unit respectively with i ray UV illumination unit (i-UV) 96 and box station (C/S) 14 handing-over substrate G, and can be unit and the auxiliary conveyer 40 that transports in the space 38 joins substrate G with 1.
Interface station (I/F) 18 has and is used for and conveyer 104 that the exposure device 12 of adjacency carries out the exchange of substrate G, disposes buffer table (BUF) 106 around it, expansion cooling bench (EXTCOL) 108 and peripheral unit 110.Place fixed buffer pocket (scheming not shown) on the buffer table (BUF) 106.Expansion cooling bench (EXTCOL) the 108th possesses the substrate handing-over platform of refrigerating function, and processing station (P/S) 16 top-cross rebush at the bottom of use during G.Peripheral unit 110 can be for example stacked on top of one another titler (TITLER) and the structure of exposure device (EE) all around.Conveyer 104 has the mechanism that can keep substrate G, for example transports arm 104a, can with the exposure device 12 of adjacency and each unit (BUF) 06, (EXTCOL) 108, (TITLER/EE) 110 handing-over substrate G.
Among Fig. 3, represent the processing sequence of this coating developing system.At first, in box station (C/S) 14, take out 1 substrate G conveyer 22 any box C from platform 20, the cleaning of moving into processing station (P/S) 16 adds excimers UV illumination unit (e-UV) 41 (the step S of the Ministry of worker 24 1).
In excimers UV illumination unit (e-UV) 41, substrate G is applied the dry type of using ultraviolet irradiation and clean (step S 2).In this ultraviolet ray is cleaned mainly is the organic substance of removing substrate surface.After ultraviolet ray clean to finish, substrate G is transplanted on the conveyer 22 of box station (C/S) 14 cleans the scouring unit (SCR) 42 that adds the Ministry of worker 24.
In cleaning unit (SCR) 42, adopt as described above by roller and transport or conveyer belt transports, with horizontal attitude along production line A direction, one side advection transports substrate G and substrate G top (processed face) is applied flushing cleaning and blowing cleaning on one side, removes granular spot (step S from substrate surface 3).Then, apply rinsing and handle, make substrate G drying with air knife etc. at last on one side also on one side transport substrate G after the cleaning with advection.
The substrate G that clean is in cleaning unit (SCR) 42 moves into the interior transfer unit (PASS of upstream side baking oven tower (TB) 44 of the 1st heat treatment portion 26 advection L) 50.
In the 1st heat treatment portion 26, substrate G is transplanted on the baking oven unit of regulation successively with the regulation order by means of conveyer 46.For example, substrate G is at first from transfer unit (PASS L) 50 be transplanted on of heating unit (DHP) 52,54, accept processed (step S at this 4).Secondly, with of being transplanted on cooling unit (COL) 62,64 of substrate G, be cooled to certain underlayer temperature (step S at this 5).Then, substrate G is transplanted on coherent unit (AD) 56, accepts hydrophobization at this and handles (step S 6).After this hydrophobization processing finished, substrate G was cooled to certain underlayer temperature (step S in of cooling unit (COL) 62,64 7).At last, substrate G is transplanted on transfer unit (PASS in the downstream baking oven tower (TB) 48 R) 60.
Like this, in the 1st heat treatment portion 26, substrate G just can be by conveyer 46 contact optionally between the baking oven tower (TB) 48 in multilayer baking oven tower (TB) 44 of upstream side and downstream.Also have, the 2nd and the 3rd heat treatment portion 30,36 carries out substrate too and transports running.
Substrate G after that be subjected to above-mentioned such a succession of heat in the 1st heat treatment the portion 26 or hot series of processes, the transfer unit (PASS in the downstream baking oven tower (TB) 48 R) 60 be transplanted on that the adjacent coating in downstream adds the Ministry of worker 28 move into unit (IN) 81, be transplanted on resist-coating unit (CT) 82 from moving into unit (1IN) 81.
In resist-coating unit (CT) 82, aftermentioned is such, and substrate G is by giving (processed face) painting erosion resistant agent liquid above the substrate with the spin-coating method of slit-type resist nozzle.Subsequently, the dried of decompression method has been accepted to utilize in the drying under reduced pressure unit (VD) 84 that substrate G is adjacent in the downstream, and then resist (the step S of unnecessary (not the needing) of underlayer brim is removed in adjacent remover unit, edge (ER) 86 in the downstream 8).
Substrate G after accepting as described above resist-coating and handling moves into the transfer unit (PASS in adjacent the 2nd heat treatment portion 30 upstream side baking oven towers (TB) 88 from remover unit, edge (ER) 86 L).
In the 2nd heat treatment portion 30, substrate G is transplanted on the unit of regulation successively with order specified by means of conveyer 90.For example, with substrate G at first from transfer unit (PASS L) transfer to 1 heating unit (PREBAKE), therefore be subjected to heat treated (the step S of prebake 9).Then, substrate G is transplanted on a cooling unit (COL), therefore is cooled to certain underlayer temperature (step S 10).Then, substrate G via or not via the transfer unit (PASS of downstream baking oven tower (TB) 92 sides R), and give the expansion cooling bench (EXTCOL) 108 of interface station (I/F) 18 sides.
In interface station (I/F) 18, substrate G moves into the exposure device (EE) all around of peripheral unit 110 from expansion cooling bench (EXTCOL) 108, therefore remove when being subjected to developing after the exposure that the resist of the periphery that is attached to substrate G uses, be sent to adjacent exposure device 12 (step S 11).
In exposure device 12, to the circuit pattern exposure of the resist on the substrate G with regulation.Then, the substrate G behind the end pattern exposure returns 18 o'clock (the step S in interface station (I/F) from exposure device 12 11), at first move into the titler (TITLER) of peripheral unit 110, therefore to information (the step S of regulation part mark regulation on the substrate 12).Then, substrate G returns expansion rinsing table (EXTCOL) 108.With conveyer 104 carry out in the interface station (I/F) 18 substrate G transport and with the exchange of the substrate G of exposure device 12.
In processing station (P/S) 16, conveyer 90 receives the substrate G that exposure is over by expansion rinsing table (EXTCOL) 108 in the 2nd heat treatment portion 30, through the transfer unit (PASS in the production line B side baking oven tower (TB) 92 R) deliver to develop and add the Ministry of worker 32.
Add in the Ministry of worker 32 in development, the transfer unit (PASS in this baking oven tower (TB) 92 R) the substrate G that receives moves into developing cell (DEV) 94.In developing cell (DEV) 94, substrate G transports in the advection mode to the downstream of production line B, develops, rinsing dry a series of development treatment operation (step S in this transports 13).
Add the substrate G that has been subjected to development treatment in the Ministry of worker 32 in development and move into the adjacent decolouring in downstream in the advection mode to add the Ministry of worker 34, (step S is handled in the decolouring that therefore is subjected to the i radiation exposure 14).Transfer unit (the PASS in the upstream side baking oven tower (TB) 98 that the substrate G be over moves into the 3rd heat treatment portion 36 is handled in decolouring L).
In the 3rd heat treatment portion 36, substrate G is at first from The transfer unit (PASS L) be transplanted on a heating unit (POBAKE), therefore be subjected to heat treated (the step S of prebake 15).Then, substrate G is transplanted on the transmission cooling unit (PASS in the downstream baking oven tower (TB) 109 RCOL), underlayer temperature (the step S that therefore is cooled to stipulate 16).Transporting by conveyer 100 of the substrate G of the 3rd heat treatment portion 36 undertaken.
In boxlike station (C/S) 14 sides, conveyer 22 is from the transmission cooling unit (PASS of the 3rd heat treatment portion 36 RCOL) receive the substrate G of all operations of the coating development treatment that is through with, the substrate G that receives (the step S in any box C on the platform 20 that packs into 1).
In this coating developing system 10, can apply the present invention to coating and add the Ministry of worker 28, especially resist-coating unit (CT) 82.Below, with reference to Fig. 4～Figure 13, illustrate the present invention is applied to be coated with an execution mode that adds the Ministry of worker 28.
As shown in Figure 4, coating adds the Ministry of worker 28 and is, moves into unit (IN) 81, resist-coating unit (CT) 82, drying under reduced pressure unit (VD) 84, remover unit, edge (ER) 86 and takes out of unit (OUT) 87 in supporting station 112 upper edge directions Xs (along a production line A) row configuration.The pair of guide rails 114,114 of extending along directions X is laid on the both ends of supporting station 112 abreast, use moved by 114,114 guidings of two guide rails one or more groups transport arm 116,116, just can between the unit, exchange substrate G.
Moving into unit (IN) 81, be arranged on directions X lay at certain intervals can approximate horizontal mounting substrate G roller 118 and the roller that constitutes the advection mode transports route 120.This roller transports route 120, the transfer unit (PASS in the adjacent baking oven tower (TB) 48 R) 60 introducings, drive by the drive division 122 that transports that drive motor and transmission mechanism are for example arranged.Roller transport route 120 below, liftable many elevating levers 124 are set, be used for picking up from transfer unit (PASS with horizontal attitude R) 60 transport the substrate G that come and pass to and transport arm 116,116.And, cleaner 126 above the substrate above transporting route 120, roller is set, be used for clean substrate G above, and roller transport route 120 below and elevating lever 124 hands-off positions cleaner 128 below the substrate is set, be used for following (Fig. 6) of clean substrate G.The detailed structure and the effect of two cleaners 126,128 illustrate later on reference to Fig. 6.Also have, at transfer unit (PASS R) in 60, liftable elevating lever 130 is set, be used for that the 1st heat treatment portion 26 has been finished required heat treated substrate G and accept and move to roller from conveyer 46 (Fig. 2) and transport route 120.
Resist-coating unit (CT) 82 has: be used for horizontal mounting and keep the platform 132 of substrate G; On the substrate G of this mounting on 132 (processed face), adopt slit-type resist nozzle 134 coating handling parts 136 with spin-coating method painting erosion resistant agent liquid; Be used for the platform cleaner 138 above the clean hatch 132; Be used for whether the coated film inspection of the last formed resist liquid of substrate G is existed the coated film inspection portion 140 of spot; Be used for the resist liquid ejection function of resist nozzle 134 is maintained nozzle recovery portion 142 of normal condition or recovery etc.The formation and the effect of each several part are described in detail later on reference to Fig. 6～Figure 13 in the resist-coating unit (CT) 82.
Drying under reduced pressure unit (VD) 84 have the pallet of top opening or container type of the shallow end bottom cell 144 and with the top cell (scheming not shown) of these airtight lid shapes of being close to or can constituting chimericly above bottom cell 144.Bottom cell 144 is quadrangle roughly, is used for the platform 146 of horizontal mounting support substrate G in center configuration, and four jiaos are provided with exhaust outlet 148 in the bottom surface.Each exhaust outlet 148 leads to vacuum pump (scheming not shown) by blast pipe (scheming not shown).Under the situation that has covered the top cell on the bottom cell 144, just can use the The vacuum pump, with the two indoor airtight processing spaces specified vacuum degree that reduces pressure.
Remover unit, edge (ER) 86 is being provided with the platform 150 of mounting flatly and support substrate G, the aligning guide 152 that is used in an opposed across corner substrate G being positioned, and is removing 4 remover heads (リ system one バ one ヘ Star De) 154 etc. of unnecessary resist from substrate G surrounding edge (edge).Located at aligning guide 152 under the state of the substrate G on the platform 150, each remover head 154 moves along each limit of substrate G on one side, with diluent dissolving remove the unnecessary resist that the edge part on substrate each limit on adhere on one side.
Taking out of unit (OUT) 87 has with the above-mentioned same roller in unit (IN) 81 of moving into and transports route and lift bar (scheming not shown).Remove the substrate G of processing with remover unit, edge (ER) 86 resist that is through with, deliver to transport and take out of unit (OUT) 87 by transporting arm 116,116, elevating lever receives and is displaced to roller behind the substrate G and transports on the route from transporting arm 116,116.Then, just substrate G is transported to transfer unit (PASS in the adjacent baking oven tower described later (TB) 88 with the roller method of shipment of advection L).
Among Fig. 5, the formation of main each control system in the expression resist-coating unit (CT) 82 and all around.Control part 160 is made of the microcomputer that comprises CPU and memory etc., according to the software or the program control each several part of regulation.On this control part 160, connecting above the above-mentioned substrate cleaner 128, coating handling part 136, platform cleaner 138, coated film inspection portion 140 and nozzle recovery portion 142 below cleaner 126, the substrate with the interface of control system, and connecting platform mechanism 166 and nozzle obstacle monitor 168 etc. with the interface of control system.And control part 160 also couples together with the keyboard of guidance panel or display unit (scheming not shown) or external host or controller (scheming not shown) etc.
Among Fig. 6, represent above the substrate of an embodiment formation of cleaner 128 below the cleaner 126 and substrate.Cleaner 126 has above the substrate: cover roller passing through and transport the strip cleaner body 170 of the length of the substrate G on the route 120 along Y direction (horizontal direction vertical with carriage direction) extension, the following setting of this cleaner body 170 slit-shaped of (Y direction) extension along its length attracts mouth 172 and attracts the both sides of mouth 172 to spray the gas vent 174 of gases (for example pure air) from this.On cleaner body 170, be connected air intake duct 176 and gas supply pipe 178 respectively with the side.In cleaner body 170 inboards, at central part vent line or the suction line 180 that connects attraction mouth 172 and air intake duct 176 is set, and vent line or the supply air line 182 that connects gas supply pipe 178 and gas vent 174 is set in the both sides of The suction line 180.Supply air line 182 porous plate 184 is set midway, be used to make the ejection pressure of gas vent 174 even.Porous plate (scheming not shown) also can be set in suction line 180, be used to make attract the attraction of mouth 172 even.Air intake duct 176 for example leads to vacuum plant via dust suction filter (scheming not shown), and in vacuum pump or the extractor displacer (scheming not shown), gas supply pipe 178 connects for example compressor (scheming not shown) of gas source.
Finish the transfer unit (PASS of required heat treated substrate G in the baking oven tower (TB) 48 in the 1st heat treatment portion 26 R) 60 move into resist-coating unit (CT) 82 move into unit (IN) 81 o'clock, substrate G roller for example transport on the route 120 with below several mm near distance by cleaner 126 above the substrate under.At this moment, if the top attaching particles of substrate G, rubbish, the words of foreign matter P such as fragment, these foreign matters P just gives pull of vacuum above the substrate by means of the attraction mouth 172 by cleaner body 170 and is drawn into and attracts among mouthfuls 172, is captured by dust suction filter by suction line 180 and air intake duct 176.Attract mouthfuls 172 around block above by substrate and suck and attract mouthfuls 172 from the gas of gas vent 174 ejections, so form air curtain.Therefore, do not involve in surrounding air and introduce the worry of rubbish in the atmosphere.Like this, substrate G transports on the route 120 advection at roller and moves into and move into unit (IN) 81 o'clock, cleans by means of the vacuum attraction formula of cleaner above the substrate 126 and remove foreign matter P substantially above substrate G.
Cleaner 128 has the structure identical with cleaner above the substrate 126 below the substrate, and as shown in Figure 6, (up) is configured in and transports route 120 belows in the opposite direction.So substrate G transports on the route 120 advection and moves into and move into unit (IN) 81 o'clock moving into, apply with the 126 same vacuum attraction formulas of cleaner above the substrate below 128 couples of substrate G of cleaner below the substrate and clean, below substrate G, remove foreign matter P substantially.Also have, constituting the fortune roller, to send each roller 118 of route 120 be at the fixing a pair of roller 118b that transports in the both ends of axle 118a, and substrate G is positioned in these pair of right and left and transports on the roller 118 and transport.So, below the substrate G and between the axle 118a certain interval is arranged, although the foreign matter P that is attached to below the substrate G passes through the The gap, also captured by cleaner 128 below the substrate.And, as present embodiment, on substrate, below cleaner 126 and the substrate in the structure of cleaner arranged opposite about in the of 128, offset the pressure that gives substrate G by two cleaners separately, just can stably keep the horizontal attitude of substrate G.
Among Fig. 7, represent the structure of platform 132 and the platform cleaner 138 of an embodiment.Platform 132 is as corresponding to the cuboid mounting table of the shape and size of substrate G and constitute.On platform 132, respectively with a plurality of hole 190 and a plurality of vacuum suction mouths 192 that are used for fixing the substrate G on the platform of accommodating the elevating lever (scheming not shown) that can haunt in vertical direction of suitable configuration pattern setting.
On platform 132 during load substrates G, elevating lever is outstanding to vertical direction from each hole 190, height and position with regulation receives substrate G from transporting arm 116,116 (Fig. 4), drop to the pole top subsequently and enter height and position among the hole 190, substrate G dislocation or mounting to platform 132.Each vacuum suction mouth 192 is linked on the vacuum pump equal vacuum source (scheming not shown), keeps being positioned in substrate G on the platform 132 in the certain altitude position with vacuum adsorption force.When substrate G unloads from platform 132, just removed vacuum adsorption force, elevating lever is outstanding to vertical direction from each hole 190, substrate G is picked up pass to behind the height and position of regulation and transports arm 116,116.Utilize the dress/release mechanism of such elevating lever and,, under the control of control part 160, move as the some of platform mechanism 166 (Fig. 5) with the substrate maintaining body of vacuum suction mouth 192.
In Fig. 7, platform cleaner 138 has the length that can cover platform 132 to pass through makes this cleaner body 194 move horizontally the i.e. scanner section 196 of scanning along the cleaner body 194 of the strip of Y direction extension with above platform 132 along directions X.Cleaner body 194, can be for example and cleaner 126 identical construction above the above-mentioned substrate, link on the vacuum source (scheming not shown) by air intake duct 198, and link on the gas supply source (scheming not shown) through gas supply pipe 200, and have and platform 132 opposed slit-shaped air entry and gas vents.Scanner section 196 has the supporting mass 202 of the word of falling コ shape of horizontal supporting cleaner body 194 and the scanning driving part 204 that this supporting mass 202 is moved at the directions X two-way linear.This scanning driving part 204 can be for example be made of the ball screw framework or the linear electrical machine mechanism of tape guiding piece.At the junction surface that connects supporting mass 202 and cleaner body 194, the elevating mechanism 206 that tape guiding piece preferably is set is so that the height and position of change or adjustment cleaner body 194.
Platform cleaner 138 moved under the control of control part 160 in the idle period of time that does not have mounting substrate G on the platform 132.More detailed point is said, on one side with scanner section 196 with certain speed scan cleaner body 194 make its directions X pass through platform 132 above, on one side by giving pull of vacuum with 194 pairs of platforms of cleaner body, 132 top each several parts, from an end clean other end ground rinsing table 132 above.Therefore, adhere on the platform 132 or the residual foreign matter device body 194 that is cleaned is captured and removed.
Among Fig. 8, represent the structure of coating handling part 136 and the nozzle obstacle monitor 168 of an embodiment.Coating handling part 136 has: the resist liquid supply unit 210 that comprises resist nozzle 134; Above platform 132, make resist nozzle 134 move horizontally the i.e. scanner section 212 of scanning along directions X; Be used to change or regulate the nozzle elevating mechanism 220 of resist nozzle 134 height and positions.
In resist liquid supply unit 210, resist nozzle 134 has the slit-shaped ejiction opening 134a that extends in the Y direction with the length of the substrate G on the covering platform 132 that can pass through, and is connected on the resist liquid supply pipe 214 that comes from resist liquid supply source (scheming not shown).Scanner section 212 has the supporting mass 216 of the word of falling コ shape of horizontal supporting resist nozzle 134 and the scanning driving part 218 that supporting mass 216 twocouese straight lines are moved.This scanning driving part 218 also can use ball screw framework, yet from the uniformity viewpoint of coated film, preferably is made of the little linear electrical machine mechanism of mechanical oscillation.Nozzle elevating mechanism 220 can be made of ball screw framework, regulate and at random to set or to adjust the ejiction opening 134a of nozzle bottom after the height and position of resist nozzle 134 and the distance between (processed face) above the substrate G on the platform 132 is the size of gap g (Fig. 9) at interval, and can make 134 moments of resist nozzle rise mobile.
Coating handling part 136 is moving under the control of control part 160 during the mounting substrate G on the platform 132.More detailed point is said, with scanner section 212 with certain speed one scan edge resist nozzle 134 make its directions X pass through platform 132 above, on one side in resist liquid supply unit 210, the wire discharging jet that extends with the Y direction above the substrate G on the platform 132 is supplied with resist liquid from the slit-shaped ejiction opening 134a of resist nozzle 134.At this moment, make and spill into resist liquid on the substrate G from ejiction opening and be that directions X advances with prescribed direction or flatly extend the bottom of the resist nozzle 134 that moves horizontally, then on substrate G with certain thickness of corresponding gap g, form the coated film CR (Fig. 9) of resist liquid.
Nozzle obstacle monitor 168 when the resist-coating processing of carrying out as described above, checks whether the place ahead of resist nozzle 134 has obstacle in being coated with handling part 136.As described above, substrate G moves into unit (IN) 81 o'clock with the roller method of shipment of advection, below cleaner above the substrate 126 and substrate cleaner 128 respectively with the vacuum attraction method clean the top of substrate G and below, and then the top of platform 132 also cleans with the vacuum attraction method termly with platform cleaner 138, thereby, being attached with the occurrence frequency of the situation that clips foreign matter between the situation of foreign matter and substrate G and the platform 132 and existing apparatus above the substrate G of mounting relatively on platform 132, is very low.But, from move into unit (IN) 81 be transplanted on platform 132 during substrate G above or below the possibility of adhering to foreign matter is arranged, the possibility of adhering to new foreign matter on the platform 132 is arranged.And, promptly use cleaner 126,128,138 that the possibility that can not remove foreign matter is fully also arranged.In the present embodiment, as the countermeasure that endangers nozzle obstacle monitor 168 is set, on platform 132 above the substrate G of mounting or below adhere in fact or carry secretly under the situation of (have coating handle go up fault) foreign matter, according to as the effect of the nozzle obstacle monitor 168 of following narration, will prevent docking or being slidably connected to possible trouble of resist nozzle 134 and substrate G.
In Fig. 8, nozzle obstacle monitor 168 has: penetrate for example laser beam LB of the high light beam of directionality, so that near the laser injection part 222 cross above the substrate G of mounting on the platform 132 along Y direction approximate horizontal at the height and position of regulation; Across the substrate G on the platform 132 and on the Y direction, be configured in and laser injection part 222 opposed locational light accepting parts 224.As shown in the figure, laser injection part 222 and light accepting part 224 are installed in respectively on a pair of Horizontal Branch bearing arm 226,226 outstanding from the left and right sides of supporting mass 216 towards the place ahead, scanning direction, on the scanning direction apart from resist nozzle 134 certain distance (the anterior position transmitting-receiving laser beam LB of 100mm～200mm) for example only.If light accepting part 224 is received the laser beam LB from laser injection part 222, just export laser beam LB light quantity or the corresponding level voltage signal of receiving with it of luminous intensity.Nozzle obstacle monitor 168 has signal processing circuit, and input is from the voltage signal of light accepting part 224, and relatively this voltage signal level and specified reference value monitor judgement.Here, fiducial value can be, the laser beam LB that penetrates from laser injection part 222 does not run into that any obstacle ground is propagated aloft and when arriving light accepting part 224, the voltage signal level of exporting from light accepting part 224.
When in coating handling part 136, carrying out resist-coating and handling, by the turntable driving of scanner section 212, the detection of obstacles of nozzle obstacle monitor 168 with laser beam LB also with resist nozzle 134, and in its place ahead above directions X scanning substrate G.In the scanning of this laser beam LB, remain on the height and position of setting above the substrate G, and at scanning position that this what foreign matter does not all adhere to, shown in Fig. 9 (A), from what obstacle of laser beam LB of laser injection part 222 do not run into yet on substrate near propagation and arrive light accepting part 224, obtain the level voltage signal approximate by light accepting part 224 with fiducial value.So it is " normally " that the signal processing circuit of nozzle obstacle monitor 168 is exported this scanning position, the monitor result of determination that the barrier of resist nozzle 134 is not had just.Like this, as long as draw the monitor result of determination of " normally " by nozzle obstacle monitor 168, control part 160 just makes coating handling part 136 proceed or continues the resist-coating processing.
But, for example shown in Fig. 9 (B), clip between substrate G and the platform 132 under the foreign matter P situation that also substrate G swells in its vicinity, if laser beam LB arrives the place of substrate G protuberance in the scanning process, laser beam LB is partly covered by the side with the substrate G of laser injection part 222 opposite sides, and the degree of this laser beam shading is increased gradually along with the protuberance degree of substrate G.Thus, in light accepting part 224, the light income of laser beam LB reduces gradually, and output signal level just descends gradually.In the signal processing circuit of nozzle obstacle monitor 168, from the voltage signal level of light accepting part 224 with respect to fiducial value than the also low moment of the ratio of regulation (for example 50%), output is " unusually ", promptly in the monitor result of determination of The scanning position existence with respect to some barrier of resist nozzle 134.
Perhaps, shown in Fig. 9 (C), even the somewhere is adhered under the situation of foreign matter P of suitable size on substrate G, because laser beam LB is also covered by The foreign matter P in the scanning process, this is constantly from the signal processing circuit output of nozzle obstacle monitor 168 and the monitor result of determination of above-mentioned " unusually " equally.
Also have, as shown in Figure 9, the height and position of laser beam LB and size (beam diameter d), the height and position and the size (distance at interval) that can be formed gap g between substrate G top of normal mounting on ejiction opening 134a and the platform 132 according to the lower end of resist nozzle 134 are set, and preferably make both sides' (LB, g) height and position and consistent size or make it approximate.For example, be the situation of 100 μ m setting gap g, the beam diameter d of setting laser bundle LB is 100 μ m, can make the centre-height position of laser beam LB and the centre-height position consistency of gap g.
As described above, from the monitor result of determination of nozzle obstacle monitor 168 outputs " unusually ", control part 160 just indication coating handling part 136 interruption resist-coating is handled.
At this moment, as the 1st coating handling interrupt method, control part 160 is also indicated coating handling part 136 interrupt scanning.Thus, coating handling part 136, in resist liquid supply unit 210, stop to supply with resist liquid to resist nozzle 134 from resist liquid supply source, interrupt the resist liquid ejection action of nozzle 134, and in scanner section 212, stop the forward drive running of scanning driving part 218, interrupt the scanning of resist nozzle 134, make scanning driving part 218 retreat driving subsequently, make resist nozzle 134 retreat or dodge toward the origin-location from the top of platform 132.
Perhaps, as the 2nd coating handling interrupt method, control part 160 indication coating handling parts 136 are kept out of the way mobile to resist nozzle 134 tops.Thus, coating handling part 136, moment makes resist nozzle 134 rise in nozzle elevating mechanism 220 and moves.At this moment, in resist liquid supply unit 210, interrupt resist liquid ejection action yes gratifying.And in scanning driving part 218, also can halt drives running, yet even does not stop also harmless.Drive running although do not halt, because 134 moments of resist nozzle rise and move, the avoiding obstacles of being not difficult as shown in Figure 10 and Figure 11 (foreign matter P or because of its substrate that causes protuberance partly) moves to top (leaping).As described above the nozzle ejiction opening and above the substrate between gap g be about 100 μ m, the height of barrier also be usually about hundreds of μ m below.Nozzle obstacle monitor 168 after barrier is found in resist nozzle 134 the place aheads up to resist nozzle 134 arrive The barrier positions move horizontally distance (for example between the 100mm～200mm), resist nozzle 134 as long as rising count mm just can ten minutes realization keeping out of the way upward comfortably.
The 2nd coating handling interrupt method uses the situation of linear motor especially favourable to scanning driving part 218.That is, linear motor, mechanical oscillation are little, on the other hand owing to there is not reducing gear, having puts brakes on violently to stop when up to long this of the displacement that stops fully on the one hand.But, as the 2nd method, make only the rise emergency action of number mm of resist nozzle 134 in this way, then the load moment of inertia of seeing from drive division (motor) angle of elevating mechanism is low, resist nozzle 134 can be kept out of the way rapidly upward, can move to the top of barrier.
Interrupted the situation that resist-coating is handled at coating handling part 136 as described above, this substrate G is being regarded as on the basis of defective, also can flow to follow-up treatment process, perhaps temporarily take care of in surge chamber that also can be provided with in intrasystem suitable place or the storeroom.And, platform cleaner 138 is started temporarily and clean rinsing table 132 above.
Like this, in the present embodiment, in resist-coating is handled, when there is barrier in the place ahead, scanning direction of resist nozzle 134, typically between substrate G and platform 132, clip the foreign matter P and the situation of substrate G protuberance in its vicinity as described above, or on substrate G, adhere under the situation of foreign matter P, nozzle obstacle monitor 168 is found such barrier (substrate bump in advance, foreign matter etc.), carve at this moment and interrupt nozzle scan, thereby just can prevent resist nozzle 134 contact or sliding contact substrate G bumps, perhaps through top and so on the situation of foreign matter friction substrate G in possible trouble.
And, in the nozzle obstacle monitor 168 of present embodiment, because near the detection of obstacles of propagating or crossing to a direction (Y direction) above the substrate G is moved horizontally with the laser beam LB edge direction (directions X) vertical with the direction of propagation, so can have whole that omits above the ground scanning substrate, even on the substrate G which place has unusual local (barrier) also can detect reliably.And, because utilize the scanner section 212 of coating handling part 136, detection of obstacles is scanned together, with laser beam LB and resist nozzle 134 so also can seek the simplification and the cost degradation of monitor mechanism.
The structure of the coated film inspection portion 140 of expression one embodiment among Figure 12 and Figure 13.This coated film inspection portion 140 has: to the image pickup part of being accepted by coating handling part 136 as described above to make a video recording above the substrate G after resist-coating is handled 230; Judge the monitor handling part 232 that whether has spot (irregular) on the coated film CR on the substrate G with image recognition technology according to the picture signal that obtains by this image pickup part 230.
Image pickup part 230 is by the turntable driving of scanning driving part 234 (Fig. 4), just can make lamp 236, collector lens 238 and ccd video camera 240 scannings at directions X in the top of platform 132 (Fig. 4), cuing open above the substrate G on the shape lamp 236 illumination platforms 132 that the Y direction is extended, ccd video camera 240 just passes through 238 pairs of irradiated parts above the substrate of collector lens and makes a video recording as shown in figure 13.
In Figure 12, monitor handling part 232, with A/D converter 242 analog picture signal from 240 outputs of CC video camera is converted to data image signal, based on this data image signal, be used for image processing or the determination processing that this as described later coated film monitors with image recognition portion 244, video memory 246, monitor detection unit 248, configuration part 250 and monitor efferent 252 etc.
Image recognition portion 244, from A/D converter 242 input digital image signals, with video memory 246, the synthetic image of being taken by image pickup part 230 is formed all images of 1 width of cloth, is exactly the image of most of mapping above the substrate G.Then, by binary coding for example, remove denoising, label, known image recognition processing such as connection layout conformal analysis, if having substantial spot, with regard to this spot of Figure recognition in the photographs the inside.Here, do not reduce in fact the so small spot of resist-coating film quality can be from identifying object except.Subsequently, to the spot that Figure recognition is crossed, calculate its shape, size, position etc. and quantize as attribute data.Generally, this spot is because of the reason of resist nozzle 134 sides, promptly adhere to rubbish and so on or resist solidifies and takes place in the situation that eyelet stops up in a part of the slit-shaped ejiction opening of resist nozzle 134, with the corresponding substrate of these eyelet block part on the position, present as shown in figure 13 and form streak (striped) M that the scanning direction wire is extended.
Monitor detection unit 248 is when having received the spot attribute data from the recognition result of image recognition portion 244, the monitoring value of setting with configuration part 250 compares, if exist aspects such as shape, size, number, position to surpass the spot of monitoring value, the resist-coating film that just is judged as on the The substrate G is " spottiness ".The result of determination of monitor detection unit 248 is delivered to control part 160 from monitor efferent 252.
When control part 160 is received the result of determination of " spottiness " by coated film inspection portion 140, also can be defined as this substrate G after the defective, flow to follow-up treatment process, perhaps temporarily take care of in surge chamber that also can be provided with in intrasystem suitable place or the storeroom.Also have, situation after bad (spot) of such resist-coating film takes place is because the eyelet of resist nozzle 134 stops up the situation that becomes reason as described above mostly, and control part 160 starts the nozzle recovery portion 142 of the resist liquid ejection function answer that makes resist nozzle 134.
At Figure 14, represent the structure of the nozzle recovery portion 142 of an embodiment.This nozzle recovery portion 142 has barrel-shaped process chamber 254, and this barrel-shaped process chamber can be arranged on the origin-location of resist nozzle 134 for example and be provided for making the opening of resist nozzle 134 turnover in the above.Configuration washer jet 256 is used for spraying cleaning fluid (for example diluent) in this process chamber 254 near the ejiction opening of the resist nozzle 134 of accommodating at indoor assigned position.This washer jet 256, move horizontally to nozzle length direction (Y direction) along with the turntable driving of washer jet sweep mechanism 262 by vertical support 258 and horizontal supporting member 260, drench at this steering handle cleaning fluid near whole ejection portion (passing through) the last cleaning ejiction opening of resist nozzle 134.The cleaning fluid that uses is sent to waste liquid portion (scheming not shown) from the leakage fluid dram 255 of the bottom setting of process chamber 254.By such nozzle cleaning, wash the rubbish of the ejection portion that is attached to resist nozzle 134 or solid resist etc. off.Also have, the cleaning solution supplying pipeline also can be made of the cleaning solution supplying pipe 264 that comes from cleaning liquid source (scheming not shown), for example constitutes vertical support 258 by cylindrical body, wherein is connected to washer jet 256 by cleaning solution supplying pipe 264.And, also can be at cleaning solution supplying pipe 264 be provided for the open and close valve 266 controlling the connection of nozzle cleaning and close midway.Washer jet sweep mechanism 262 for example can be made of the ball screw framework of tape guiding piece.
Also have, in this nozzle recovery portion 142, also can carry out distributing to the simulation of resist nozzle 134 ejection resist liquid.At this moment, the switching valve 268 of being located at resist liquid supply pipe 214 being switched to resist liquid supplies with source and opens (opening) open and close valve 270 with certain hour.Distribute by means of this simulation, can stop up with the eyelet that probability is to a certain degree removed resist nozzle 134 inside.
In the present embodiment, for the eyelet of more effectively or fully removing in the resist nozzle 134 stops up, also can be with (for example diluent) displacement and washer jet 134 inside in the resist circulation flow path of solvent in nozzle 134.Be exactly, after switching valve 268 being switched to solvent supply source, make open and close valve 270 open (opening) certain hour, can import to resist nozzle 134 to the solvent that the solvent supply source comes through resist liquid supply pipe 214, dissolving becomes the nozzle 134 interior resist solid portions of eyelet plugging reason and is discharged by ejiction opening afterwards.
In Figure 15, expression can be applicable to another embodiment of platform mechanism 166 of the resist-coating unit (CT) 82 of the foregoing description.In the present embodiment, on the platform 132 that is used for mounting substrate G, be provided with and make the floating substrate float mechanism of substrate G level on the certain altitude position.More detailed point says that the top setting of platform 132 mixes the configuration pattern in a plurality of gas squit holes 254 and a plurality of attractions hole 256 with certain density.Each gas squit hole 254, the vent line 258 that forms via the inside of platform 132 and lead on the gases at high pressure supply source 262 by the platform 132 outside flues 260 that attract.On the other hand, each attracts hole 256, the vent line 264 that forms via the inside of platform 139 and led on the vacuum source 268 by the platform 132 outside flues 266 that attract.Gases at high pressure supply source 262 and vacuum source 268 move under the control of floating control part 270.
In this float mechanism, each the gas squit hole 254 above platform is applied to gases at high pressure below substrate G whole equably to vertical direction ejection and the high-pressure gas pressure of the gravity that surpasses substrate G, and substrate G is flatly floated above platform 132.Also have,, above platform, respectively attract the downward attraction of hole 256 couples of substrate G effect with reaching from the gas pressure of gas squit hole ejection evenly for the location dimension of floating that makes substrate G is held in the only certain position of certain interval S above the destage.The height detection sensor (scheming not shown) etc. of utilizing the gap sensor (scheming not shown) of the size of detector gap S or detecting the height and position of substrate G also can be carried out FEEDBACK CONTROL.Also have, substrate G mounting to platform 132 time, is stopped the running of gases at high pressure supply source 262 and vacuum source 268.
According to present embodiment, owing to carry out resist-coating under the substrate G state floating and handle making from platform 132, even thereby the following or platform 139 of substrate G above adhere to foreign matter, can can not avoid contacting because of this foreign matter makes substrate G protuberance because of caused resist nozzle 134 of the foreign matter under the substrate and substrate G yet.And, even substrate G above adhere to foreign matter, being situated between makes resist nozzle 134 contact with substrate G with this foreign matter, because the pressure that comes with resist nozzle 134 sides makes below the substrate G of float state shifts to, thereby can make the both sides that cause because of contact damage lighter.
In the above-described embodiment, add in the Ministry of worker 28 a coating, comprehensive or the key technologies of each one such as cleaner 128, coating handling part 136, platform cleaner 138, coated film inspection portion 140, nozzle recovery portion 142, platform mechanism 166 and nozzle obstacle monitor 168 below cleaner 126, the substrate above the applied in any combination substrate can obtain action effect these stacks or that multiply each other.But, each key technologies is applied to be coated with separately or individually adds the Ministry of worker 28 and also can obtain independent separately action effect.
In the above-described embodiment, above transporting route 120, disposed by roller cleaner 126 above the substrate, yet also can constitute like this, promptly be installed on the supporting mass 216 of the scanner section 212 of coating in the handling part 136 and on substrate G is cleaned in resist nozzle 134 the place aheads.Perhaps, also platform cleaner 138 can be also used as cleaner 126 above the substrate.
Can constitute like this in the above-mentioned execution mode, be about on the supporting mass 216 of the scanner section 212 that laser injection part 222 in the nozzle obstacle monitor 168 and light accepting part 224 be installed in coating handling part 136 and resist nozzle 134 carries out scanning on the substrate simultaneously.But, also can constitute nozzle obstacle monitor 168 independently with coating handling part 136, before resist-coating is handled beginning, make 168 actions of nozzle obstacle monitor, carry out the scanning of detection of obstacles usefulness laser beam LB as described above with independent scanner section.At this moment, when drawing the monitor result of determination of " unusually ", the resist-coating of this substrate G is handled as long as in coating handling part 136, end by nozzle obstacle monitor 168.
In the above-mentioned execution mode, its formation is, the platform 132 of fixed configurations mounting substrate G, make the laser injection part 222 and the light accepting part 224 that should carry out the required part that relatively moves or scan, for example resist nozzle 134, nozzle obstacle monitor 168 to the substrate G on the platform 132 with scanning driving part, perhaps platform cleaner 138 moves to prescribed direction.But, also can constitute, with opposite relation, these scanning members of fixed configurations move platform 132 side direction prescribed direction with scanning driving part.
In the above-mentioned execution mode, in resist-coating unit (CT) 82, be provided with coated film inspection portion 140, yet also can be arranged on back segment for example among drying under reduced pressure unit (VD) 84.Coated film inspection behind the drying under reduced pressure is handled the drying under reduced pressure of the bad coated film that has spot and have been become futile, however the spot on the coated film because dry back than clearer before the drying, so the advantage that useful image recognition detects easily.
As resist nozzle of the present invention, use in the above-described embodiment to have the slit-type nozzle of slit-shaped ejiction opening, yet also can use the nozzle of trickle diameter type with one or more trickle diameter squit holes.
Above-mentioned execution mode is about the resist-coating device in the coating developing system of making LCD, yet the present invention also can be applied in any application of supplying with coating fluid on processed substrate.As coating fluid of the present invention, except that resist liquid, interlayer dielectic for example, dielectric substance, liquid such as wiring material also can.Processed substrate of the present invention is not limited to the LCD substrate, and other planes show that printed circuit board etc. also can with substrate, semiconductor wafer, CD substrate, glass substrate, photomask.

Claims (28)

1. coating process, at the processed substrate of the 1st height and position approximate horizontal ground supporting, the nozzle that makes the position approaching from the top spray coating fluid above described substrate carries out the scanning of moving relative to horizontal direction with respect to described substrate, the described coating fluid of coating on described substrate is characterized in that:
Before described nozzle scans, penetrate the high light beam of directionality from the laser beam injection part, with the 2nd height and position approximate horizontal cross above the described substrate that is bearing in described the 1st height and position near;
Use across described substrate arrangement and receiving described light beam and be converted to the signal of telecommunication with the opposed locational light accepting part of described light beam injection part;
Based on the described signal of telecommunication of described light accepting part output, the described nozzle that carry out described scanning above described substrate is judged at described the 2nd height and position clear is arranged in fact;
According to described result of determination, select of execution, termination or the interruption of described nozzle to the scanning of described substrate.
2. according to the described coating process of claim 1, it is characterized in that, described substrate in described the 1st height and position mounting on the mounting table of level.
3. according to the described coating process of claim 1, it is characterized in that, add gas pressure, described substrate approximate horizontal ground is floated at described the 1st height and position from the following described undercoat of direction.
4 according to each described coating process of claim 1～3, it is characterized in that, described light beam injection part and described light accepting part are configured in the front side of described nozzle on described scanning direction, and relatively move with respect to described substrate with described nozzle.
5. according to the described coating process of claim 4, it is characterized in that, when drawing in described scanning the result of determination that barrier is in fact arranged in the place ahead of described nozzle, interrupt moving of described nozzle horizontal direction at once.
6. according to the described coating process of claim 4, it is characterized in that, when drawing in described scanning the result of determination that barrier is in fact arranged in the place ahead of described nozzle, described nozzle is risen move to the height and position of regulation.
7. according to claim 1,2,3,5, each described coating process of 6, it is characterized in that, in order to attract to remove the foreign matter that is attached to above the described substrate, above being coated with the described substrate before the described coating fluid, apply pull of vacuum.
8. according to claim 1,2,3,5, each described coating process of 6, it is characterized in that, in order to attract to remove the foreign matter that is attached to below the described substrate, apply pull of vacuum below the described substrate before the described coating fluid being coated with.
9. according to claim 1,2,5, each described coating process of 6, it is characterized in that,, the described mounting table before the described substrate of mounting is applied pull of vacuum in order to attract to remove the foreign matter that is attached to described mounting table.
10. according to the described coating process of claim 7, it is characterized in that, around described pull of vacuum where-used, supply with clean gas.
11. according to claim 1,2,3,5,6, each described coating process of 10, it is characterized in that, above being coated with the later described substrate of described coating fluid, make a video recording, utilize image recognition to judge on the coated film on the described substrate whether have substantial spot.
12. according to the described coating process of claim 11, it is characterized in that, after coated film on the described substrate carried out dried,, utilize image recognition to judge on the coated film on the described substrate whether have substantial spot to making a video recording above the described substrate.
13. according to the described coating process of claim 11, it is characterized in that, when having the result of determination of substantial spot on the coated film on drawing described substrate, be used to make the processing of the coating fluid ejection functional rehabilitation normal condition of described nozzle behind the described end of scan.
14. an apparatus for coating has:
Support at the processed substrate of the 1st height and position approximate horizontal ground supporting;
Be used for the position approaching from the top sprays coating fluid above by the described substrate of described support part supports nozzle;
Be used for above described substrate, carrying out the scanner section of the scanning that described nozzle relatively moves in the horizontal direction with respect to described substrate;
Penetrate the light beam injection part of the high light beam of directionality, with the 2nd height and position approximate horizontal cross by the described substrate of described support part supports above near;
Across described substrate arrangement with the opposed position of described light beam injection part and receive the light accepting part that described Beam Transformation is the signal of telecommunication;
Based on the described signal of telecommunication, the described nozzle judgement that will carry out described scanning above described substrate is had or not the detection unit of barrier in fact at described the 2nd height and position from described light accepting part output; And
According to the result of determination of described detection unit, select to carry out, end or interrupt the scan control section of described nozzle to the scanning of described substrate.
15., it is characterized in that described nozzle has along the trickle diameter ejiction opening that extends with the horizontal direction of the direction approximate vertical of described scanning according to the described apparatus for coating of claim 14.
16., it is characterized in that described support has in described the 1st height and position mounting table of the described substrate of mounting flatly according to claim 14 or 15 described apparatus for coating.
17., it is characterized in that described support has with vacuum adsorption force described substrate is fixed on fixed mechanism on the described mounting table according to the described apparatus for coating of claim 16.
18. according to claim 14 or 15 described apparatus for coating, it is characterized in that, described support has the substrate float mechanism, there are a plurality of gas squit holes in this mechanism, the pressure of the gas that will spray from these gas squit holes towards the top imposes on below the described substrate, and described substrate is floated on described the 1st height and position approximate horizontal ground.
19., it is characterized in that having according to the described apparatus for coating of claim 18:
Attract the hole with a plurality of gases of described gas squit hole mixed configuration;
Attract the hole to attract the attraction mechanism of gas via described gas;
For the height and position that makes described substrate maintains described the 1st height and position, make by described gas squit hole to give the upward pressure of described substrate and attract the hole to give the floating control part of the downward pressure balance of described substrate by described gas.
20. according to claim 14,15,17, each described apparatus for coating of 19, it is characterized in that, support described light beam injection part and described light accepting part along described scanning direction in the position of described nozzle front side, utilize described scanner section to make it to relatively move with respect to described substrate with described nozzle.
21. according to the described apparatus for coating of claim 20, it is characterized in that, has the elevating mechanism that is used to make described nozzle lifting moving, when drawing the result of determination that barrier is in fact arranged in the place ahead of described nozzle by described detection unit in the described scanning, with described elevating mechanism described nozzle is risen at once and move to the height and position of regulation.
22. according to claim 14,15,17,19, each described apparatus for coating of 21, it is characterized in that, in order to attract to remove the foreign matter that is attached to above the described substrate, has the 1st cleaning part that applies pull of vacuum above the described substrate before the described coating fluid to being coated with.
23. according to claim 14,15,17,19, each described apparatus for coating of 21, it is characterized in that, in order to attract to remove the foreign matter that is attached to below the described substrate, has the 2nd cleaning part that applies pull of vacuum below the described substrate before the described coating fluid to being coated with.
24. according to the described apparatus for coating of claim 22, it is characterized in that, have the roller conveyer, described substrate is accepted described pull of vacuum while this roller conveyer carries out to above-mentioned substrate that roller transports with the approximate horizontal attitude passes through near the described cleaning part.
25. according to claim 14,15,17,21, each described apparatus for coating of 24, it is characterized in that, in order to attract to remove the foreign matter that is attached to described mounting table, has the 3rd cleaning part that the described mounting table before the described substrate of mounting is applied pull of vacuum.
26., it is characterized in that described cleaning part comprises the gas supply mechanism of supplying with clean gas around described pull of vacuum where-used according to the described apparatus for coating of claim 22.
27., it is characterized in that having according to claim 14,15,17,19,21, each described apparatus for coating of 24:
To being coated with the image pickup part of making a video recording above the later described substrate of described coating fluid;
Based on the picture signal that obtains by described image pickup part, utilize image recognition to judge on the coated film on the described substrate whether have the detection unit of spot in fact.
28., it is characterized in that having according to the described apparatus for coating of claim 27:
Be used for that described nozzle is applied for the coating fluid ejection functional rehabilitation that makes described nozzle and arrive the nozzle recovery portion of the processing of normal condition;
When on described detection unit draws described substrate, having the result of determination of spot in fact, make described nozzle recovery portion carry out the recovery control part that described recovery is handled.
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TWI272657B (en) 2007-02-01

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