JP3734294B2 - Substrate transfer device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to substrate transport in a substrate processing apparatus for performing each substrate processing (resist coating, pre-baking, exposure, development, post-baking, etc.) of a photolithography process on a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display. The present invention relates to an apparatus, and in particular, a substrate between a processing unit for performing various types of substrate processing such as resist coating before and after exposure processing, baking, and development and an exposure unit for performing exposure processing in a photolithography process. The present invention relates to a substrate transfer device for transferring (delivery).
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a substrate processing apparatus for performing various types of substrate processing in a photolithography process on a substrate performs exposure processing and a processing unit for performing various types of substrate processing before and after the exposure processing in the photolithography process. The exposure unit is divided into two.
[0003]
The processing unit is a spin coater, spin developer, bake unit (hot plate or cool plate) for performing each substrate processing before exposure processing such as resist coating and pre-baking, and each substrate processing after exposure processing such as development and post-baking. Etc.) and a substrate transport robot for transporting the substrate in the processing unit are integrally formed as a unit.
[0004]
The exposure unit performs exposure, for example, an exposure machine such as a reduction projection exposure machine (stepper), an alignment mechanism that performs positioning for printing an exposure pattern in the exposure machine, and transport of a substrate in the exposure unit. The substrate transfer robot and the like for performing the above are integrated into a unit.
[0005]
In the processing procedure by this apparatus, first, the substrate processing before the exposure processing is performed in the processing unit, then the exposure processing is performed in the exposure unit, and the substrate processing after the exposure processing is performed again in the processing unit. Therefore, it is necessary to transfer (deliver) the substrate between the processing unit and the exposure unit, and this type of apparatus includes a substrate transfer device for transferring the substrate between these units. Conventionally, this substrate transport apparatus is configured by integrally unitizing a substrate transport robot, a substrate transfer table, a substrate loading table, a substrate loading table, a buffer unit, and the like. This unit is called an interface unit (hereinafter referred to as “IF unit”).
[0006]
The configuration of a conventional IF unit (substrate transport apparatus) will be described with reference to FIG. FIG. 19A is an overall plan sectional view of a substrate processing apparatus including an IF unit according to a conventional example, and FIG. 19B is a front view of the IF unit according to the conventional example viewed from the processing unit side. FIG. 3C is a side view thereof. In addition, in order to clarify the positional relationship of each figure, XYZ orthogonal coordinates are attached to each figure.
[0007]
Reference numeral 101 in the figure denotes a substrate transfer robot provided in the IF unit 100. The substrate transport robot 101 includes a substrate support unit 102 that supports the substrate W, an X-direction moving mechanism 103 that moves the substrate support unit 102 in the X-axis direction in the figure, and a substrate support unit 102 via the X-direction moving mechanism 103. A Z-direction moving mechanism 104 that moves the substrate support unit 102 in the Y-axis direction in the figure via the Z-direction moving mechanism 104 and the X-direction moving mechanism 103. I have. As a result, the substrate transfer robot 101 places and supports the substrate W on the substrate support unit 102 and moves the substrate W in the X, Y, and Z axis directions (in the three-dimensional space), and the substrate transfer table 110 and the substrate carry-in The substrate W is configured to be transferred (delivered) between the base 111, the substrate carry-out stand 112, and an arbitrary storage shelf 113 a (each position) of the buffer unit 113.
[0008]
The substrate transfer table 110 is a table for transferring the substrate W to and from the processing unit 2 (the substrate transfer robot 23 in the processing unit 2). The substrate transfer table 111 and the substrate transfer table 112 are the exposure unit 4. This is a table for transferring the substrate W (carrying in and out of the exposure unit 4) to / from the substrate transfer robot (not shown).
[0009]
Note that reference numeral 4 a in FIG. 19B indicates that the substrate transport robot in the exposure unit 4 that supports the substrate W passes when the substrate W is transferred between the exposure unit 4 and the IF unit 100. It is an opening. Although not shown, when the substrate W is transferred between the processing unit 2 and the IF unit 100, an opening through which the substrate transport robot 23 in the processing unit 2 that supports the substrate W passes is also processed. It is provided between the unit 2 and the IF unit 100.
[0010]
The buffer unit 113 includes a plurality of storage shelves 113a for temporarily storing a plurality of substrates W, and a time difference occurs between the processing time in the processing unit 2 and the processing time in the exposure unit 4. Is provided for temporarily storing the substrate W.
[0011]
The processing time in the exposure unit 4 is roughly determined by the time required for printing the exposure pattern by the exposure machine, the time required for transporting the substrate W in the exposure unit 4, and the time required for positioning the substrate W. Among these, the processing time of the former two is substantially constant, but the time required for positioning varies.
[0012]
On the other hand, the processing time in the processing unit 2 is approximately the processing time required for each substrate processing such as resist coating, pre-baking, developing, and post-baking before and after the exposure processing performed in the processing unit 2 and the substrate in the processing unit 2. These processing times are substantially constant. Further, the substrate transfer robot 23 in the processing unit 2 converts the substrate W (hereinafter referred to as “pre-exposure substrate”) W for which processing to be performed before the exposure processing is completed according to the processing time in the exposure unit 4 into the IF unit 100. To the substrate transport robot in the exposure unit 4 and a substrate (hereinafter referred to as “exposed substrate”) W that has been subjected to the exposure process transferred from the exposure unit 4 via the IF unit 100 is processed in the processing unit. 2 is taken in. Generally, the timing of sending the pre-exposure substrate W to the IF unit 100 by the substrate transport robot 23 in the processing unit 2 and the timing of taking the exposed substrate W into the processing unit 2 are generally the substrate W in the exposure unit 4. Is determined based on the exposure processing time (average exposure processing time) in the exposure unit 4 with the average positioning time as the positioning time.
[0013]
If exposure processing is performed on the exposure unit 4 side in accordance with the above average exposure processing time, transport (delivery) of the pre-exposure substrate W sent from the processing unit 2 and carried into the exposure unit 4 via the IF unit 100, Transport (delivery) of the exposed substrate W carried out of the exposure unit 4 and taken into the processing unit 2 via the IF unit 100 is performed smoothly. However, as described above, since the positioning time of the substrate W in the exposure unit 4 varies, there are cases where the transfer of the pre-exposure substrate W and the transfer of the exposed substrate W is not performed smoothly.
[0014]
For example, when a certain pre-exposure substrate W is carried into the exposure unit 4 and the positioning takes a longer time than the average positioning time, the next pre-exposure substrate W is transferred from the processing unit 2 to the IF unit 100. Even if it is sent out, since the pre-exposure substrate W carried in before is exposed in the exposure unit 4, the substrate transfer robot 101 in the IF unit 100 uses the pre-exposure substrate W in the exposure unit 4. The transfer to the substrate transfer robot cannot be performed, and the transfer of the substrate W in the IF unit 100 is stopped.
[0015]
Further, the exposure process in the exposure unit 4 is not performed in the average exposure process time, and the timing of unloading the exposed substrate W from the exposure unit 4 to the IF unit 100 and the IF unit by the substrate transport robot 23 in the processing unit 2. When a deviation occurs in the timing of taking the exposed substrate W from 100 into the processing unit 2, the substrate transfer robot 101 in the IF unit 100 does not have to move the exposed substrate W out of the exposure unit 4. The substrate W cannot be transferred to the substrate transfer robot 23 in the processing unit 2, and the transfer of the substrate W in the IF unit 100 is also stopped there.
[0016]
If the transport of the substrate W in the IF unit 100 stagnates in this way, a series of processes in the processing unit 2 and a series of processes in the exposure unit 4 are stagnation, and as a result, the throughput of the entire substrate processing apparatus decreases. End up.
[0017]
Therefore, in the conventional apparatus, the buffer unit 113 is provided in the IF unit 100 and, as will be described later, the pre-exposure substrate W is transferred to the substrate transfer robot in the exposure unit 4 and the substrate transfer robot 23 in the processing unit 2 is transferred. When the exposed substrate W cannot be delivered, the substrate W is temporarily stored in the storage shelf 113a of the buffer unit 113, thereby preventing the stagnation of the transport of the substrate W in the IF unit 100.
[0018]
The substrate transfer operation in the conventional IF unit 100 is as follows according to the processing procedure of the entire substrate processing apparatus described above.
[0019]
First, the substrate transfer robot 23 in the processing unit 2 places the pre-exposure substrate W on the substrate transfer table 110. The substrate transfer robot 101 in the IF unit 100 raises the substrate support unit 102 from below the substrate W placed on the substrate transfer table 110 (moves in the Z-axis direction), thereby moving the substrate W to the substrate support unit 102. The substrate support unit 102 is appropriately moved in the X-axis, Y-axis, and Z-axis directions, and the substrate support unit 102 is lowered (moved in the Z-axis direction) from above the substrate carry-in table 111 to receive the substrate. W is placed on the substrate loading table 111. The pre-exposure substrate W placed on the substrate carry-in table 111 is taken into the exposure unit 4 by the substrate transfer robot in the exposure unit 4.
[0020]
In the above-described transfer operation of the pre-exposure substrate W, for example, it takes a long time to position the pre-exposure substrate W carried into the exposure unit 4 (carrying in the previous time), and the exposure process time is the average exposure process time In the case where the length is longer, the substrate transfer robot 101 places the pre-exposure substrate W placed on the substrate carry-in table 111 in the previous transfer of the pre-exposure substrate W on the substrate carry-in table 111 without carrying it into the exposure unit 4. Therefore, the substrate transfer robot 101 cannot place the pre-exposure substrate W received this time from the substrate transfer robot 23 in the processing unit 2 on the substrate transfer table 111. In such a case, the substrate transport robot 101 temporarily stores the pre-exposure substrate W in an arbitrary storage shelf 113a of the buffer unit 113. Then, when the pre-exposure substrate W placed on the substrate carry-in table 111 is taken into the exposure unit 4 by the substrate carrying robot in the exposure unit 4 and the substrate carry-in table 111 becomes empty, the substrate carrying robot 101 is The pre-exposure substrate W stored in the buffer unit 113 is taken out and placed on the substrate carry-in table 111. As a result, even when the exposure process in the exposure unit 4 is delayed, the transport of the substrate W in the IF unit 100 does not stagnate, and the substrate W is placed on the substrate delivery table 110 for a long time. Instead, the IF unit 100 can receive the pre-exposure substrate W sent out from the processing unit 2 at a fixed timing.
[0021]
The exposed substrate W that has undergone the exposure processing in the exposure unit 4 is unloaded from the exposure unit 4 by the substrate transfer robot in the exposure unit 4 and placed on the substrate unloading table 112. The substrate transfer robot 101 in the IF unit 100 raises the substrate support unit 102 from below the substrate W placed on the substrate carry-out stand 112, thereby receiving and supporting the substrate W on the substrate support unit 102. The substrate W is placed on the substrate delivery table 110 by moving the unit 102 appropriately in the X-axis, Y-axis, and Z-axis directions and lowering the substrate support unit 102 from above the substrate delivery table 110. The exposed substrate W placed on the substrate delivery table 110 is taken into the processing unit 2 by the substrate transfer robot 23 in the processing unit 2.
[0022]
In the transfer operation of the exposed substrate W described above, the exposure process in the exposure unit 4 is not performed in the average exposure process time, and the timing of carrying out the exposed substrate W from the exposure unit 4 to the IF unit 100 and the processing unit 2 When a deviation occurs in the timing of taking the exposed substrate W from the IF unit 100 into the processing unit 2 by the substrate transport robot 23 in the inside, the exposed substrate W (previously transferred to the substrate delivery table 110 (in some cases) In some cases, the pre-exposure substrate W) remains placed. At this time, the substrate transfer robot 101 places the substrate W received this time from the substrate transfer robot in the exposure unit 4 on the substrate transfer table 110. Can not do it. Even in such a case, the substrate transfer robot 101 temporarily stores the substrate W in an arbitrary storage shelf 113 a of the buffer unit 113, and the substrate W placed on the substrate transfer table 110 is stored in the processing unit 2. When the substrate transfer table 110 becomes empty due to being taken into the processing unit 2 by the substrate transfer robot 23, the substrate transfer robot 101 takes out the exposed substrate W stored in the buffer unit 113, and the substrate transfer table 110. Thereby, even if the exposure processing time in the exposure unit 4 varies, the transport of the substrate W in the IF unit 100 does not stagnate and the substrate W is placed on the substrate carry-out table 110 for a long time. Thus, the exposed substrate W can be smoothly carried out from the exposure unit 4 to the IF unit 100 without being left as it is.
[0023]
[Problems to be solved by the invention]
However, the conventional example having such a configuration has the following problems.
In the IF unit 100 according to the conventional example, the buffer unit 113 is provided in consideration of the time difference between the processing time in the processing unit 2 and the processing time in the exposure unit 4, but for positioning the substrate W in the exposure unit 4. The time required generally tends to vary for each substrate W, and therefore the buffer unit 113 is frequently used. That is, in most cases, the substrate transfer robot 101 in the IF unit 100 temporarily transfers the pre-exposure substrate W from the substrate transfer table 110 to the buffer unit 113 and then transfers the substrate W from the buffer unit 113 to the substrate transfer table 111. Similarly, in the transfer of the exposed substrate W, the transfer from the substrate carry-out table 112 to the substrate transfer table 110 once passes through the buffer unit 113. Thus, in the conventional configuration, the position for delivering the substrate W by the substrate transfer robot 101 in the IF unit 100 in order to cope with the time difference between the processing time in the processing unit 2 and the processing time in the exposure unit 4. The number increases as much as it passes through the buffer unit 113, and it is difficult to shorten the time required for transporting the substrate W itself.
[0024]
Further, as shown in FIG. 19A, the conventional processing unit 2 includes a first device placement unit 21 (usually a spin coater, a spin developer, etc.) and a second device placement unit 22 ( As shown in FIG. 19, the substrate transfer table 110 of the IF unit 100 is provided with a transfer path 24 of the substrate transfer robot 23 in the processing unit 2. Is arranged near the center in the Y-axis direction in the figure. That is, since the substrate transfer table 110 is disposed within the movement area of the substrate transfer robot 101, for example, the buffer unit disposed on the opposite side of the substrate transfer table 111 and the substrate transfer table 112 with the substrate transfer table 110 interposed therebetween. When the substrate W is transferred between the substrate 113 and the substrate carry-in table 111 or the substrate carry-out table 112, the substrate transfer robot 101 may have to move while avoiding the substrate transfer table 110. Therefore, shortening of the transfer time of the substrate W in the IF unit 100 is hindered.
[0025]
The substrate transfer in the IF unit 100 may be performed within the timing at which the substrate W is delivered between the processing unit 2 and the exposure unit 4. The delivery timing of the substrate W between the processing unit 2 and the exposure unit 4 roughly depends on the average exposure processing time in the exposure unit 4. Since the average exposure processing time in the exposure unit 4 has conventionally been relatively low, about 60 seconds / one substrate, in the IF unit 100 as in the substrate transfer device in the IF unit 100 according to the conventional example. Even if there is a large number of substrate delivery positions or a wasteful operation that avoids the substrate delivery table 110 occurs, the substrate transfer in the IF unit 100 is carried out between the processing unit 2 and the exposure unit 4. It was possible to do it within the timing, and it was not a big problem.
[0026]
However, in recent years, an exposure unit 4 having an average exposure processing time of 40 seconds / one substrate to 30 seconds / one substrate has been provided. In the processing unit 2, for example, the processing time in the processing unit 2 can be increased by optimizing the transfer operation by the substrate transfer robot 23, and the exposure processing time in the exposure unit 4 is increased. However, it can be followed to some extent. However, when the IF unit 100 according to the conventional example is used as the IF unit of the substrate processing apparatus in which the exposure unit 4 which is accelerated as described above and the processing unit 2 which follows the exposure unit 4 is incorporated, as described above, the IF unit Since it is difficult to shorten the transfer time of the substrate W in the 100, the transfer of the substrate in the IF unit 100 is delayed compared to the delivery timing of the substrate W between the processing unit 2 and the exposure unit 4. Has occurred. When the substrate transport in the IF unit 100 is delayed as described above, the substrate processing before the exposure processing (performed in the processing unit 2) from the exposure processing to the next substrate after the exposure processing is performed. The flow of processing during processing (performed in the processing unit 2) cannot be performed smoothly. As a result, the overall throughput of the substrate processing apparatus is high despite the high-speed processing performed by the exposure unit 4 and the processing unit 2. There is an inconvenience that it is not converted into a standard. Further, no IF unit (substrate transport apparatus) that can follow the delivery timing of the substrate W between the exposure unit 4 that has been speeded up as described above and the processing unit 2 that has followed the exposure unit 4 has been proposed and proposed. Is the actual situation.
[0027]
The present invention has been made in view of such circumstances, and it is possible to increase the speed of substrate transport itself in the interface unit while accommodating the time difference between the processing time in the processing unit and the processing time in the exposure unit. An object of the present invention is to provide a substrate transfer apparatus that achieves the above.
[0028]
[Means for Solving the Problems]
In order to achieve such an object, the present invention has the following configuration.
That is, according to the first aspect of the present invention, a substrate is transported (delivered) between a processing unit for performing various types of substrate processing before and after exposure processing and an exposure unit for performing exposure processing in a photolithography process. In the substrate transfer apparatus for carrying out the above, a plurality of storage portions that can temporarily store a plurality of substrates are provided, While dividing the plurality of storage portions into a region for storing a pre-exposure substrate and a region for storing an exposed substrate, The substrate is transferred between the processing unit and a substrate storage unit capable of storing / removing a substrate from / to the plurality of storage units from two different directions, and to any storage unit of the substrate storage unit The substrate is transferred between the exposure unit and the first substrate transfer means for storing / removing the substrate before and after the exposure processing from one side, and the other with respect to an arbitrary storage portion of the substrate storage portion. And a second substrate transfer means for storing / removing the substrate before and after the exposure processing from the side.
[0029]
According to a second aspect of the present invention, in the substrate transfer apparatus according to the first aspect, the plurality of storage portions of the substrate storage portion are formed in a multi-tiered manner in the vertical direction, and the first substrate transfer means Includes substrate transfer means for transferring the substrate to and from the processing unit, and supports the substrate to extend and contract in the horizontal direction to store / take out the substrate to / from an arbitrary storage portion of the substrate storage portion. The substrate storing / removing means and a vertical moving means for moving the substrate storing / removing means in the vertical direction are configured, and the second substrate transport means supports the substrate and expands and contracts in the horizontal direction. In addition to storing / removing a substrate to / from an arbitrary storage portion of the substrate storage portion, placing / removing a substrate with respect to a substrate loading / unloading base for delivering the substrate to / from the exposure unit. The line Substrate storage / removal means, rotation means for rotating the substrate storage / removal means in the vertical direction, vertical movement means for moving the substrate storage / removal means in the vertical direction, and the substrate storage / removal means horizontally. The first substrate transport means, the substrate storage unit, and the second substrate transport means in that order, and the second substrate transport means in that order. The substrate loading / unloading base is arranged along the movement direction of the one-axis direction moving means, and is arranged in a substantially straight line parallel to the movement direction of the one-axis direction moving means. To do.
[0030]
[Action]
The operation of the present invention is as follows.
In the transfer of the pre-exposure substrate from the processing unit to the exposure unit according to the first aspect of the invention, the first substrate transfer means receives the pre-exposure substrate from the processing unit, and the substrate is stored in an arbitrary storage portion of the substrate storage portion. From one side And the second substrate transfer means removes the substrate from the substrate storage portion. From the other side This is done by handing it over to the take-out exposure unit. When the exposure processing in the exposure unit is prolonged and the pre-exposure substrate received from the processing unit cannot be subsequently transferred to the exposure unit, the first substrate transport means transfers the pre-exposure substrate received thereafter to another storage unit. From one side When the second substrate transport means is capable of delivering the pre-exposure substrate to the exposure unit, the substrate storage unit The other side of The pre-exposure substrate is taken out and transferred to the exposure unit.
[0031]
In addition, when the exposed substrate is transferred from the exposure unit to the processing unit, the second substrate transfer means receives the exposed substrate from the exposure unit and places the substrate in an arbitrary storage portion of the substrate storage portion. From the other side The first substrate transport means is stored in the substrate storage section. From one side The substrate is taken out from the substrate and transferred to the processing unit. Also in this case, when the transfer of the substrate to the processing unit cannot be performed smoothly, the substrate is temporarily stored in one or a plurality of storage portions of the substrate storage portion.
[0032]
The operation of the second aspect of the invention is as follows.
For transporting the pre-exposure substrate from the processing unit to the exposure unit, first, the substrate delivery means constituting the first substrate transport means receives the pre-exposure substrate from the processing unit, and the substrate storage / constituting the first substrate transport means The take-out means is supported. The vertical movement means constituting the first substrate transfer means moves the substrate storage / removal means in the vertical direction, and the position of the substrate storage / removal means in the vertical direction is about to store the substrate. It adjusts according to the position of the vertical direction of the predetermined | prescribed storage part of a storage part. The substrate storage / removal means supports the substrate and expands and contracts in the horizontal direction to store the substrate in a predetermined storage portion of the substrate storage portion.
[0033]
Next, the rotating means constituting the second substrate transporting means can accommodate the substrate so that the horizontal direction of the substrate storing / extracting means constituting the second substrate transporting means can be expanded and contracted with respect to the substrate housing part. / Rotate the take-out means around the vertical. The vertical movement means constituting the second substrate transport means moves the substrate storage / removal means in the vertical direction to adjust the position of the substrate storage / removal means in the vertical direction. The take-out means is expanded and contracted to take out the substrate stored by the first substrate transfer means from the predetermined storage portion of the substrate storage portion. Further, the uniaxial moving means constituting the second substrate transporting means moves the substrate storing / extracting means supporting the taken out substrate in the horizontal uniaxial direction, and is arranged along this moving direction. Stop in front of the board loading / unloading base. Then, the substrate storing / removing means is rotated in the vertical direction so that the rotating means can expand and contract the substrate storing / removing means in the horizontal direction with respect to the substrate loading / unloading base. / The vertical position of the take-out means is adjusted according to the vertical position of the substrate carry-in / out table, the substrate storage / take-out means is expanded and contracted, and the substrate is placed on the substrate carry-in / out table. The substrate placed on the substrate carry-in / out table is taken into the exposure unit by a substrate transfer robot or the like in the exposure unit.
[0034]
Note that either the rotation around the vertical or the movement in the vertical direction with respect to the substrate storage / removal means when the substrate is taken out from the substrate storage portion by the second substrate transfer means may be performed first. What is the movement in the horizontal uniaxial direction, the rotation around the vertical, and the movement in the vertical direction with respect to the substrate storing / removing means between the time when the substrate is taken out and the time when the substrate is placed on the substrate carry-in / out table? You may carry out in order.
[0035]
In addition, the transfer of the exposed substrate from the exposure unit to the processing unit according to the second aspect of the invention is performed in substantially the reverse operation to the transfer of the pre-exposure substrate from the processing unit to the exposure unit described above. The exposed substrate is unloaded from the exposure unit by a substrate transfer robot in the exposure unit and placed on a substrate loading / unloading table.
[0036]
In the second aspect of the invention, the first substrate transport unit, the substrate storage unit, and the second substrate transport unit are arranged in this order in parallel with the moving direction of the uniaxial moving unit of the second substrate transport unit. Since the substrate loading / unloading base is disposed along the moving direction of the uniaxial moving means, the substrate storing / removing of the substrate with respect to the substrate storing portion by the first substrate transporting means, Substrate storage / removal with respect to the substrate storage portion by the second substrate transfer means and movement in the horizontal one-axis direction can be performed along a substantially straight line. The substrate transfer apparatus according to the present invention is formed as a unit (interface unit). According to the present invention, the unit can be formed long in the horizontal one-axis direction. The interface unit (IF unit) is arranged between the processing unit and the exposure unit. For example, when the processing unit, the IF unit, and the exposure unit are arranged in one horizontal axis, the longitudinal direction of the IF unit is processed. If each unit is arranged perpendicular to the arrangement direction of the unit, IF unit, and exposure unit, the interval between the processing unit and the exposure unit can be reduced, so the width from the processing unit to the exposure unit is reduced. The floor area utilization efficiency of the unit is improved.
[0037]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings.
<First embodiment>
FIG. 1 is a plan sectional view showing the entire configuration of a substrate processing apparatus including a substrate transfer apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic configuration near the buffer section of the first embodiment apparatus. FIG. 3 is a front view of the first embodiment apparatus as viewed from the exposure unit side. Each figure after FIG. 1 is attached with an XYZ orthogonal coordinate system in order to clarify the positional relationship.
[0038]
In the present embodiment, the second embodiment described later, and various modifications, an example in which the present invention is applied to a substrate processing apparatus for performing each substrate processing in a photolithography process on a semiconductor wafer (substrate) is an example. However, the present invention can be similarly applied to a substrate processing apparatus for various substrates such as a glass substrate for a liquid crystal display.
[0039]
As shown in FIG. 1, a substrate processing apparatus to which a substrate transfer apparatus according to the present invention is applied includes an indexer 1, a processing unit 2, an interface unit (IF unit) 3, an exposure unit 4, and the like.
[0040]
The indexer 1 includes a carry-in / out table 11 for delivering the carrier C to / from an automatic carrier conveyance device (Auto Guided Vehicle: hereinafter referred to as “AGV”) 5, and a carrier C mounted on the carry-in / out table 11. A substrate carry-in / out robot 12 for delivering a substrate W to / from a substrate transfer robot 23 in the processing unit 2 to be described later is provided.
[0041]
The processing unit 2 includes a first device placement unit 21, a second device placement unit 22, and a transport path 24 for the substrate transport robot 23. A plurality of spin coaters SC for performing resist coating, spin developers SD for performing development, and the like are disposed in the first apparatus placement portion 21 along the X-axis direction of FIG. The second apparatus placement unit 22 is provided with a bake unit BU for performing pre-bake, post-bake, and the like, and a plurality of edge exposure units EEW. The bake unit BU includes a baking device for heating the substrate W to a predetermined temperature, and a cooling device for cooling the heated substrate W to near room temperature, each of which includes a plurality of baking devices and cooling devices, They are arranged two-dimensionally in the X-axis direction and the vertical direction (the Z-axis direction orthogonal to the X and Y axes and the direction perpendicular to the paper surface of FIG. 1). In the present embodiment, the substrate delivery for delivering the substrate W to the first substrate transfer robot 31 in the IF unit 3 to be described later is provided near the end of the second device placement unit 22 on the IF unit 3 side. A stand 25 is provided. A plurality of substrate support pins 25a are fixedly erected in the vertical direction on the substrate delivery table 25, and the substrate W is placed on these substrate support pins 25a to deliver the substrate W.
[0042]
A transfer path 24 of the substrate transfer robot 23 is provided between the first and second apparatus placement units 21 and 22. As shown in FIGS. 1 and 4, the substrate transfer robot 23 includes a horseshoe-shaped hand 23 b having a plurality of protrusions 23 a for placing and supporting the substrate W, and the hand 23 b in the horizontal direction (XY plane). An expansion / contraction part 23c for extending / contracting, a rotation part 23d for rotating the hand 23b around the Z axis via the expansion / contraction part 23c, and a Z-direction moving part for moving the hand 23b in the Z-axis direction via the expansion / contraction part 23c, the rotation part 23d. 23e, and an X-direction moving part 23f that moves the hand 23b in the X-axis direction via the expansion / contraction part 23c, the rotating part 23d, and the Z-direction moving part 23e. The telescopic part 23c, the Z-direction moving part 23e, and the X-direction moving part 23f are configured by a well-known one-axis direction moving mechanism including a screw shaft 23g, a motor 23h, and a guide shaft 23i, and the rotating part 23d is configured by a motor 23j. ing.
[0043]
The substrate transfer robot 23 is a combination of rotation of the hand 23b around the Z axis, movement in the X and Z axis directions, and expansion and contraction operations as appropriate, so that the spin coater SC, spin developer SD, bake device, cooling device, edge exposure unit Access to a processing apparatus such as EEW (loading / unloading operation of the substrate W with respect to each apparatus), placement / removal of the substrate W with respect to the substrate transfer table 25, transfer of the substrate W between the apparatuses in the processing unit 2, etc. To do.
[0044]
For example, when the substrate W is carried into the cooling device CA shown in the longitudinal section of FIG. First, the hand 23b is appropriately moved in the X-axis direction and the Z-axis direction, the hand 23b is positioned in front of the target cooling device CA, and the hand 23b is expanded and contracted in the cooling device CA direction by the rotation of the hand 23b around the Z-axis. It can be so. Next, the hand 23b is inserted into the cooling device CA from the substrate loading / unloading port io of the cooling device CA, and the substrate W placed and supported on the hand 23b is inserted into the cooling device CA. Elevating pins ZP are provided in the cooling device CA, and the elevating pins ZP are raised to receive the substrate W from the hand 23b. Then, after the delivery of the substrate W, the hand 23b is withdrawn from the cooling device CA. Next, the substrate W received by lowering the lift pins ZP is placed on the cool plate CP, and cooling of the substrate W is started. The unloading of the substrate W from the cooling device CA is performed in an operation reverse to the operation at the time of loading. The operation of the substrate transfer robot 23 when accessing other processing apparatuses is substantially the same as the above-described operation. In addition, the code | symbol BA in Fig.4 (a) has shown the baking apparatus.
[0045]
As shown in FIG. 4B, when the substrate W is placed on the substrate delivery table 25, first, the movement of the hand 23b in the X-axis direction and the Z-axis direction and the movement around the Z-axis are performed as described above. The hand 23b can be expanded and contracted above the substrate transfer table 25 by appropriately rotating. Next, the hand 23 b is extended in the direction of the substrate delivery table 25, and the substrate W placed and supported is positioned slightly above the substrate support pins 25 a of the substrate delivery table 25. Then, the hand 23b is lowered in the Z-axis direction, the substrate W is placed on the substrate support pin 25a and delivered, and the hand 23b is retreated at a position where it is slightly lowered. The substrate W placed on the substrate delivery table 25 is taken out by lifting the substrate W from the lower side of the substrate W placed on the substrate delivery table 25 by the operation reverse to the above.
[0046]
In the processing unit 2, a processing liquid supply unit for supplying a processing liquid such as a resist solution, a chemical solution, a developing solution, and a cleaning solution to the spin coater SC and the spin developer SD, and a storage unit for storing the processing liquid (whicheverever (Not shown) and the like. The processing unit 2 is configured by unitizing the above-described elements.
[0047]
The IF unit 3 is a portion corresponding to the substrate transfer apparatus according to the present invention. As shown in FIGS. 1 to 3, the IF substrate 3 includes a first substrate transfer robot 31, a buffer unit 32, a second substrate transfer robot 33, and a substrate. The carry-in table 34 and the substrate carry-out table 35 are integrally formed as a unit. In the present embodiment, the IF unit 3 is also provided with two table bases 37a and 37b for setting the first and second cassettes 36a and 36b, respectively.
[0048]
The first substrate transport robot 31 includes a Z-direction drive unit 31a, a connecting member 31b, a rotation drive unit 31c, a telescopic drive unit 31d, a substrate support unit 31e, and the like.
[0049]
The Z-direction drive unit 31a is fixed to the lower surface of the IF unit 3, a screw shaft 31aa is provided to be rotatable in the Z-axis direction, and a guide shaft (not shown) is provided in parallel to the screw shaft 31aa. A motor 31ab that rotates the screw shaft 31aa in the forward and reverse directions is also provided.
[0050]
The base end portion of the connecting member 31b is screwed to the screw shaft 31aa in the Z-direction drive portion 31a and is slidably fitted to the guide shaft. By rotating the screw shaft 31aa in the forward and reverse directions, The connecting member 31b is configured to move in the Z-axis direction (up and down in the vertical direction). In addition, a rotation drive unit 31c is fixed to the tip of the connecting member 31b.
[0051]
The rotation drive unit 31c is provided with a rotation shaft 31ca provided thereon so as to be rotatable in the Z-axis (vertical) direction, and a motor 31cb for rotating the rotation shaft 31ca in the forward and reverse directions is provided therein.
[0052]
A telescopic drive unit 31d is fixed to the tip of the rotary shaft 31ca. A timing belt 31db driven by a motor 31da is provided in the telescopic drive unit 31d. A base end portion of the substrate support portion 31e is connected to a part of the timing belt 31db, and the timing support belt 31db is driven to extend and retract the substrate support portion 31e with respect to the expansion / contraction drive portion 31d. Yes. In addition, by rotating the rotation shaft 31ca of the rotation drive unit 31c in the forward and reverse directions, the expansion / contraction drive unit 31d and the substrate support unit 31e are rotated around the Z axis (vertical), and in the XY plane (horizontal plane). The substrate support portion 31e is configured to be extendable and contractable in an arbitrary direction. Further, by rotating the screw shaft 31aa of the Z-direction drive unit 31a in the forward and reverse directions, the Z-axis (vertical) for extending and contracting the substrate support unit 31e via the connecting member 31b, the rotation drive unit 31c, and the expansion / contraction drive unit 31d. The height of the direction is adjustable.
[0053]
Further, the expansion / contraction drive unit 31d is positioned in front of the substrate transfer table 25 in the X-axis direction so that the substrate support unit 31e can expand and contract with respect to the substrate transfer table 25 in the processing unit 2 and the buffer unit 32 described later. It is arrange | positioned in the Y-axis direction front. Further, the Z-direction drive unit 31a is connected to the expansion / contraction drive unit 31d or the rotation drive via the connecting member 31b so that the expansion / contraction drive unit 31d can rotate around the Z-axis even when the expansion / contraction drive unit 31d is lowered in the Z-axis direction. It arrange | positions in the position shifted | deviated from the downward direction of the part 31c.
[0054]
With the above configuration, the first substrate transfer robot 31 places / takes out the substrate W from / to the substrate delivery table 25 in the processing unit 2 and stores / takes out the substrate W from / to an arbitrary storage shelf 32a of the buffer unit 32 described later. Do. 3 is an opening through which the first substrate transport robot 31 supporting the substrate W passes when the substrate W is transferred between the processing unit 2 and the IF unit 3.
[0055]
The placement / removal of the substrate W with respect to the substrate delivery table 25 is performed with the expansion / contraction direction of the substrate support 31e set in the direction of the substrate delivery table 25. The placement / removal of the substrate W at this time is performed by the processing unit 2 described above. The same operation as the placement / removal of the substrate W with respect to the substrate transfer table 25 by the substrate transfer robot 23 is performed.
[0056]
Further, the substrate W is stored in an arbitrary storage shelf 32a of the buffer unit 32 as shown in FIG. First, the rotation direction of the substrate support portion 31e is directed toward the buffer portion 32 by the rotation drive portion 31c, and the height is adjusted in the Z-axis (vertical) direction of the storage shelf 32a of the buffer portion 32 where the substrate W is to be stored. The height of the substrate support portion 31e is adjusted by the Z direction drive portion 31a. Either rotation or height adjustment may be performed first. Next, the substrate W that is supported by extending the substrate support portion 31e is inserted into the intended storage shelf 32a, and the substrate support portion 31e is lowered in the Z direction by the Z-direction drive portion 31a so that the substrate W is lowered. The descent of the substrate support 31e is stopped at a position where the back surface of the stored substrate W is not in contact with the substrate support 31e. And the board | substrate support part 31e is withdrawn from the storage shelf 32a, and the accommodation of the board | substrate W to arbitrary storage racks 32a is complete | finished. Further, the removal of the substrate W from the arbitrary storage shelf 32a of the buffer unit 32 is performed by reversing the operation of storing the substrate W, and the substrate W is lifted from below the substrate W storing the substrate support unit 31e. It is done.
[0057]
The first substrate transfer robot 31 corresponds to the first substrate transfer means in the present invention, and the expansion / contraction drive part 31d and the substrate support part 31e are the substrate storing / extracting means of the first substrate transfer means in the present invention. The substrate storing / removing means and the rotation driving portion 31c constitute the substrate delivery means of the first substrate transport means in the present invention, and the Z direction driving portion 31a is the first substrate transport means in the present invention. A vertical movement means is comprised.
[0058]
The buffer unit 32 is disposed at a position between the first substrate transport robot 31 and a second substrate transport robot 33 described later, and is supported on the inner surface of the IF unit 3. A plurality of (for example, 50) storage shelves 32 a are stacked and formed in a multistage shape in the Z-axis (vertical) direction in the buffer unit 32. Each storage shelf 32a has an opening facing the first substrate transfer robot 31 and a second substrate transfer robot 33 described later. The first and second substrate transfer robots 31 and 33 are open. The substrate W can be accommodated / removed. The buffer unit 32 corresponds to the substrate storage unit in the present invention, and the storage shelf 32a corresponds to the storage unit of the substrate storage unit in the present invention.
[0059]
The second substrate transfer robot 33 includes a Y-direction drive unit 33a, a first connection member 33b, a Z-direction drive unit 33c, a second connection member 33d, a rotation drive unit 33e, a telescopic drive unit 33f, a substrate support unit 33g, and the like. It consists of
[0060]
The Y-direction drive unit 33a is fixed to the inner surface of the IF unit 3, a screw shaft 33aa is rotatably provided in the Y-axis direction, a guide shaft 33ab is provided in parallel to the screw shaft 33aa, and a screw A motor 33ac that rotates the shaft 33aa in the forward and reverse directions is also provided. The Y-direction drive unit 33a moves the expansion / contraction drive unit 33f and the substrate support unit 33g of the second substrate transport robot 33 between the front surface in the Y-axis direction of the buffer unit 32 and the front surface in the X-axis direction of the substrate loading table 34 described later. It is arranged to be movable between.
[0061]
The base end portion of the first connecting member 33b is screwed to the screw shaft 33aa in the Y-direction drive portion 33a and is slidably fitted to the guide shaft 33ab so that the screw shaft 33aa is moved in the forward and reverse directions. The first connecting member 33b is configured to move in the Y-axis direction (horizontal one-axis direction) by rotating. In addition, a Z-direction drive portion 33c is fixed to the distal end portion of the first connecting member 33b.
[0062]
The Z-direction drive unit 33c, the second connecting member 33d, the rotation drive unit 33e, the telescopic drive unit 33f, and the substrate support unit 33g of the second substrate transfer robot 33 are the Z-direction drive unit of the first substrate transfer robot 31. 31a, the connection member 31b, the rotation drive part 31c, the expansion-contraction drive part 31d, and the board | substrate support part 31e have the same structure, and perform the same operation | movement. In other words, the substrate support portion 33g can be expanded and contracted with respect to the expansion / contraction drive portion 33f, and the rotation drive portion 33e rotates the expansion / contraction drive portion 33f and the substrate support portion 33g around the Z axis (vertical), thereby obtaining an XY plane (horizontal plane). The substrate support portion 33g can be expanded and contracted in any direction. Further, the height in the Z-axis (vertical) direction in which the substrate support portion 33g is expanded and contracted via the second connecting member 33d, the rotation driving portion 33e, and the expansion / contraction driving portion 33f can be adjusted by the Z-direction driving portion 33c. Further, in the second substrate transport robot 33, the Y-direction drive unit 33a and the telescopic drive unit 33f through the first connection member 33b, the Z-direction drive unit 33c, the second connection member 33d, and the rotation drive unit 33e The position of the substrate support portion 33g in the Y-axis direction can be displaced.
[0063]
With the above configuration, the second substrate transfer robot 33 stores / takes out the substrate W from / to an arbitrary storage shelf 32 a of the buffer unit 32, places the substrate W on the substrate loading table 34, and loads the substrate W from the substrate unloading table 35. And the storage / extraction of the substrate W with respect to cassettes 36a and 36b described later.
[0064]
The storage / removal of the substrate W to / from the arbitrary storage shelf 32a of the buffer unit 32 is performed by setting the expansion / contraction direction of the substrate support unit 33g to the buffer unit 32 direction and adjusting the height of the storage shelf 32a to be stored / removed. Further, the height of the substrate support portion 33g in the Z-axis direction is adjusted, and the storage / removal of the substrate W at this time is also performed by an arbitrary storage shelf 32a of the buffer portion 32 by the first substrate transfer robot 31 described above. The same operation as the storage / removal of the substrate W with respect to the substrate is performed. Further, the placement of the substrate W on the substrate carry-in table 34 and the removal of the substrate W from the substrate carry-out table 35 are performed with the direction of expansion / contraction of the substrate support portion 33g being directed to the substrate carry-in table 34 or the substrate carry-out table 35. However, the placement and removal of the substrate W at this time are performed in the same manner as the placement and removal of the substrate W with respect to the substrate delivery table 25 by the substrate transfer robot 23 in the processing unit 2 described above.
[0065]
The second substrate transfer robot 33 corresponds to the second substrate transfer means in the present invention, and the expansion / contraction drive part 31d and the substrate support part 31e are the substrate storage / extraction means of the second substrate transfer means in the present invention. The rotation drive unit 33e constitutes the rotation means of the second substrate transport means in the present invention, the Z direction drive portion 31c constitutes the vertical direction movement means of the second substrate transport means in the present invention, and Y The direction driving unit 33a constitutes a uniaxial moving means of the second substrate carrying means in the present invention. In this embodiment, the horizontal one-axis direction, which is the moving direction of the one-axis direction moving means, is taken as the Y-axis direction in the figure.
[0066]
In this embodiment, the first substrate transfer robot 31, the buffer unit 32, and the second substrate transfer robot 33 are arranged in that order in the Y direction drive unit 33a (uniaxial movement means) of the second substrate transfer robot 33. Are arranged in a straight line parallel to the moving direction (Y-axis direction).
[0067]
As with the substrate delivery table 25 in the processing unit 2, the substrate carry-in table 34 and the substrate carry-out table 35 have a plurality of substrate support pins 34a and 35a fixedly erected in the vertical direction, and these substrate support pins 34a. , 35a, and the substrate W is transferred to and from the exposure unit 4 (a substrate transfer robot in the exposure unit 4 (not shown)). These substrate loading table 34 and substrate loading table 35 correspond to the substrate loading / unloading table in the present invention. Further, in this embodiment, the substrate unloading table 35 is arranged in the order from the buffer unit 32 along the moving direction (Y-axis direction) of the Y-direction driving unit 33a (uniaxial moving means) of the second substrate transport robot 33. A substrate carry-in table 34 is provided. Although not shown, when the substrate W is transferred between the exposure unit 4 and the IF unit 3, an opening through which the substrate transport robot in the exposure unit 4 that supports the substrate W passes is also provided in the exposure unit. 4 and the IF unit 3.
[0068]
The table base 37a on which the first cassette 36a is set faces the buffer unit 32 on one end (the end opposite to the buffer unit 32) of the Y-direction drive unit 33a of the second substrate transfer robot 33. The IF unit 3 is fixedly provided on the inner surface.
[0069]
The table base 37b for setting the second cassette 36b is closer to the buffer unit 32 in the Y-axis direction than the table base 37a and higher in the Z-axis direction than the table base 37a. It is fixed to the side and deployed. Further, the height of the table base 37b in the Z-axis direction is second when the second substrate transport robot 33 is positioned on the substrate carry-in base 34 (table base 37a) side as indicated by an imaginary line in FIG. The upper end of the Z-direction drive unit 33c of the substrate transfer robot 33 is determined so as not to interfere.
[0070]
The first and second cassettes 36a and 36b are provided with a plurality of storage shelves (not shown) for storing a plurality of substrates W in a horizontal posture. These cassettes 36 a and 36 b are used, for example, when a pilot substrate (exposure test substrate) is accommodated for an exposure test, or when the IF unit 3 is used as the indexer 1.
[0071]
Note that “when the IF unit 3 is used as the indexer 1” is a case where only the exposure processing is performed by the exposure unit 4 of this embodiment apparatus without passing through the indexer 1 or the processing unit 2 of this embodiment apparatus. Then, the substrate (pre-exposure substrate) W that has been processed up to just before the exposure processing by another processing apparatus is stored in the cassettes 36a and 36b and set on the table bases 37a and 37b. The substrate transport robot 33 sequentially transports the pre-exposure substrates W from the cassettes 36a and 36b to the exposure unit 4 to perform exposure processing. The exposed substrates W are again stored in the cassettes 36a and 36b, and the cassettes 36a and 36b are loaded. This refers to a case where the exposed substrate W is used to be processed from the IF unit 3 and applied after the exposure process by another processing apparatus.
[0072]
The cassettes 36a and 36b are set and removed from the table bases 37a and 37b by an operator opening the door 38 (see FIG. 1) provided on one side of the IF unit 3.
[0073]
The exposure unit 4 includes, for example, an exposure machine such as a reduction projection exposure machine (stepper), an alignment mechanism that performs positioning for printing an exposure pattern in the exposure machine, and the substrate W in the exposure unit 4. A substrate transport robot (none of which is shown) that transports and the like is integrated into a unit. The substrate transport robot in the exposure unit 4 takes the pre-exposure substrate W placed on the substrate carry-in table 34 in the IF unit 3 into the exposure unit 4 and the exposure processing in the exposure unit 4 is completed. An operation of unloading the exposed substrate W from the exposure unit 4 and placing it on the substrate unloading table 35 in the IF unit 3 is also performed. The operations of taking out the substrate W from the substrate carry-in table 34 and placing the substrate W on the substrate carry-out table 35 by the substrate carrying robot in the exposure unit 4 are the substrate carrying robot in the processing unit 2 described with reference to FIG. 23 is performed in the same manner as the removal / placement of the substrate W with respect to the substrate delivery table 25.
[0074]
Next, the configuration of the control system of the substrate processing apparatus will be described with reference to FIG.
This apparatus includes an indexer controller 6a, a processing unit controller 6b, an IF unit controller 6c, an exposure unit controller 6d, and the like.
[0075]
The indexer control unit 6a controls the substrate carry-in / out robot 12 and the like in the indexer 1 to take out the unprocessed substrate (substrate before being subjected to a series of processes by the substrate processing apparatus) W from the carrier C to the processing unit 2. In addition to controlling the substrate carry-in operation in the indexer 1 leading to the delivery of the unprocessed substrate W to the substrate transfer robot 23 in the inside, the processed substrate from the substrate transfer robot 23 in the processing unit 2 (a series of processes by the substrate processing apparatus) The substrate unloading operation in the indexer 1 from the reception of W) to the storage in the carrier C is controlled. The indexer control unit 6a transmits information to the production line management computer 6e, exchanges information regarding the timing of loading and unloading of the carrier C by the AGV 5, and the processing unit control unit 6b described later. Information is transmitted, and information relating to the timing of delivery of the substrate W to the substrate transport robot 23 in the processing unit 2 is also exchanged.
[0076]
The processing unit control unit 6b controls each device in the processing unit 2 (spin coater SC, spin developer SD, baking device BA, cooling device CA, edge exposure unit EEW, substrate transport robot 23, processing liquid supply unit, etc.). Thus, a series of processing in the processing unit 2 is performed in accordance with a sequence set from the operation unit 6f, and the substrate W is placed on and taken out from the substrate delivery table 25. Information is also transmitted between the processing unit controller 6b and an IF unit controller 6c, which will be described later, and information relating to the timing of placing / removing the substrate W on / from the substrate delivery table 25 is exchanged.
[0077]
The IF unit control unit 6c includes first and second substrate transfer robots 31 and 33 in the IF unit 3, more specifically, a motor 31ab and a rotation drive unit 31c of the Z-direction drive unit 31a of the first substrate transfer robot 31. Motor 31cb, motor 31da of telescopic drive unit 31d, motor 33ac of Y direction drive unit 33a of second substrate transport robot 33, motor of Z direction drive unit 33c, motor of rotation drive unit 33e, telescopic drive unit 31f , The transport of the pre-exposure substrate W from the processing unit 2 (substrate transfer table 25) to the exposure unit 4 (substrate loading table 34), and the processing unit 2 from the exposure unit 4 (substrate transfer table 35). Transport of the exposed substrate W to the (substrate delivery table 25) (normal processing), and transfer from the cassettes 36a and 36b to the exposure unit 4 (substrate delivery table 34) Transportation of light before the substrate W, and the exposure unit 4 (substrate unloading table 35) from the cassette 36a, the transport of the exposed substrate W to 36b (special processing) and to perform.
[0078]
Information is also transmitted between the IF unit controller 6c and an exposure unit controller 6d, which will be described later, and exchange of information regarding the loading / unloading timing of the substrate W with respect to the substrate carry-in table 34 and the substrate carry-out table 35 is performed. ing. Whether to perform normal processing or special processing is set from the operation unit 6f. Further, the IF unit control unit 6c is connected to a memory 6g in which a buffer unit management table CT is stored. The use management of the storage shelf 32a of the buffer unit 32 is managed as described later. It is done using.
[0079]
The exposure unit controller 6d controls each device (exposure machine, alignment mechanism, substrate transfer robot, etc.) in the exposure unit 4 and takes in the pre-exposure substrate W from the substrate carry-in table 34 in the IF unit 3, thereby aligning the alignment mechanism. After the positioning, the exposure pattern is printed by the exposure machine, and a series of exposure processes for placing the exposed substrate W on the substrate carry-out table 35 in the IF unit 3 is performed.
[0080]
The indexer control unit 6a, the processing unit control unit 6b, the IF unit control unit 6c, and the exposure unit control unit 6d are each constituted by a so-called microcomputer, and each control unit 6a, 6b, 6c according to a program created and stored in advance. , 6d is executed.
[0081]
Next, the operation of the substrate processing apparatus having the above configuration will be described. In the following, the operation when normal processing is performed in the IF unit 3 will be described.
[0082]
An example of processing in this case is shown below.
[01] Setting of carrier C to carry-in / out table 11
[02] Delivery of substrate W before processing from substrate C to substrate transfer robot 23 in processing unit 2
[03] Bake with baking device BA
[04] Cooling by cooling device CA
[05] Resist application by spin coater SC
[06] Bake with baking device BA
[07] Cooling by cooling device CA
[08] Edge exposure by edge exposure unit EEW
[09] Bake with baking device BA
[10] Cooling by cooling device CA
[11] Delivery of pre-exposure substrate W from processing unit 2 to exposure unit 4
[12] Exposure processing by exposure unit 4
[13] Delivery of exposed substrate W from exposure unit 4 to processing unit 2
[14] Development with spin developer SD
[15] Bake with baking device BA
[16] Cooling by cooling device CA
[17] Storage of processed substrate W in carrier C
[18] Removal of carrier C from loading / unloading table 11
[0083]
The above [01] and [18] are based on AGV5, [02] and [17] are based on the indexer 1, and [03] to [10] and [14] to [16] are based on [11], [ 13] is executed by the IF unit 3, and [12] is executed by the exposure unit 4.
[0084]
First, the AGV 5 transports a carrier C in which a plurality of unprocessed substrates W before being subjected to a series of processes performed by the substrate processing apparatus from the previous process, and places the carrier C at a predetermined position on the loading / unloading table 11 of the indexer 1. Place ([01]).
[0085]
Next, the substrate carry-in / out robot 12 of the indexer 1 takes out the pre-treatment substrates W one by one from the carrier C placed on the carry-in / out table 11 and sequentially delivers them to the substrate carrying robot 23 in the processing unit 2 ( [02]) . So Then, each substrate processing until the exposure processing is performed is performed in the processing unit 2 ([03] to [10]). Specifically, the substrate transfer robot 23 in the processing unit 2 first carries the unprocessed substrate W received from the indexer 1 into the baking apparatus BA, where the substrate W is heated (baked) to a predetermined temperature. When the baking is completed, the substrate transport robot 23 unloads the substrate W from the baking apparatus BA ([03]).
[0086]
The unprocessed substrates W are sequentially loaded into the processing unit 2 and the exposed substrates W are also sequentially loaded as described later. Therefore, the baking process at each stage ([03], [06], [09], [15]) may compete, but the processing unit 2 of this embodiment includes a plurality of baking apparatuses BA. In addition, each stage of baking processing on the plurality of substrates W can be performed in parallel, the processing throughput in the processing unit 2 is improved, and the processing time (average exposure processing time) in the exposure unit 4 is high. It is devised to make it follow even if it is made. Note that the use of the baking apparatus BA is determined experimentally or theoretically in advance for the optimum usage of the throughput, and the processing unit controller 6b uses the baking apparatus BA in this procedure.
[0087]
Further, the processing unit 2 of this embodiment includes a plurality of cooling devices CA, spin coater SC, edge exposure unit EEW, and spin developer SD, which will be described later (see FIG. 1 and the like). It contributes to the improvement of throughput. The usage of each of these devices CA, SC, EEW, and SD is controlled so that the throughput is optimized similarly to the usage of the baking device BA. Furthermore, the transfer of the substrate W by the substrate transfer robot 23 between the devices BA, CA, SC, EEW, SD in the processing unit 2 is controlled so as to optimize the throughput, and the throughput in the processing unit 2 is improved. It is illustrated.
[0088]
The substrate transfer robot 23 carries the baked substrate W into the cooling device CA, cools the heated substrate W to near room temperature ([04]), and spins the cooled substrate W carried out of the cooling device CA. It is loaded into the coater SC, where it is coated with resist ([05]). Then, the substrate transfer robot 23 carries the resist-coated substrate W again in the order of the baking device BA and the cooling device CA to perform the baking process and the cooling process ([06], [07]), and then the edge exposure. Then, the edge exposure is performed in the section EEW ([08]), and the edge-exposed substrate W is again loaded in the order of the baking device BA and the cooling device CA to perform the baking process and the cooling process ([09]). ,[Ten]). The substrate W that has been cooled in [10] (in this sequence, becomes the pre-exposure substrate W) is placed on the substrate delivery table 25 by the substrate transport robot 23. The timing of placing the pre-exposure substrate W on the substrate transfer table 25 by the substrate transport robot 23 is determined based on an average exposure processing time by the exposure unit 4 described later, and is a predetermined time (for example, 40 seconds to 30 seconds). The pre-exposure substrate W is placed on the substrate transfer table 25 every time.
[0089]
The pre-exposure substrate W placed on the substrate delivery table 25 is taken out by the first substrate transfer robot 31 in the IF unit 3, stored in an arbitrary storage shelf 32a of the buffer unit 32, and stored in the storage shelf 32a. The pre-exposure substrate W is taken out by the second substrate transport robot 33 and placed on the substrate carry-in table 34 ([11]). For example, a delay occurs in the exposure process in the exposure unit 4, and the pre-exposure substrate W previously placed on the substrate carry-in table 34 is not loaded into the exposure unit 4 and is still placed on the substrate carry-in table 34. In this state, the pre-exposure substrate W newly placed on the substrate delivery table 25 cannot be placed on the substrate carry-in table 34. However, in this embodiment, the pre-exposure substrate W is newly placed on the substrate delivery table 25. The first substrate transport robot 31 sequentially stores the new pre-exposure substrate W in an arbitrary storage shelf 32a of the buffer unit 32 regardless of the mounting status of the substrate loading table 34. The second substrate transport robot 33 sequentially takes out the pre-exposure substrates W from the storage shelf 32 a of the buffer unit 32 and places them on the substrate carry-in table 34 according to the empty state of the substrate carry-in table 34. Therefore, regardless of the exposure processing delay in the exposure unit 4 and the like, the removal of the pre-exposure substrate W from the substrate transfer table 25 is always performed at a predetermined timing (exposure to the substrate transfer table 25 by the substrate transfer robot 23 in the processing unit 2). (The timing according to the timing of placing the front substrate W), and there is no delay in the delivery of the pre-exposure substrate W from the processing unit 2 to the IF unit 3, and the processing in the processing unit 2 is performed. There is no inconvenience such as causing a delay. In this case, details of usage management of the buffer unit 32 will be described later.
[0090]
The pre-exposure substrate W placed on the substrate carry-in table 34 is taken into the exposure unit 4 by the substrate transport robot in the exposure unit 4 and delivered to the alignment mechanism where positioning processing is performed and positioned. A given exposure pattern is printed onto the exposure machine. Then, the exposed substrate W that has been subjected to the exposure process is unloaded from the exposure unit 4 by the substrate transfer robot in the exposure unit 4 and placed on the substrate unloading table 35 in the IF unit 3 ([12]).
[0091]
The exposed substrate W placed on the substrate carry-out table 35 is taken out by the second substrate transfer robot 33 in the IF unit 3, stored in an arbitrary storage shelf 32a of the buffer unit 32, and stored in this storage shelf 32a. The exposed substrate W is taken out by the first substrate transport robot 31 and placed on the substrate delivery table 25 ([13]). Note that, for example, the exposure processing time by the exposure unit 4 is increased or decreased, and the timing of carrying out the exposed substrate W from the exposure unit 4 and the processing unit 2 exposure When the exposed substrate W is placed on the substrate carry-out table 35 due to a deviation in the timing of taking in the completed substrate W, the previous exposed substrate W or, in some cases, the pre-exposure substrate may be placed on the substrate delivery table 25. In such a case, the exposed substrate W cannot be placed on the substrate delivery table 25. In this embodiment, however, the placement status of the substrate delivery table 25 is changed. Regardless, when the exposed substrate W is placed on the substrate carry-out table 35, the second substrate transport robot 33 sequentially stores the substrate W in the arbitrary storage shelf 32 a of the buffer unit 32, The first substrate transfer robot 31 sequentially transfers the exposed substrates W from the storage shelf 32a of the buffer unit 32 in accordance with the timing of taking out the exposed substrate W from the substrate transfer table 25 by the substrate transfer robot 23 in the processing unit 2. Extraction board It is placed on the pass table 25. Therefore, regardless of the length of the exposure processing time by the exposure unit 4, when the exposed substrate W is placed on the substrate carry-out table 35, the substrate W can be quickly taken out from the substrate carry-out table 35, and the substrate carry-out table 35 The substrate transfer robot in the exposure unit 4 can quickly place the exposed substrate W on the substrate carry-out table 35 without placing the exposed substrate W on the substrate 35 for a long time. There is no inconvenience such as delay in taking the next pre-exposure substrate W into the exposure unit 4 while waiting for the unexposed substrate W to be unloaded. Note that details of usage management of the buffer unit 32 in this case will also be described later.
[0092]
The substrate W placed on the substrate delivery table 25 is taken out by the substrate transfer robot 23 in the processing unit 2, loaded into the spin developer SD, subjected to development processing there, and exposed by the exposure machine of the exposure unit 4. The pattern and the edge portion of the substrate W exposed at the edge exposure portion EEW are developed and removed ([14]). The timing of taking out the exposed substrate W from the substrate delivery table 25 by the substrate transport robot 23 is also determined based on the average exposure processing time by the exposure unit 4 described later, and every predetermined time (for example, 40 seconds to 30 seconds). Then, the exposed substrate W is taken out from the substrate delivery table 25.
[0093]
The developed substrate W is carried in by the substrate transport robot 23 in the order of the baking device BA and the cooling device CA, and subjected to the baking process and the cooling process in order ([15], [16]). The cooled substrates (processed substrates in this sequence) W are sequentially delivered to the substrate carry-in / out robot 12 in the indexer 1 by the substrate transfer robot 23, and the substrate carry-in / out robot 12 receives the processed substrates W received. It is sequentially stored in an empty carrier C waiting at a predetermined position on the carry-in / out table 11 ([17]). Then, the carrier C in which a predetermined number of processed substrates W are stored is taken out from the loading / unloading table 11 by the AGV 5 and is transferred to a subsequent process. When It is transported ([18]).
[0094]
Next, an example of usage management of the buffer unit 32 in the IF unit 3 will be described with reference to FIGS.
[0095]
As shown in FIG. 7, in this example, shelves No1 to n (n is, for example, 50) are sequentially attached to the storage shelves 32a of the buffer unit 32 from below, and shelves No1 to (n / 2) (for example, 1 to 25). ) Storage shelf 32a is used to store the pre-exposure substrate W (substrate W transported from the substrate transfer table 25 to the substrate carry-in table 34), and shelves No ((n / 2) +1) to n (for example, 26 to 50). The storage shelf 32a is used for storing the exposed substrate W (the substrate W transported from the substrate carry-out table 35 to the substrate delivery table 25). In storing the substrates W, the storage shelves 32a located below are used in order (the pre-exposure substrates W are sequentially from shelf No1 and the exposed substrates W are sequentially from shelf No26).
[0096]
In addition, as shown in FIG. 8A, the buffer unit management table CT is provided with an area MA1 for storing the storage status of the storage shelf 32a for each shelf No. A substrate W that is carried into the substrate processing apparatus and subjected to a series of processes is assigned a sequence number (substrate number) and managed. When the substrate W is stored in a certain storage shelf 32a, the substrate number of the substrate W is stored in the area MA1 corresponding to the shelf No. stored in the buffer unit management table CT.
[0097]
For example, as shown in FIG. 9A, the substrate W with the substrate number 99 in the exposure unit 4 is used. ₉₉ Is exposed, and the substrate W having the substrate number 100 is placed on the substrate carry-in table 34. ₁₀₀ Is assumed, and no buffer W is accommodated in the buffer unit 32. In this case, nothing is stored in the area MA1 corresponding to each shelf No as shown in FIG.
[0098]
In this state, the substrate W of the substrate number 99 ₉₉ During the exposure process, the next pre-exposure substrate W is placed on the substrate transfer table 25. ₁₀₁ When (substrate number 101) is placed, the IF unit control unit 6c checks the usage status of the storage shelf 32a of the shelf No. (1-25) used for storing the pre-exposure substrate W in the buffer unit management table CT, The lowest shelf number in the empty state is searched, and the pre-exposure substrate W placed on the substrate delivery table 25 ₁₀₁ Is sent to the storage shelf 32a of the shelf No. (in this case, shelf No. 1) of the buffer unit 32 to give a command to the first substrate transfer robot 31. As a result, as shown in FIG. 9B, the pre-exposure substrate W having the substrate number 101 is stored in the storage shelf 32 a of the shelf No 1 of the buffer unit 32. ₁₀₁ And the substrate W is placed in the area MA1 corresponding to the shelf No. 1 of the buffer unit management table CT as shown in FIG. ₁₀₁ The board number 101 is stored.
[0099]
If the exposure processing in the exposure unit 4 proceeds smoothly, the next pre-exposure substrate W ₁₀₂ Substrate W with substrate number 99 before (substrate number 102) is placed on substrate delivery table 25 ₉₉ Exposure processing is finished, and the exposed substrate W is exposed by the substrate transfer robot in the exposure unit 4. ₉₉ Is placed on the substrate carry-out table 35, and the pre-exposure substrate W of the next substrate number 100 is placed on the substrate carry-in table 34. ₁₀₀ Is taken into the exposure unit 4 and the exposure process is started.
[0100]
Exposed substrate W with substrate number 99 ₉₉ Is placed on the substrate carry-out table 35, the IF unit controller 6c checks the usage status of the storage shelf 32a of the shelf No. (26 to 50) used for storing the exposed substrate W by the buffer unit management table CT, The lowest empty shelf No. is searched, and the exposed substrate W placed on the substrate carry-out table 35 is exposed. ₉₉ Is sent to the storage shelf 32a of the shelf No. (in this case, shelf No. 26) of the buffer unit 32 to give a command to the second substrate transfer robot 31. As a result, as shown in FIG. 9C, the exposed substrate W having the substrate number 99 is placed in the storage shelf 32a of the shelf No. 26 of the buffer unit 32. ₉₉ And the substrate W is placed in the area MA1 corresponding to the shelf No. 26 of the buffer unit management table CT as shown in FIG. ₉₉ The board number 99 is stored.
[0101]
Further, the substrate W placed on the substrate carry-in table 34 by the substrate transport robot in the exposure unit 4. ₁₀₀ When (substrate number 100) is taken into the exposure unit 4, the substrate carry-in table 34 becomes empty, so that the IF unit controller 6c can store the storage shelves 32a of the shelves No1 to 25 used for storing the pre-exposure substrates W. The usage state is checked by the buffer unit management table CT, and the pre-exposure substrate W (W of the storage shelf 32a (in this case, the storage shelf 32a of the shelf No. 1)) in which the pre-exposure substrate W having the smallest substrate number is stored. ₁₀₁ ) Is transferred to the substrate carry-in table 34 and a command is given to the second substrate transfer robot 33. As a result, as shown in FIG. 9D, the storage shelf 32a of the shelf No. 1 of the buffer unit 32 becomes empty, and the pre-exposure substrate W having the substrate number 101 is placed on the substrate carry-in table 34. ₁₀₁ In addition, as shown in FIG. 8D, the board number (101) stored in the area MA1 corresponding to the shelf No1 of the buffer unit management table CT is deleted.
[0102]
Note that the pre-exposure substrate W having the substrate number 100 by the substrate transfer robot in the exposure unit 4 is used. ₁₀₀ In the exposure unit 4 and the exposed substrate W of the substrate number 99 by the second substrate transfer robot 33. ₉₉ Since the transfer / storage operation from the substrate carry-out table 35 to the storage shelf 32a of the shelf No. 26 of the buffer unit 32 is performed in parallel, the exposed substrate W having the substrate number 99 is placed on the storage shelf 32a of the shelf No. 26 of the buffer unit 32. ₉₉ Is stored, the substrate carry-in table 34 is empty. Therefore, the second substrate transfer robot 33 is the pre-exposure substrate W having the substrate number 101. ₁₀₁ It is possible to immediately shift to the transfer operation to the substrate loading table 34. At this time, since the second substrate transfer robot 33 is located in the vicinity of the buffer unit 32, the exposed substrate W having the substrate number 99 is used. ₉₉ Is stored in the storage shelf 32a of the shelf No. 26 and then the substrate support portion 33g and the like are lowered in the Z-axis direction, the pre-exposure substrate W of the substrate number 101 ₁₀₁ The second substrate transport robot 33 can move from the storing operation of the exposed substrate W to the predetermined storage shelf 32a before the exposure without performing a useless operation. A series of operations to the operation of taking out the substrate W from the predetermined storage shelf 32a can be quickly performed.
[0103]
Depending on the timing of taking out the exposed substrate W from the substrate delivery table 25 by the substrate transfer robot 23 in the processing unit 2 (taking it into the processing unit 2), the substrate delivery table 25 is loaded before the above loading is performed. In order to place the exposed substrate W, the IF unit control unit 6c gives a command to the first substrate transport robot 31 to transport the exposed substrate W from the buffer unit 32 to the substrate delivery table 25. Also in this case, the IF unit control unit 6c checks the usage status of the storage shelves 32a of the shelf Nos. 26 to 50 used for storing the exposed substrates W by using the buffer management table CT, and the exposed substrate W having the smallest substrate number is found. Exposed substrate W (W of storage shelf 32a stored (in this case, storage shelf 32a of shelf No. 26)) ₉₉ ) Is sent to the substrate transfer table 25 and a command is given to the first substrate transfer robot 31. As a result, as shown in FIG. 9E, the storage shelf 32a of the shelf No. 26 of the buffer unit 32 becomes empty, and the exposed substrate W with the substrate number 99 is placed on the substrate delivery table 25. ₉₉ In addition, as shown in FIG. 8E, the board number (99) stored in the area MA1 corresponding to the shelf No. 26 of the buffer management table CT is deleted.
[0104]
In addition, the substrate W before exposure from the storage shelf 32a of the shelf No1 to the substrate carry-in table 34 is shown. ₁₀₁ Transfer timing and the exposed substrate W from the storage shelf 32a of shelf No. 26 to the substrate delivery table 25 ₉₉ Even if the transfer timing overlaps with time, according to this embodiment, the former transfer is performed independently by the second substrate transfer robot 33 and the latter transfer is performed independently by the first substrate transfer robot 31. Therefore, these transport operations are performed in parallel, and even when the individual transport operations are overlapped, no waiting time occurs, and a series of transport operations can be performed smoothly.
[0105]
When the exposed substrate W having the substrate number 99 placed on the substrate delivery table 25 is taken out by the substrate transfer robot 23 in the processing unit 2, the state (substrate number) similar to that shown in FIGS. Is increased by 1). Then, a new pre-exposure substrate W with substrate number 102 ₁₀₂ Is placed on the substrate delivery table 25, the same operations as described above (FIGS. 8B to 8E and 9B to 9E) are repeated, and the processing unit 2 moves to the exposure unit 4. The pre-exposure substrate W and the exposed substrate W from the exposure unit 4 to the processing unit 2 are sequentially transferred. As described above, when the exposure process in the exposure unit 4 is performed smoothly, the pre-exposure substrate W uses only the storage shelf 32a of the shelf No1 and the exposed substrate W only includes the storage shelf 32a of the shelf No26. Is used to deliver the substrate W. That is, in this case, the substrate W is transferred between the first substrate transfer robot 31 and the second substrate transfer robot 33 using the storage racks 32a of the shelves No1 and 26 as the transfer platform of the substrate W. Not too much.
[0106]
However, the exposure processing time in the exposure unit 4 still varies, and the processing time in the processing unit 2 in which the internal processing time is set corresponding to the average exposure processing time in the exposure unit 4; The substrate W must be transported in the IF unit 3 in correspondence with the time difference from the actual exposure processing time in the exposure unit 4. The buffer unit 32 is provided with a plurality of storage shelves 32a for such a case.
[0107]
For example, a delay occurs in the exposure processing in the exposure processing unit 4, and the pre-exposure substrate W with the substrate number m is placed on the shelf No1 as shown in FIGS. _m In the state in which the substrate W is stored, a new pre-exposure substrate W with the substrate number (m + 1) _{m + 1} Is mounted on the substrate delivery table 25, the IF unit control unit 6c checks the usage status of the storage shelf 32a of the shelf No. (1-25) used for storing the pre-exposure substrate W in the buffer unit management table CT, The lowest shelf number in the empty state is searched, and the pre-exposure substrate W placed on the substrate delivery table 25 _{m + 1} A command is given to the first substrate transfer robot 31 so that it is transferred and stored in the storage shelf 32a of the shelf No. (in this case, shelf No. 2) of the buffer unit 32. Thus, the storage state of the buffer unit 32 and the storage state of the buffer unit management table CT are as shown in FIGS.
[0108]
Further, the exposure processing in the exposure processing unit 4 is delayed, and in the state shown in FIGS. _{m + 2} Is placed on the substrate delivery table 25, as shown in FIGS. 10E and 10F, this new pre-exposure substrate W is formed. _{m + 2} Is stored in the storage shelf 32a of shelf No3.
[0109]
Thereafter, similarly, when a new pre-exposure substrate W is temporarily stored and the number of storage shelves 32a of the buffer unit 32 is n (for example, 50), the maximum number of pre-exposure substrates W is (n / 2) (25). Can be stored temporarily.
[0110]
Further, for example, when the substrate carry-in table 34 becomes empty in the states of FIGS. 10E and 10F, the pre-exposure substrate with the smallest substrate number among the pre-exposure substrates W stored in the buffer unit 32. W (in this case, the pre-exposure substrate W stored in the storage shelf 32a of the storage shelf No1 _m ) Is transferred and placed on the substrate carry-in table 34 by the second substrate transfer robot 33 (FIGS. 10G and 10H).
[0111]
Then, a new pre-exposure substrate W with the substrate number (m + 3) in the state of FIGS. _{m + 3} Is placed on the substrate delivery table 25, as shown in FIGS. 10I and 10J, this new pre-exposure substrate W is formed. _{m + 3} Is stored in the storage shelf 32a of the lowest shelf No. 1 among the empty storage shelves 32a.
[0112]
10 (i) and (j), when the substrate carry-in table 34 becomes empty, the pre-exposure substrate W (with the smallest substrate number among the pre-exposure substrates W stored in the buffer 32) ( In this case, the pre-exposure substrate W stored in the storage shelf 32a of the storage shelf No2. _{m + 1} ) Is transported and placed on the substrate carry-in table 34 by the second substrate transport robot 33. Further, in this state (the pre-exposure substrate W only on the storage shelves 32a of the shelf Nos. 1 and 3). _{m + 3} , W _{m + 2} When the substrate carry-in table 34 becomes empty, the pre-exposure substrate W stored in the storage shelf 32a of the storage shelf No3 is stored. _{m + 2} Is transported and placed on the substrate carry-in table 34 by the second substrate transport robot 33.
[0113]
Note that a new pre-exposure substrate W with the substrate number (m + 4) in the states of FIGS. _{m + 4} Is placed on the substrate delivery table 25, this new pre-exposure substrate W _{m + 4} Is stored in the storage shelf 32a of the lowest shelf No. 4 among the empty storage shelves 32a.
[0114]
In addition, the use management of the shelf Nos. ((N / 2) +1) to n (for example, 26 to 50) of the exposed substrate W is also used for the shelf Nos. 1 to (n / 2) (for example, 1 to 25) of the pre-exposure substrate W described above. ) Is used in the same procedure as the usage management.
[0115]
As described above, according to the present embodiment, since the buffer unit 32 is provided, even if there is a time difference between the processing time in the processing unit 2 and the processing time in the exposure unit 4, it can flexibly cope with it. A series of substrate transfers can be performed smoothly without leaving the substrate W placed on the substrate transfer table 25 or the substrate carry-out table 35.
[0116]
Further, according to the present embodiment, the first substrate transfer robot 31 performs transfer of the substrate W between the substrate transfer table 25 and the buffer unit 32, and the buffer unit 32, the substrate loading table 34, and the substrate unloading table 35 Since the second substrate transfer robot 33 performs the transfer of the substrate W between the two, the substrate transfer robots 31 and 33 cooperate to transfer the substrate in the IF unit 3. The number of transfer positions of the substrates W of the transfer robots 31 and 33 is reduced, and each transfer can be performed independently and in parallel, so that the transfer operation of the substrate W in the IF unit 3 can be speeded up. Further, the buffer unit 32 is disposed so as to be sandwiched between the first and second substrate transfer robots 31 and 33. When the substrate transfer robots 31 and 33 transfer the substrate W, the buffer unit 32 and the substrate transfer table are arranged. 25, since it is not necessary to move so as to avoid the substrate carry-in table 34, the substrate carry-out table 35, etc., the operations of the substrate transfer robots 31 and 33 are performed smoothly. Therefore, the substrate transport in the IF unit 3 can be increased in speed by following the exposure unit 4 and the processing unit 2 following it.
[0117]
In addition, the first substrate transfer robot 31, the buffer unit 32, and the second substrate transfer robot 33 are arranged in that order in a substantially straight line parallel to the Y axis direction, and the substrate loading table along the Y axis direction. 34, since the substrate carry-out table 35 is disposed, as shown in FIG. 1, the IF unit 3 obtained by unitizing them can be elongated in the Y-axis direction. Therefore, for example, as shown in FIG. 1, when the processing unit 2, the IF unit 3, and the exposure unit 4 are arranged in the X-axis direction, each unit 2, 3, 4, the distance B3 (see FIG. 1) between the processing unit 2 and the exposure unit 4 can be reduced, and the width B from the processing unit 2 to the exposure unit 4 is reduced. The floor area utilization efficiency of the exclusive floor can be increased. In addition, since the storage shelves 32a of the buffer unit 32 are formed in a multi-tiered manner in the Z-axis direction, the floor usage area required for arranging the buffer unit 32 can be reduced, and the IF unit 3 can be configured to be compact in the horizontal direction. The floor area of the IF unit 3 can be reduced. Although this type of substrate processing apparatus is installed in a clean room with high operating costs, according to this embodiment, the floor surface of the clean room can be used efficiently.
[0118]
The method of managing the use of the buffer unit 32 is not limited to the method exemplified above. For example, the storage shelf 32a for storing the pre-exposure substrate W and the storage shelf 32a for storing the exposed substrate W are not distinguished, These may be mixed and stored sequentially from the lower storage shelf 32a.
[0119]
For example, the pre-exposure substrate W of the substrate number m _m , Substrate W before exposure of substrate number (m + 1) _{m + 1} , Exposed substrate W with substrate number (m-4) _m-4 , Substrate W before exposure of substrate number (m + 2) _{m + 2} , Exposed substrate W with substrate number (m-3) _m-3 Are stored in the buffer unit 32 in that order (in this case, the pre-exposure substrate W having the substrate number (m−1)). _m-1 Is mounted on the substrate carry-in table 34, and the substrate W with the substrate number (m-2) is provided. _m-2 In the method according to the modification, each substrate W is subjected to exposure processing in the exposure unit 4. _m-4 , W _m-3 , W _m ~ W _{m + 2} Is housed as shown in FIG. In the buffer unit management table CT, as shown in FIG. 11B, a flag (in the figure, for identifying whether the stored substrate W is a pre-exposure substrate W or an exposed substrate W). An area MA2 for storing “0” for the pre-exposure substrate W and “1” for the exposed substrate W) is provided.
[0120]
In the state of FIG. 11, for example, a new pre-exposure substrate W _{m + 3} Or exposed substrate W _m-2 Is stored in the buffer unit 32, the substrate W is stored in the storage shelf 32a of the lowest shelf No. 6 among the empty storage shelves 32a. The area MA1 corresponding to the shelf No. 6 of the buffer unit management table CT stores the substrate number of the newly stored substrate W, and the area MA2 stores the type of the stored substrate W (before exposure or already exposed). Flag (“0” or “1”) is stored.
[0121]
11, for example, when the pre-exposure substrate W is transported to the substrate carry-in table 34, the pre-exposure substrate W having the smallest substrate number among the pre-exposure substrates W stored in the buffer unit 32 (this In this case, the substrate W before exposure with the substrate number m _m ) From the buffer unit management table CT (search only for the storage substrate W whose flag is “0”), and the substrate W _m Is taken out from the storage shelf 32a of the shelf No. 1 of the buffer unit 32 and transferred to the substrate loading table 34, and the stored contents of the areas MA1 and MA2 corresponding to the shelf No. 1 of the buffer unit management table CT are deleted. The above-mentioned pre-exposure substrate W _m In a state where the substrate is taken out, the pre-exposure substrate W _{m + 3} Or exposed substrate W _m-2 Is newly stored in the buffer unit 32, the substrate W is stored in the storage shelf 32a of the lowest shelf No. 1 among the empty storage shelves 32a, and a predetermined area is stored in the corresponding area of the buffer unit management table CT. Is stored.
[0122]
In the state of FIG. 11, for example, when the exposed substrate W is transported to the substrate delivery table 25, the exposed substrate W having the smallest substrate number among the exposed substrates W stored in the buffer unit 32 (this In this case, the pre-exposure substrate W of the substrate number (m-4) _m-4 ) From the buffer management table CT (search only for the storage substrate W with the flag “1”), and the substrate W _m-4 Is taken out from the storage shelf 32a of the shelf No. 3 of the buffer unit 32 and transferred to the substrate delivery table 25, and the stored contents of the areas MA1 and MA2 corresponding to the shelf No. 3 of the buffer unit management table CT are deleted. In addition, the exposed substrate W _m-4 In a state where the substrate is taken out, the pre-exposure substrate W _{m + 3} Or exposed substrate W _m-2 Is newly stored in the buffer unit 32, the substrate W is stored in the storage shelf 32a of the lowest shelf No. 3 among the empty storage shelves 32a, and a predetermined area is stored in the corresponding area of the buffer unit management table CT. Is stored.
[0123]
By managing the use of the buffer unit 32 in this way, the pre-exposure substrate W and the exposed substrate W can be temporarily stored in the maximum number of storage shelves, and the temporary storage number of the pre-exposure substrates W and the exposed substrate It is possible to avoid a situation in which temporary storage of one type of substrate W cannot be performed, for example, when the difference from the temporary storage number of W is large.
[0124]
Further, the use management of the buffer unit 32 can be performed by a method other than the above two examples, but it is preferable to manage the buffer unit 32 so that it is used in order from the lower storage shelf 32a as in the above two examples. In view of the configuration of the processing unit 2 and the exposure unit 4, the substrate delivery table 25, the substrate carry-in table 34, and the substrate carry-out table 35 are disposed below the buffer unit 32 in the Z-axis direction. When the substrate W is stored / taken out of the storage shelf 32a, the movement of the substrate support portions 31e and 33g of the first and second substrate transport robots 31 and 33 in the Z-axis direction is inevitably increased. Compared to this, when used sequentially from the lower storage shelf 32a, the movements of the substrate support portions 31e and 33g of the first and second substrate transfer robots 31 and 33 in the Z-axis direction are reduced, and the first and second movements are accordingly increased. Therefore, the operation of the substrate transfer robots 31 and 33 at the time of substrate transfer is not wasted, which contributes to speeding up the transfer of the substrate W in the IF unit 3.
[0125]
Next, the operation when special processing is performed in the IF unit 3 will be briefly described.
The worker stores, for example, one or a plurality of pre-exposure substrates W that have been subjected to processing up to immediately before being subjected to exposure processing in a processing apparatus other than the processing unit 2 of the substrate processing apparatus, in the cassettes 36a and 36b. Then, the door 38 of the IF unit 3 is opened, the cassettes 36a and 36b are set on the table bases 37a and 37b, and the door 38 is closed. Then, special processing is set from the operation unit 6f.
[0126]
Thereby, in the IF unit 3, the second substrate transport robot 33 takes out one pre-exposure substrate W from the cassettes 36a and 36b, transports it to the substrate carry-in table 34, and places it thereon. The substrate W is taken into the exposure unit 4 and subjected to an exposure process. When the substrate carry-in table 34 becomes empty, the second substrate transport robot 33 takes out one next pre-exposure substrate W from the cassettes 36a and 36b, and transports and places it on the substrate carry-in table 34. When the exposure processing is completed and the exposed substrate W is placed on the substrate carry-out table 35, the second substrate transport robot 33 takes out the exposed substrate W from the substrate carry-out table 35, and stores it in the cassettes 36a and 36b. It is stored in a predetermined storage location (the storage location where the substrate W was initially stored). When the above operations are repeated and exposure processing of all the substrates W is completed and stored in the cassettes 36a and 36b, the operator opens the door 38, takes out the cassettes 36a and 36b from the IF unit 3, and closes the door 38. Then, the cassettes 36a and 36b in which the exposed substrate W is stored are carried to another processing apparatus, where various substrate processing (development, post-baking, etc.) after the exposure processing can be performed. In the above operation, even if the exposure processing time in the exposure unit 4 becomes longer or shorter, the second substrate transport robot 33 basically sets the next pre-exposure substrate W when the substrate loading table 34 becomes empty. When the substrate W is placed on the substrate carry-out table 35, the substrate W is taken out and stored in the cassettes 36a and 36b. There is no particular problem because it works.
[0127]
Further, when one or a plurality of pilot substrates W are accommodated in the cassettes 36a and 36b, the exposure unit 4 performs exposure processing, and the exposure state is tested (exposure test) using the substrate W after the exposure processing. The IF unit 3 operates in the same manner as described above.
[0128]
As described above, according to the present embodiment, it is possible to flexibly cope with the use of the IF unit 3 as an indexer and an exposure test.
[0129]
<Second embodiment>
The configuration of the second embodiment of the present invention will be described with reference to FIGS.
In the second embodiment, the rotation drive unit 31c is omitted from the first substrate transfer robot 31, the expansion / contraction direction of the substrate support unit 31e of the first substrate transfer robot 31 is fixed in the direction of the buffer unit 32, and the Z axis A plurality of (three in the figure) substrate support pins 31f that can be moved in and out in the direction are provided on the upper surface of the telescopic drive unit 31d of the first substrate transport robot 31. The movement of the substrate support pin 31f is performed by an air cylinder (not shown) provided in the telescopic drive unit 31d of the first substrate transfer robot 31. Other configurations are the same as those of the first embodiment, and the same reference numerals as those in FIG.
[0130]
The IF unit 3 (substrate transport apparatus) according to the second embodiment is disposed on the opposite side of the transport path 24 across the processing unit 2 as shown in FIG. 12, that is, the second apparatus placement portion 22 of the processing unit 2. The second transfer path 41 is provided, and the second transfer path 41 is configured to be applied to the processing unit 2 provided with the second substrate transfer robot 42.
[0131]
The processing unit 2 having such a configuration has been recently developed by the present applicant for the purpose described later.
[0132]
Here, the purpose and configuration of the processing unit 2 configured as described above will be described.
As described above, the baking process in the processing unit 2 is a so-called heat treatment for heating the substrate W. On the other hand, processes such as resist coating and development are generally performed at room temperature (room temperature), and these non-processes are performed. In the heat treatment, it is necessary to strictly control and stabilize the temperature in the substrate W and the spin coater SC and the spin developer SD that perform these treatments at a predetermined temperature near room temperature.
[0133]
However, in the processing unit 2 (hereinafter referred to as the conventional processing unit) to which the conventional example or the first embodiment is applied, a single substrate transfer robot 23 performs a heat treatment (hereinafter referred to as a heat treatment unit) and a non-heat treatment. Therefore, not only the hand 23b of the substrate transfer robot 23 heated in the heat treatment part is inserted into the non-heat treatment part, but also at room temperature. The temperature of the other substrate W or the non-heat-treated portion partially rises by holding the substrate W in a stage where the state should be maintained with the warmed hand 23b or by heat radiation from the warmed substrate W, As a result, the thermal stability of the treatment is hindered.
[0134]
Further, in the conventional processing unit 2, each apparatus BA, CA, SC, SD, EEW and the like must be accessed by one substrate transport robot 23, and there is a limit to improving the throughput of the entire processing unit 2.
[0135]
Furthermore, since the conventional processing unit 2 is provided with the transport path 24 of the substrate transport robot 23 with the first device placement portion 21 and the second device placement portion 22 in between, the loading / unloading port io (FIG. 4) of the heat treatment portion is provided. Therefore, every time the hand 23b of the substrate transfer robot 23 accesses the heat treatment part, hot air and dust (particles) are scattered from the heat treatment part to the periphery, Adverse effects such as inhibition of thermal stability and contamination of the non-processed part are caused by mixing in the heat-treated part.
[0136]
In view of the above inconvenience,
(1) Do not give the non-heat treated part the influence of heat from the heat treated part,
(2) Enabling further improvement of the throughput of the entire processing unit,
(3) Prevent hot air and particles from the heat treatment part from entering the non-heat treatment part,
The present applicant has improved the processing unit for the purpose.
[0137]
A specific configuration of the improved processing unit 2 will be described with reference to FIG. 12, FIG. 14, FIG.
[0138]
The processing unit 2 includes a first apparatus placement unit 21, a transfer path 24 of the first substrate transfer robot 23, a second apparatus arrangement unit 22, and a transfer path 41 of the second substrate transfer robot 42 in a planar arrangement. Arranged in order.
[0139]
As in the conventional processing unit 2, a plurality of spin coaters SC and spin developers SD are arranged in the first device arrangement unit 21 (two in the figure).
[0140]
The first substrate transfer robot 23 is configured in the same manner as the substrate transfer robot 23 of the conventional processing unit 2, and the hand 23 b is extendable in the horizontal direction, rotatable around the Z axis, and Z axis (vertical). It is configured to be movable in the direction and the X axis (longitudinal direction of the transport path 24). The first substrate transfer robot 23 accesses each of the devices SC and SD constituting the non-heat treatment unit arranged in the first device arrangement unit 21 and is provided in the second device arrangement unit 22 described later. The substrate transfer unit IF, the cooling device CA, and the edge exposure unit EEW are accessed.
[0141]
In the second apparatus arrangement unit 22, a bake unit BU and a plurality of edge exposure units EEW are arranged. As shown in FIG. 14, the bake unit BU is configured by two-dimensionally stacking a plurality of bake devices BA, cooling devices CA, and substrate transfer units IF on the X axis and the Z axis. In addition, as shown in FIG. 15, the substrate transfer unit IF is provided with a substrate loading / unloading port io facing both the transfer path 24 and the transfer path 41, so that both the first and second substrate transfer robots 23 and 42 can access. A plurality of substrate support pins 43 for supporting the substrate W are fixedly erected in the vertical direction. The cooling device CA has the same configuration as the conventional one, but the substrate carry-in / out port io is provided facing both the transfer path 24 and the transfer path 41, and both the first and second substrate transfer robots 23 and 42 are provided. Can be accessed. The substrate transfer unit IF is provided specifically for transferring the substrate W between the first and second substrate transfer robots 23 and 42, but the cooling device CA is also provided with the first and second substrate transfer robots. It is used for delivery of the substrate W between 23 and 42. This is because in the cooling device CA, the heated substrate W is cooled to near room temperature when it is unloaded, so even if the first substrate transport robot 23 comes into contact with the substrate W at the time of unloading, the first device placement unit 21. This is because there is no concern of having a thermal effect on the non-heat-treated portion disposed in the. Further, the substrate loading / unloading port io of the baking apparatus BA is provided only for the transfer path 41 so that only the second substrate transfer robot 42 can access it. Accordingly, it is possible to prevent hot air, particles, and the like from the substrate loading / unloading port io of the baking apparatus BA (heat treatment section) from entering the non-heat treatment section (spin coater SC or spin developer SD) of the first apparatus placement section 21. Although not shown, the substrate carry-in / out port of the edge exposure unit EEW is provided only for the transfer path 24 and is accessible only by the first substrate transfer robot 23. The hot air and particles from the substrate loading / unloading port io of the apparatus BA (heat treatment part) are also prevented from entering the edge exposure part EEW (non-heat treatment part). Note that a door (not shown) that can be opened and closed is provided at the substrate loading / unloading port io of each apparatus, and is configured to be automatically opened and closed only when each substrate transport robot 23 and 42 accesses.
[0142]
The second substrate transfer robot 42 is also configured in the same manner as the substrate transfer robot 23 of the conventional processing unit 2, and the hand 23 b can be expanded and contracted in the horizontal direction, can be rotated around the Z axis, and the Z axis direction and X It is configured to be movable in the axial direction. The second substrate transport robot 42 accesses the baking device BA, the cooling device CA, and the substrate transfer unit IF arranged in the second device arrangement unit 22.
[0143]
The transfer of the substrate W from the first substrate transfer robot 23 to the second substrate transfer robot 42 is performed by the first substrate transfer robot 23 placing the substrate W on the substrate support pins 43 in the substrate transfer unit IF, and then The second substrate transfer robot 42 takes out the substrate W from the substrate transfer unit IF. Further, the delivery of the substrate W from the second substrate transport robot 42 to the first substrate transport robot 23 is performed by the second substrate transport robot 42 carrying the substrate W heated by the bake device BA into the cooling device CA. After the substrate W is cooled to near room temperature, the first substrate transport robot 23 takes out the substrate W from the cooling device CA. In the series of processing in the processing unit 2, since the cooling processing by the cooling device CA is performed after the baking processing by the baking device BA, as described above, the second substrate transport robot 42 to the first substrate transport robot 23. By using the cooling device CA to deliver the substrate W to the substrate, the substrate W can be delivered in accordance with the processing sequence.
[0144]
As described above, only the second substrate transfer robot 42 accesses the heat treatment unit, and the first substrate transfer robot 23 accessing the non-heat treatment unit is not used at all, and also when the substrate W is delivered. Since the first and second substrate transfer robots 23 and 42 do not come into contact with or approach each other, inconveniences such as inhibition of the thermal stability of the non-heat treated portion due to the heat of the heat treated portion are eliminated. Further, according to the processing unit 2, since the first and second substrate transport robots 23 and 42 cooperate to transport the substrate in the processing unit 2, the processing efficiency is improved and the throughput of the entire substrate processing apparatus is increased. This can be further improved.
[0145]
In the substrate transfer apparatus according to the second embodiment applied to the processing unit 2 having the above-described configuration, the first substrate transfer robot 31 is arranged on the second substrate transfer robot 42 side in the process unit 2.
[0146]
Then, the transfer of the substrate W between the processing unit 2 and the IF unit 3 includes the second substrate transport robot 42 in the processing unit 2, and the substrate support pins 31 f of the first substrate transport robot 31 in the IF unit 3. Is done by. That is, when the pre-exposure substrate W is carried from the processing unit 2 to the IF unit 3, the hand 23b of the second substrate transport robot 42 in the processing unit 2 is moved to the IF unit 3 as shown in FIG. The pre-exposure substrate W extended in the direction of the first substrate transport robot 31 and supported by the hand 23 b is positioned slightly above the substrate support portion 31 e of the first substrate transport robot 31 in the IF unit 3. Next, as shown in FIG. 16B, the first substrate transport robot 31 in the IF unit 3 raises the substrate support pins 31f and receives the substrate W from the hand 23b. Then, the hand 23b moves backward, the substrate support pin 31f is lowered, and the substrate W is placed and supported on the substrate support portion 31e of the first substrate transfer robot 31 in the IF unit 3. Further, when the exposed substrate W is carried out from the IF unit 3 to the processing unit 2, the substrate support is performed in the reverse operation to the above. pin The exposed substrate W placed and supported on the substrate support 31e is lifted by raising 31f, and the hand 23b is inserted below it, and the substrate support pin 31f is lowered and the substrate W is delivered to the hand 23b. To be done.
[0147]
Since the operations in the IF unit 3 other than the transfer of the substrate W between the processing unit 2 and the IF unit 3 are the same as those in the first embodiment, detailed description thereof is omitted here. In the second embodiment, the substrate support pin 31f of the first substrate transfer robot 31 in the IF unit 3 constitutes the substrate transfer means of the first substrate transfer means in the present invention.
[0148]
In the substrate processing apparatus having the configuration shown in FIG. 12, when the series of processing is performed in the steps [01] to [18] described in the first embodiment, “cooling by the cooling device CA” in [10] is completed. The substrate (pre-exposure substrate) W is delivered to the first substrate transfer robot 31 in the IF unit 3. Accordingly, the second substrate transport robot 42 in the processing unit 2 takes out the substrate W after the cooling of [10] from the cooling device CA. The exposed substrate W received from the first substrate transport robot 31 in the IF unit 3 is subjected to “development by the spin developer SD” ([14]). The second substrate transport robot 42 in the processing unit 2 performs the removal, and the exposed substrate W is carried into the spin developer SD by the first substrate transport robot 23 in the processing unit 2. The substrate W needs to be transferred between the substrate transfer robot 42 and the first substrate transfer robot 23. In this case, the delivery of the substrate W is performed not through the cooling device CA but through the substrate delivery unit IF.
[0149]
Next, some modifications of the above embodiments will be introduced.
<Modification 1>
In order to deliver the substrate W between the improved processing unit 2 described in the second embodiment and the IF unit 3, the first substrate transfer robot 31 in the IF unit 3 is used in the second embodiment. In addition to the configuration in which the expansion / contraction direction of the substrate support portion 31e of the first substrate transfer robot 31 is fixed in the direction of the buffer portion 32 and the substrate support pins 31f that can be moved back and forth from the upper surface of the expansion / contraction drive portion 31d are provided as in the example, The first substrate transfer robot 31 in the IF unit 3 is configured such that the extension / contraction drive part 31d and the substrate support part 31e of the first substrate transfer robot 31 are rotatable around the Z axis as in the first embodiment. In addition, the substrate W can be transferred between the units 2 and 3 by providing the substrate transfer table 25 at the end of the improved processing unit 2 on the IF unit 3 side of the second transport path 41.
[0150]
<Modification 2>
In the first and second embodiments, the first substrate transfer robot 31, the buffer unit 32, and the second substrate transfer robot 33 in the IF unit 3 are arranged in the direction of the uniaxial direction of the second substrate transfer robot 33. However, as shown in FIG. 17A, the arrangement of the buffer unit 32 and the second substrate transfer robot 33 is arranged as the second substrate transfer robot 33. The first substrate transport robot 31 and the buffer unit 32 are arranged in a straight line parallel to the moving direction (Y-axis direction) by the one-axis direction moving means, and the buffer unit 32 and the second substrate are arranged. The transfer robots 33 may be arranged substantially orthogonally (in parallel to the X-axis direction) with the arrangement direction (Y-axis direction). At this time, the buffer unit 32 configures each storage shelf 32b as shown in FIG. 17B, for example, and the substrate W can be stored / taken out from the side surfaces (X axis direction and Y axis direction) adjacent to each other. Like that.
[0151]
Also in the above arrangement, the delivery of the substrate W between the processing unit 2 and the IF unit 3 can be realized by the same configuration as each of the embodiments described above. For example, when the telescopic drive unit 31d and the substrate support unit 31e of the first substrate transport robot 31 are configured to be rotatable about the Z axis as in the first embodiment, the positions indicated by the dotted lines in FIG. The substrate transfer table 25 may be provided on the substrate.
[0152]
Further, as in the second embodiment, the expansion / contraction direction of the substrate support portion 31e of the first substrate transfer robot 31 is fixed in the direction of the buffer portion 32, and a substrate support pin 31f that can be withdrawn and retracted from the upper surface of the expansion / contraction drive portion 31d is provided. In this case, the substrate support pins 31f and the substrate transfer robot in the processing unit 2 can cooperate to deliver the substrate W between the processing unit 2 and the IF unit 3. In this case, the length L in the Y-axis direction (see FIG. 17B) from the first substrate transfer robot 31 to the first cassette 36a (the table base 67a) is the first and second implementations. As a result of being shorter than the example, the substrate W can be transferred to and from the substrate transfer robot 23 of the conventional processing unit 2 described in the first embodiment, and the first substrate transfer robot 31 in the IF unit 3 can be transferred. Can be applied to the substrate processing apparatus provided with the conventional processing unit 2 while being configured as in the second embodiment. Further, when the substrate W is transferred to or from the improved processing unit 2 described in the second embodiment, the substrate W is transferred between the first and second substrate transfer robots 23 and 42 in the processing unit 2. It is also possible to deliver the substrate W.
[0153]
<Modification 3>
The layout of the processing unit 2, the IF unit 3, and the exposure unit 4 is not limited to the case where they are arranged in the horizontal one-axis direction as in each of the above embodiments. For example, as shown in FIG. Various layouts are adopted such as arrangement in a mold or arrangement in an “L” shape as shown in FIG. 18B. For such various layouts, for example, FIG. As shown in (a) and (b), the present invention can be similarly applied.
[0154]
18A and 18B, when the first substrate transport robot 31 in the IF unit 3 is configured as in the first embodiment, the substrate delivery table is located at the position indicated by the dotted line in FIG. 25 may be provided. In this case, when the processing unit 2 is the conventional processing unit 2 described in the first embodiment, the substrate transfer table 25 is the end on the IF unit 3 side of the second device arrangement portion 22 of the conventional processing unit 2. When the processing unit 2 is the improved processing unit 2 described in the second embodiment, the substrate transfer table 25 is disposed on the IF unit 3 side of the second transport path 41 of the processing unit 2. Provided at the end.
[0155]
Further, in the layouts of FIGS. 18A and 18B, when the first substrate transport robot 31 in the IF unit 3 is configured as in the second embodiment, it has been described in the second embodiment. The substrate W can be transferred between the units 2 and 3 in cooperation with the second substrate transfer robot 42 in the improved processing unit 2.
[0156]
Further, as shown in FIGS. 18C and 18D, the connection position of the first substrate transfer robot 31 in the IF unit 3 with the processing unit 2 is determined from the layouts of FIGS. 18A and 18B. If the first substrate transfer robot 31 in the IF unit 3 is configured as in the second embodiment when the layout is shifted in the direction of the center of the end surface of the processing unit 2, the processing unit 2 is changed to the conventional processing unit 2. In addition, the substrate support pin 31f of the first substrate transfer robot 31 in the IF unit 3 and the substrate transfer robot 23 of the conventional processing unit 2 cooperate to transfer the substrate W between these units 2 and 3. it can. Further, in the layouts of FIGS. 18C and 18D, when the first substrate transfer robot 31 in the IF unit 3 is configured as in the second embodiment and the processing unit 2 is the conventional processing unit 2. As shown by the dotted line in the figure, if the substrate delivery table 25 is provided at the end of the transfer path 24 of the conventional processing unit 2 on the IF unit 3 side, the substrate W is delivered between these units 2 and 3. be able to.
[0157]
18C and 18D, the first substrate transfer robot 31 in the IF unit 3 is configured as in the second embodiment, and the processing unit 2 is improved. Even so, the substrate support pin 31f of the first substrate transfer robot 31 in the IF unit 3 and the first substrate transfer robot 23 of the improved processing unit 2 cooperate to establish a connection between the units 2 and 3. When the substrate W can be delivered and the first substrate transfer robot 31 in the IF unit 3 is configured as in the first embodiment, the second apparatus placement section of the improved processing unit 2 is used. By disposing the substrate delivery table 25 at the end of the IF 22 or the first transport path 24 on the IF unit 3 side, the substrate W can be delivered between these units 2 and 3.
[0158]
Further, in the case where the connection position of the first substrate transfer robot 31 in the IF unit 3 with the processing unit 2 is further shifted to the vicinity of the first apparatus placement portion 21 of the processing unit 2, the IF unit 3 is configured as in the first embodiment, and the IF unit of the first apparatus placement unit 21 of the processing unit (which may be a conventional processing unit or an improved processing unit) 2 By providing the substrate delivery table 25 at the end portion on the 3 side, the substrate W can be delivered between these units 2 and 3.
[0159]
In the layout as shown in FIG. 18 as well, the IF unit 3 in which the arrangement of the first substrate transfer robot 31, the buffer unit 32, and the second substrate transfer robot 33 in the IF unit 3 is configured as in the second modification. It is also possible to use.
[0160]
【The invention's effect】
As is apparent from the above description, according to the first aspect of the invention, since the substrate storage portion is provided, the time difference between the processing time in the processing unit and the processing time in the exposure unit can be flexibly handled. be able to. In addition, since the first substrate transfer unit performs the substrate transfer between the processing unit and the substrate storage unit, and the second substrate transfer unit performs the substrate transfer between the substrate storage unit and the exposure unit. The number of substrate delivery positions in each transport means is reduced, and the substrate transport by the first substrate transport means and the substrate transport by the second substrate transport means can be performed independently and in parallel. The time required for transporting the substrate between the processing unit and the exposure unit can be shortened. Also, the delivery of the substrate by the first and second substrate transport means is sandwiched between the substrate storage portions. From one side and the other side Therefore, both the first and second substrate transporting units do not need to transport the substrate across the substrate delivery position including the substrate storage portion, and useless operation avoids the substrate delivery position. Thus, the time required for transporting the substrate between the processing unit and the exposure unit can be shortened accordingly.
[0161]
Therefore, if the substrate transport apparatus according to the first aspect of the present invention is used in a substrate processing apparatus incorporating a high-speed exposure unit or a processing unit following the exposure unit, the substrate transport between the processing unit and the exposure unit is performed. Can be made to follow the high processing speed of the exposure unit and the processing unit, and the disadvantage that the throughput of the entire substrate processing apparatus is reduced can be solved.
[0162]
According to the invention described in claim 2, in addition to the effect of the invention described in claim 1, the following effect can be obtained. That is, the first substrate transport unit, the substrate storage unit, and the second substrate transport unit are arranged in a substantially straight line in this order in parallel with the moving direction of the uniaxial moving unit of the second substrate transport unit. Since the substrate loading / unloading base is disposed along the moving direction of the uniaxial moving means, an interface unit (IF unit) in which the substrate transfer apparatus according to the present invention is unitized is formed long in the horizontal uniaxial direction. For example, when processing units, IF units, and exposure units are arranged in one horizontal axis direction, each unit is arranged with the longitudinal direction of the IF units orthogonal to the arrangement direction of the processing units, IF units, and exposure units. Therefore, the distance between the processing unit and the exposure unit can be reduced, and the width from the processing unit to the exposure unit is reduced. It is possible to increase the product efficiency.
[0163]
In addition, the storage units of the substrate storage unit are formed in a multi-tiered manner in the vertical axis direction, and the first and second substrate transfer units store and remove substrates from the storage units of the substrate storage unit. / Since the take-out means can be moved in the vertical direction, the floor usage area required for placing the substrate storage unit can be reduced, and the IF unit can be configured compactly in the horizontal direction. The floor area can be reduced.
[0164]
This type of substrate processing apparatus is installed in a clean room with high operating costs, but according to the present invention, the floor surface of the clean room can be used efficiently.
[Brief description of the drawings]
FIG. 1 is a cross-sectional plan view showing the entire configuration of a substrate processing apparatus including a substrate transfer apparatus according to a first embodiment of the present invention.
FIG. 2 is a perspective view showing a schematic configuration in the vicinity of a buffer section of the first embodiment apparatus;
FIG. 3 is a front view of the first embodiment apparatus as viewed from the exposure unit side.
FIG. 4 is a diagram for explaining a procedure for accessing a cooling device by a substrate transport robot in a processing unit and a procedure for placing a substrate on a substrate delivery table;
FIG. 5 is a diagram for explaining a procedure for storing a substrate in a buffer unit by a first substrate transfer robot in the IF unit.
FIG. 6 is a block diagram illustrating a schematic configuration of a control system of the embodiment apparatus.
FIG. 7 is a diagram for explaining an example of buffer unit use management;
FIG. 8 is a diagram for explaining an example of buffer unit usage management;
FIG. 9 is also a diagram for explaining an example of usage management of a buffer unit;
FIG. 10 is a diagram for explaining an example of usage management of the buffer unit.
FIG. 11 is a diagram for explaining another example of usage management of a buffer unit;
FIG. 12 is a cross-sectional plan view showing the overall configuration of a substrate processing apparatus including a second embodiment apparatus.
FIG. 13 is a front view showing a schematic configuration of a first substrate transfer robot of the second embodiment apparatus.
FIG. 14 is a front view showing a configuration of a bake unit of the improved processing unit.
FIG. 15 is a longitudinal sectional view showing a configuration of an improved processing unit.
FIG. 16 is a diagram for explaining a procedure for transferring a substrate between a processing unit and an IF unit in the second embodiment;
FIG. 17 is a diagram illustrating a configuration of a second modification with respect to each embodiment.
FIG. 18 is a diagram for explaining a configuration of a third modification with respect to each embodiment.
FIG. 19 is a plan sectional view, a front view, and a side view showing an overall configuration of a substrate transfer apparatus and a substrate processing apparatus incorporating the apparatus according to a conventional example.
[Explanation of symbols]
2… Processing unit
3 ... Interface (IF) unit (substrate transfer device)
4 ... Exposure unit
25 ... Board delivery table
31: First substrate transfer robot (first substrate transfer means)
31a ... Z-direction drive unit of the first substrate transfer robot
31c: Rotation drive unit of first substrate transfer robot
31d: Extension / contraction drive unit of first substrate transfer robot
31e: Substrate support portion of the first substrate transfer robot
31f: Substrate support pin of the first substrate transfer robot
32 ... Buffer section (board storage section)
32a ... Buffer unit storage shelf (substrate storage unit storage unit)
33 ... Second substrate transfer robot (second substrate transfer means)
33a ... Y-direction drive unit of second substrate transfer robot
33c Z-direction drive unit of second substrate transfer robot
33e: Rotation drive unit of second substrate transfer robot
33f ... Extension / contraction drive unit of second substrate transfer robot
33 g ... Substrate support part of second substrate transfer robot
34… Board loading table
35 ... Substrate carry-out stand
W ... Substrate

Claims (2)

In a substrate transport apparatus for transporting (delivery) a substrate between a processing unit for performing various substrate processes before and after the exposure process and an exposure unit for performing the exposure process in the photolithography process,
A plurality of storage portions for temporarily storing a plurality of substrates, the plurality of storage portions being divided into a region for storing a pre-exposure substrate and a region for storing an exposed substrate; A substrate storage unit capable of storing / removing a substrate with respect to the storage unit;
First substrate transfer means for delivering a substrate to and from the processing unit and for storing / removing the substrate before and after the exposure processing from one side with respect to an arbitrary storage portion of the substrate storage portion;
A second substrate transfer means for delivering and receiving the substrate to and from the exposure unit, and for storing / removing the substrate before and after the exposure processing from the other side with respect to an arbitrary storage portion of the substrate storage portion;
A substrate transfer device comprising: The substrate transfer apparatus according to claim 1,
The plurality of storage portions of the substrate storage portion are stacked in a multi-stage shape in the vertical direction,
The first substrate transfer means includes a substrate delivery means for delivering a substrate to and from the processing unit; and a first substrate transfer means that supports the substrate and expands and contracts in a horizontal direction with respect to an arbitrary storage portion of the substrate storage portion. A substrate storing / removing means for storing / removing the substrate; and a vertical direction moving means for moving the substrate storing / removing means in the vertical direction.
The second substrate transfer means supports the substrate and expands and contracts in the horizontal direction to store / take out the substrate from / to an arbitrary storage portion of the substrate storage portion, and to / from the exposure unit. Board storage / unloading means for loading / unloading the substrate with respect to the substrate loading / unloading table for delivering the substrate, rotating means for rotating the substrate storage / unloading means vertically, and the substrate storage / removal A vertical movement means for moving the means in the vertical direction, and a uniaxial movement means for moving the substrate storage / removal means in the horizontal uniaxial direction.
In addition, the first substrate transfer means, the substrate storage portion, and the second substrate transfer means are arranged in a straight line in this order in parallel with the moving direction of the one-axis direction moving means of the second substrate transfer means. And a substrate carrying-in / out table along the moving direction of the uniaxial moving means.

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