JP4255791B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a processing unit that performs predetermined processing such as heat treatment on a substrate (hereinafter simply referred to as “substrate”) such as a semiconductor substrate, a glass substrate for a liquid crystal display, a glass substrate for a photomask, or a substrate for an optical disk. The present invention relates to a substrate processing apparatus that teaches a substrate transfer position of a transfer robot.

  As is well known, products such as semiconductors and liquid crystal displays are manufactured by performing a series of processes such as cleaning, resist coating, exposure, development, etching, interlayer insulation film formation, heat treatment, and dicing on the substrate. Has been. Among these various processes, for example, a plurality of processing units for performing resist coating processing, development processing, and heat treatment associated therewith are incorporated, and the substrate is circulated and transferred between the processing units by a transfer robot. A substrate processing apparatus that performs photolithography processing is widely used as a so-called coater and developer.

  In such an apparatus, it is necessary to accurately convey the substrate to a predetermined delivery position in each processing unit. This is because if the substrate cannot be transported to an accurate position, processing unevenness, unnecessary particles may adhere to the substrate, or the substrate may drop off, which is not preferable. However, in reality, various design errors such as processing errors of the members that make up the holding arm that holds the substrate, mounting errors when mounting each member, and assembly errors when assembling the transfer robot are the causes. In some cases, the holding arm of the robot does not access the accurate transfer position, resulting in a positional shift. In order to eliminate such misalignment due to errors or the like, teaching (transport teaching) work is performed on the transport robot prior to actually transporting the substrate.

  On the other hand, recent substrate processing apparatuses are required to improve throughput and reduce footprint, and many processing units are often mounted in multiple stages around the transfer robot. In such a state, it is difficult to perform the teaching work while confirming the transfer position with the naked eye of the operator. For example, an auto teaching function as shown in Patent Document 1 is mounted on the substrate processing apparatus. The auto teaching function is a function for automatically performing conveyance teaching by attaching a light sensor or a CCD camera to a holding arm, thereby detecting a target in the processing unit and causing the conveyance robot to recognize an accurate conveyance position.

JP 2001-156153 A

  However, the processing units to be subjected to auto teaching are all the units accessed by the transfer robot, and some of them are extremely high in temperature, such as a bake unit. If auto-teaching is performed on such a bake unit in a high temperature state, a failure occurs in a mechanism unit such as an optical sensor. For this reason, conventionally, when performing auto teaching, the temperature of the bake unit is manually lowered or the temperature control is turned off. Then, auto-teaching is started after the temperature of the bake unit is lowered. For this reason, it takes a lot of time to execute auto teaching, and the temperatures of all the baking units are manually lowered, so that there is a problem that the operability of auto teaching is very poor.

Further, conventionally, after the auto-teaching is completed, had been again because temperature had to undo the bake unit manually, this is a reducing more the operability of the automatic teaching.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus in which the operability of the conveyance teaching process is improved.

In order to solve the above-described problem, the invention of claim 1 includes a plurality of processing units that perform predetermined processing on a substrate and a transfer robot that transfers the substrate to the plurality of processing units. In the substrate processing apparatus that teaches the substrate transfer position of the transfer robot, the input accepting unit that receives a start instruction of the transfer teaching processing operation for the transfer robot, and the plurality of processing units when the start instruction is input A teaching control means for causing the transfer robot to start the transfer teaching processing operation in order from a processing unit other than the heating processing unit adjusted to a first temperature at which the transfer teaching processing operation is impossible, and other than the heating processing unit While the conveyance teaching process operation is being performed in the processing unit, the temperature adjusting hand that lowers the temperature of the heating processing unit to a second temperature or less at which the conveyance teaching process operation can be performed. The teaching control means causes the transport robot to perform a transport teaching processing operation in the heat processing section after the temperature of the heat processing section is lowered to the second temperature or lower. And

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, after the transfer teaching processing operation in the heating processing unit is completed, the temperature of the heating processing unit is set to the temperature adjusting unit. The temperature is raised to 1.

According to the first aspect of the present invention, at the time when the start instruction is input from the input receiving means, the heating processing unit whose temperature is adjusted to the first temperature at which the transfer teaching processing operation is impossible among the plurality of processing units. other processing to start transporting the teaching processing operation to the transport robot in order from the unit Rutotomoni, the temperature was decreased to below a second temperature temperature capable of performing the conveyance teaching processing operations of the heat treatment section therebetween, the heat treatment unit Since the transfer robot is caused to perform the transfer teaching process operation in the heat processing unit after the temperature is lowered to the second temperature or less, the temperature is adjusted to the first temperature simply by inputting a start instruction . The conveyance teaching processing operation is automatically executed in order from the processing unit other than the heating processing unit, and the conveyance teaching processing operation is automatically executed after the temperature of the heating processing unit is lowered to the second temperature or lower. , of conveying the teaching process Work is improved.

According to the second aspect of the present invention, since the temperature of the heat treatment unit is raised to the first temperature after the conveyance teaching processing operation in the heat treatment unit is completed, the temperature of the heat treatment unit is automatically increased. Therefore, the operability of the conveyance teaching process is further improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view of the substrate processing apparatus of the present embodiment. 2 is a front view of the liquid processing unit of the substrate processing apparatus, FIG. 3 is a front view of the heat treatment unit, and FIG. 4 is a diagram showing a peripheral configuration of the substrate mounting unit. 1 to 4 have an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane in order to clarify the directional relationship.

  The substrate processing apparatus of this embodiment is an apparatus that applies an antireflection film or a photoresist film to a substrate such as a semiconductor wafer and performs development processing on the substrate after pattern exposure. In addition, the board | substrate used as the process target of the substrate processing apparatus which concerns on this invention is not limited to a semiconductor wafer, The glass substrate for liquid crystal displays etc. may be sufficient. Further, the processing content of the substrate processing apparatus according to the present invention is not limited to coating film formation and development processing, but may be etching processing or cleaning processing.

  The substrate processing apparatus of the present embodiment is configured by arranging five processing blocks of an indexer block 1, a bark block 2, a resist coating block 3, a development processing block 4 and an interface block 5 in parallel. An exposure apparatus (stepper), which is an external apparatus separate from the substrate processing apparatus, is connected to the interface block 5.

  The indexer block 1 takes a mounting table 11 on which a plurality of carriers C (four in this embodiment) are placed side by side, and takes out an unprocessed substrate W from each carrier C and also transfers a processed substrate W to each carrier C. A substrate transfer mechanism 12 is provided. The substrate transfer mechanism 12 includes a movable table 12a that can move horizontally along the mounting table 11 (along the Y direction), and a holding arm 12b that holds the substrate W in a horizontal posture is mounted on the movable table 12a. Has been. The holding arm 12b is configured to be capable of moving up and down (Z direction) on the movable table 12a, turning in a horizontal plane, and moving back and forth in the turning radius direction. As a result, the substrate transfer mechanism 12 can access the holding arms 12b to the carriers C to take out the unprocessed substrate W and store the processed substrate W. In addition to the FOUP (front opening unified pod) that accommodates the substrate W in a sealed space, the carrier C may be a standard mechanical interface (SMIF) pod or an OC (open cassette) that exposes the storage substrate W to the outside air. There may be.

  A bark block 2 is provided adjacent to the indexer block 1. A partition wall 13 is provided between the indexer block 1 and the bark block 2 for shielding the atmosphere. In order to transfer the substrate W between the indexer block 1 and the bark block 2, two substrate platforms PASS 1 and PASS 2 on which the substrate W is mounted are stacked on the partition wall 13.

  The upper substrate platform PASS1 is used to transport the substrate W from the indexer block 1 to the bark block 2. The substrate platform PASS1 has three support pins, and the substrate transfer mechanism 12 of the indexer block 1 moves the unprocessed substrate W taken out from the carrier C onto the three support pins of the substrate platform PASS1. Place. Then, the transfer robot TR1 of the bark block 2 described later receives the substrate W placed on the substrate platform PASS1. On the other hand, the lower substrate platform PASS <b> 2 is used for transporting the substrate W from the bark block 2 to the indexer block 1. The substrate platform PASS2 is also provided with three support pins, and the transport robot TR1 of the bark block 2 places the processed substrate W on the three support pins of the substrate platform PASS2. Then, the substrate transfer mechanism 12 receives the substrate W placed on the substrate platform PASS2 and stores it in the carrier C. In addition, the structure of the board | substrate mounting parts PASS3-PASS10 mentioned later is also the same as the board | substrate mounting parts PASS1 and PASS2.

  The substrate platforms PASS <b> 1 and PASS <b> 2 are provided so as to partially penetrate a part of the partition wall 13. The substrate platforms PASS1 and PASS2 are provided with optical sensors (not shown) for detecting the presence or absence of the substrate W, and the substrate transfer mechanism 12 and the bark block 2 are based on detection signals from the sensors. It is determined whether the transfer robot TR1 is ready to deliver the substrate W to the substrate platforms PASS1, PASS2.

  Next, the bark block 2 will be described. The bark block 2 is a processing block for applying and forming an antireflection film on the base of the photoresist film in order to reduce standing waves and halation generated during exposure. The bark block 2 includes a base coating processing unit BRC for coating and forming an antireflection film on the surface of the substrate W, two heat treatment towers 21 and 21 for performing heat treatment associated with the coating formation of the antireflection film, and base coating processing A transfer robot TR1 that transfers the substrate W to the section BRC and the heat treatment towers 21 and 21.

  In the bark block 2, the base coating treatment unit BRC and the heat treatment towers 21 and 21 are arranged to face each other with the transfer robot TR1 interposed therebetween. Specifically, the base coating treatment part BRC is located on the front side of the apparatus, and the two heat treatment towers 21 and 21 are located on the rear side of the apparatus. In addition, a heat partition (not shown) is provided on the front side of the heat treatment towers 21 and 21. By arranging the base coating processing part BRC and the heat treatment towers 21 and 21 apart from each other and providing a thermal partition, the thermal processing towers 21 and 21 are prevented from having a thermal influence on the base coating processing part BRC. .

  As shown in FIG. 2, the base coating processing unit BRC is configured by stacking and arranging three coating processing units BRC1, BRC2, and BRC3 having the same configuration in order from the bottom. If the three coating processing units BRC1, BRC2, and BRC3 are not particularly distinguished, these are collectively referred to as a base coating processing unit BRC. Each of the coating processing units BRC1, BRC2, and BRC3 includes a spin chuck 22 that sucks and holds the substrate W in a substantially horizontal posture and rotates the substrate W in a substantially horizontal plane, and an antireflection film on the substrate W held on the spin chuck 22 And a cup (not shown) that surrounds the periphery of the substrate W held on the spin chuck 22.

  As shown in FIG. 3, in the heat treatment tower 21 on the side close to the indexer block 1, six hot plates HP1 to HP6 for heating the substrate W to a predetermined temperature and the heated substrate W are cooled to a predetermined temperature. Cool plates CP <b> 1 to CP <b> 3 are provided that lower the temperature to a predetermined temperature and maintain the substrate W at the predetermined temperature. In the heat treatment tower 21, cool plates CP1 to CP3 and hot plates HP1 to HP6 are laminated in order from the bottom. On the other hand, the heat treatment tower 21 on the side far from the indexer block 1 has three adhesion reinforcements for heat-treating the substrate W in a vapor atmosphere of HMDS (hexamethyldisilazane) in order to improve the adhesion between the resist film and the substrate W. The processing units AHL1 to AHL3 are stacked in order from the bottom. In FIG. 3, piping wiring sections and spare empty spaces are assigned to the locations indicated by “x” marks.

  As described above, the coating processing units BRC1 to BRC3 and the heat treatment units (hot plates HP1 to HP6, cool plates CP1 to CP3, adhesion strengthening processing units AHL1 to AHL3) are stacked in multiple stages to reduce the space occupied by the substrate processing apparatus. And footprint can be reduced. Further, by arranging two heat treatment towers 21 and 21 in parallel, there is an advantage that maintenance of the heat treatment unit is facilitated and duct piping and power supply equipment necessary for the heat treatment unit need not be extended to a very high position. .

  FIG. 5 is a diagram for explaining the transfer robot TR1. FIG. 5A is a plan view of the transfer robot TR1, and FIG. 5B is a front view of the transfer robot TR1. The transfer robot TR1 includes two holding arms 6a and 6b that hold the substrate W in a substantially horizontal posture so as to be close to each other in the vertical direction. The holding arms 6a and 6b have a "C" shape at the top end in a plan view, and a plurality of pins 7 projecting inward from the inner side of the "C" shaped arm to surround the periphery of the substrate W. Supports from below.

  The base 8 of the transfer robot TR1 is fixedly installed on the apparatus base (apparatus frame). On the base 8, a guide shaft 9c is erected and the screw shaft 9a is erected and supported rotatably. A motor 9b that rotationally drives the screw shaft 9a is fixedly installed on the base 8. The lifting platform 10a is screwed onto the screw shaft 9a, and the lifting platform 10a is slidable with respect to the guide shaft 9c. With such a configuration, when the motor 9b rotationally drives the screw shaft 9a, the lifting platform 10a is guided by the guide shaft 9c to move up and down in the vertical direction (Z direction).

  Further, an arm base 10b is mounted on the lifting platform 10a so as to be able to turn around an axis along the vertical direction. A motor 10c for turning the arm base 10b is built in the elevator base 10a. The two holding arms 6a and 6b described above are arranged vertically on the arm base 10b. Each holding arm 6a, 6b is configured to be able to move forward and backward independently in the horizontal direction (in the turning radius direction of the arm base 10b) by a slide drive mechanism (not shown) mounted on the arm base 10b. .

  With such a configuration, as shown in FIG. 5A, the transfer robot TR1 includes two holding arms 6a and 6b that are individually provided on the substrate platforms PASS1 and PASS2 and the heat treatment tower 21, respectively. It is possible to access a coating processing unit provided in the base coating processing unit BRC and substrate mounting units PASS3 and PASS4, which will be described later, and transfer the substrate W between them.

  Next, the resist coating block 3 will be described. A resist coating block 3 is provided so as to be sandwiched between the bark block 2 and the development processing block 4. Between the resist coating block 3 and the bark block 2, an atmosphere blocking partition 25 is also provided. In order to transfer the substrate W between the bark block 2 and the resist coating block 3, two substrate platforms PASS 3 and PASS 4 on which the substrate W is mounted are stacked on the partition wall 25 in the vertical direction. The substrate platforms PASS3 and PASS4 have the same configuration as the substrate platforms PASS1 and PASS2 described above.

  The upper substrate platform PASS3 is used to transport the substrate W from the bark block 2 to the resist coating block 3. That is, the transport robot TR2 of the resist coating block 3 receives the substrate W placed on the substrate platform PASS3 by the transport robot TR1 of the bark block 2. On the other hand, the lower substrate platform PASS 4 is used to transport the substrate W from the resist coating block 3 to the bark block 2. That is, the transport robot TR1 of the bark block 2 receives the substrate W placed on the substrate platform PASS4 by the transport robot TR2 of the resist coating block 3.

  The substrate platforms PASS3 and PASS4 are provided partially through a part of the partition wall 25. The substrate platforms PASS3 and PASS4 are provided with optical sensors (not shown) for detecting the presence or absence of the substrate W, and the transfer robots TR1 and TR2 are mounted on the substrate based on detection signals from the sensors. It is determined whether or not the substrate W can be delivered to the parts PASS3 and PASS4. Further, under the substrate platforms PASS 3 and PASS 4, two water-cooled cool plates WCP for roughly cooling the substrate W are provided above and below the partition wall 25.

  The resist coating block 3 is a processing block for coating and forming a photoresist film on the substrate W on which the antireflection film is coated and formed in the bark block 2. In the present embodiment, a chemically amplified resist is used as the photoresist. The resist coating block 3 includes a resist coating processing section SC that coats and forms a photoresist film on an antireflection film that has been coated on the base, two heat treatment towers 31 and 31 that perform heat treatment associated with the resist coating processing, and resist coating. A transfer robot TR2 that transfers the substrate W to the processing unit SC and the heat treatment towers 31, 31 is provided.

  In the resist coating block 3, the resist coating processing unit SC and the heat treatment towers 31 and 31 are arranged to face each other with the transfer robot TR2 interposed therebetween. Specifically, the resist coating processing section SC is located on the front side of the apparatus, and the two heat treatment towers 31 and 31 are located on the rear side of the apparatus. A heat partition (not shown) is provided on the front side of the heat treatment towers 31 and 31. By disposing the resist coating processing part SC and the heat treatment towers 31 and 31 apart from each other and providing a thermal partition, the thermal treatment towers 31 and 31 are prevented from having a thermal influence on the resist coating processing part SC. .

  As shown in FIG. 2, the resist coating processing section SC is configured by stacking and arranging three coating processing units SC1, SC2, SC3 having the same configuration in order from the bottom. If the three coating processing units SC1, SC2, and SC3 are not particularly distinguished, they are collectively referred to as a resist coating processing unit SC. Each of the coating processing units SC1, SC2, SC3 discharges the photoresist onto the spin chuck 32 that sucks and holds the substrate W in a substantially horizontal posture and rotates it in a substantially horizontal plane, and the substrate W held on the spin chuck 32. A coating nozzle 33 and a cup (not shown) surrounding the periphery of the substrate W held on the spin chuck 32 are provided.

  As shown in FIG. 3, in the heat treatment tower 31 on the side close to the indexer block 1, six heating parts PHP <b> 1 to PHP <b> 6 that heat the substrate W to a predetermined temperature are sequentially stacked from below. On the other hand, in the heat treatment tower 31 on the side far from the indexer block 1, cool plates CP4 to CP9 for cooling the heated substrate W and lowering the temperature to a predetermined temperature and maintaining the substrate W at the predetermined temperature are provided from below. They are arranged in order.

  Each of the heating units PHP1 to PHP6 includes a substrate temporary placement unit that places the substrate W on an upper position separated from the hot plate, in addition to a normal hot plate that places the substrate W and performs heat treatment. The heat treatment unit includes a local transport mechanism 34 (see FIG. 1) for transporting the substrate W between the hot plate and the temporary substrate placement unit. The local transport mechanism 34 is configured to be capable of moving up and down and moving back and forth, and includes a mechanism for cooling the substrate W in the transport process by circulating cooling water.

  The local transport mechanism 34 is installed on the opposite side to the transport robot TR2 across the hot plate and the temporary substrate placement section, that is, on the back side of the apparatus. The temporary substrate placement portion is open to both the transfer robot TR2 side and the local transfer mechanism 34 side, while the hot plate is open only to the local transfer mechanism 34 side and is closed to the transfer robot TR2 side. . Accordingly, both the transport robot TR2 and the local transport mechanism 34 can access the temporary substrate placement portion, but only the local transport mechanism 34 can access the hot plate.

  When the substrate W is carried into each of the heating units PHP1 to PHP6 having such a configuration, the transport robot TR2 first places the substrate W on the temporary substrate placement unit. Then, the local transport mechanism 34 receives the substrate W from the temporary substrate placement unit, transports it to the hot plate, and heats the substrate W. The substrate W that has been subjected to the heat treatment by the hot plate is taken out by the local transport mechanism 34 and transported to the temporary substrate placement unit. At this time, the substrate W is cooled by the cooling function provided in the local transport mechanism 34. Thereafter, the substrate W after the heat treatment transferred to the temporary substrate placement unit is taken out by the transfer robot TR2.

  In this way, in the heating units PHP1 to PHP6, the transfer robot TR2 only transfers the substrate W to the substrate temporary placement unit at room temperature, and does not transfer the substrate W to the hot plate. Temperature rise can be suppressed. Further, since the hot plate is opened only on the local transfer mechanism 34 side, the transfer robot TR2 and the resist coating processing unit SC are prevented from being adversely affected by the thermal atmosphere leaked from the hot plate. Note that the transfer robot TR2 directly transfers the substrate W to the cool plates CP4 to CP9.

  The configuration of the transfer robot TR2 is exactly the same as that of the transfer robot TR1. Therefore, the transfer robot TR2 has two holding arms individually for the substrate platforms PASS3 and PASS4, a heat treatment unit provided in the heat treatment tower 31, a coating processing unit provided in the resist coating processing unit SC, and a substrate mounting described later. The placement units PASS5 and PASS6 can be accessed, and the substrate W can be exchanged between them.

  Next, the development processing block 4 will be described. A development processing block 4 is provided so as to be sandwiched between the resist coating block 3 and the interface block 5. A partition wall 35 for shielding the atmosphere is also provided between the resist coating block 3 and the development processing block 4. In order to transfer the substrate W between the resist coating block 3 and the development processing block 4, two substrate platforms PASS 5 and PASS 6 on which the substrate W is mounted are stacked on the partition wall 35 in the vertical direction. . The substrate platforms PASS5 and PASS6 have the same configuration as the substrate platforms PASS1 and PASS2 described above.

  The upper substrate platform PASS5 is used for transporting the substrate W from the resist coating block 3 to the development processing block 4. That is, the transport robot TR3 of the development processing block 4 receives the substrate W placed on the substrate platform PASS5 by the transport robot TR2 of the resist coating block 3. On the other hand, the lower substrate platform PASS 6 is used to transport the substrate W from the development processing block 4 to the resist coating block 3. That is, the transport robot TR2 of the resist coating block 3 receives the substrate W placed on the substrate platform PASS6 by the transport robot TR3 of the development processing block 4.

  The substrate platforms PASS5 and PASS6 are provided so as to partially penetrate a part of the partition wall 35. The substrate platforms PASS5 and PASS6 are provided with optical sensors (not shown) for detecting the presence or absence of the substrate W, and the transport robots TR2 and TR3 are mounted on the substrate based on detection signals from the sensors. It is determined whether or not the substrate W can be delivered to the parts PASS5 and PASS6. Further, below the substrate platforms PASS 5 and PASS 6, two water-cooled cool plates WCP for roughly cooling the substrate W are provided vertically through the partition wall 35.

  The development processing block 4 is a processing block for performing development processing on the exposed substrate W. The development processing block 4 includes a development processing unit SD that performs development processing by supplying a developing solution to the substrate W on which the pattern has been exposed, two heat treatment towers 41 and 42 that perform heat treatment associated with the development processing, and development. A transfer robot TR3 that transfers the substrate W to the processing unit SD and the heat treatment towers 41 and 42 is provided. The transfer robot TR3 has the same configuration as the transfer robots TR1 and TR2 described above.

  As shown in FIG. 2, the development processing unit SD is configured by stacking five development processing units SD1, SD2, SD3, SD4, and SD5 having the same configuration in order from the bottom. Note that the five development processing units SD1 to SD5 are collectively referred to as the development processing unit SD unless particularly distinguished. Each of the development processing units SD1 to SD5 includes a spin chuck 43 that sucks and holds the substrate W in a substantially horizontal posture and rotates the substrate W in a substantially horizontal plane, and a nozzle that supplies a developer onto the substrate W held on the spin chuck 43. 44 and a cup (not shown) that surrounds the periphery of the substrate W held on the spin chuck 43.

  As shown in FIG. 3, in the heat treatment tower 41 on the side close to the indexer block 1, five hot plates HP7 to HP11 for heating the substrate W to a predetermined temperature and the heated substrate W are cooled to a predetermined temperature. Cool plates CP <b> 10 to CP <b> 12 are provided that lower the temperature to a predetermined temperature and maintain the substrate W at the predetermined temperature. In the heat treatment tower 41, cool plates CP10 to CP12 and hot plates HP7 to HP11 are laminated in order from the bottom. On the other hand, in the heat treatment tower 42 on the side far from the indexer block 1, six heating parts PHP7 to PHP12 and a cool plate CP13 are laminated. Each of the heating units PHP7 to PHP12 is a heat treatment unit including a temporary substrate placement unit and a local transport mechanism, similarly to the heating units PHP1 to PHP6 described above. However, the temporary substrate placement portions of the heating units PHP7 to PHP12 are open on the side of the transport robot TR4 of the interface block 5, but are closed on the side of the transport robot TR3 of the development processing block 4. That is, the transport robot TR4 of the interface block 5 can access the heating units PHP7 to PHP12, but the transport robot TR3 of the development processing block 4 is not accessible. Note that the transfer robot TR3 of the development processing block 4 accesses the heat treatment unit incorporated in the heat treatment tower 41.

  Further, in the heat treatment tower 42, two substrate platforms PASS7 and PASS8 for transferring the substrate W between the development processing block 4 and the interface block 5 adjacent to the development processing block 4 are assembled in close proximity to each other. ing. The upper substrate platform PASS7 is used to transport the substrate W from the development processing block 4 to the interface block 5. That is, the transport robot TR4 of the interface block 5 receives the substrate W placed on the substrate platform PASS7 by the transport robot TR3 of the development processing block 4. On the other hand, the lower substrate platform PASS 8 is used to transport the substrate W from the interface block 5 to the development processing block 4. That is, the transport robot TR3 of the development processing block 4 receives the substrate W placed on the substrate platform PASS8 by the transport robot TR4 of the interface block 5. The substrate platforms PASS7 and PASS8 are open to both sides of the transport robot TR3 of the development processing block 4 and the transport robot TR4 of the interface block 5.

  Next, the interface block 5 will be described. The interface block 5 is a block which is provided adjacent to the development processing block 4 and delivers the substrate W to an exposure apparatus which is an external apparatus separate from the substrate processing apparatus. In the interface block 5 of the present embodiment, in addition to the transport mechanism 55 for transferring the substrate W to and from the exposure apparatus, two edge exposures for exposing the peripheral portion of the substrate W on which the photoresist film is formed are performed. And a transport robot TR4 that delivers the substrate W to the heating units PHP7 to PHP12, the cool plate CP13, and the edge exposure unit EEW disposed in the development processing block 4.

  The edge exposure unit EEW, as shown in FIG. 2, applies light to the spin chuck 56 that sucks and holds the substrate W in a substantially horizontal posture and rotates the substrate W in a substantially horizontal plane, and the periphery of the substrate W held by the spin chuck 56. And a light irradiator 57 that exposes the light. The two edge exposure portions EEW are stacked in the vertical direction at the center of the interface block 5. The transfer robot TR4 disposed adjacent to the edge exposure unit EEW and the heat treatment tower 42 of the development processing block 4 has the same configuration as the transfer robots TR1 to TR3 described above.

  Further, as shown in FIG. 2, a return buffer RBF for returning the substrate is provided below the two edge exposure units EEW, and two substrate platforms PASS9 and PASS10 are stacked on the lower side. Is provided. When the development processing block 4 cannot perform the development processing of the substrate W due to some trouble, the return buffer RBF performs the post-exposure heating processing by the heating units PHP7 to PHP12 of the development processing block 4, and then the substrate W Is temporarily stored. The return buffer RBF is configured by a storage shelf that can store a plurality of substrates W in multiple stages. The upper substrate platform PASS9 is used to transfer the substrate W from the transport robot TR4 to the transport mechanism 55, and the lower substrate platform PASS10 transfers the substrate W from the transport mechanism 55 to the transport robot TR4. It is used to pass. Note that the transfer robot TR4 accesses the return buffer RBF.

  As shown in FIG. 2, the transport mechanism 55 includes a movable base 55a that can move horizontally in the Y direction, and a holding arm 55b that holds the substrate W is mounted on the movable base 55a. The holding arm 55b is configured to be capable of moving up and down, turning and moving in the turning radius direction with respect to the movable base 55a. With such a configuration, the transport mechanism 55 transfers the substrate W to and from the exposure apparatus, transfers the substrate W to the substrate platforms PASS9 and PASS10, and transfers the substrate W to the send buffer SBF for substrate transfer. Store and remove. The send buffer SBF temporarily stores and stores the substrate W before the exposure processing when the exposure apparatus cannot accept the substrate W, and is configured by a storage shelf that can store a plurality of substrates W in multiple stages. .

  The indexer block 1, the bark block 2, the resist coating block 3, the development processing block 4 and the interface block 5 are always supplied with clean air as a downflow, and the process is caused by the rising of particles and airflow in each block. To avoid the negative effects of. In addition, the inside of each block is kept at a slightly positive pressure with respect to the external environment of the apparatus to prevent entry of particles and contaminants from the external environment.

  The indexer block 1, the bark block 2, the resist coating block 3, the development processing block 4 and the interface block 5 described above are units obtained by mechanically dividing the substrate processing apparatus of the present embodiment. Each block is assembled to an individual block frame (frame body), and the substrate processing apparatus is configured by connecting the block frames.

  On the other hand, in the present embodiment, the transport control unit for transporting the substrate is configured separately from the block that is mechanically divided. In the present specification, such a transport control unit for transporting a substrate is referred to as a “cell”. One cell includes a plurality of processing units that perform predetermined processing on a substrate and a transfer robot that transfers the substrate to the plurality of processing units. Each of the substrate placement units described above functions as an entrance substrate placement unit for receiving the substrate W in the cell or an exit substrate placement unit for delivering the substrate W from the cell. And delivery of the board | substrate W between cells is also performed via a board | substrate mounting part. In this specification, in addition to the heat treatment unit and the coating / development processing unit, a substrate placement unit that simply places the substrate W is also included in the “processing unit” in the sense of the transfer target unit, and the substrate transfer The mechanism 12 and the transport mechanism 55 are also included in the transport robot.

  The substrate processing apparatus of the present embodiment includes six cells: an indexer cell, a bark cell, a resist coating cell, a development processing cell, a post-exposure bake cell, and an interface cell. The indexer cell includes a mounting table 11 and a substrate transfer mechanism 12 and has the same configuration as the indexer block 1 which is a unit that is mechanically divided as a result. The bark cell includes a base coating processing unit BRC, two heat treatment towers 21 and 21, and a transfer robot TR1. This bark cell also has the same configuration as the bark block 2, which is a mechanically divided unit. Further, the resist coating cell includes a resist coating processing unit SC, two heat treatment towers 31 and 31, and a transfer robot TR2. This resist coating cell also has the same configuration as the resist coating block 3, which is a mechanically divided unit.

  On the other hand, the development processing cell includes a development processing unit SD, a heat treatment tower 41, and a transport robot TR3. As described above, the transfer robot TR3 cannot access the heating units PHP7 to PHP12 of the heat treatment tower 42, and the heat treatment tower 42 is not included in the development processing cell. In this respect, the development processing cell is different from the development processing block 4 which is a mechanically divided unit.

  The post-exposure bake cell includes a heat treatment tower 42 located in the development processing block 4, an edge exposure unit EEW located in the interface block 5, and a transport robot TR 4. That is, the post-exposure bake cell extends over the development processing block 4 and the interface block 5 which are mechanically divided units. Thus, since one cell is comprised including the heating parts PHP7 to PHP12 and the transfer robot TR4 for performing the post-exposure heat treatment, the substrate W after the exposure is quickly carried into the heating parts PHP7 to PHP12 and subjected to the heat treatment. It can be performed. Such a configuration is suitable when a chemically amplified resist that needs to be heat-treated as soon as possible after pattern exposure is used.

  The substrate platforms PASS7 and PASS8 included in the heat treatment tower 42 are interposed for transferring the substrate W between the transfer robot TR3 of the development processing cell and the transfer robot TR4 of the post-exposure bake cell.

  The interface cell includes a transport mechanism 55 that transfers the substrate W to and from an exposure apparatus that is an external apparatus. This interface cell is different from the interface block 5 which is a mechanically divided unit in that the interface cell does not include the transport robot TR4 and the edge exposure unit EEW. The substrate platforms PASS9 and PASS10 provided below the edge exposure unit EEW are interposed for the transfer of the substrate W between the post-exposure bake cell transfer robot TR4 and the interface cell transfer mechanism 55.

  Next, the control mechanism of the substrate processing apparatus of this embodiment will be described. FIG. 6 is a block diagram showing an outline of the control mechanism. As shown in the figure, the substrate processing apparatus according to the present embodiment includes a control hierarchy including three levels of a main controller, a cell controller, and a unit controller. The hardware configuration of the main controller, cell controller, and unit controller is the same as that of a general computer. That is, each controller stores a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, and control applications and data. A magnetic disk or the like is provided.

  One main controller MC in the first hierarchy is provided for the entire substrate processing apparatus, and is mainly responsible for management of the entire apparatus, management of the main panel (not shown), and management of the cell controller. The second-level cell controller CC is individually provided for each of the six cells (indexer cell, bark cell, resist coating cell, development processing cell, post-exposure bake cell, and interface cell). Each cell controller CC is mainly in charge of substrate transport management and unit management in the corresponding cell. Specifically, the cell controller CC of each cell sends information that the substrate W has been placed on a predetermined substrate placement unit to the cell controller CC of the adjacent cell, and the cell controller CC of the cell that has received the substrate W. Transmits / receives information that information indicating that the substrate W has been received from the substrate platform is returned to the cell controller CC of the original cell. Such transmission / reception of information is performed via the main controller MC. Each cell controller CC gives information to the transfer robot controller TC that the substrate W has been loaded into the cell, and the transfer robot controller TC controls the transfer robot to transfer the substrate W in the cell according to a predetermined procedure (flow). Carry according to recipe. The transfer robot controller TC is a control unit realized by a predetermined application operating on the cell controller CC.

  In addition, as the unit controller of the third hierarchy, for example, a spin controller or a bake controller is provided. The spin controller directly controls spin units (coating processing unit and development processing unit) arranged in the cell in accordance with instructions from the cell controller CC. Specifically, the rotational speed of the substrate W, the discharge timing of the processing liquid, and the like are controlled. Further, the bake controller directly controls the heat treatment units (hot plate, cool plate, heating unit, etc.) arranged in the cell in accordance with instructions from the cell controller CC. Specifically, the plate temperature and the like are controlled.

  As described above, in this embodiment, the control load of each controller is reduced by adopting a three-level control hierarchy. In addition, each cell controller CC manages the substrate transfer schedule only in each cell without considering the transfer schedule in the adjacent cell, so the burden of transfer control on each cell controller CC is reduced. . As a result, the throughput of the substrate processing apparatus can be improved.

  Various commands and data can be input to each transfer robot controller TC from an input panel IP connected via a connector provided on the outer wall surface of each block. For example, the input panel IP can instruct the transfer robot to start auto teaching, which will be described later.

  Next, the operation of the substrate processing apparatus of this embodiment will be described. Here, first, a procedure for transporting the substrate W in the substrate processing apparatus will be briefly described. First, the substrate transfer mechanism 12 of the indexer cell (indexer block 1) takes out an unprocessed substrate W from a predetermined carrier C and places it on the upper substrate platform PASS1. When an unprocessed substrate W is placed on the substrate platform PASS1, the transfer robot TR1 of the bark cell receives the substrate W using one of the holding arms 6a and 6b. Then, the transfer robot TR1 transfers the received unprocessed substrate W to any one of the adhesion reinforcement processing units AHL1 to AHL3. The substrate W that has been subjected to the adhesion strengthening process is taken out by the transport robot TR1, transported to one of the cool plates CP1 to CP3, and cooled. The cooled substrate W is transported to one of the coating processing units BRC1 to BRC3 by the transport robot TR1, and the coating liquid for the antireflection film is spin-coated.

  After the coating process is completed, the substrate W is transferred to one of the hot plates HP1 to HP6 by the transfer robot TR1. When the substrate W is heated by the hot plate, the coating liquid is dried and a base antireflection film is formed on the substrate W. Thereafter, the substrate W taken out from the hot plate by the transfer robot TR1 is transferred again to any one of the cool plates CP1 to CP3 and cooled. At this time, the substrate W may be cooled by the cool plate WCP. The cooled substrate W is placed on the substrate platform PASS3 by the transport robot TR1.

  When the substrate W on which the antireflection film is formed is placed on the substrate platform PASS3, the transfer robot TR2 of the resist coating cell receives the substrate W and transports it to one of the coating processing units SC1 to SC3. In the coating processing units SC1 to SC3, a photoresist is spin-coated on the substrate W. In addition, since precise substrate temperature control is required for the resist coating process, the substrate W may be transported to any one of the cool plates CP4 to CP9 immediately before the substrate W is transported to the coating processing units SC1 to SC3.

  After the resist coating process is completed, the substrate W is transferred to one of the heating units PHP1 to PHP6 by the transfer robot TR2. When the substrate W is heated by the heating units PHP1 to PHP6, the solvent component in the photoresist is removed, and a resist film is formed on the substrate W. Thereafter, the substrate W taken out from the heating units PHP1 to PHP6 by the transport robot TR2 is transported to one of the cool plates CP4 to CP9 and cooled. The cooled substrate W is placed on the substrate platform PASS5 by the transport robot TR2.

  When the substrate W on which the resist film is formed is placed on the substrate platform PASS5, the transfer robot TR3 of the development processing cell receives the substrate W and places it on the substrate platform PASS7 as it is. Then, the substrate W placed on the substrate platform PASS7 is received by the post-exposure bake cell transport robot TR4 and carried into the edge exposure unit EEW. In the edge exposure unit EEW, exposure processing of the peripheral portion of the substrate W is performed. The substrate W that has undergone the edge exposure process is placed on the substrate platform PASS9 by the transport robot TR4. The substrate W placed on the substrate platform PASS9 is received by the interface cell transport mechanism 55, carried into an exposure apparatus outside the apparatus, and subjected to pattern exposure processing.

  The substrate W that has been subjected to the pattern exposure processing is returned to the interface cell again, and is placed on the substrate platform PASS10 by the transport mechanism 55. When the exposed substrate W is placed on the substrate platform PASS10, the post-exposure bakecell transport robot TR4 receives the substrate W and transports it to any of the heating units PHP7 to PHP12. In the heating parts PHP7 to PHP12, a heat treatment (Post Exposure Bake) for uniformly diffusing a product generated by the photochemical reaction during the exposure into the resist film is performed. The substrate W that has been subjected to the post-exposure heat treatment is taken out by the transport robot TR4, transported to the cool plate CP13, and cooled. The cooled substrate W is placed on the substrate platform PASS8 by the transport robot TR4.

  When the substrate W is placed on the substrate platform PASS8, the transport robot TR3 of the development processing cell receives the substrate W and transports it to one of the development processing units SD1 to SD5. In the developing units SD1 to SD5, a developing solution is supplied to the substrate W to advance the developing process. After the development process is finished, the substrate W is transferred to one of the hot plates HP7 to HP11 by the transfer robot TR3, and then transferred to one of the cool plates CP10 to CP12.

  Thereafter, the substrate W is placed on the substrate platform PASS6 by the transport robot TR3. The substrate W placed on the substrate platform PASS6 is placed on the substrate platform PASS4 as it is by the transfer robot TR2 of the resist coating cell. Further, the substrate W placed on the substrate platform PASS4 is placed on the substrate platform PASS2 as it is by the transfer robot TR1 of Barxel. The processed substrate W placed on the substrate platform PASS2 is stored in a predetermined carrier C by the substrate transfer mechanism 12 of the indexer cell. In this way, a series of processing is completed.

  As described above, in the substrate processing apparatus of the present embodiment, each transfer robot TR1 to TR4 transfers the substrate W to the heat treatment unit, the coating / development processing unit, the substrate placement unit, and the like, so that a series of processes proceeds. . For example, the transfer robot TR1 of Barxel is applied to each substrate delivery target portion of the substrate platforms PASS1 to PASS4, the coating processing units BRC1 to BRC3, the cool plates CP1 to CP3, the hot plates HP1 to HP6, and the adhesion reinforcement processing portions AHL1 to AHL3. On the other hand, the substrate W is transferred. Then, in order to allow the holding arms 6a and 6b of the transfer robot TR1 to access the accurate transfer position of the substrate delivery target portion, auto teaching (transfer teaching) is performed during maintenance of the apparatus. Hereinafter, the auto teaching process will be described. Here, the auto-teaching process of the transfer robot TR1 of the bark cell will be described, but the same applies to the transfer robots of other cells.

  The auto teaching process is executed by inputting a command to the transport robot controller TC from the input panel IP. During the auto teaching process, the holding arms 6a and 6b of the transfer robot TR1 are replaced in advance with teaching arms to which an optical sensor or the like is attached.

  FIG. 7 is a display screen of the input panel IP during the auto teaching process. As shown in the figure, each board delivery target portion accessible by the Berxel transport robot TR1 is displayed as a button on the input panel IP. Furthermore, a “collective selection” button and a “start” button are also displayed on the input panel IP. When the operator selects a button for the board delivery target part to be auto-teached and then presses the start button, the auto-teaching process in the selected board delivery target part is executed. Further, when the operator presses the collective selection button and then presses the start button, all substrate transfer target parts (substrate mounting parts PASS1 to PASS4, coating processing units BRC1 to BRC3, cool plates CP1 to CP1 that can be accessed by the transfer robot TR1) An auto teaching process is performed on CP3, hot plates HP1 to HP6, and adhesion reinforcement processing units AHL1 to AHL3). Here, a case will be described in which after the operator presses the batch selection button, the start button is pressed to execute the auto teaching process for all the board transfer target portions.

  FIG. 8 is a flowchart showing a processing procedure when auto-teaching processing is performed on all board delivery target portions. First, as described above, the start of auto-teaching processing is input to all substrate transfer target parts accessible by the transfer robot TR1 (step S1). When the start of the auto teaching process is input, the transfer robot controller TC determines whether or not the auto teaching process can be executed for each substrate delivery target part. That is, in the case of a baking unit (hot plates HP1 to HP6, adhesion strengthening processing units AHL1 to AHL3) for heating the substrate W, the inside of the unit is usually at a high temperature, and if a teaching arm is inserted as it is, thermal damage to the optical sensor or the like Therefore, it is determined that the auto teaching process cannot be executed. On the other hand, since the substrate delivery target part other than the bake unit is at room temperature, it is usually determined that the auto teaching process can be executed immediately. However, even if the substrate delivery target unit is other than the bake unit, for example, when another operator is performing an adjustment operation, it is determined that the substrate delivery target unit is also incapable of executing the auto teaching process.

  Next, for the substrate delivery target unit other than the baking unit, the auto teaching process is executed in order from the substrate delivery target unit ready for teaching processing (step S2). For example, when it is determined that auto teaching processing can be performed on the substrate platform PASS1, the transfer robot TR1 accesses the substrate platform PASS1 to access the arm, and the detected object provided on the substrate platform PASS1 is detected by the optical sensor. The robot controller TC automatically adjusts the horizontal position, height position, and rotation angle of the robot based on the detection result. Note that the content of the auto teaching process is the same in the substrate delivery target part other than the substrate platform PASS1.

  On the other hand, when it is determined that the auto-teaching process cannot be executed for the board delivery target unit other than the bake unit, the auto-teaching process is executed as soon as the board delivery target part is ready for auto-teaching reception. For example, when the operator is performing nozzle maintenance in the coating processing unit BRC1, it is determined that the auto teaching process cannot be performed, but it is determined that the auto teaching process can be performed when the maintenance work is completed, and the conveyance is performed. The robot TR1 accesses the coating processing unit BRC1 to access the arm and the auto teaching process is executed.

  In this manner, in parallel with performing the auto teaching process in the substrate delivery target part other than the baking unit, the temperature of the baking unit is lowered to a temperature at which the auto teaching process can be performed (step S3). Specifically, the bake controller lowers the temperature of each bake unit in accordance with an instruction from the cell controller CC. For example, in a steady state bark cell, the temperature of the hot plates HP1 to HP6 is about 200 ° C., and the temperature of the adhesion strengthening processing portions AHL1 to AHL3 is about 130 ° C. Allow to cool down. At this time, the temperature may be lowered by natural cooling, or in the case of a bake unit with a cooling function, the temperature may be forcibly rapidly lowered using a cooling mechanism (for example, a water cooling mechanism).

  When the temperature of the bake unit is lowered to a predetermined temperature or lower, for example, 50 ° C. or lower, the transfer robot TR1 accesses the arm to the bake unit and executes an auto teaching process (step S4). At this time, the processing order of the auto teaching process for the bake unit that has been lowered to a predetermined temperature or less and the auto teaching process for the substrate delivery target part other than the bake unit is arbitrary.

  Thereafter, the baking unit for which the auto teaching process has been completed is raised to the original temperature before the auto teaching process (step S5). Specifically, the temperature before the temperature drop for each bake unit is stored in the bake controller, and the bake controller raises the temperature to its original temperature in accordance with an instruction from the cell controller CC after completion of the auto teaching process. In this way, the auto teaching process for all the board delivery target parts is completed.

  Summarizing the above contents, in the substrate processing apparatus according to the present embodiment, the transfer robot TR1 sequentially accesses the auto-teaching process from the substrate delivery target part capable of auto-teaching when the start of the auto-teaching process is input. It is. Usually, auto teaching processing is executed in order from the substrate delivery target portion other than the baking unit, and during that time, the temperature of the baking unit is lowered to a predetermined temperature or less at which auto teaching processing can be performed. Then, the auto-teaching process of the bake unit that has been lowered to a predetermined temperature or less is also executed, and after the completion, the temperature of the bake unit that has been lowered is returned to the original temperature before the temperature drop.

  Therefore, simply by inputting the start of processing when performing auto-teaching processing, the temperature of the high-temperature bake unit that thermally damages the optical sensor, etc. is automatically lowered, so the temperature of the bake unit must be lowered manually. And the operability of the auto teaching process is improved.

  In addition, auto-teaching is performed in order from the board delivery target part at room temperature where auto-teaching is possible, and the temperature of the bake unit is lowered during that time, improving the operability of auto-teaching and improving the efficiency of auto-teaching. Therefore, the time required for this is shortened compared to the conventional method.

  Furthermore, since the temperature of the bake unit having been lowered is automatically raised to the original temperature after the completion of the auto teaching process, the operability of the auto teaching process is further improved.

  While the embodiments of the present invention have been described above, the present invention is not limited to the above examples. For example, in the above embodiment, after the batch selection button is pressed, the start button is pressed to execute the auto teaching process for all the board transfer target parts. It is also possible to select and execute the auto teaching process for only a part of the board delivery target parts. Even in such a case, when the teaching start is possible at the board delivery target part when the start of processing is input, the auto-teaching process is immediately performed by the transfer robot, and when the teaching is not possible, the board delivery is performed. The auto-teaching process by the transfer robot is stopped until the auto-teaching process in the target part becomes possible. And when the said board | substrate delivery object part is a bake unit, after temperature-falling below to the predetermined temperature which can perform an auto teaching process, an auto teaching process is performed. Further, after the auto teaching process is finished, the temperature of the bake unit is returned to the original temperature before the temperature drop. In this way, when the auto-teaching process is performed, only the start of the process is input, and if the substrate delivery target part is other than the bake unit, the auto-teaching process is immediately executed. Therefore, the operability of the auto teaching process is improved.

  Further, the configuration of the substrate processing apparatus according to the present invention is not limited to the form shown in FIGS. 1 to 4, and the substrate W is placed on the substrate W by the transfer robot with respect to the processing unit that performs predetermined processing on the substrate W. If it is a form which conveys, various deformation | transformation are possible.

It is a top view of the substrate processing apparatus of this embodiment. It is a front view of the liquid processing part of the substrate processing apparatus of FIG. It is a front view of the heat processing part of the substrate processing apparatus of FIG. It is a figure which shows the periphery structure of the substrate mounting part of the substrate processing apparatus of FIG. It is a figure for demonstrating the conveyance robot of the substrate processing apparatus of FIG. It is a block diagram which shows the outline of the control mechanism of the substrate processing apparatus of FIG. It is a display screen of the input panel at the time of auto teaching processing. It is a flowchart which shows the process sequence when performing the auto teaching process with respect to all the board | substrate delivery object parts.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Indexer block 2 Bark block 3 Resist application block 4 Development processing block 5 Interface block 12 Substrate transfer mechanism 21, 31, 41, 42 Heat treatment tower 55 Transfer mechanism AHL1-AHL3 Adhesion reinforcement processing part BRC1-BRC3, SC1-SC3 Application processing Unit C Carrier CC Cell controller CP1 to CP13 Cool plate HP1 to HP11 Hot plate IP input panel PASS1 to PASS10 Substrate placement unit PHP1 to PHP12 Heating unit SD1 to SD5 Development processing unit TC Transfer robot controller TR1 to TR4 Transfer robot W substrate

Claims (2)

In the substrate processing apparatus and a transfer robot for transferring the substrate to the plurality of processing units and the plurality of processing units for performing predetermined processing on a substrate, it teaches substrate transfer position of the transfer robot in the plurality of processing units There,
Input accepting means for accepting a start instruction of a transfer teaching process operation for the transfer robot;
At the time when the start instruction is input , the transfer robots are sequentially transferred from the plurality of processing units to the transfer robot from the processing units other than the heating processing unit that is temperature-controlled at the first temperature at which the transfer teaching processing operation is impossible. Teaching control means for starting teaching processing operation ;
While the conveyance teaching processing operation is being performed in a processing unit other than the heating processing unit, the temperature adjustment is performed to lower the temperature of the heating processing unit to a second temperature or less at which the conveyance teaching processing operation can be performed. Means,
With
The teaching control means causes the transfer robot to perform a transfer teaching processing operation in the heating processing section after the temperature of the heating processing section is lowered to the second temperature or lower. . The substrate processing apparatus according to claim 1,
The substrate processing apparatus , wherein the temperature adjusting unit raises the temperature of the heat treatment unit to the first temperature after the conveyance teaching process operation in the heat treatment unit is completed .

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