CN1531048A - Producing object connecting device and carrying system therewith - Google Patents
Producing object connecting device and carrying system therewith Download PDFInfo
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- CN1531048A CN1531048A CNA2004100073992A CN200410007399A CN1531048A CN 1531048 A CN1531048 A CN 1531048A CN A2004100073992 A CNA2004100073992 A CN A2004100073992A CN 200410007399 A CN200410007399 A CN 200410007399A CN 1531048 A CN1531048 A CN 1531048A
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- object thing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Specific Conveyance Elements (AREA)
Abstract
Provided is a system for delivering a production object, e.g. a wafer, quickly and surely between a line for carrying a sheet production object and a production system of the production object, and to provide a carrying system having the delivery system of the production object. The system 13 for delivering a production object W between a line 20 for carrying a sheet production object W and a production system of the production object W comprises a robot 21 for transferring the production object W between the sheet object carrying line 20 and the production system, and a buffer 34 for temporarily storing the production object W transferred from the single object carrying line 20 by means of the transfer robot 21 or the production object W processed by the production system.
Description
Technical field
The present invention relates to be used to join as the manufacturing object thing connection device of manufacturing object things such as semiconductor wafer and have the conveyer of this kind manufacturing object thing connection device.
Background technology
In the semiconductor-fabricating device of for example making semiconductor wafer (to call wafer in the following text) usefulness, for example manufacturing installation of various wafers such as lithographic equipment, film formation device, Etaching device, cleaning device, testing fixture is arranged.
In semiconductor fabrication, by mobile wafer between these wafer manufacturing installations, in each manufacturing installation, implement to handle, make.
For between these chip processing devices, mobile wafer, and utilize wafer case.This wafer case is to hold the box of a plurality of wafers with loading and unloading.According to the desired batch of technology conveyer, in this box, hold many wafers (for example patent documentation 1).
In addition, many kinds of with good grounds wafer manufacture, the requirement of small lot, the wafer transfer of alternative this wafer case mode, and slices are placed the thinking that wafer comes the so-called monolithic conveyance mode of conveyance on conveyer belt.This monolithic conveyance mode is the many kinds corresponding to wafer, the conveyance mode (for example patent documentation 2) that small lot batch manufacture requires.
Patent documentation 1: the spy open clear 62-48038 communique (the 2nd page, Fig. 1)
Patent documentation 2: the spy open the 2002-334917 communique (the 1st page, Fig. 1)
But,, following problem is arranged if adopt so so-called monolithic conveyance mode.
The wafer that the conveyance of a slice a slice is come on the conveyer belt between a plurality of manufacturing installations, utilizes manipulator to join., if when the number of the number of the wafer that the conveyer belt conveyance is come and the accessible wafer of manufacturing installation does not meet, will form the state that to handle the wafer of supplying with to manufacturing installation smoothly.Therefore, there is production capacity residue to occur, the problem that the production efficiency of wafer reduces.
Summary of the invention
The objective of the invention is to address the above problem, providing a kind of can and make between the manufacturing installation of this manufacturing object thing at the carrying line of manufacturing object things such as monolithic conveyance wafer, rapidly, handing-over is made the manufacturing object thing connection device of object and had the conveyer of manufacturing object thing connection device reliably.
Manufacturing object thing connection device of the present invention is at the monolithic carrying line of monolithic conveyance manufacturing object thing and makes between the manufacturing installation of above-mentioned manufacturing object thing, the manufacturing object thing connection device that the above-mentioned manufacturing object thing that joins is used has the shifting mechanical arm of the above-mentioned manufacturing object thing of transfer between above-mentioned monolithic carrying line and above-mentioned manufacturing installation and temporarily takes care of above-mentioned manufacturing object thing that above-mentioned shifting mechanical arm comes from above-mentioned monolithic carrying line conveyance or the buffer of the above-mentioned manufacturing object thing that above-mentioned manufacturing installation was handled.
According to this structure, shifting mechanical arm between monolithic carrying line and manufacturing installation, transfer manufacturing object thing.Buffer is temporarily taken care of the manufacturing object thing that shifting mechanical arm is come from the conveyance of monolithic carrying line; Or temporarily take care of the manufacturing object thing that manufacturing installation was handled.
Thus, by temporary transient the keeping buffer of manufacturing object thing that shifting mechanical arm is come from the conveyance of monolithic carrying line, can wait for can be to the time of this manufacturing object thing of manufacturing installation conveyance.Equally, temporarily take care of the manufacturing object thing that manufacturing installation was handled, can wait for also and can utilize shifting mechanical arm that conveyance is to the time of a side of carrying line the manufacturing object thing of handling by utilizing buffer.
Thereby, give and accept (handing-over) of the manufacturing object thing between monolithic carrying line and the manufacturing installation, even utilize between the number of disposal ability of manufacturing object thing number that the conveyance of monolithic carrying line comes and manufacturing installation and produce difference, also can carry out the handing-over of manufacturing object thing rapidly, reliably.
And, because this buffer can temporarily be taken care of manufacturing object thing or the temporary transient handled manufacturing object thing of manufacturing installation that utilizes certainly that shifting mechanical arm is come from the conveyance of monolithic carrying line, so the phenomenon that the monolithic carrying line stops can not to take place, can prevent the decline of conveyance ability.Because manufacturing installation can be made the manufacturing object thing according to the disposal ability of its manufacturing installation, can not reduce manufacturing capacity, not reduce production efficiency, and continue to produce.
In above-mentioned structure, above-mentioned manufacturing object thing is preferably made substrate or the substrate wafer that electronic component is used; Above-mentioned buffer preferably can hold a plurality of above-mentioned manufacturing object things works possible, that be configured near the shelf-like of above-mentioned shifting mechanical arm.
According to this structure, the manufacturing object thing is to make substrate or the substrate wafer that electronic component is used.Buffer is the works of shelf-like.The works of this shelf-like for example can releasably hold a plurality of manufacturing object things, is configured near the shifting mechanical arm.
Thus, because buffer is positioned near the shifting mechanical arm, so can reduce the area that is provided with as far as possible from the connection device of the manufacturing object thing on plane.
In above-mentioned structure, wish and then have the auxiliary mouth of the above-mentioned manufacturing object thing of loading, above-mentioned auxiliary mouthful is configured near the above-mentioned shifting mechanical arm.
According to this structure, can releasably to hold the container of a plurality of manufacturing object things in order for example loading, and then to be provided with auxiliary mouthful.Should assist in the mouth, for example the operator can manually place the container that holds a plurality of manufacturing object things.
As using this situation of auxiliary mouthful, such as certain fault is when taking place or carrying out the adjusted affirmation operation of device etc. in the monolithic carrying line, and the user places the container that holds a plurality of manufacturing object things with manual type.Thus, shifting mechanical arm can join the manufacturing object thing to manufacturing installation from the container that is placed on auxiliary mouth.
Manufacturing object thing connection device of the present invention, be to give and accept between the device at the monolithic carrying line of monolithic conveyance manufacturing object thing and the manufacturing object thing that is attached to the manufacturing installation of making above-mentioned manufacturing object thing in advance, the manufacturing object thing connection device that the above-mentioned manufacturing object thing that joins is used, have and give and accept between the device manipulator of the above-mentioned manufacturing object thing of transfer at above-mentioned monolithic carrying line and above-mentioned manufacturing object thing; The buffer of the above-mentioned manufacturing object thing that above-mentioned manufacturing object thing of coming from the conveyance of above-mentioned monolithic carrying line with the above-mentioned shifting mechanical arm of temporary transient keeping or above-mentioned manufacturing installation were handled.
According to this structure, to give and accept between the device at monolithic carrying line and the manufacturing object thing that is attached to manufacturing installation in advance, this manufacturing object thing connection device can be rapidly, object is made in handing-over reliably.
Shifting mechanical arm is given and accepted between the device at monolithic carrying line and manufacturing object thing, transfer manufacturing object thing.Buffer is temporarily taken care of manufacturing object thing that shifting mechanical arm comes from the conveyance of monolithic carrying line or the manufacturing object thing that utilizes manufacturing installation to handle.
Thus, buffer, can wait for that this manufacturing object thing can conveyance gives and accepts time of device to manufacturing installation by the temporary transient keeping of the manufacturing object thing that will utilize shifting mechanical arm to come from the conveyance of monolithic carrying line.Equally, can utilize shifting mechanical arm to move to time of a side of carrying line by utilizing the temporary transient keeping of manufacturing object thing that manufacturing installation handled in buffer, and can waiting for handling the manufacturing object thing.
Thereby, give and accept (handing-over) of the manufacturing object thing between the device of giving and accepting of monolithic carrying line and manufacturing installation, even produce difference between the number of the manufacturing object thing number that the conveyance of monolithic carrying line is come and the disposal ability of manufacturing installation, also can carry out the handing-over of manufacturing object thing rapidly, reliably.And, because this buffer can temporarily be taken care of the manufacturing object thing that shifting mechanical arm comes from the conveyance of monolithic carrying line or temporarily take care of the manufacturing object thing that manufacturing installation was handled, therefore the phenomenon that the monolithic carrying line stops can not to take place, can prevent the decline of conveyance ability.Because manufacturing installation can be made the manufacturing object thing according to the disposal ability of its manufacturing installation, thus manufacturing capacity can not reduced, do not reduce production efficiency, and continue to produce.
In above-mentioned structure, above-mentioned manufacturing object thing is preferably made substrate or the substrate wafer that electronic component is used, and above-mentioned buffer is to hold near the shelf-like works of the above-mentioned shifting mechanical arm of being configured in of a plurality of above-mentioned manufacturing object things.
According to this structure, the manufacturing object thing is to make substrate or the substrate wafer that electronic component is used.Buffer is the shelf-like works.This works can releasably hold a plurality of manufacturing object things, and is configured near the above-mentioned shifting mechanical arm.
Thus, because buffer is positioned near the shifting mechanical arm, so can reduce the area that is provided with as far as possible from the manufacturing object thing connection device on plane.
In above-mentioned structure, wish and then have loading to hold the auxiliary mouthful of a plurality of above-mentioned manufacturing object things, above-mentioned auxiliary mouthful is configured near the above-mentioned shifting mechanical arm.
According to this structure, in order to load the container that for example can hold a plurality of manufacturing object things, and then be provided with auxiliary mouthful.Should assist in the mouth, for example the operator can manually place the container that holds a plurality of manufacturing object things.
As using this situation of auxiliary mouthful, such as certain fault is when taking place or carrying out the adjusted affirmation operation of device etc. in the monolithic carrying line, and the user places the container that holds a plurality of manufacturing object things with manual type.Thus, shifting mechanical arm can join the manufacturing object thing to manufacturing installation from the container that is placed on auxiliary mouth.
Conveyer with manufacturing object thing connection device of the present invention is at the carrying line of conveyance manufacturing object thing and makes between the manufacturing installation of above-mentioned manufacturing object thing, join the conveyer of above-mentioned manufacturing object thing, have monolithic carrying line that the above-mentioned manufacturing object thing of monolithic conveyance uses and the connection device of the above-mentioned manufacturing object thing of handing-over between above-mentioned monolithic carrying line and above-mentioned manufacturing object material producing device; Above-mentioned manufacturing object thing connection device has between above-mentioned monolithic carrying line and above-mentioned manufacturing installation, the buffer of the above-mentioned manufacturing object thing that above-mentioned manufacturing object thing that the shifting mechanical arm of the above-mentioned manufacturing object thing of transfer and the above-mentioned shifting mechanical arm of temporary transient keeping are come from the conveyance of above-mentioned monolithic carrying line or above-mentioned manufacturing installation were handled.
According to this structure, shifting mechanical arm is transfer manufacturing object thing between monolithic carrying line and manufacturing installation.Buffer is temporarily taken care of the manufacturing object thing that shifting mechanical arm comes from the conveyance of monolithic carrying line or is temporarily taken care of the manufacturing object thing that manufacturing installation was handled.
Thus, by temporary transient the keeping at buffer of manufacturing object thing that will utilize shifting mechanical arm to come from the conveyance of monolithic carrying line, can wait for can be to the time of this manufacturing object thing of manufacturing installation conveyance; Equally, temporarily take care of the manufacturing object thing that manufacturing installation was handled, can wait for the time that to utilize the manufacturing object thing that shifting mechanical arm handled to carrying line one side shifting by utilizing buffer.
Thereby, give and accept (handing-over) of the manufacturing object thing between monolithic carrying line and the manufacturing installation, even between the number of the disposal ability of the number of the manufacturing object thing that the conveyance of monolithic carrying line is come and manufacturing installation difference takes place, also can carry out the handing-over of manufacturing object thing rapidly, reliably.
And this buffer can temporarily be taken care of the manufacturing object thing that shifting mechanical arm comes from the conveyance of monolithic carrying line or temporarily take care of the manufacturing object thing that manufacturing installation was handled, and therefore, the monolithic carrying line can not stop, and can prevent the decline of conveyance ability.Because manufacturing installation can be made the manufacturing object thing according to the disposal ability of its manufacturing installation, so can not reduce its manufacturing capacity, do not reduce production efficiency, and continue to produce.
Conveyer with manufacturing object thing connection device of the present invention is at the carrying line of conveyance manufacturing object thing and the manufacturing object thing that is attached to the manufacturing installation of making above-mentioned manufacturing object thing is given and accepted between the device, join the conveyer of above-mentioned manufacturing object thing, have the monolithic carrying line of the above-mentioned manufacturing object thing of monolithic conveyance and give and accept between the device, join above-mentioned manufacturing object thing connection device at above-mentioned monolithic carrying line and above-mentioned manufacturing object thing; Above-mentioned manufacturing object thing connection device has at above-mentioned monolithic carrying line and above-mentioned manufacturing object thing gives and accepts between the device, the shifting mechanical arm of the above-mentioned manufacturing object thing of transfer and temporarily take care of above-mentioned manufacturing object thing that above-mentioned shifting mechanical arm comes from the conveyance of above-mentioned monolithic carrying line or the buffer of the above-mentioned manufacturing object thing that above-mentioned manufacturing installation was handled.
According to this structure, to give and accept between the device at monolithic carrying line and the manufacturing object thing that is attached to manufacturing installation in advance, this manufacturing object thing connection device can be rapidly, object is made in handing-over reliably.
Shifting mechanical arm is at monolithic carrying line and the manufacturing object thing transfer manufacturing object thing between the device of giving and accepting.Buffer is temporarily taken care of the manufacturing object thing that manufacturing object thing that shifting mechanical arm comes from the conveyance of monolithic carrying line or manufacturing installation were handled.
Thus, temporarily take care of the manufacturing object thing that shifting mechanical arm is come from the conveyance of monolithic carrying line by utilizing buffer, can wait for can be to the time of this manufacturing object thing of device conveyance of giving and accepting of manufacturing installation.Equally, temporarily take care of the manufacturing object thing that manufacturing installation was handled, also can wait for the time of the manufacturing object thing that shifting mechanical arm can be handled to carrying line one side conveyance by utilizing buffer.
Thereby, give and accept (handing-over) of the manufacturing object thing between the device of giving and accepting of monolithic carrying line and manufacturing installation, even between the number of the disposal ability of the number of the manufacturing object thing that the conveyance of monolithic carrying line is come and manufacturing installation difference takes place, also can carry out the handing-over of manufacturing object thing rapidly, reliably.And this buffer can temporarily be taken care of the manufacturing object thing that shifting mechanical arm comes from the conveyance of monolithic carrying line or temporarily take care of the manufacturing object thing that manufacturing installation was handled, and therefore, the monolithic carrying line can not stop, and can prevent the decline of conveyance ability.Because manufacturing installation can be made the manufacturing object thing according to the disposal ability of its manufacturing installation, so can not reduce its manufacturing capacity, do not reduce production efficiency, and continue to produce.
Description of drawings
Fig. 1 is the plane graph that expression comprises the semiconductor device of the conveyer with manufacturing object thing connection device of the present invention.
Fig. 2 is the E direction end view of the semiconductor device of Fig. 1.
Fig. 3 is the plane graph of the expression embodiment of the invention 1.
Fig. 4 is the stereogram of expression embodiment 1.
Fig. 5 is in embodiment 1, the illustrated stereogram of clipped.
Fig. 6 is the stereogram of an example of expression shifting mechanical arm.
Fig. 7 is the stereogram of the shifting mechanical arm seen from other angle.
Fig. 8 is the hand of expression shifting mechanical arm and the figure of wafer.
Fig. 9 is the figure of an example of the wafer handover method of expression embodiment 1.
Figure 10 is the plane graph of the expression embodiment of the invention 2.
Figure 11 is the stereogram of the expression embodiment of the invention 2.
Figure 12 is in embodiment 2, the illustrated stereogram of clipped.
Figure 13 is the plane graph of the expression embodiment of the invention 3.
Figure 14 is the stereogram of the expression embodiment of the invention 3.
Figure 15 is in embodiment 3, the illustrated stereogram of clipped.
Among the figure: the 10-semiconductor-fabricating device, 11-has the conveyer of manufacturing object thing connection device, 13-manufacturing object thing connection device, 20-monolithic conveyance conveyer belt (monolithic carrying line), the 21-shifting mechanical arm, 33-load port (auxiliary mouthful), 34-buffer, W-wafer (example of manufacturing object thing).
Embodiment
Below, accompanying drawings preferred forms of the present invention.
Fig. 1 is the plane graph of representing to have the conveyer of manufacturing object thing connection device of the present invention and being located near a plurality of manufacturing installations of this conveyer.Fig. 2 is an end view of seeing conveyer and manufacturing installation from the E direction of Fig. 1.
In Fig. 1, conveyer 11 and for example many manufacturing installations 23～28 constitute semiconductor-fabricating device 10.
The semiconductor-fabricating device 10 of Fig. 1 and Fig. 2 is devices of making as the wafer W of manufacturing object thing.Therefore, the conveyance object of 11 conveyances of conveyer is a wafer W.
Manufacturing installation illustrated in figures 1 and 2 (claiming process units or processing unit again) 23～28th as various wafer manufacturing installations such as lithographic equipment, film formation device, Etaching device, cleaning device, testing fixtures, is arranged as required.
Monolithic conveyance conveyer belt 20 is called the monolithic carrying line again.Monolithic conveyance conveyer belt 20 is cleaned tunnel 30 and separates.This purification tunnel 30 is to separate the part that wafer W can be passed through with the little enclosure space of trying one's best.
Purify the filter (FFU) 31 that tunnel 30 has the band fan.The filter 31 of this band fan is configured in the top that purifies tunnel 30.The filter 31 of band fan produces from the air flows (down to flow) of overhead stream below the bottom, thus, removes airborne dust, manages purifying tunnel 30 with the cleannes level (cleannes grade) of regulation.
As mentioned above, the structure of each manufacturing object thing connection device 13 shown in Figure 1 is identical.Therefore, in the following description, the structure of a manufacturing object thing connection device 13 is described in conjunction with Fig. 3～Fig. 8.
Fig. 3～Fig. 8 represents the embodiment 1 of manufacturing object thing connection device 13 of the present invention.
Fig. 3 is the plane graph of a representative expression manufacturing object thing connection device 13 and a manufacturing installation 23.Fig. 4 and Fig. 5 are the stereograms of a representative expression manufacturing object thing connection device 13 and a manufacturing installation 23.
In Fig. 3～Fig. 5, manufacturing object thing connection device 13 has shifting mechanical arm 21, buffer 34, load port (assisting a kind of of mouth) 33 and main body 35.
This main body 35 is configured between manufacturing installation 23 and the monolithic conveyance conveyer belt 20.Main body 35 is held above-mentioned shifting mechanical arm 21 and buffer 34 in inside.
Fig. 4 and Fig. 5 have represented the structure of the manufacturing object thing connection device 13 of Fig. 3 in more detail.Manufacturing object thing connection device 13 and monolithic conveyance conveyer belt 20 constitute conveyer 11.In Fig. 4, the outside and the load port 33 of the main body 35 of expression manufacturing object thing connection device 13.Among Fig. 5, main body 35 illustrates the shifting mechanical arm 21 and the buffer 34 that are contained in the main body 35 with the double dot dash line diagram.
As shown in Figure 4, at the top of main body 35 35B, the filter (FFU) 38 of band fan is installed.This main body 35 is held shifting mechanical arm 21 and buffer 34 in minimum enclosure space.Produce for example air flows below the top 35B flow direction of main body 35 (down to flowing) in the space of filter 38 in this main body 35 of band fan.Thus, can remove the airborne dust in the main body 35, come in the management subject 35 with the cleannes level (cleannes grade) of regulation.
Below, the structure example of key diagram 3 and shifting mechanical arm 21 shown in Figure 5.
In Fig. 6 and Fig. 7, the more detailed concrete structure example of representing shifting mechanical arm 21.
This shifting mechanical arm 21 is that transfer is as the manipulator of the wafer W of manufacturing object thing between monolithic carrying line 20 and manufacturing installation 23.As shown in Figure 5, shifting mechanical arm 21 is configured between load port 33 and the buffer 34.And shifting mechanical arm 21 is configured between manufacturing installation 23 and the monolithic carrying line 20.
The shifting mechanical arm of representing in detail among Fig. 6 and Fig. 7 21 has main body 300, the first arm 301, second arm 302 and hand 303.The first arm 301 can be that the center relatively rotates around main body 300 with central shaft CL.Second arm 302 can be that rotate with respect to the first arm 301 at the center with rotating shaft CL1.Hand 303 can be that rotate at the center with rotating shaft CL2, is that the center can be rotated with rotating shaft CL3 simultaneously.
The hand 303 of presentation graphs 6 and manipulator 21 shown in Figure 7 among Fig. 8.The peripheral part of the support 306 supporting wafer W of this hand 303.
Below, key diagram 3 and buffer 34 shown in Figure 5.
Above-mentioned shifting mechanical arm 21 and buffer 34 are configured in the enclosure space in the main body 35.This enclosure space locality improves cleannes.
Below, key diagram 3～load port 33 shown in Figure 5.
At the front face 60 of manufacturing installation 23, be provided with and load locking (Load Lock) chamber inlet 62A and unloading locking (Un load Lock) chamber inlet 62B.Shifting mechanical arm 21 is sent into wafer in the manufacturing installation 23 by inlet 62A.In addition, shifting mechanical arm 21 takes out processed wafer W by inlet 62B in manufacturing installation 23.
Below, the structure example of the monolithic conveyance conveyer belt 20 of key diagram 3～shown in Figure 5.
Monolithic conveyance conveyer belt 20 has base plate 20A and a plurality of wafer maintaining part 46.On base plate 20A, arranging a plurality of wafer maintaining parts 46 along conveyance direction T.These wafer maintaining parts 46 are along conveyance direction T ring-type circulation conveyance.On wafer maintaining part 46, placing wafer W.Each wafer maintaining part 46 to be equidistantly arranging along conveyance direction T, and can utilize not shown drive division, and T moves along the conveyance direction.
As shown in Figure 4 and Figure 5, on base plate 20A, be provided with and purify tunnel 30.At this upper surface that purifies tunnel 30, be provided with the filter 31 of band fan.The filter 31 of band fan is in order to improve the cleannes of the enclosure space that forms in purifying tunnel 30, and produces air flows (down to flowing).Thus, remove the dust that purifies in tunnel 30 inner airs, manage with the cleannes of stipulating.
Below, have the action of conveyer 11 of the manufacturing object thing connection device 13 of Fig. 3～shown in Figure 5 in conjunction with the flow process explanation of the handing-over of wafer shown in Figure 9 action.
At first, in the step ST1 of Fig. 9, as shown in Figure 5, utilize monolithic conveyance conveyer belt 20 along conveyance direction T conveyance wafer W.
In the step ST2 of Fig. 9, shifting mechanical arm 21 takes out manufacturing installation 23 from wafer maintaining part 46 and will make or corresponding wafer W to be processed.
In the step ST3 of Fig. 9, be in can accept and handle the state of wafer W the time at manufacturing installation 23, shown in step ST7, shifting mechanical arm 21 is handed to manufacturing installation 23 to wafer W.
Really not so, and shown in the step ST4 of Fig. 9, when being in manufacturing installation 23 and can not accepting and handle the state of wafer W, then shown in step ST5, shifting mechanical arm 21 the temporary transient keeping of the wafer W of taking out at buffer 34.Then, shown in step ST6,23 one-tenth of manufacturing installations can be to be accepted and when handling the state of wafer W, in step ST7, shifting mechanical arm 21 is handed to manufacturing installation 23 to wafer W.
Then, shown in the step ST8 of Fig. 9, shifting mechanical arm 21 takes out the wafer W that manufacturing installation 23 has been made or handled from manufacturing installation 23.
At this moment, shown in step ST9, when monolithic conveyance conveyer belt 20 can be accepted wafer W, shifting mechanical arm 21 was the wafer maintaining part 46 of wafer W transfer to monolithic conveyance conveyer belt 20.
Really not so, and shown in step ST10, when monolithic conveyance conveyer belt 20 can not be accepted wafer W, the temporary transient keeping of the wafer W that shifting mechanical arm 21 has been made manufacturing installation 23 or handled was at buffer 34.
Then, shown in step ST9, when monolithic conveyance conveyer belt 20 becomes the state that can accept wafer W, shifting mechanical arm 21 the wafer W transfer above the wafer maintaining part 46 of monolithic conveyance conveyer belt 20.
In the step ST10 of Fig. 9, so-called monolithic conveyance conveyer belt 20 is following situation in the time of can not accepting the state of wafer W.That is, the wafer maintaining part 46 of monolithic conveyance conveyer belt 20 top can not be placed the state of wafer W, promptly not be the situation of free wafer maintaining part 46.The another one situation is the many situations of wafer W number of carrying to monolithic conveyance conveyer belt 20 1 sidesways from manufacturing installation 23.
At this moment, as mentioned above, shifting mechanical arm 21 temporarily is contained in the buffer 34 keeping to wafer W, and thereafter, but when becoming the state of conveyance, the wafer W transfer is to the wafer maintaining part 46 of conveyer belt.
Thus, shifting mechanical arm 21 can be supplied with the wafer W that is placed on load port 33 among manufacturing installation 23.At this moment, when wafer W was placed on load port 33, one or more wafer W can be contained in the box that is called front-open wafer box (Foup).This front-open wafer box is the airtight container that holds one or more wafer W.Load port 33 has the opener that this front-open wafer box of open and close is used.
Embodiment 2
Below, the embodiment 2 of the conveyer of the present invention of Figure 10～shown in Figure 12 is described.
Figure 10～embodiment 2 shown in Figure 12 compares with Fig. 3～embodiment 1 shown in Figure 5, and manufacturing installation 23 (24～28) and monolithic conveyance conveyer belt 20 are identical construction.
Therefore, manufacturing object thing connection device 13 is described.To manufacturing installation 23 (24～28) and monolithic conveyance conveyer belt 20, adopt the manufacturing installation 23 (24～28) of Fig. 3～Fig. 5 and the explanation of monolithic conveyance conveyer belt 20.
The wafer that the manufacturing installation 23 of Figure 10～shown in Figure 12 is provided with general employing in a side of its front face 60 device 61 of giving and accepting.This wafer device 61 of giving and accepting is called EFEM (Equipment FrontEnd Module).
This wafer device 61 of giving and accepting is the devices of giving and accepting that are attached to the existing wafer handing-over usefulness of manufacturing installation 23 in advance.In Figure 10～Figure 11, manufacturing object thing connection device 13 of the present invention is located at this existing wafer and gives and accepts between device 61 and the monolithic conveyance conveyer belt 20, and this point is different with the embodiment 1 of Fig. 3～Fig. 5.
The wafer device 61 of giving and accepting has manipulator (not shown) in its container 63.This manipulator carries out the handing-over of wafer W between manufacturing object thing connection device 13 and manufacturing installation 23.On container 63, be provided with the filter 64 of band fan.Thus, for example can utilize down to flowing, with the inside of the cleannes Manage Containers 63 of regulation.
The structure of manufacturing object thing connection device 13 is described in conjunction with Figure 12.
In Figure 12, main body 135 shown in Figure 11 is omitted expression with double dot dash line.In main body 135, disposing shifting mechanical arm 21 and buffer 34.Shifting mechanical arm 21 and buffer 34 can adopt the structure identical with shifting mechanical arm shown in Figure 5 21 and buffer 34.
Among main body 135, be provided with wafer station 150 in addition.This wafer station 150 is arranged on and the give and accept corresponding position of peristome 65 of device 61 of wafer.Load port 133 is located at give and accept front one side of device 61 of wafer.Load port 133 is positioned at and the give and accept corresponding position of flashboard 136 of device 61 of wafer.Load port 133 can adopt the load port identical with load port shown in Figure 5 33.
As Figure 10 and shown in Figure 12, when seeing on main body 135 planes, has the L font.Filter 38 with fan is being set on the top of main body 135.The filter 38 of this band fan produces air flows (down to flowing) in the enclosure space of main body 135.Thus, can remove airborne dust in the main body 135, manage with the cleannes level of stipulating.
On an end 135A of main body 135, accommodate buffer 34.The other end in main body 135 accommodates wafer station 150.Between buffer 34 and wafer station 150, disposing shifting mechanical arm 21.On the position of facing with the shifting mechanical arm 21 and the monolithic conveyance conveyer belt 20 of main body 135, form peristome 140.
One section wafer station 150 is being set at least.The transducer that has or not that detects wafer is being set on wafer station 150.Under the situation that multistage wafer station 150 is set, each wafer station 150 can be divided into accept with and handing-over be used for utilization, also can not distinguished and be utilized.
Why this wafer station 150 is enclosed in the main body 135 of manufacturing object thing connection device 13, is because need conveyance be placed on the wafer of wafer station 150 under the atmosphere of cleaning.
The action of the manufacturing object thing connection device 13 of the action of the manufacturing object thing connection device 13 of the embodiment 2 of Figure 10～shown in Figure 12 and Fig. 3～shown in Figure 5 is basic identical.The manufacturing object thing connection device 13 of embodiment 2 carries out the handing-over of wafer between existing wafer is given and accepted the wafer maintaining part 46 of device 61 and monolithic conveyance conveyer belt 20.
Embodiment 3
Figure 13～Figure 15 represents the embodiment 3 of conveyer of the present invention.
The embodiment 3 of Figure 13～shown in Figure 15 and Figure 10～embodiment 2 identical parts shown in Figure 12 are give and accept structures of device 61 and monolithic conveyance conveyer belt 20 of manufacturing installation 23 (24～28), wafer.The structure of the manufacturing object thing connection device 13 of the embodiment 2 of the structure of the manufacturing object thing connection device 13 of the embodiment 3 of Figure 13～shown in Figure 15 and Figure 10～shown in Figure 12 is slightly different.
Therefore, the structure of the manufacturing object thing connection device 13 of Figure 13～shown in Figure 15 is described.
As Figure 13～shown in Figure 15, manufacturing object thing connection device 13 has main body 235.See on the plane that this main body 235 is rectangle.At the upper surface of main body 235 filter 38 with fan is being set.Produce air flows (down to flowing) in the enclosure space of filter 38 in main body 235 of this band fan.Thus, can remove the airborne dust in the main body 135, manage with the cleannes level of stipulating.
Among main body 235, accommodate shifting mechanical arm 21, buffer 34, two wafer station 150.On a side of main body 235, load port 33 is being set.By opening flashboard 35C, can hand to the wafer device 61 of giving and accepting to the wafer W that is loaded in load port 33 by shifting mechanical arm 21.
Shifting mechanical arm 21, load port 33 and buffer 34 are in the position of monolithic conveyance conveyer belt 20 sides, along conveyance direction T linear array.Two wafer station 150 are located at the give and accept front of device 61 of wafer.
In the embodiment 3 of the embodiment 2 of Figure 10～shown in Figure 12 and Figure 13～shown in Figure 15, manufacturing object thing connection device 13 all is configured in the existing wafer that is attached in advance on the manufacturing installation 23 and gives and accepts between device 61 and the monolithic conveyance conveyer belt 20, and this is its feature part.
But under any situation of the above embodiments 1～3, manufacturing object thing connection device 13 buckets are called as shifting apparatus.This manufacturing object thing connection device 13 preferably has aforesaid buffer 34 and shifting mechanical arm 21 at least.This shifting mechanical arm 21 also is called the wafer transfer manipulator.This manufacturing object thing connection device 13 preferably except buffer 34 and shifting mechanical arm 21, also has following device.
That is, connection device 13 has: the ID recognition device of mechanism that the alignment wafer otch is used and identification id (distinguished symbol) usefulness.The mechanism that the alignment wafer otch is used is called the locator that is installed in wafer or the cut alignment mechanism on the manipulator again.The ID recognition device for example is located on the shifting mechanical arm, the kind of identification wafer when the handing-over wafer W.This ID recognition device also can be located at the position different with manufacturing object thing connection device 13.
At this moment, wafer W to this ID recognition device one side that is provided with separately, is discerned the kind of wafer W by conveyance.
The mechanism that is used to carry out wafer orientation (alignment wafer otch) preferably is located at for example top of buffer.Buffer is temporary transient to be kept or keeping one or more wafer, is equipped with on buffer and detects the transducer that wafer has or not.
When the operator supplies with wafer with manual method, utilize load port.At this moment, wafer for example utilizes that front-open wafer box (Foup) is placed on the load port.Utilize load port during following situation.The situation that monolithic conveyance conveyer belt 20 goes wrong, for example can not carry out the monolithic conveyance.In addition, after the maintenance, tentatively the wafer of certain batch is put into the situation of manufacturing installation for the state of confirming manufacturing installation.
In an embodiment of the present invention, between monolithic carrying line and manufacturing installation (claiming process units or processing unit again), dispose manufacturing object thing connection device 13 of the present invention.This manufacturing object thing connection device 13 can be between monolithic carrying line 20 and manufacturing installation 23 (24～28) direct handing-over wafer.
When manufacturing installation joined wafer, buffer can temporarily be taken care of wafer or the temporary transient wafer of having been handled by manufacturing installation of taking care of that the monolithic conveyance is come from the monolithic carrying line.
In addition, in other embodiments of the invention, standard the wafer that is attached on the manufacturing installation give and accept between device 61 and the monolithic carrying line 20, disposing manufacturing object thing connection device 13 of the present invention.At this moment, give and accept between the device in monolithic conveyance and wafer, manufacturing object thing connection device 13 also can carry out the handing-over of wafer.Buffer can temporarily be taken care of the wafer that the monolithic conveyance comes or temporarily take care of the wafer that manufacturing installation was handled.
Thereby shifting mechanical arm is transfer manufacturing object thing between monolithic carrying line and manufacturing installation.Buffer can temporarily be taken care of manufacturing object thing of being come from the conveyance of monolithic carrying line by shifting mechanical arm or the manufacturing object thing of having been handled by manufacturing installation.
Thus, temporarily take care of by buffer, can wait for that this manufacturing object thing can be to the time (opportunity) of manufacturing installation conveyance by the manufacturing object thing that will utilize manipulator to come from the conveyance of monolithic carrying line.Equally, in buffer, can wait for the time (opportunity) of utilizing the manufacturing object thing that shifting mechanical arm can handle to carrying line one side conveyance by the temporary transient keeping of manufacturing object thing that manufacturing installation was handled.
Thereby, give and accept (handing-over) of the manufacturing object thing between monolithic carrying line and the manufacturing installation, even between the number of the disposal ability of the number of the manufacturing object thing that the conveyance of monolithic carrying line is come and manufacturing installation, produce difference, also can carry out the handing-over of manufacturing object thing rapidly, reliably.And, because this buffer can temporarily be taken care of the manufacturing object thing that shifting mechanical arm comes from the conveyance of monolithic carrying line or temporarily take care of the manufacturing object thing that manufacturing installation was handled, so the monolithic carrying line can not stop, therefore, can prevent the reduction of conveyance ability.Because manufacturing installation can be made the manufacturing object thing according to the disposal ability of its manufacturing installation, so can not reduce manufacturing capacity, do not reduce production efficiency, and continue to produce.
The manufacturing object thing is to make substrate or the substrate wafer that electronic component is used.Buffer is the works of shelf-like.But this buffer also can substitute the works of shelf-like with box.This works can hold a plurality of manufacturing object things, is configured near the shifting mechanical arm.
Thus, because buffer is near shifting mechanical arm, when seeing on the plane, the area that is provided with of manufacturing object thing connection device can be minimum.
In order to load the manufacturing object thing, and then be provided with auxiliary mouthful.Should assist in the mouth, for example the operator can manually place the container that holds a plurality of manufacturing object things.Using under this situation of auxiliary mouthful, for example to take place under the situation of certain fault at the monolithic carrying line, the user places the container that accommodates the manufacturing object thing with manual type.Thus, shifting mechanical arm can join the manufacturing object thing to manufacturing installation from the container that is placed on auxiliary mouth.
In an embodiment of the present invention because manufacturing object thing connection device 13 between monolithic carrying line and manufacturing installation directly the handing-over wafer, so can shorten the transfer time of wafer.By buffer is set, the wafer that the continuously conveyance of can packing into is come or can continuously take out the wafer of handling in the manufacturing installation.Therefore, can successfully carry out packing into and taking out of wafer.Thus, can not reduce the production capacity and lasting production of semiconductor-fabricating device.
The manufacturing object thing connection device of Shi Yonging can use the handing-over of the wafer between various manufacturing installations and monolithic conveyance conveyer belt in embodiments of the present invention.Thus, the transformation of semiconductor-fabricating device and control can get final product in very little scope with the transformation of software, can suppress the rising of the cost of semiconductor-fabricating device.
In an embodiment of the present invention, as an example of manufacturing object thing, enumerated the example of semiconductor wafer W.But, be not limited to this, as the manufacturing object thing, can be as making substrate or the substrate wafer that electronic component is used, also can be for example to be used in the substrate wafer of liquid crystal indicator or the substrate that quartzy device fabrication is used.
Shifting mechanical arm 21 is manipulators that the arm form is arranged.This shifting mechanical arm 21 can certainly be to move in the horizontal direction and join the form of wafer.The number of shifting mechanical arm can be illustrated one, also can be many.
In an embodiment of the present invention, the manufacturing object thing is to make substrate or the substrate wafer that electronic component is used.Buffer preferably can hold a plurality of above-mentioned manufacturing object things and be configured near the shelf-like works of shifting mechanical arm.
According to this structure, the manufacturing object thing of wafer etc. is to make substrate or the substrate wafer that electronic component is used.Buffer is the shelf-like works.This works can releasably hold for example a plurality of manufacturing object things, is configured near the shifting mechanical arm.Buffer gets final product for the shelf-like works, also can constitute with the state that is completely fixed, in addition, also can be, temporarily fixedly box etc. can releasably hold the container of wafer and constitute according to the mode of simply dismounting.This container is box preferably for example.
The invention is not restricted to the embodiments described, can carry out all changes in the scope that does not surmount the claim scope.
The structure of each above-mentioned embodiment can omit its part, or and combination in any different with above-mentioned combination.
Claims (8)
1. manufacturing object thing connection device is used at the monolithic carrying line of monolithic conveyance manufacturing object thing and makes between the manufacturing installation of described manufacturing object thing, joins described manufacturing object thing, it is characterized in that:
Have between described monolithic carrying line and described manufacturing installation, the shifting mechanical arm of the described manufacturing object thing of transfer and
The buffer of the described manufacturing object thing that described manufacturing object thing that the described shifting mechanical arm of temporary transient keeping is come from the conveyance of described monolithic carrying line or described manufacturing installation were handled.
2. manufacturing object thing connection device according to claim 1 is characterized in that:
Described manufacturing object thing is to make substrate or the substrate wafer that electronic component is used, and described buffer is to hold near the shelf-like works of the described shifting mechanical arm of being configured in of described a plurality of manufacturing object things.
3. manufacturing object thing connection device according to claim 1 and 2 is characterized in that:
Also have the auxiliary mouth that is used to load described manufacturing object thing, described auxiliary mouthful is configured near the described shifting mechanical arm.
4. manufacturing object thing connection device is used for giving and accepting between the device at the monolithic carrying line of monolithic conveyance manufacturing object thing and the manufacturing object thing that is attached in advance on the manufacturing installation of making described manufacturing object thing, joins described manufacturing object thing, it is characterized in that:
Have the giving and accepting between the device of described monolithic carrying line and described manufacturing object thing, the shifting mechanical arm of the described manufacturing object thing of transfer and
The buffer of the described manufacturing object thing that described manufacturing object thing that the described shifting mechanical arm of temporary transient keeping is come from the conveyance of described monolithic carrying line or described manufacturing installation were handled.
5. manufacturing object thing connection device according to claim 4 is characterized in that:
Described manufacturing object thing is to make substrate or the substrate wafer that electronic component is used, and described buffer is to hold near the shelf-like works of the described shifting mechanical arm of being configured in of described a plurality of manufacturing object things.
6. according to claim 4 or 5 described manufacturing object thing connection devices, it is characterized in that:
Also have the auxiliary mouth that is used to load described manufacturing object thing, described auxiliary mouthful is configured near the described shifting mechanical arm.
7. conveyer with manufacturing object thing connection device is used at the carrying line of conveyance manufacturing object thing and makes between the manufacturing installation of described manufacturing object thing, joins described manufacturing object thing, it is characterized in that:
Have the described manufacturing object thing of monolithic conveyance the monolithic carrying line and
The connection device of the described manufacturing object thing of handing-over between the manufacturing installation of described monolithic carrying line and described manufacturing object thing;
Described manufacturing object thing connection device has:
Between described monolithic carrying line and described manufacturing installation, the shifting mechanical arm of the described manufacturing object thing of transfer and
The buffer of the described manufacturing object thing that described manufacturing object thing that the described shifting mechanical arm of temporary transient keeping is come from the conveyance of described monolithic carrying line or described manufacturing installation were handled.
8. conveyer with manufacturing object thing connection device, be used for giving and accepting between the device at the carrying line of conveyance manufacturing object thing and the manufacturing object thing that is attached on the manufacturing installation of making described manufacturing object thing, join described manufacturing object thing, it is characterized in that:
Have the described manufacturing object thing of monolithic conveyance the monolithic carrying line and
Give and accept between the device at described monolithic carrying line and described manufacturing object thing, join the connection device of described manufacturing object thing;
Described manufacturing object thing connection device has:
Give and accept between the device at described monolithic carrying line and described manufacturing object thing, the shifting mechanical arm of the described manufacturing object thing of transfer and
The buffer of the described manufacturing object thing that described manufacturing object thing that the described shifting mechanical arm of temporary transient keeping is come from the conveyance of described monolithic carrying line or described manufacturing installation were handled.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003067294 | 2003-03-12 | ||
| JP2003067294A JP2004281474A (en) | 2003-03-12 | 2003-03-12 | Delivering system for production object and carrying system having delivery system of production object |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1531048A true CN1531048A (en) | 2004-09-22 |
Family
ID=33284944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004100073992A Pending CN1531048A (en) | 2003-03-12 | 2004-03-02 | Producing object connecting device and carrying system therewith |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7108121B2 (en) |
| JP (1) | JP2004281474A (en) |
| KR (1) | KR20040081342A (en) |
| CN (1) | CN1531048A (en) |
| TW (1) | TWI278954B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100437963C (en) * | 2005-04-27 | 2008-11-26 | 东京毅力科创株式会社 | Processing device system |
| CN101533793B (en) * | 2008-03-11 | 2011-04-13 | 精工爱普生株式会社 | Component test apparatus and component transport method |
| CN103010705A (en) * | 2011-09-26 | 2013-04-03 | 大日本网屏制造株式会社 | Substrate treating system |
| CN102074443B (en) * | 2009-11-19 | 2013-04-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Atmospheric transmission chamber and change method of inner airflow thereof and plasma processing equipment |
| CN109742041A (en) * | 2019-01-07 | 2019-05-10 | 成都中电熊猫显示科技有限公司 | The control method and equipment of substrate transmission |
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| US8292563B2 (en) * | 2004-06-28 | 2012-10-23 | Brooks Automation, Inc. | Nonproductive wafer buffer module for substrate processing apparatus |
| US7578650B2 (en) * | 2004-07-29 | 2009-08-25 | Kla-Tencor Technologies Corporation | Quick swap load port |
| JP4296601B2 (en) * | 2005-01-20 | 2009-07-15 | 村田機械株式会社 | Conveyor cart system |
| JP4563219B2 (en) * | 2005-03-01 | 2010-10-13 | 東京エレクトロン株式会社 | Relay station and substrate processing system using relay station |
| JP5030410B2 (en) * | 2005-09-28 | 2012-09-19 | 株式会社日立ハイテクノロジーズ | Vacuum processing equipment |
| JP4378655B2 (en) * | 2007-03-07 | 2009-12-09 | 株式会社ダイフク | Article processing equipment |
| GB2452320B (en) * | 2007-09-03 | 2012-04-11 | Dek Int Gmbh | Workpiece processing system and method |
| JP5181809B2 (en) * | 2008-04-30 | 2013-04-10 | 村田機械株式会社 | Processing system and transfer method |
| EP2399280B1 (en) * | 2009-02-22 | 2020-01-15 | ASML Netherlands B.V. | Preparation unit for lithography machine |
| GB2469112A (en) | 2009-04-03 | 2010-10-06 | Mapper Lithography Ip Bv | Wafer support using controlled capillary liquid layer to hold and release wafer |
| CN102556652A (en) * | 2010-12-31 | 2012-07-11 | 平成科贸股份有限公司 | Object transmission system |
| TWI514089B (en) | 2011-04-28 | 2015-12-21 | Mapper Lithography Ip Bv | Apparatus for transferring a substrate in a lithography system |
| JP6839993B2 (en) * | 2017-02-09 | 2021-03-10 | 日本電産サンキョー株式会社 | Transport system |
| WO2019082111A1 (en) * | 2017-10-27 | 2019-05-02 | Ronchi Mario S.P.A. | Apparatus for unscrambling randomly arranged containers comprising extraction means independent of each other |
| KR20220060261A (en) * | 2020-11-04 | 2022-05-11 | 세메스 주식회사 | Interface apparatus and container transporting system with the apparatus |
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- 2004-03-04 US US10/793,648 patent/US7108121B2/en not_active Expired - Fee Related
- 2004-03-04 TW TW093105740A patent/TWI278954B/en not_active IP Right Cessation
- 2004-03-11 KR KR1020040016382A patent/KR20040081342A/en not_active Application Discontinuation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100437963C (en) * | 2005-04-27 | 2008-11-26 | 东京毅力科创株式会社 | Processing device system |
| CN101533793B (en) * | 2008-03-11 | 2011-04-13 | 精工爱普生株式会社 | Component test apparatus and component transport method |
| CN102074443B (en) * | 2009-11-19 | 2013-04-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Atmospheric transmission chamber and change method of inner airflow thereof and plasma processing equipment |
| CN103010705A (en) * | 2011-09-26 | 2013-04-03 | 大日本网屏制造株式会社 | Substrate treating system |
| US9176496B2 (en) | 2011-09-26 | 2015-11-03 | SCREEN Holdings Co., Ltd. | Substrate treating system |
| CN103010705B (en) * | 2011-09-26 | 2016-01-06 | 斯克林集团公司 | Base plate processing system |
| CN109742041A (en) * | 2019-01-07 | 2019-05-10 | 成都中电熊猫显示科技有限公司 | The control method and equipment of substrate transmission |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200423283A (en) | 2004-11-01 |
| TWI278954B (en) | 2007-04-11 |
| KR20040081342A (en) | 2004-09-21 |
| JP2004281474A (en) | 2004-10-07 |
| US7108121B2 (en) | 2006-09-19 |
| US20040247417A1 (en) | 2004-12-09 |
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