JPH11135596A - Board treatment equipment and intermediate delivery equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board treatment equipment where foot print is reduced and an intermediate delivery equipment. SOLUTION: A board treatment equipment 100 is provided with an indexer 1, a treatment unit 2 and an interface unit 3. An exposure unit 4 is arranged adjacently to the interface unit 3. The interface unit 3 is equipped with a board carrying robot 33, a board carrying-in table 34 and a board carrying-out table. The board carrying-in table 34 and the board carrying-out table are stacked in the vertical direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an intermediate transfer device for transferring a substrate to and from an external device, and a substrate processing apparatus provided with the intermediate transfer device.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to perform various processes on substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a glass substrate for an optical disk. For example, in a semiconductor device manufacturing process, a substrate processing apparatus in which each of a series of processes is unitized and a plurality of units are integrated is used to increase production efficiency.

In a photolithography process, various types of substrate processing before and after exposure processing are performed in a substrate processing apparatus.
Exposure processing is performed in an exposure unit. In this case, the substrate processing apparatus includes a spin coater (rotary coating apparatus) that performs a coating process of a photoresist, a spin developer (a rotary developing device) that performs a developing process, and a bake plate (a substrate heat processing device) that performs a heating process and a cooling process. ), And a substrate transport unit that transports a substrate between the processing devices.

On the other hand, an exposure unit includes an exposure machine such as a reduction projection exposure machine (stepper) for performing exposure, an alignment mechanism for performing positioning for printing an exposure pattern by the exposure machine, and a transfer of a substrate in the exposure unit. And a substrate transfer robot for performing the above.

[0005] In the photolithography process, first, the substrate processing before exposure processing is performed in the substrate processing apparatus, then the exposure processing is performed in the exposure unit, and then the substrate processing after the exposure processing is performed again in the substrate processing apparatus. Done. Therefore, it is necessary to transfer the substrate between the substrate processing apparatus and the exposure unit. Therefore, the substrate processing apparatus is provided with an interface unit (intermediate transfer device; hereinafter, abbreviated as an IF unit) for transferring the substrate.

FIG. 14 is a plan view of a conventional substrate processing apparatus having an IF unit, FIG. 15 is a front view of the IF unit in the substrate processing apparatus of FIG. 14, and FIG. 16 is a side view of the IF unit in the substrate processing apparatus of FIG. FIG.

[0007] In FIG. 14, a substrate processing apparatus 200 includes:
A plurality of spin coaters 210a, a plurality of spin developers 210b, a plurality of heat treatment units 210c including a hot plate or a cool plate, a substrate transfer unit 220, and an IF unit 230 are provided. An exposure unit 250 is provided at one end of the substrate processing apparatus 200 so as to be adjacent to the IF unit 230.

The substrate transfer unit 220 is a substrate transfer robot 221 for transferring a substrate in the X-axis direction (the direction of arrow X).
Having. IF unit 230 is a substrate transfer robot 23
One. The substrate transfer robot 231 includes a substrate holding unit 232 that holds the substrate W, an X-direction moving mechanism 233 that moves the substrate holding unit 232 in the X-axis direction, and the substrate holding unit 232 via the X-axis moving mechanism 233. The Z direction moving mechanism 234 for moving in the direction (the direction of arrow Z), and the Y direction for moving the substrate holder 232 in the Y axis direction (the direction of arrow Y) via the Z direction moving mechanism 234 and the X direction moving mechanism 233. The moving mechanism 235 is included.

As a result, the substrate transfer robot 231
The substrate transfer unit 240 holds the substrate W in the substrate holding unit 232 and moves the substrate W in the X-axis direction, the Y-axis direction, and the Z-axis direction.
The substrate W can be transferred between the substrate carry-in table 241, the substrate carry-out table 242, and the buffer unit 243.

[0010] The substrate transfer table 240 is used for transferring the substrate W between the substrate transfer robot 231 and the substrate transfer robot 221. The substrate carry-in table 241 and the substrate carry-out table 242 are used by the substrate transfer robot 231 to transfer the substrate W to and from a substrate transfer robot (not shown) in the exposure unit 250. FIG.
As shown in the figure, an opening 2 for transferring the substrate W between the IF unit 230 and the exposure unit 250 is provided on the side surface of the IF unit 230.
36 are provided. The buffer unit 243 is used to temporarily store the substrate W when there is a difference between the processing time in the substrate processing apparatus 200 and the processing time in the exposure unit 250.

In the substrate processing apparatus 200, first, the substrate transport robot 221 of the substrate transport unit 220
However, the spin coater 210a and the heat treatment unit 210
The substrate W processed in step c is placed on the substrate delivery table 240. The substrate transfer robot 231 of the IF unit 230
The substrate W placed on the substrate transfer table 240 is received and held by the substrate holding unit 232, and the substrate W is transferred to the substrate transfer table 2.
Place on 41. Substrate W placed on substrate carry-in table 241
Is taken into the exposure unit 250 by the substrate transfer robot in the exposure unit 250.

In the exposure unit 250, the substrate W subjected to the exposure processing is carried out of the exposure unit 250 by the substrate transfer robot in the exposure unit 250, and is placed on the substrate carrying table 242. The substrate transfer robot 231 of the IF unit 230 receives and holds the substrate W placed on the substrate unloading table 242 by the substrate holding unit 232, and places the substrate W on the substrate transfer table 240. The substrate W placed on the substrate delivery table 240 is
Heat treatment unit 210 by the substrate transfer robot 221
c and the spin developer 210b.

[0013]

In recent years, each processing apparatus and substrate transport unit have been increasing in size as the diameter of the substrate has increased. In the above-described conventional substrate processing apparatus 200, a substrate carry-in table 241 and a substrate carry-out table 242 for transferring a substrate W to and from the exposure unit 250 are provided in the IF unit 230 in addition to the substrate transfer robot 231. Therefore, the occupied area increases. However, since the space in the factory is limited, it is desired to reduce the overall footprint (installation area) of the substrate processing apparatus as much as possible.

[0014] It is an object of the present invention to provide a substrate processing apparatus and an intermediate transfer apparatus having a reduced footprint.

[0015]

Means for Solving the Problems and Effects of the Invention

(1) First Invention A substrate processing apparatus according to a first invention is a processing unit that performs a predetermined process on a substrate, a first transfer unit that transfers a substrate to an external device, and receives a substrate from an external device. And a transfer means for transferring a substrate between a substrate transfer position with the processing unit and the first and second transfer units, the first transfer unit and the second transfer unit Are stacked vertically.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing unit is transported to the first transfer unit by the transfer unit, and is loaded into the external device from the first transfer unit. Further, the substrate carried out from the external device is received by the second transfer unit, transported to a substrate transfer position with the processing unit by the transport unit, and the processing unit performs processing on the substrate.

In particular, since the first transfer portion and the second transfer portion are vertically stacked, the space required for transferring the substrate to and from an external device is reduced, and the space required for the substrate processing apparatus is reduced. The overall footprint is reduced.

(2) Second Invention In a substrate processing apparatus according to a second invention, in the configuration of the substrate processing apparatus according to the first invention, the first transfer unit mounts a substrate carried into an external device. The first substrate placing section on which the substrate is placed, and the second transfer section is a second substrate placing section on which a substrate carried out from an external device is placed.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means,
It is mounted on the first substrate mounting part. The substrate placed on the first substrate placing portion is carried into the external device by the substrate carrying means of the external device. The substrate carried out of the external device by the substrate carrying means of the external device is placed on the second substrate placing portion. The substrate placed on the second substrate placement unit is transported to a substrate transfer position with the processing unit by the transport unit,
The processing unit performs processing on the substrate.

Also in this case, since the first substrate mounting portion and the second substrate mounting portion are vertically stacked, a space necessary for transferring the substrate to and from an external device is reduced. It reduces the overall footprint of the substrate processing apparatus.

(3) Third Invention In a substrate processing apparatus according to a third aspect of the present invention, in the configuration of the substrate processing apparatus according to the first aspect of the present invention, the first transfer section includes a substrate transferring the substrate into an external device. The second transfer unit is a carry-out unit that carries out the substrate from the external device.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means,
It is passed to the substrate loading means. Then, the substrate is carried into the external device by the substrate carrying means. The substrate is unloaded from the external device by the substrate unloading means, taken into the substrate processing apparatus, and transferred to the transfer means. The substrate is transported to a substrate transfer position with the processing unit by the transport unit, and the processing unit processes the substrate.

Also in this case, since the substrate carrying means and the substrate carrying means are vertically stacked, the space required for transferring the substrate to and from an external device is reduced, and the whole of the substrate processing apparatus is reduced. Footprint is reduced.

(4) Fourth Invention A substrate processing apparatus according to a fourth invention is a processing unit for performing predetermined processing on a substrate, and a common delivery for delivering the substrate to an external device and receiving the substrate from the external device. And a transport unit for transporting a substrate between a common delivery unit and a substrate delivery position with respect to a processing unit.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means,
It is passed to a common delivery unit. Then, the common transfer unit is moved up and down to the transfer position of the substrate with the external device by the elevating means, and the substrate is carried into the external device from the common transfer unit. Further, the common transfer unit is moved up and down to the transfer position of the substrate with the external device by the elevating means, and the substrate carried out of the external device is received by the common transfer unit. Then, the substrate is transported from the common delivery unit to the substrate delivery position with the processing unit by the transportation unit, and the processing unit performs processing on the substrate.

In particular, by raising and lowering the common transfer unit by means of the lifting / lowering means, the common transfer unit is used when loading the substrate into and out of the external device. The space required for the transfer of the substrate in the substrate is reduced, and the overall footprint of the substrate processing apparatus is reduced.

(5) Fifth Invention In the substrate processing apparatus according to the fifth invention, in the configuration of the substrate processing apparatus according to the fourth invention, the common transfer unit has a substrate on which a substrate to be carried into an external device is placed. And a substrate mounting portion on which the substrate carried out from the external device is mounted.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means,
It is mounted on the substrate mounting part. Then, the substrate mounting portion is moved up and down by the elevating means to the position for transferring the substrate to and from the external device, and the substrate mounted on the substrate mounting portion is carried into the external device by the substrate carrying means of the external device. In addition, the substrate mounting portion is moved up and down to a transfer position of the substrate with the external device by the elevating means, and the substrate carried out of the external device is mounted on the substrate mounting portion by the substrate carrying out device of the external device. Then, the substrate is transported from the substrate mounting section to the substrate transfer position with the processing section by the transport section, and the processing section processes the substrate.

Also in this case, the substrate mounting portion is commonly used when the substrate mounting portion is moved up and down by the elevating means when the substrate is loaded into the external device and when the substrate is unloaded from the external device. The space required for transferring a substrate to and from an external device is reduced, and the overall footprint of the substrate processing apparatus is reduced.

(6) Sixth invention A substrate processing apparatus according to a sixth aspect of the present invention is the substrate processing apparatus according to the fourth aspect of the present invention, wherein the common transfer unit loads a substrate into an external device and the external device This is a substrate loading / unloading means for transporting a substrate from the inside.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means,
It is passed to the substrate loading / unloading means. Then, the substrate carrying-in / out means is moved up and down to the transfer position of the substrate with the external device by the elevating means, and the substrate is carried into the external device by the substrate carrying-in / out means. Further, the substrate carrying-in / out means is moved up and down to the transfer position of the substrate with the external device by the elevating means, and the substrate is carried out of the external device by the substrate carrying-in / out means and taken into the substrate processing apparatus. Then, the substrate is transported from the substrate loading / unloading unit to the substrate transfer position with the processing unit by the transport unit, and the processing unit processes the substrate.

Also in this case, the substrate loading / unloading means is moved up and down by the lifting / lowering means, so that the substrate loading / unloading means is commonly used when loading the substrate into and out of the external device. The space required for transferring a substrate to and from an external device is reduced, and the overall footprint of the substrate processing apparatus is reduced.

(7) Seventh Invention A substrate processing apparatus according to a seventh invention is a processing unit for performing predetermined processing on a substrate, and a common delivery for delivering the substrate to an external device and receiving the substrate from the external device. And a transport unit for transporting the substrate between a substrate transfer position and a common transfer unit with the processing unit.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means,
The substrate is transferred to the common transfer unit, and the substrate is carried into the external device from the common transfer unit. Further, the substrate carried out from the external device is received by the common transfer unit, the substrate is transferred from the common transfer unit to the substrate transfer position with the processing unit by the transfer unit, and the processing unit processes the substrate.

In particular, since a common transfer unit is used when a substrate is carried into and out of an external device, a space required for transferring the substrate to and from the external device is reduced. In addition, the overall footprint of the substrate processing apparatus is reduced.

(8) Eighth Invention In a substrate processing apparatus according to an eighth aspect of the present invention, in the configuration of the substrate processing apparatus according to the seventh aspect of the present invention, the common delivery unit mounts a substrate carried into an external device. And a substrate mounting portion on which the substrate carried out from the external device is mounted.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means.
It is mounted on the substrate mounting part. Then, the substrate placed on the substrate placing portion is carried into the external device by the substrate carrying means of the external device. Further, the substrate carried out of the external device by the substrate carrying means of the external device is placed on the substrate placing portion. Then, the substrate is transported from the substrate mounting section to the substrate transfer position with the processing section by the transport section, and the processing section processes the substrate.

Also in this case, since the substrate mounting portion is commonly used when the substrate is loaded into the external device and when the substrate is unloaded from the external device, it is necessary to transfer the substrate to and from the external device. And the overall footprint of the substrate processing apparatus is reduced.

(9) Ninth Invention In a substrate processing apparatus according to a ninth aspect of the present invention, in the configuration of the substrate processing apparatus according to the seventh aspect, the common transfer section loads the substrate into the external device and sets the external This is a substrate loading / unloading means for loading and unloading a substrate from the apparatus.

In the substrate processing apparatus according to the present invention, the substrate processed by the processing section is transported by the transport means,
It is passed to the substrate loading / unloading means. Then, the substrate is carried into the external device by the substrate carrying-in / out means. Further, the substrate is carried out of the external device by the substrate carrying-in / out means and taken into the substrate processing apparatus. Then, the substrate is transported from the substrate loading / unloading unit to the substrate transfer position with the processing unit by the transport unit, and the processing unit processes the substrate.

Also in this case, since the substrate loading / unloading means is commonly used when loading the substrate into and out of the external device, it is necessary to transfer the substrate to and from the external device. And the overall footprint of the substrate processing apparatus is reduced.

(10) Tenth invention An intermediate delivery device according to a tenth invention is an intermediate delivery device for delivering a substrate between a processing section for performing a predetermined process on a substrate and a predetermined external device. A first transfer unit for transferring a substrate to an external device, a second transfer unit for receiving a substrate from the external device, and a substrate transfer position between the processing unit and the first and second transfer units. And a transfer means for transferring the substrate by using the first transfer part and the second transfer part, which are vertically stacked.

In the intermediate transfer apparatus according to the present invention, the substrate processed by the processing unit is transferred to the first by the transfer means.
And transferred from the first transfer unit to an external device. Further, the substrate carried out from the external device is received by the second transfer unit, transported to a substrate transfer position with the processing unit by the transport unit, and the processing unit performs processing on the substrate.

In particular, since the first transfer section and the second transfer section are vertically stacked, the space required for transferring the substrate to and from an external device is reduced, and the intermediate transfer apparatus has a small space. Footprint is reduced.

(11) Eleventh Invention An intermediate delivery device according to an eleventh invention is an intermediate delivery device for delivering a substrate between a processing section for performing a predetermined process on a substrate and a predetermined external device. A common transfer unit for transferring the substrate to the external device and receiving the substrate from the external device, an elevating unit for vertically moving the common transfer unit up and down, and a common transfer unit for the substrate transfer position with the processing unit. Transport means for transporting the substrate between them.

In the intermediate transfer device according to the present invention, the substrate processed by the processing unit is transferred by the transfer unit and transferred to the common transfer unit. Then, the common transfer unit is moved up and down to the transfer position of the substrate with the external device by the elevating means, and the substrate is carried into the external device from the common transfer unit. Further, the common transfer unit is moved up and down to the transfer position of the substrate with the external device by the elevating means, and the substrate carried out of the external device is received by the common transfer unit. Then, the substrate is transported from the common delivery unit to the substrate delivery position with the processing unit by the transportation unit, and the processing unit performs processing on the substrate.

In particular, by raising and lowering the common transfer unit by the lifting / lowering means, the common transfer unit is used when the substrate is carried into and out of the external device, so that the common transfer unit is used. The space required for the transfer of the substrate at the same time is reduced, and the footprint of the intermediate transfer device is reduced.

(12) Twelfth Invention An intermediate delivery device according to a twelfth invention is an intermediate delivery device for delivering a substrate between a processing unit for performing a predetermined process on a substrate and a predetermined external device. A common transfer unit for transferring the substrate to the external device and receiving the substrate from the external device, and a transfer unit for transferring the substrate between a substrate transfer position with the processing unit and the common transfer unit. is there.

In the intermediate transfer device according to the present invention, the substrate processed by the processing section is transferred by the transfer means, transferred to the common transfer section, and the substrate is carried into the external device from the common transfer section. Further, the substrate carried out from the external device is received by the common transfer unit, the substrate is transferred from the common transfer unit to the substrate transfer position with the processing unit by the transfer unit, and the processing unit processes the substrate.

In particular, since a common transfer section is used when a substrate is carried into and out of an external device, the space required for transferring the substrate to and from the external device is reduced. , The footprint of the intermediate transfer device is reduced.

[0051]

BEST MODE FOR CARRYING OUT THE INVENTION

(1) First Embodiment FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a front view of the substrate processing apparatus of FIG. 1 as viewed from the exposure unit side. FIG. 3 is FIG.
FIG. 4 is a perspective view showing a schematic configuration near a buffer unit in the substrate processing apparatus of FIG. 1 and subsequent figures are provided with an XYZ orthogonal coordinate system in order to clarify the positional relationship.

The substrate processing apparatus 100a shown in FIG. 1 includes an indexer 1, a processing unit 2, and an interface unit (intermediate transfer device; hereinafter, abbreviated as IF unit).
3 is provided. An exposure unit 4 is disposed as an external device adjacent to the IF unit 3.

The indexer 1 has a loading / unloading table 11 for transferring a carrier C to and from an automatic guided vehicle (hereinafter referred to as AGV) 5 for a carrier, and is mounted on the loading / unloading table 11. A substrate loading / unloading robot 12 for transferring a substrate W between a carrier C and a substrate transport robot 23 in the processing unit 2 described below.

The processing unit 2 includes a first device placement unit 21
, A second apparatus arrangement unit 22, and a transfer path 24 for the substrate transfer robot 23. A first coater (rotary coating device) SC for performing resist coating and a spin developer (rotary developing device) SD for performing development are provided along the X-axis direction in FIG.
Are arranged in plurals. Further, the second apparatus arrangement unit 22 includes a bake unit BU for performing pre-bake, post-bake, and the like, and a plurality of edge exposure units EE.
W is provided.

Transfer path 24 for substrate transfer robot 23
Is provided between the first device placement unit 21 and the second device placement unit 22. The substrate transfer robot 23 moves the substrate W
Hand 23b provided with a plurality of projections 23a for supporting the hand, and the hand 23b is moved in the horizontal direction (XY plane).
And an expansion / contraction part 23c that expands and contracts. Telescopic part 23c
Is configured by a one-axis direction moving mechanism including a screw shaft and a motor (not shown), and is rotated around the Z axis by a predetermined motor (not shown).

The substrate transfer robot 23 includes a hand 23
b, the rotation about the Z-axis (vertical axis), the movement in the X-axis and the Y-axis directions, and the expansion and contraction operations are appropriately combined to form a spin coater SC, a spin developer SD, and a bake unit B
U, access to the processing apparatus such as the edge exposure unit EEW (loading and unloading operations of the substrate W), storage (loading) and removal of the substrate W to and from an optional storage shelf 32a of the buffer unit 32 in the IF unit 3, which will be described later. Processing unit 2
The transfer of the substrate W to / from each of the processing apparatuses is performed.

For example, when carrying the substrate W into the spin coater SC, first, the hand 23b supporting the substrate W is moved appropriately in the X-axis direction and the Z-axis direction to be positioned in front of the spin coater SC, and The rotation around the Z axis allows the hand 23b to expand and contract in the direction of the spin coater SC. Next, the hand 23b is inserted into the spin coater SC from the substrate loading / unloading port of the spin coater SC, and after the transfer of the substrate W, the hand 23b is withdrawn from the spin coater SC. The unloading of the substrate W from the spin coater SC is performed in a reverse operation to the above-described loading. The operation of the substrate transfer robot 23 when accessing other processing apparatuses is almost the same as the above operation.

As shown in FIGS. 1 and 2, the IF unit 3 is configured by integrally integrating a buffer section 32, a substrate transport robot 33, a substrate loading table 34, and a substrate discharging table 35. The substrate loading table 34 and the substrate loading table 35 are vertically stacked (see FIG. 2).
In this embodiment, two table tables 37a and 37b for setting the first and second cassettes 36a and 36b are also provided in the IF unit 3.

The buffer unit 32 is provided with an extension of the moving path of the substrate transfer robot 23 in the X-axis direction in the processing unit 2 and a substrate transfer robot 33 in the IF unit 3 described later.
And is supported on the inner surface of the IF unit 3 at a position intersecting with the extension of the movement path in the X-axis direction.

As shown in FIG. 3, the buffer unit 32 includes
A plurality of storage shelves 32a are stacked in multiple stages in the Z-axis direction. Each storage shelf 32a has a side wall 32b on the side of the exposure unit 4.
A plurality of substrate support pins 32d are vertically provided on a pair of support arms 32c provided to protrude toward the processing unit 2 side, and the substrate W is mounted on the substrate support pins 32d.
Is placed. In each of the storage shelves 32a, a surface facing the substrate transfer robot 23 in the processing unit 2 and the substrate transfer robot 33 in the IF unit 3 is opened. Thereby, each substrate transfer robot 23, 33
Of the substrate W is taken out and taken out.

The substrate transfer robot 23 in the processing unit 2
When the substrate W is stored in the buffer unit 32 by the operator, first, the hand 23b supporting the substrate W is
The movement in the axial direction and the rotation around the Z axis are appropriately performed so that the hand 23b can expand and contract in the direction of the buffer unit 32. Next, the hand 23b is extended in the direction of the buffer section 32, and the supporting substrate W is inserted into the storage shelf 32a.
The substrate W is lowered in the axial direction to place the substrate W on the substrate support pins 32d of the storage shelf 32a, and the hand 23b is further lowered slightly to be retreated. Optional storage shelf 32 in buffer section 32
The removal of the substrate W from a is performed in such a manner that the substrate W in which the hand 23b is stored is lifted from below by the reverse operation of the storage of the substrate W.

As shown in FIG. 2, the substrate transfer robot 33 in the IF unit 3 includes a Y-direction drive unit 33a, a first connection member 33b, a Z-direction drive unit 33c, and a second connection member 3c.
3d, a rotation drive unit 33e, a telescopic drive unit 33f, and a substrate support unit 33g.

The Y-direction driving section 33a is fixed to the inner surface of the IF unit 3. The Y-direction driving unit 33a includes:
A screw shaft 33aa is rotatably provided around the Y axis, a guide shaft 33ab is provided in parallel with the screw shaft 33aa, and a motor 33ac for rotating the screw shaft 33aa in the forward and reverse directions.
Is also installed inside. The Y-direction driving unit 33a includes a telescopic driving unit 33f of the substrate transfer robot 33 and the substrate supporting unit 3
3g is movably arranged between the front surface of the buffer unit 32 in the Y-axis direction and the front surfaces of the substrate loading table 34 and the substrate discharging table 35 described later in the X-axis direction.

The base end of the first connecting member 33b is
The screw shaft 3aa is screwed to the screw shaft 33aa in the direction drive unit 33a, and is slidably fitted to the guide shaft 33ab.
By rotating 3aa in the forward and reverse directions, the first connecting member 33b can be moved in the Y-axis direction. Also,
The Z-direction driving unit 33c is provided at the tip of the first connecting member 33b.
Has been fixed.

The Z-axis driving section 33c has a screw shaft 33ca
Is provided rotatably around the Z axis, a guide shaft (not shown) is provided in parallel with the screw shaft 33ca, and the screw shaft 33
A motor 33cb for rotating ca in the forward and reverse directions is also provided inside.

The base end of the second connecting member 33d is
The second connecting member 33d is screwed into the screw shaft 33ca in the direction driving unit 33c and slidably fitted on the guide shaft, and is rotated in the forward and reverse directions by rotating the screw shaft 33ca.
Can be moved in the Z-axis direction. In addition, a rotation drive unit 33e is fixed to a distal end of the second connection member 33d.

The rotation drive unit 33e has a rotation shaft 33
ea is provided so as to be rotatable around the Z axis.
A motor 33eb for rotating ea in the forward and reverse directions is provided therein.

A telescopic drive section 33f is fixed to the tip of the rotary shaft 33ea. A timing belt 33 driven by a motor 33fa is attached to the telescopic drive unit 33f.
fb is provided internally. This timing belt 33fb
The base end of the substrate supporting portion 33g is connected to a part of
By driving the timing belt 33fb, the substrate supporting portion 33g can be expanded and contracted with respect to the expansion and contraction driving portion 33f.

By rotating the rotation shaft 33ea of the rotation drive unit 33e in the forward and reverse directions, the expansion / contraction drive unit 33f and the substrate support unit 33g are rotated around the Z-axis, and the arbitrary rotation in the XY plane (horizontal plane) is performed. The substrate support 33g can be expanded and contracted in the direction.

Further, by rotating the screw shaft 33ca of the Z-direction drive unit 33c in the forward and reverse directions, the second connection member 33d, the rotation drive unit 33e, and the extension drive unit 33c are rotated.
It is possible to adjust the height in the Z-axis direction for expanding and contracting the substrate support 33g via f.

The screw shaft 33a of the Y-direction drive unit 33a
is rotated in the forward and reverse directions, the first extension member 33b, the Z-direction drive section 33c, the second extension member 33d, and the rotation drive section 33e move the expansion / contraction drive section 33f and the substrate support section 33g along the Y axis. In the direction.

It should be noted that the Z-direction drive unit 33c is connected to the second connecting member 33d so that the extension / contraction drive unit 33f can rotate around the Z-axis even when the extension / contraction drive unit 33f is lowered in the Z-axis direction.
Are disposed at positions deviated from below the expansion / contraction drive unit 33f and the rotation drive unit 33e.

With the above configuration, the substrate transfer robot 33
Are stored in and taken out of the substrate W from / to an arbitrary storage shelf 32a of the buffer unit 32, placed on the substrate carrying table 34, taken out of the substrate W from the substrate carrying table 35, and loaded into cassettes 36a and 36b described later. The substrate W is stored and taken out.

When the substrate W is stored in or taken out of any storage shelf 32a of the buffer section 32, the direction of expansion and contraction of the substrate support section 33g is set to the direction of the buffer section 32, and the storage shelf 32a to be stored or taken out is set. The height in the Z-axis direction of the telescopic drive unit 33f and the substrate support unit 33g is adjusted according to the height. The storage and removal of the substrate W in this case are also performed by the same operation as the storage and removal of the substrate W from the optional storage shelf 32a of the buffer unit 32 by the substrate transfer robot 23 in the processing unit 2 described above.

The substrate loading table 34 and the substrate loading table 35 are
It is stacked on the support table 142 in two stages vertically. In this embodiment, the substrate loading table 34 is disposed on the substrate loading table 35 by the support member 143. Three or more (four in this embodiment) substrate support pins 34a and 35a are respectively provided on the substrate carry-in table 34 and the substrate carry-out table 35 in the vertical direction. The substrate W is placed on the substrate support pins 34a and 35a, and the substrate W is transferred to and from a substrate transport robot (not shown) in the exposure unit 4.

Although not shown, the exposure unit 4
The opening through which the substrate transport robot in the exposure unit 4 supporting the substrate W passes when the substrate W is transferred between the exposure unit 4 and the IF unit 3 is provided between the exposure unit 4 and the IF unit 3.
And is provided between them.

The substrate transfer robot 33 in the IF unit 3
The mounting of the substrate W on the substrate loading table 34 by the above is performed as shown in FIG. First, the expansion / contraction driving unit 33f and the substrate support unit 33g are moved in the Y-axis direction by the Y-direction driving unit 33a in FIG. 2 to be positioned in front of the substrate loading table 34 in the X-axis direction, and are also driven by the rotation driving unit 33e. The part 33f is rotated about the Z-axis, and the substrate supporting part 33g is moved to the substrate loading table 3
4 so that it can expand and contract. Then, the height of the substrate supporting portion 33g is adjusted by the Z-direction driving portion 33c in accordance with the height of the substrate loading table 34 in the Z-axis direction.

The movement of the substrate support 33g in the Y-axis direction, the rotation about the Z-axis, and the movement in the Z-axis direction may be performed first.

Next, the substrate W supporting the substrate supporting portion 33 g by extending it is supported by the substrate supporting pins 34 a of the substrate loading table 34.
The substrate W is placed on the substrate support pins 34a of the substrate loading table 34 by lowering the substrate support 33g in the Z-axis direction by the Z-axis drive unit 33c. The lowering of the substrate support 33g is stopped at a position where the back surface does not contact the substrate support 33g. After that, the substrate support 33g is withdrawn.

The substrate transfer robot 33 in the IF unit 3
When the substrate W is taken out of the substrate carrying-out table 35 by the above operation, the substrate supporting portion 33g is placed on the substrate supporting pins 35a of the substrate carrying-out table 35 in an operation reverse to the operation of placing the substrate W on the substrate carrying-in table 34. The substrate W is lifted from below.

The table table 37a on which the first cassette 36a is set is mounted on the substrate transfer robot 3 in the IF unit 3.
3 at one end (the end opposite to the buffer unit 32) of the Y-direction driving unit 33a so as to face the buffer unit 32.
It is fixed to the inner surface of the unit 3. The table base 37b for setting the second cassette 36b is fixed to the inner surface of the IF unit 3 at a position closer to the buffer unit 32 in the Y-axis direction than the table base 37a and higher than the table base 37a. I have. In addition, the table table 37
The height of the Z-direction drive unit 3 when the substrate transfer robot 33 in the IF unit 3 is located on the substrate loading table 34 and the substrate loading table 35 as shown by the imaginary line in FIG.
The upper end of 3c is positioned so as not to interfere.

First and second cassettes 36a and 36b
Is provided with a plurality of storage shelves (not shown) for storing a plurality of substrates W in a horizontal posture. These cassettes 36a and 36b are used, for example, when a pilot board (substrate for exposure test) is stored and an exposure test is performed, or when the IF unit 3 is used as the indexer 1.

The setting or taking out of the cassettes 36a, 36b with respect to the table bases 37a, 37b is performed by an operator opening a door 38 (see FIG. 1) provided on one side of the IF unit 3.

The exposure unit 4 includes an exposure machine such as a reduction projection exposure machine (stepper) for performing exposure, an alignment mechanism for performing positioning for printing an exposure pattern by the exposure machine, and a substrate W in the exposure unit 4. It is configured by integrally integrating a substrate transfer robot (both not shown) for performing transfer and the like.

The substrate transport robot in the exposure unit 4
The substrate W before exposure placed on the substrate loading table 34 in the IF unit 3 is taken into the exposure unit 4, and the exposed substrate W after the exposure processing in the exposure unit 4 is unloaded from the exposure unit 4. And placed on the substrate carrying table 35 in the IF unit 3.

In the present embodiment, the substrate W
The substrate transfer position with the substrate transfer robot in the exposure unit 4 at the time of loading of the substrate W is arranged at the upper part, and the substrate transfer position with the substrate transfer robot within the exposure unit 4 at the time of unloading the substrate W from the exposure unit 4 is at the lower part. It is assumed that they are arranged.

The removal of the substrate W from the substrate carry-in table 34 and the placement of the substrate W on the substrate carry-out table 35 by the substrate transfer robot in the exposure unit 4 are performed by using the substrate in the IF unit 3 described with reference to FIG. The operation of placing the substrate W on the substrate carry-in table 34 and taking out the substrate W from the substrate carry-out table 35 by the transfer robot 33 is performed.

In the present embodiment, the processing unit 2 corresponds to a processing section, and the substrate carrying table 34 is connected to the first transfer section and the first transfer section.
The substrate unloading table 35 corresponds to the second transfer unit and the second substrate mounting unit, and the buffer unit 32
Each of the storage shelves 32a corresponds to a substrate transfer position with the processing unit 2 as a processing unit, and the substrate transfer robot 33 corresponds to a transfer unit.

Next, the operation of the substrate processing apparatus 100a of FIG. 1 will be described. First, the loading / unloading table 11 is operated by the AGV 5.
The substrate transport robot W before processing is taken out of the carrier C by the substrate loading / unloading robot 12, and the substrate W is transferred to the substrate transport robot 23 in the processing unit 2. Then, the substrate W before processing is sequentially transported by the substrate transport robot 23 to the spin coater SC, the bake unit BU, the edge exposure unit EEW, and the like, and resist coating by the spin coater SC, baking by the bake unit BU, edge exposure by the edge exposure unit EEW, and the like. Are performed.

The processed substrate W is transferred to the substrate transfer robot 23
Is stored in an optional storage shelf 32a of the buffer unit 32 of the IF unit 3. Then, the substrate W before exposure stored in the storage shelf 32a is taken out by the substrate transfer robot 33 and placed on the substrate support pins 34a of the substrate loading table 34.

Thereafter, the substrate W before exposure is taken into the exposure unit 4 from the substrate carry-in table 34 by the substrate transfer robot (not shown) in the exposure unit 4. In the exposure unit 4, the substrate W is transferred to the alignment mechanism to perform a positioning process. The substrate W is transferred to the exposure device in a positioned state, and a predetermined exposure pattern is printed.

The exposed substrate W having been subjected to the exposure processing is carried out of the exposure unit 4 by the substrate transfer robot in the exposure unit 4, and the substrate support pins 35 a of the substrate carrying table 35 are provided.
Placed on top.

After that, the exposed substrate W is taken out from the substrate carry-out stand 35 by the substrate transfer robot 33 of the IF unit 3 and stored in an optional storage shelf 32 a of the buffer unit 32.

Then, the exposed substrate W is taken out from the storage shelf 32a of the buffer unit 32 by the substrate transfer robot 23 in the processing unit 2, and is sequentially transferred to the bake unit BU, the spin developer SD, etc.
Various processes such as baking by U and development by the spin developer SD are performed. The processed substrate W is transferred to the substrate transfer robot 23 of the indexer 1 by the substrate transfer robot 23.
The substrate is transferred to the carrier C on the loading / unloading table 11 by the substrate loading / unloading robot 12.

In the substrate processing apparatus 100a of this embodiment, since the substrate loading table 34 and the substrate loading table 35 of the IF unit 3 are vertically stacked, the exposure unit 4
The space required for the transfer of the substrate W to the above is reduced, and the footprint of the IF unit 3 is reduced.
In the case of the present embodiment, an extra space S is generated between the substrate processing apparatus 100a and the exposure unit 4. The IF unit 3 and the exposure unit 4 can be maintained using the surplus space S. Alternatively, this surplus space S
It is also possible to install another processing device or the like in the system.

(2) Second Embodiment Next, a substrate processing apparatus according to a second embodiment of the present invention will be described. In the substrate processing apparatus of the second embodiment, a substrate loading / unloading table 130 shown in FIG. 5 is used instead of the substrate loading table 34 and the substrate loading table 35 of the substrate processing apparatus 100a of the first embodiment.

As shown in FIG. 5, the substrate loading / unloading table 130
Can be moved in the Z-axis direction by the lifting device 140. On the substrate loading / unloading table 130, three or more substrate supporting pins 130a are erected. The configuration of another part of the substrate processing apparatus of the present embodiment is the same as that of the substrate processing apparatus 1 of the first embodiment.
The configuration is the same as 00a.

In this embodiment, the substrate loading / unloading table 130 corresponds to a common transfer section and a substrate placing section,
0 corresponds to the elevating means.

When the substrate W before exposure is carried into the exposure unit 4, the substrate W before exposure is placed on the substrate support pins 130 a of the substrate loading / unloading table 130 by the substrate transfer robot 33 in the IF unit 3. . Then, the substrate loading / unloading table 130 is raised / lowered by the lifting / lowering device 140 to the transfer position of the substrate transfer robot in the exposure unit 4. Thereafter, the substrate W before exposure is taken into the exposure unit 4 from the substrate loading / unloading table 130 by the substrate transfer robot in the exposure unit 4.

When the exposed substrate W is carried out of the exposure unit 4, the substrate loading / unloading table 130 is
Is moved up and down to the transfer position of the substrate transfer robot in the exposure unit 4. Then, the exposed substrate W is placed on the substrate support pins 130 a of the substrate loading / unloading table 130 by the substrate transport robot in the exposure unit 4. After that, the exposed substrate W is taken out from the substrate loading / unloading table 130 by the substrate transfer robot 33 in the IF unit 3.

In the substrate processing apparatus of the present embodiment, the substrate loading / unloading table 1 commonly used when loading / unloading the substrate W into / from the exposure unit 4 is used.
Since the lifting / lowering device 140 is provided so as to be able to move up and down in the vertical direction, the space required for transferring the substrate W to and from the exposure unit 4 is reduced, and
Footprint is reduced.

(3) Third Embodiment Next, a substrate processing apparatus according to a third embodiment of the present invention will be described. In the substrate processing apparatus of the third embodiment, a substrate loading / unloading table 132 shown in FIG. 6 is used instead of the substrate loading table 34 and the substrate loading table 35 of the substrate processing apparatus 100a of the first example.

As shown in FIG. 6, the substrate loading / unloading table 132 is fixed at a predetermined height by a support table 142. On the substrate loading / unloading table 132, three or more substrate supporting pins 132
a is erected. The configuration of the other parts of the substrate processing apparatus of the present embodiment is the same as the configuration of the substrate processing apparatus 100a of the first embodiment.

In this embodiment, the board loading / unloading table 132 corresponds to a common transfer section and a board mounting section.

The substrate processing apparatus of this embodiment can be applied to a case where the substrate transfer robot in the exposure unit 4 is provided so as to be movable in the Z-axis direction.

When the substrate W before exposure is carried into the exposure unit 4, the substrate W before exposure is placed on the substrate support pins 132 a of the substrate loading / unloading table 132 by the substrate transport robot 33 in the IF unit 3. . The substrate transfer robot in the exposure unit 4 moves up and down to the height of the substrate loading / unloading table 132,
The substrate W before exposure is taken into the exposure unit 4 from the substrate loading / unloading table 132.

When unloading the exposed substrate W from the exposure unit 4, the substrate transfer robot in the exposure unit 4 moves up and down to the height of the substrate loading / unloading table 132, and removes the exposed substrate W from the substrate loading / unloading table 132. It is placed on the support pins 132a. After that, the substrate transfer robot 33 in the IF unit 3
As a result, the exposed substrate W is taken out of the substrate loading / unloading table 132.

In the substrate processing apparatus of this embodiment, the substrate loading / unloading table 1 commonly used when loading the substrate W into and out of the exposure unit 4 is used.
32, the substrate W with the exposure unit 4
Space required for delivery of
The footprint of the unit 3 is reduced.

(4) Fourth Embodiment FIG. 7 is a plan view showing the overall configuration of a substrate processing apparatus according to a fourth embodiment of the present invention. FIG. 8 is a front view of the substrate processing apparatus of FIG. 7 as viewed from the exposure unit side.

The substrate processing apparatus 100b of FIG. 7 includes an indexer 1, a processing unit 2, and an IF unit 3.
An exposure unit 40 is arranged adjacent to the IF unit 3.

The configuration of the indexer 1 is the same as the configuration of the indexer 1 in FIG. In the processing unit 2 of the present embodiment, a substrate transfer for transferring a substrate W to and from a substrate transfer robot 31 in the IF unit 3 described later is provided near the end of the second apparatus arrangement unit 22 on the IF unit 3 side. A table 25 is provided. Three or more substrate support pins 25a are provided upright on the substrate transfer table 25, and the substrate W is placed on the substrate support pins 25a to transfer the substrate W. The configuration of the other parts of the processing unit 2 is the same as the configuration of the processing unit 2 shown in FIG.

The substrate transfer robot 23 in the processing unit 2
Access to processing devices such as the spin coater SC, the spin developer SD, the bake unit BU, and the edge exposure unit EEW by appropriately combining the rotation of the hand 23b around the Z axis, the movement of the hand 23b in the X and Y directions, and the expansion and contraction operations. Placement and removal of the substrate W to and from the substrate transfer table 25, and the substrate W between the respective processing apparatuses in the processing unit 2.
Is carried out.

For example, when placing the substrate W on the substrate delivery table 25, first, the hand 23b supporting the substrate W
Is appropriately moved in the X-axis direction and the Z-axis direction.
By rotating around the axis, the hand 23b can be expanded and contracted above the substrate transfer table 25. Next, the hand 23b is extended in the direction of the substrate transfer table 25, and the supporting substrate W is positioned slightly above the substrate support pins 25a of the substrate transfer table 25. And hand 23b
Is lowered in the Z-axis direction, the substrate W is placed on the substrate support pins 25a, and the hand 23b is retreated at a position slightly lowered further. The removal of the substrate W placed on the substrate delivery table 25 is performed in such a manner that the hand 23b lifts the substrate W placed on the substrate delivery table 25 from below by the reverse operation.

As shown in FIGS. 7 and 8, the IF unit 3 integrates the substrate transfer robot 31, the buffer section 32, the substrate transfer robot 33, the substrate carry-in device 134, and the substrate carry-out device 135 into a unit. It is configured. Substrate carry-in device 134 and substrate carry-out device 13
5 is laminated in the up-down direction. Also in this embodiment, two table bases 37a and 37b for setting the first and second cassettes 36a and 36b, respectively, are provided in the IF unit 3.

The substrate transfer robot 31 is provided with the processing unit 2
Loading and unloading of the substrate W to and from the substrate transfer table 25 in the inside, and an optional storage shelf 32a of the buffer unit 32
The substrate W is stored and taken out. As shown in FIG. 8, the substrate transfer robot 31 includes a Z-axis direction drive unit 31a, a connecting member 31b, a rotation drive unit 31c, a telescopic drive unit 31d, and a substrate support unit 31e.

The Z-axis direction drive section 31a is fixed to the lower surface of the IF unit 3. A screw shaft 31aa is provided inside the Z-axis direction driving unit 31a so as to be rotatable around the Z-axis.
A guide shaft (not shown) is provided in parallel with the screw shaft 31aa, and the motor 31 rotates the screw shaft 31aa in the forward and reverse directions.
ab is also provided internally.

The base end of the connecting member 31b is screwed to the screw shaft 31aa in the Z-axis direction driving unit 31a and is slidably fitted on the guide shaft, and rotates the screw shaft 31aa in the forward and reverse directions. By doing so, the connecting member 31b can be moved in the Z-axis direction (moved up and down in the vertical direction). In addition, a rotation drive unit 31c is fixed to a distal end of the connection member 31b.

The rotation drive unit 31c has the rotation shaft 31
ca is rotatably set up around the Z-axis.
A motor 31cb for rotating ca in forward and reverse directions is provided therein.

A telescopic drive unit 31d is fixed to the tip of the rotation shaft 31ca. The expansion / contraction drive unit 31d includes a timing belt 31 driven by a motor 31da.
db is provided internally. This timing belt 31db
The base end of the substrate support portion 31e is connected to a part of
By driving the timing belt 31db, the substrate supporting portion 31e can be expanded and contracted with respect to the expansion and contraction driving portion 31d.

By rotating the rotation shaft 31ca of the rotation drive unit 31c in the forward and reverse directions, the expansion / contraction drive unit 31d and the substrate support unit 31e are rotated around the Z-axis, and in any direction on the XY plane (horizontal plane). The substrate supporting portion 31e can be expanded and contracted.

Further, by rotating the screw shaft 31aa of the Z-axis direction drive section 31a in the forward and reverse directions, the Z-axis of the substrate support section 31e is expanded and contracted via the connecting member 31b, the rotation drive section 31c and the expansion and contraction drive section 31d. The height in the axial direction can be adjusted.

Reference numeral 2a in FIG. 8 denotes an opening through which the substrate transport robot 31 supporting the substrate W passes when the substrate W is transferred between the processing unit 2 and the IF unit 3. .

The substrate support 31e is connected to the processing unit 2
The expansion / contraction drive unit 31d is arranged on the front surface of the substrate transfer table 25 in the X-axis direction and on the front surface of the buffer unit 32 in the Y-axis direction so that the substrate transfer table 25 and the buffer unit 32 can expand and contract. Further, the Z-axis direction drive unit 31a is connected to the extension / contraction drive unit 31d via the connecting member 31b so that the extension / contraction drive unit 31d can rotate around the Z-axis even when the extension / contraction drive unit 31d is lowered in the Z-axis direction. It is arranged at a position shifted from below the portion 31c.

The buffer unit 32 is provided with the substrate transfer robot 31
Is disposed at a position sandwiched between the substrate transfer robot 33 and
It is supported on the inner surface of the IF unit 3. The configuration of the buffer unit 32 is the same as the configuration of the buffer 32 shown in FIGS. 1, 2, and 3. In the buffer section 32, the surfaces of the storage shelves 32a facing the substrate transport robot 31 and the substrate transport robot 33 are opened. Thus, the substrate W is stored and taken out by the substrate transfer robots 31 and 33.

The substrate transfer robot 33 includes a buffer unit 32
Of the substrate W into and out of the optional storage shelf 32a, placement of the substrate W in the substrate carry-in device 134, removal of the substrate W from the substrate carry-out device 135, and storage and removal of the substrate W in the cassettes 36a and 36b. Do. The configuration of the substrate transport robot 33 is the same as the configuration of the substrate transport robot 33 shown in FIGS.

The substrate carry-in device 134 carries the substrate W before exposure into the substrate transfer section 40a of the exposure unit 40, and the substrate carry-out device 135 removes the exposed substrate W that has been subjected to the exposure processing in the exposure unit 40. 4 from the substrate transfer unit 40b.

The substrate transfer section 40 of the exposure unit 40
a and 40b are vertically stacked. In the present embodiment, the substrate transfer unit 40a in the exposure unit 40 when the substrate W is loaded into the exposure unit 40 is arranged at the upper part, and the substrate transfer unit 40b when the substrate W is unloaded from the exposure unit 40 is arranged at the lower part. It is assumed that

FIG. 9 is a perspective view of the substrate loading device 134, and FIG.
0 is a plan view of the substrate loading device 134. FIG.
FIG. 11 is a perspective view of a power transmission mechanism of the substrate carrying-in device 134 of FIGS. 9 and 10.

As shown in FIGS. 9 and 10, the substrate carrying-in device 134 includes a first arm (transfer arm) 41,
Arm 42, a third arm 43, a rotating means (electric motor) 44, an arm base 45, and a power transmission mechanism 46 (FIG. 11).

A substrate W is mounted on the first arm 41. The second arm 42 supports the first arm 41 rotatably in a horizontal plane. The third arm 43 supports the second arm 42 rotatably in a horizontal plane. Rotating means 4
4 rotates the third arm 43 in a horizontal plane. The arm base 45 supports the third arm 43 upward. FIG.
The first power transmission mechanism 46 transmits power to the second arm 42 and the first arm 41 when the third arm 43 is rotated by the rotation means 44, and the second arm 42 and the first Of the arm 41 is controlled.

The arm stand 45 is attached to the support plate 87 by a lifting cylinder (not shown) so as to be able to move up and down. Further, two positioning guide pins 88 are provided at positions on the processing unit 2 side of the support plate 87 so as to be movable in the same advancing and retreating direction as the first arm 41 by a guide moving cylinder 89.

The support plate 87 is fixed to the pair of Y-axis rails 73 by fixing screws 76. Y-axis rail 7
3 is fixed to four Z-axis rails 81, and a pair of Y-axis rails 73 and Z-axis rails 81 are connected to each other by support members 85.

The first arm 41 has two strip-shaped mounting pieces 51 arranged in parallel, and one strip-shaped connecting portion 52 connecting the base ends of these mounting pieces 51 to each other. To form an inverted U-shape. A stopper 54 is fixed to the base end and the distal end of each mounting piece 51 by a pin or the like to abut on the substrate W to prevent a displacement. Also,
A part of the connecting portion 52 includes positioning guide pins 8 from behind.
A positioning notch 54a is formed for positioning the substrate W on the first arm 41 by fitting with the positioning arm 8. Further, the first rotating shaft 5 is provided at the center of the connecting portion 52.
5 is fixed vertically downward.

As shown in FIG. 11, a first bearing hole 56 for rotatably bearing the first rotary shaft 55 is provided at the distal end of the second arm 42. A second pivot shaft 57 is vertically fixed to the base end of the second arm 42.

The third arm 43 is set to the same length as the second arm 42, and has a second bearing hole at its tip end for rotatably bearing the second rotating shaft 57. 58 are provided. A third rotating shaft 59 for transmitting the rotating power of the rotating means 44 is provided at the base end of the third arm 43.
Are fixed vertically downward.

The distance between the first rotating shaft 55 and the second rotating shaft 57 and the distance between the second rotating shaft 57 and the third rotating shaft 59 are set to be the same.

The power transmission mechanism 46 shown in FIG. 11 includes the third rotation shaft 59 of the rotation means 44 and the first rotation shaft 5.
5 and a second pulley 61 fixed to the upper surface side of the second bearing hole 58 of the third arm 43.
Pulley 62, a first belt 63 bridged between the first pulley 61 and the second pulley 62, and a second belt 63 fixed to the lower surface side of the second bearing hole 58 of the third arm 43. A third pulley 64, a fourth pulley 65 fixed to the arm base 45 and loosely fitted with the third rotation shaft 59, and bridged between the third pulley 64 and the fourth pulley 65. And a second belt 66. The diameters of the second pulley 62 and the third pulley 64 are set to 倍 times the diameters of the first pulley 61 and the fourth pulley 65, respectively. The rotation angle of the rotation means 44 is controlled by a control device (not shown).

In the above configuration, when the rotation means 44 rotates the third arm 43 in the direction of Aω (leftward rotation) in FIG. 11 through the third rotation shaft 59, the second bearing hole 58 The supported second rotating shaft 57 rotates through the second belt 66 and the third pulley 64 at twice the speed of the third rotating shaft 59 in the direction of Bω (clockwise) in FIG. I do. As a result, the first arm bearing on the distal end of the second arm 42
The rotation shaft 55 and the first arm 41 of FIG.
(X-axis direction).

At this time, the first pulley 61 is controlled to rotate downward through the second pulley 62 and the first belt 63.

Here, since the diameter of the first pulley 61 is twice the diameter of the second pulley 62, the second arm 4
When the second arm 4 is used as a reference, the second arm 4 rotates counterclockwise at a rotation speed that is half the rotation speed of the second pulley 62.
2 itself is rotating, and since the fourth pulley 65 is immovable with respect to the arm base 45, the first pulley 61
Without rotating with respect to the arm stand 45, x1 in FIG.
(X-axis direction). Therefore, the first arm 41 moves forward with respect to the arm stand 45 while maintaining a posture in the x1 direction (direction toward the exposure unit 40).

When the rotating means 44 is rotated in the direction opposite to the direction Aω, the movement of each part is directed in the opposite direction, so that the first arm 41 faces the exposure unit 44. , While retreating in the direction opposite to the direction x1.

In this embodiment, a substrate unloading device 135 is provided below the substrate loading device 134. The configuration of the substrate unloading device 135 is the same as the configuration of the substrate unloading device 134.

In this embodiment, the processing unit 2 corresponds to a processing section, the substrate carry-in device 134 corresponds to a first transfer section and a substrate carry-in means, and the substrate carry-out device 135 corresponds to a second transfer section and a substrate carry-out means. The substrate transfer table 25 corresponds to a substrate transfer position with the processing unit 2 as a processing unit, and the substrate transfer robots 31 and 33 correspond to transfer means.

Next, the operation of the substrate processing apparatus 100b shown in FIG. 7 will be described. First, the loading / unloading table 11 is operated by the AGV 5.
The substrate C is placed on the substrate C, the substrate W before processing is taken out of the carrier C by the substrate loading / unloading robot 12, and the substrate W is transferred to the substrate transport robot 23 in the processing unit 2. Then, the substrate W before processing is sequentially transported by the substrate transport robot 23 to the spin coater SC, the bake unit BU, the edge exposure unit EEW, and the like, and resist coating by the spin coater SC, baking by the bake unit BU, edge exposure by the edge exposure unit EEW, and the like. Are performed.

The substrate W after processing is transferred to the substrate transfer robot 23.
Is placed on the substrate delivery table 25. Then, the substrate W before exposure placed on the substrate delivery table 25 is taken out by the substrate transfer robot 31 of the IF unit 3 and stored in an arbitrary storage shelf 32a of the buffer unit 32. Further, the substrate W before exposure stored in the storage shelf 32a is taken out by the substrate transport robot 33, and the substrate loading device 134
Is mounted on the first arm 41.

The substrate W before exposure by the substrate carry-in device 134
Is taken into the exposure unit 40 and the substrate transfer section 4
0a. In the exposure unit 4, the substrate W is delivered to the alignment mechanism to perform a positioning process.
In a positioned state, it is transferred to an exposure machine, and a predetermined exposure pattern is printed.

The exposed substrate W after the exposure processing is
It is placed on the substrate transfer section 40 b in the exposure unit 40. After that, the exposed substrate W is taken out from the substrate transfer unit 40b in the exposure unit 40 by the substrate unloading device 135 of the IF unit 3, and is taken into the IF unit 3. Then, the substrate transfer robot 3 of the IF unit 3
By 3, the exposed substrate W is taken out of the substrate unloading device 135 and stored in an arbitrary storage shelf 32 a of the buffer unit 32.

Further, the exposed substrate W stored in the storage shelf 32a is taken out by the substrate transfer robot 31, and
The substrate is placed on the substrate delivery table 25. Thereafter, the substrate W placed on the substrate delivery table 25 is sequentially transferred to the bake unit BU, the spin developer SD, and the like by the substrate transfer robot 23 in the processing unit 2, and the bake unit B
Various processes such as baking by U and development by the spin developer SD are performed. The processed substrate W is transferred to the substrate transfer robot 23 of the indexer 1 by the substrate transfer robot 23.
The substrate is transferred to the carrier C on the loading / unloading table 11 by the substrate loading / unloading robot 12.

In the substrate processing apparatus 100b of this embodiment, since the substrate carry-in device 134 and the substrate carry-out device 135 of the IF unit 3 are vertically stacked, it is necessary to transfer the substrate W to the exposure unit 40. The required space is reduced, and the footprint of the IF unit 3 is reduced. In the case of the present embodiment, an extra space S is generated between the substrate processing apparatus 100b and the exposure unit 40. The maintenance of the IF unit 3 and the exposure unit 40 can be performed using the surplus space S. Alternatively, another processing device or the like can be installed in the surplus space S.

(5) Fifth Embodiment Next, a substrate processing apparatus according to a fifth embodiment of the present invention will be described. In the substrate processing apparatus of the fifth embodiment, a substrate loading / unloading apparatus 150 shown in FIG. 12 is used instead of the substrate loading / unloading apparatus 134 and the substrate unloading apparatus 135 of the substrate processing apparatus 100b of the fourth embodiment.

As shown in FIG. 5, the substrate loading / unloading device 150
Can be moved in the Z-axis direction by the lifting device 160. The configuration of the substrate loading / unloading device 150 is the same as the configuration of the substrate loading / unloading device 134 shown in FIGS. The configuration of the other parts of the substrate processing apparatus of the present embodiment is the same as the configuration of the substrate processing apparatus of the fourth embodiment.

In this embodiment, the substrate loading / unloading device 150 corresponds to a common transfer unit and a substrate loading / unloading unit, and the lifting / lowering device 160 corresponds to a lifting / lowering unit.

When the substrate W before exposure is carried into the exposure unit 40, the substrate transport robot 33 in the IF unit 3
Thus, the substrate W before exposure is placed on the first arm 41 of the substrate loading / unloading device 150. Then, the substrate loading / unloading device 150 is moved up and down by the elevating device 160 to the position of the substrate transfer section 40 a in the exposure unit 40. Thereafter, the substrate W before exposure is taken into the exposure unit 40 by the substrate carry-in / out device 150, and is placed on the substrate transfer section 40a.

When carrying out the exposed substrate W from the exposure unit 40, the substrate loading / unloading device 150 is moved up and down by the elevating device 160 to the position of the substrate transfer section 40b in the exposure unit 40. Then, the substrate W on the substrate transfer section 40b is taken out by the substrate carry-in / out device 150, and
It is taken into the F unit 3. Thereafter, the substrate transfer robot 33 in the IF unit 3 controls the substrate loading / unloading device 15.
From 0, the exposed substrate W is taken out.

In the substrate processing apparatus of this embodiment, when the substrate W is loaded into the exposure unit 40 and when the exposure unit 4
Since the substrate loading / unloading device 150 that is commonly used when unloading the substrate W from 0 is provided so as to be vertically movable by the lifting / lowering device 160, a space required for transferring the substrate W to and from the exposure unit 40 is reduced. As a result, the footprint of the IF unit 3 is reduced.

(6) Sixth Embodiment Next, a description will be given of a substrate processing apparatus according to a sixth embodiment of the present invention. In the substrate processing apparatus of the sixth embodiment, a substrate carry-in / out apparatus 152 shown in FIG. 13 is used instead of the substrate carry-in apparatus 134 and the substrate carry-out apparatus 135 of the substrate processing apparatus 100b of the fourth embodiment.

As shown in FIG. 13, the substrate loading / unloading device 15
2 is fixed at a predetermined height by a support base 162. The configuration of the substrate loading / unloading device 152 is the same as the configuration of the substrate loading / unloading device 134 shown in FIGS. The configuration of the other parts of the substrate processing apparatus of the present embodiment is the same as the configuration of the substrate processing apparatus 100b of the fourth embodiment.

In this embodiment, the substrate loading / unloading device 152 corresponds to a common transfer unit and a substrate loading / unloading unit.

The substrate processing apparatus of the present embodiment can be applied to a case where the substrate transfer section in the exposure unit 40, which is used for loading and unloading the substrate W, is provided so as to be movable in the Z-axis direction. .

When the substrate W before exposure is carried into the exposure unit 40, the substrate transfer robot 33 in the IF unit 3
Thus, the substrate W before exposure is placed on the first arm 41 of the substrate carry-in / out device 152. Then, the substrate transfer section in the exposure unit 4 moves up and down to the position of the substrate carry-in / out device 152. Thereafter, the substrate W before exposure is transferred to the substrate loading / unloading device 15.
The wafer is taken into the exposure unit 40 by 2 and placed on the substrate transfer section.

When carrying out the exposed substrate W from the exposure unit 40, the substrate transfer section in the exposure unit 40 moves up and down to the position of the substrate carry-in / out device 152. And
The exposed substrate W on the substrate transfer section is taken out by the substrate carry-in / out device 152 and taken into the IF unit 3. Then, the substrate transfer robot 3 in the IF unit 3
By 3, the exposed substrate W is taken out of the substrate carry-in / out device 152.

In the substrate processing apparatus of this embodiment, when the substrate W is loaded into the exposure unit 40 and when the exposure unit 4
Since the substrate carry-in / out device 152 that is commonly used when carrying out the substrate W from 0 is provided, the space required for transferring the substrate W to / from the exposure unit 40 is reduced, and the footprint of the IF unit 3 is reduced. Is reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a front view of the substrate processing apparatus of FIG. 1 as viewed from an exposure unit side.

FIG. 3 is a perspective view showing a schematic configuration near a buffer unit in the substrate processing apparatus of FIG. 1;

FIG. 4 is a view for explaining mounting of a substrate on a substrate loading table by a substrate transfer robot.

FIG. 5 is a front view showing a substrate loading / unloading table of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 6 is a front view showing a substrate loading / unloading table of a substrate processing apparatus according to a third embodiment of the present invention.

FIG. 7 is a plan view illustrating an overall configuration of a substrate processing apparatus according to a fourth embodiment of the present invention.

8 is a front view of the substrate processing apparatus of FIG. 7 as viewed from an exposure unit side.

FIG. 9 is a perspective view of a substrate loading device in the substrate processing apparatus of FIG. 7;

FIG. 10 is a plan view of a substrate loading device in the substrate processing apparatus of FIG. 7;

FIG. 11 is a perspective view of a power transmission mechanism of the substrate carrying-in device of FIGS. 9 and 10;

FIG. 12 is a front view of a substrate loading / unloading device of a substrate processing apparatus according to a fifth embodiment of the present invention.

FIG. 13 is a front view of a substrate loading / unloading device of a substrate processing apparatus according to a sixth embodiment of the present invention.

FIG. 14 is a plan view of a conventional substrate processing apparatus.

FIG. 15 is a front view of an interface unit in the substrate processing apparatus of FIG.

FIG. 16 is a side view of an interface unit in the substrate processing apparatus of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Indexer 2 Processing unit 3 Interface unit 4, 40 Exposure unit 4a, 4b, 40a, 40b Substrate transfer part 23, 31, 33 Substrate transfer robot 34 Substrate carry-in 35 Substrate carry-out 130, 132 Substrate carry-in 134 134 Substrate carry-in device 135 Substrate unloading device 140, 160 Lifting device 142, 162 Support table 150, 152 Substrate loading / unloading device W Substrate

Claims (12)

[Claims] A processing unit configured to perform a predetermined process on the substrate; a first transfer unit configured to transfer the substrate to an external device; a second transfer unit configured to receive the substrate from the external device; And the first and second substrate transfer positions.
And a transfer unit for transferring the substrate to and from the transfer unit, wherein the first transfer unit and the second transfer unit are vertically stacked. 2. The first transfer unit is a first substrate mounting unit on which a substrate to be loaded into the external device is mounted, and the second transfer unit is unloaded from the external device. The substrate processing apparatus according to claim 1, wherein the substrate processing unit is a second substrate mounting unit on which the mounted substrate is mounted. 3. The first transfer unit is a substrate transfer unit that transfers a substrate into the external device. The second transfer unit is a substrate transfer unit that transfers a substrate from the external device. The substrate processing apparatus according to claim 1, wherein: 4. A processing unit for performing a predetermined process on a substrate, a common delivery unit for delivering the substrate to an external device and receiving the substrate from the external device, and an elevating unit for vertically moving the common delivery unit up and down And a transfer means for transferring a substrate between a substrate transfer position with the processing unit and the common transfer unit. 5. The common transfer part is a substrate mounting part on which a substrate carried into the external device is placed and a substrate carried out from the external device is placed. Item 5. A substrate processing apparatus according to item 4. 6. The substrate processing apparatus according to claim 4, wherein the common transfer unit is a substrate loading / unloading unit that loads a substrate into the external device and unloads a substrate from the external device. . 7. A processing unit for performing a predetermined process on a substrate, a common transfer unit for transferring the substrate to an external device and receiving the substrate from the external device, a substrate transfer position with the processing unit, and the common unit. A substrate processing apparatus, comprising: transport means for transporting a substrate to and from a delivery unit. 8. The common transfer unit is a substrate mounting unit on which a substrate loaded into the external device is mounted and a substrate unloaded from the external device is mounted. Item 8. The substrate processing apparatus according to item 7. 9. The substrate processing apparatus according to claim 7, wherein the common transfer unit is a substrate loading / unloading unit that loads a substrate into the external device and unloads a substrate from the external device. . 10. An intermediate transfer device for transferring a substrate between a processing unit for performing a predetermined process on a substrate and a predetermined external device, comprising: a first transfer unit for transferring a substrate to the external device; A second transfer unit for receiving a substrate from the external device; a substrate transfer position with the processing unit; and the first and second substrates.
And a transfer unit for transferring the substrate to and from the transfer unit, wherein the first transfer unit and the second transfer unit are vertically stacked. 11. An intermediate transfer device for transferring a substrate between a processing unit for performing a predetermined process on a substrate and a predetermined external device, wherein the intermediate transfer device transfers the substrate to the external device and receives the substrate from the external device. A transfer unit for transferring the substrate between the substrate transfer position with the processing unit and the common transfer unit. An intermediate delivery device, characterized in that: 12. An intermediate transfer device for transferring a substrate between a processing unit for performing a predetermined process on a substrate and a predetermined external device, wherein the intermediate transfer device transfers the substrate to the external device and receives the substrate from the external device. A transfer unit for transferring a substrate between a substrate transfer position with the processing unit and the common transfer unit.