JP2002093876A - Device and method for transfer of semiconductor product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the occupying space of a clean room by eliminating the need for in-process transfer means other than a product stocker from the room. SOLUTION: In the clean room, a plurality of manufacturing devices EQ1-EQ6 are arranged on both sides of the product stocker 1, and the devices EQ1-EQ6 are connected to the stocker 1 by providing receiving and delivering positions 3 for in-process transfer in the stocker 1, corresponding to the manufacturing devices EQ. An intra-stocker transfer robot 2 is provided in the stocker 1 for transferring products between the stocker 1 and devices EQ, and each device EQ is provided with an exclusively used transfer robot 4. In addition, the ceiling of the clean room excluding the ceiling portions of the devices EQ is provided with a fan filter unit 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for storing a product such as a semiconductor wafer processed by a semiconductor manufacturing apparatus installed in a clean room in a carrier, temporarily storing the carrier in a product stocker, and manufacturing the product stocker. The present invention relates to an apparatus and a method for transporting semiconductor products that deliver products to and from the apparatus in priority order.

[0002]

2. Description of the Related Art A conventional semiconductor device transfer apparatus and method will be described with reference to the plan view of the conventional transfer apparatus shown in FIG.

[0003] The arrangement of the conventional transfer device shown in FIG.
As shown in JP-A-61-173849, a product stocker 1 placed in a clean room
And a plurality of manufacturing apparatuses EQ arranged on both sides of the in-process transfer means 12 such as a transfer cart. The plurality of manufacturing apparatuses EQ include, for example, seven units of EQ1 to EQ7. For example, in the case of a photolithography process, which is one manufacturing process of a semiconductor wafer, these manufacturing apparatuses E
Q is a manufacturing apparatus used in a photolithography process, such as a photoresist coating apparatus, an exposure apparatus, a developing apparatus, and an etching apparatus.

In the manufacturing apparatuses EQ 1 to EQ 7, a dedicated manufacturing apparatus transfer robot 4 and an in-process transfer position 3 are provided at positions facing the in-process transfer means 12. The supply and collection of products can be performed between the in-process transfer / transfer position 3 and the transfer robot 4 dedicated to the manufacturing apparatus.

The product stocker 1 includes a product storage shelf 8 for temporarily storing a carrier containing a product such as a semiconductor wafer, and in-process transfer / transfer positions 13 and 14 for transferring a product to / from a manufacturing apparatus EQ. And a transfer robot 2 in a product stocker for transferring a product between the in-process transfer delivery positions 13 and 14 and the product storage shelf 8.

Further, the product stocker 1 is provided with inter-process transfer positions 5 and 6 for receiving and paying out products from other processes (for example, before or after the photolithography process). The product is transferred to and from an inter-process transfer means 7 such as a transfer trolley. The product transfer in this inter-process transfer is also performed by the transfer robot 2 in the product stocker, and these operations are performed according to instructions from a host computer controlling the process, and the product to be processed is transferred between devices such as manufacturing devices. It is possible to carry.

[0007]

In the conventional apparatus and method for transporting semiconductor products, the product stocker 1 and the manufacturing apparatus EQ are arranged independently of each other.
A new transport means such as the in-process transport means 12 is required between the apparatus and the manufacturing apparatus EQ, and it is necessary to install this transport means in a clean room, so that it has been difficult to save space in the clean room. Further, each of the manufacturing apparatuses EQ has its own in-process transfer / delivery position 3 for the product, and the use efficiency of the clean room is poor.

[0008] Furthermore, the product stocker 1 to the manufacturing apparatus E
When the product is supplied to Q, the in-process transfer positions 13 and 14 of the product stocker 1 and the in-process transfer means 12, and the in-process transfer means 12 and the in-process transfer position 3 of the manufacturing apparatus EQ. Is necessary, which takes a long time to transport, which is one of the causes of deteriorating equipment productivity and manufacturing lead time.

SUMMARY OF THE INVENTION The present invention has been made to solve these problems. The present invention aims at reducing the space in a clean room and shortening the transfer time by eliminating the in-process transfer means other than the product stocker, and improving the manufacturing apparatus. The purpose is to reduce the investment of.

[0010]

SUMMARY OF THE INVENTION A semiconductor product transfer apparatus according to the present invention is an in-process transfer for transferring a product between a product stocker installed in a clean room and having a product storage shelf and a plurality of manufacturing apparatuses. A plurality of manufacturing devices are arranged on both side surfaces of a product stocker, and an in-process transfer position corresponding to each of the manufacturing devices is set in the product stocker. Further, a transfer robot in the product stocker is provided in the product stocker as the in-process transfer means, and a transfer robot dedicated to the manufacturing device is provided in each manufacturing apparatus.

The product stocker having the in-process transfer / delivery position and the transfer robot in the product stocker and the transfer robot dedicated to the manufacturing apparatus are installed in a clean room having a fan filter unit installed on the ceiling, and the manufacturing apparatus is installed in the clean room. It is characterized by being installed in an area with a lower degree of cleanliness.

Further, the transfer robot dedicated to the manufacturing apparatus is
The present invention is characterized in that products are supplied and collected between a transfer unit in a process in a product stocker and a manufacturing apparatus.

Further, the product stocker is provided with an inter-process transfer position for receiving and paying out products from other processes, and transfers the product to and from the inter-process transfer means. .

[0014] The semiconductor product transfer method of the present invention is a semiconductor product transfer method for transferring products between a product stocker which is installed in a clean room and has a product storage shelf and a plurality of manufacturing apparatuses. In the transfer device, for the products received from other processes, the upper level computer determines the manufacturing device to be processed based on the progress of the manufacturing process, and transfers the robot in the product stocker to the determined intra-process transfer position of the manufacturing device. The products transported by the manufacturing apparatus are supplied to the manufacturing apparatus by a transfer robot dedicated to the manufacturing apparatus, and the products that have been processed by the manufacturing apparatus are collected by the transfer robot dedicated to the manufacturing apparatus at the in-process transfer delivery position.

If the in-process transfer / delivery position of the manufacturing apparatus to be processed is vacant, the product is delivered to the corresponding in-process transfer / delivery position by the transfer robot in the product stocker, and the delivery is performed. The manufacturing apparatus is characterized in that products are supplied to the manufacturing apparatus by a transfer robot dedicated to the manufacturing apparatus.

If the in-process transfer / delivery position of the manufacturing apparatus to be processed is not vacant, the product is temporarily stored in a product storage shelf in a product stocker until the in-process transfer / delivery position is vacant. And

Further, the product that has been processed by the manufacturing apparatus is collected by the transfer robot dedicated to the manufacturing apparatus to the in-process transfer / delivery position, and the in-process transfer / delivery position of the manufacturing apparatus in the next processing step is vacant. Is characterized in that a transfer robot in a product stocker transports the product to a corresponding in-process transfer delivery position, and temporarily stores the product in a product storage shelf of the product stocker when the in-process transfer delivery position is not empty.

When the next processing step of the product collected at the intra-process transfer position is in another area, the product is transferred to the inter-process transfer position by the transfer robot in the product stocker and transferred between the processes. It is characterized by being transported to another area by means.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the configuration of the transport device according to the present invention. FIG. 2 shows FIG.
FIG. 2 is a configuration diagram of the inside of the device viewed from the front.

As shown in FIGS. 1 and 2, the transfer device of the present invention comprises a product stocker 1 arranged in a clean room and a plurality of manufacturing devices EQ arranged in parallel on both side surfaces of the product stocker 1. Be composed. In the present embodiment, the plurality of manufacturing apparatuses EQ include six EQ1 to EQ6. For example, in the case of a photolithography process, which is one manufacturing process of a semiconductor wafer, these manufacturing devices are configured by manufacturing devices used in the photolithography process, such as a photoresist coating device, an exposure device, a developing device, and an etching device. Shall be

In each of the manufacturing apparatuses EQ1 to EQ6, a dedicated manufacturing apparatus transfer robot 4 is provided at a position facing the product stocker 1.
As shown in FIG. 2, the area including the transfer robot 4 dedicated to the manufacturing apparatus is arranged in the clean room 10 having a higher degree of cleanness by the fan filter unit 11 installed on the ceiling. On the other hand, the manufacturing apparatuses EQ <b> 1 to EQ <b> 6 are installed in the maintenance area 9 having a lower degree of cleanness than the clean room 10.

The product stocker 1 includes a product storage shelf 8 for temporarily storing a carrier containing a product such as a semiconductor wafer, an in-process transfer / delivery position 3 for delivering / receiving products to / from the manufacturing apparatus EQ, It is configured to include a product stocker transfer robot 2 that transfers products between the storage shelf 8 and the in-process transfer delivery position 3. Further, the in-process transfer / transfer position 3 is a transfer robot 4 dedicated to the manufacturing apparatus provided in each manufacturing apparatus EQ.
The product stocker 1 is provided at a position corresponding to each manufacturing apparatus EQ so that the product can be supplied and collected between the production stocker 1 and the production equipment EQ.

Further, the transfer robot 2 in the product stocker
Is a linear reciprocating mechanism in the horizontal direction as shown by arrow A in FIG. 1, a vertical and vertical moving mechanism as shown by arrow B in FIG. 2, and a horizontal and horizontal moving mechanism as shown by arrow C in FIG. And transports the product in the process in the product stocker 1.

The product stocker 1 is provided with inter-process transfer positions 5 and 6 for receiving and discharging products from other processes (for example, before or after the photolithography process). The product is transferred to and from an inter-process transfer means 7 such as a transfer trolley. The product transfer in this inter-process transfer is also performed by the transfer robot 2 in the product stocker, and these operations are performed according to instructions from a host computer controlling the process, and the product to be processed is transferred between devices such as manufacturing devices. It is possible to carry.

Next, the operation of the semiconductor product transport apparatus having the above-described configuration will be described with reference to FIGS. In the following description, the manufacturing apparatus E
The letter Q indicates any one of the manufacturing apparatuses EQ1 to EQ6.

First, as the basic operation of the in-process transfer, the transfer robot 2 in the product stocker 1 transfers the in-process transfer position 3 of the manufacturing equipment EQ.
Is supplied to the manufacturing apparatus EQ by the manufacturing apparatus dedicated transfer robot 4 dedicated to the manufacturing apparatus EQ.
This is an operation in which the product that has been processed in Q is again collected at the intra-process transfer position 3 by the transfer robot 4 dedicated to the manufacturing apparatus.

On the other hand, as a basic operation of the inter-process transfer, the inter-process transfer position 5 for receiving and delivering products from another process (pre-process or post-process of the intra-process transfer) provided in the product stocker 1 is described. , 6 and the inter-process transfer means 7 from another process.

For products received from other processes,
The host computer determines the manufacturing apparatus EQ to be processed based on the progress of the manufacturing process. If the determined in-process transfer delivery position 3 of the manufacturing apparatus EQ to be processed is vacant, the transfer robot 2 in the product stocker 1 in the product stocker 1 transfers the product received to the corresponding in-process transfer delivery position 3. Make a payout. The manufacturing apparatus EQ that has been paid out supplies the product to the manufacturing apparatus EQ by the manufacturing apparatus dedicated transfer robot 4.

If the in-process transfer / delivery position 3 of the manufacturing apparatus EQ to be processed is not vacant for a product received from another process, the product is temporarily transferred to the product storage shelf 8 until the in-process transfer / delivery position 3 is vacant. Store product.

The product that has been processed by the manufacturing equipment EQ is
It is collected at the in-process transfer / delivery position 3 by the transfer robot 4 dedicated to the manufacturing apparatus. When the manufacturing apparatus EQ for performing the next in-process processing of the recovered product is connected to the product stocker 1 and the in-process transfer / delivery position 3 of the manufacturing apparatus EQ is vacant, the product stocker in the product stocker 1 is Vacant manufacturing equipment E using the internal transfer robot 2
The transfer is performed to the in-process transfer transfer position 3 of Q.
If the intra-process transfer delivery position 3 is not vacant, it is temporarily stored in the product storage shelf 8.

When the next processing step of the collected product is in another inter-process area, the product is paid out to the inter-process transfer position 6 by the product stocker transfer robot 2 in the product stocker 1, and It is conveyed to another inter-process area by the inter-process conveying means 7.

Next, a method of transporting a semiconductor product using the transport apparatus of the present invention as described above will be described with reference to the flowchart of FIG. 3 while referring to FIGS. The product to be processed arrives at the inter-process transfer delivery position 5 of the product stocker 1 by the inter-process transfer means 7.
After the product to be processed arrives at the inter-process transfer position 5, the product information is sent from the product stocker 1 to the host computer. The host computer selects the manufacturing apparatus EQ to be processed according to the process information of the product. Manufacturing equipment E to be processed
After determining Q, the state of presence (the presence or absence of a vacancy) of the in-process transfer / delivery position 3 of the target manufacturing apparatus EQ is confirmed. If the intra-process transfer position 3 can receive the product (there is no cargo), the product at the inter-process transfer position 5 is transferred by the manufacturing equipment EQ by the transfer robot 2 in the product stocker 1 in the product stocker 1. It is transported to the delivery position 3. When the in-process transfer / delivery position 3 of the manufacturing apparatus EQ cannot receive the product (there is a stock), the product stocker transfer robot 2 temporarily stores the product in an empty product storage shelf 8. Manufacturing equipment EQ
When the in-process transfer / delivery position 3 is ready to receive the product, the transfer robot 2 in the product stocker
As a result, the product to be processed in the product storage rack 8 is paid out to the in-process transfer / delivery position 3 (in a state). The manufacturing apparatus EQ from which the product has been delivered to the in-process transfer / delivery position 3 supplies the product to the manufacturing apparatus EQ by the manufacturing apparatus dedicated transfer robot 4. The processing is performed by the manufacturing apparatus EQ, and the processed product is collected by the manufacturing apparatus dedicated transfer robot 4 at the in-process transfer / delivery position 3 in the product stocker 1. The product collected at the in-process transfer / delivery position 3 sends the product information to the host computer, and selects the next target manufacturing apparatus EQ based on the process information of the product. If the selected processing target manufacturing apparatus EQ is connected to the same product stocker 1, and if the in-process transfer / delivery position 3 can receive the product (there is no stock), the process of the completed manufacturing apparatus EQ is completed. The product is delivered from the transfer delivery position 3 to the in-process transfer transfer position 3 of the next manufacturing apparatus EQ to be processed by the transfer robot 2 in the product stocker (the state becomes). If the delivered product cannot be received at the in-process transfer / delivery position 3 (there is a stock), the product is temporarily stored in the product storage shelf 8 (in a state). If the next processing target equipment EQ exists in another inter-process area,
The product is paid out to the inter-process transfer delivery position 6 and is conveyed to another inter-process processing area by the inter-process transfer means 7.

The product form in the product stocker described in the above embodiment can be applied to either a collective form stored in a carrier or a single-sheet form.

[0034]

As described above in detail, according to the semiconductor device transfer apparatus and method of the present invention, the manufacturing apparatus is connected to the product stocker, and the transfer in the process is performed by the transfer robot in the product stocker. As a result, in-process transport means other than the product stocker becomes unnecessary, and as a result,
The clean room can be minimized, the use efficiency of the clean room is increased, and the investment in the clean room and transport equipment is also reduced.

Further, since the in-process transfer means other than the product stocker is eliminated, the transfer time is reduced and the transfer efficiency is improved. Further, since a product delivery position unique to the manufacturing apparatus is provided inside the product stocker, a product delivery position unique to the manufacturing apparatus becomes unnecessary, and investment in the manufacturing apparatus can be suppressed.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a configuration of a transport device according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of the inside of FIG. 1 as viewed from the front.

FIG. 3 is a flowchart illustrating a transport method according to the present invention.

FIG. 4 is a plan view showing a configuration of a conventional transport device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Product stocker 2 Transfer robot in product stocker 3 In-process transfer / transfer position 4 Transfer robot dedicated for manufacturing equipment 5, 6 Transfer / transfer position between processes 7 Inter-process transfer means 8 Product storage shelf 9 Maintenance area 10 Clean room 11 Fan filter unit 12 In-process transport means 13, 14 In-process transport delivery position

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) B65G 1/04 515 B65G 1/04 515Z 1/137 1/137 A 49/07 49/07 L H01L 21/02 H01L 21 / 02 D 21/027 21/30 502J F-term (reference) 3F022 AA08 BB09 CC02 EE05 FF01 JJ07 KK20 LL12 MM01 MM13 5F031 CA02 DA01 DA17 FA01 FA03 FA07 FA11 GA02 GA47 GA48 GA49 GA58 MA06 MA09 NA02 PA02 PA03 5F046 LA05

Claims (9)

[Claims] 1. A semiconductor product transfer device having in-process transfer means for transferring products between a product stocker installed in a clean room and having a product storage shelf and a plurality of manufacturing devices, wherein said plurality of manufacturing devices are provided. The devices are arranged on both side surfaces of the product stocker, and the in-process transfer positions corresponding to the respective manufacturing devices are installed in the product stocker to connect the product stocker and the manufacturing device. A transfer device for semiconductor products, wherein a transfer robot in a product stocker is provided therein, and a transfer robot dedicated to the manufacturing device is provided in each manufacturing device. 2. The product stocker having the in-process transfer / delivery position and the transfer robot in the product stocker and the transfer robot dedicated to a manufacturing device are installed in a clean room in which a fan filter unit is installed on a ceiling;
2. The semiconductor product transport apparatus according to claim 1, wherein the manufacturing apparatus is installed in an area having a lower degree of cleanness than the clean room. 3. The semiconductor product transfer device according to claim 1, wherein the transfer robot dedicated to the manufacturing apparatus supplies and recovers the product between the in-process transfer / delivery position in the product stocker and the manufacturing apparatus. Transport device. 4. A product stocker is provided with an inter-process transfer position for receiving and paying out products from other processes, and transfers products to and from the inter-process transfer means. The semiconductor device transport device according to claim 1. 5. A semiconductor product transfer device having an in-process transfer means for transferring products between a product stocker installed in a clean room and having a product storage shelf and a plurality of manufacturing devices. Based on the progress of the manufacturing process, the accepted product determines the manufacturing equipment to be processed by the host computer, and the product transferred by the transfer robot in the product stocker to the in-process transfer delivery position of the determined manufacturing equipment is the manufacturing equipment. A method of transporting semiconductor products, wherein a dedicated transfer robot supplies a product to a manufacturing apparatus, and a product that has been processed by the manufacturing apparatus is collected at an in-process transfer delivery position by the dedicated transfer robot. 6. When the in-process transfer delivery position of the manufacturing apparatus to be processed is vacant, the product is delivered to the corresponding in-process transfer delivery position by the transfer robot in the product stocker, and the delivery is received. 6. The method according to claim 5, wherein the manufacturing apparatus supplies the product to the manufacturing apparatus by a transfer robot dedicated to the manufacturing apparatus. 7. If the in-process transfer delivery position of the manufacturing apparatus to be processed is not vacant, the product is temporarily stored in a product storage shelf in a product stocker until the in-process transfer delivery position is vacant. The method for conveying a semiconductor product according to claim 5, wherein 8. The product that has been processed by the manufacturing apparatus is collected by the transfer robot dedicated to the manufacturing apparatus at the in-process transfer / delivery position, and the in-process transfer / delivery position of the manufacturing apparatus in the next processing step is vacant. 6. The method according to claim 5, wherein the transfer robot in the product stocker transports the product to the corresponding in-process transfer delivery position, and temporarily stores the product in the product storage shelf of the product stocker when the in-process transfer delivery position is not empty. A method for transporting semiconductor products as described in the above. 9. When the next processing step of the product collected at the in-process transfer / delivery position is in another area,
6. The semiconductor product transfer method according to claim 5, wherein the transfer robot in the product stocker pays out the goods to the inter-process transfer delivery position, and transfers the products to another area by the inter-process transfer means.