4442 4 9 Α7 Β7 經濟部智慧財產局員工消焊合作社印於 五、發明說明（ 【發明之背景】 本發明是有關製造半導體裝置之製造線。 【習知之技術】 第3圖表示之半導體裝置之製造線係串聯並排複數之 處理裝置’沿著該等處理裝置設置輸送路徑1者。 上述處理裝置Μ係於晶圓基板上形成各個層之用者， 例如濺射裝置’或雜質擴散裝置、底片處理裝置等。 又，輸送路徑1上，以晶圓基板作為輸送至各個處理 裝置Μ的手段’設置朝箭頭X方向移動之基板輸送車2， 該基板輸送車2上載置收納晶圓基板之無塵箱3。該基板 輸送車2是藉著未圖示之控制c PU的指令而移動、停止 者。 並且，上述處理裝置Μ是藉上述基板輸送車2將晶圓 基板朝著X方向輸送，而可以必要的處理順序_聯並排。 亦即，各處理裝置Μ是以形成各層之順序並排’因此在形 成不同層而重覆進行相同的處理時，可重覆設置同種的處 理裝置Μ。 但是，該製造線也可以設置對應不同品種製造的處理 裝置Μ。亦即，將僅製造特定品種時所利用的處理裝置Μ ，或製造複數品種用之共同使用的處理裝置…並排在一線 上。因此，可無須因品種而使用所有的處理裝置Μ ^基板 輪送車2對於搭載之晶圓基板，只須選擇所需的處理裝置 輸送晶圓基板即可。 於上述之製造線中，簡單說明製造半導體裝置之方法 如下。 c請先閱讀背面之注意事項再填寫本頁) ..叙--------訂. 線-4442 4 9 Α7 Β7 Soldering cooperatives of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs printed on the 5. Description of the invention (Background of the invention) The present invention relates to a manufacturing line for manufacturing semiconductor devices. [Known Technology] The semiconductor device shown in Figure 3 Manufacturing lines are serially arranged in parallel with a plurality of processing apparatuses 'along which a conveying path 1 is provided. The above-mentioned processing apparatus M is a user who forms various layers on a wafer substrate, such as a sputtering apparatus', an impurity diffusion apparatus, and a negative film. Processing equipment, etc. In addition, on the conveying path 1, a wafer substrate is used as a means for conveying to each processing device M. A substrate conveying vehicle 2 is provided which moves in the direction of the arrow X, and the substrate conveying vehicle 2 carries a substrate for storing wafer substrates. Dust box 3. This substrate transport vehicle 2 is moved and stopped by a command to control cPU (not shown). The processing device M transports the wafer substrate in the X direction by the substrate transport vehicle 2. And the necessary processing sequence can be arranged side by side. That is, each processing device M is arranged side by side in the order of forming each layer. Therefore, the same process is repeatedly performed in the formation of different layers. In time, the same type of processing device M can be repeatedly installed. However, the manufacturing line can also be provided with processing devices M made for different varieties. That is, only the processing devices M used when a specific type is manufactured, or a plurality of types can be manufactured. The processing devices used in common ... are lined up side by side. Therefore, it is not necessary to use all processing devices M ^ substrate wheel cart 2 for the wafer substrate to be carried, only the processing device needed to transport the wafers The substrate can be used. In the above manufacturing line, the method for manufacturing semiconductor devices is briefly explained as follows. C Please read the precautions on the back before filling in this page) ..------------ Order. Line-
五、發明說明（ 4442 4 9 …二板輸送車2係載置收納晶圓基板之無塵箱3，於輸 =路徑1上朝著箭頭方向移動。並且，於載置基板輸送車 2之晶圓基板的處理移至所須處理裝置“之前停止。當基 板輸送車2停止時’處理裝倾健受從無塵箱3輸送^ 裝置内的晶圓基板’進行處理。χ，各處理裝置Μ具備使 收納於無塵箱3之晶圓基板不致暴露於外氣而可收納於裝 置内的機構。 ： ' 如上述，基板輸送車2可一邊選擇必要的處理裝置μ 朝著箭頭X方向前進，對晶圓基板施以必要的處理。並且 上述基板輸送車2在到達輸送路徑1的右端時完成該製 造線的處理。 於上述半導體裝置之製造線上依序處理晶圓基板時， 可在輸送路徑1上輸送複數基板輸送車2。如上述，在處 理裝置Μ中具有延緩處理速度的裝置時，在其裝置跟前會 導致數台基板輸送車2的滯留。 此外’複數基板輸送車2中，必須特定位置者，需附 加符號2 a〜2 c說明之。又，處理裝置μ之中，特定裝 置者附以符號Μ 1〜Μ 3。 例如’第3圖表示之製造線中’處理裝置μ較前後處 理裝置Μ 1、Μ 3之處理速度緩慢時，在輸送路徑丄上會 形成等待處理裝置M2處理完後之基板輸送車2 a〜2 c 的行列。該行列前頭之基板輸送車2 a送來的晶圓基板在 處理裝置2内處理的期間，係以基板輸送車2 a為前頭.， 基板輸送車2 b、2 c則形成待機狀態。 ^ fA*-----(It--------•線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印*'< 4 本纸張尺度適用中0囵家標準（CNS)AJ規格（210 X 297公髮^ A7 444249 五、發明說明（） 並且，在輸送路徑1上待機的基板輸送車2 a〜2 c 形成長的行列時，在其前面的處理裝置]^ i上會形成輸送 晶圓基板之後續基板輸送車2的阻礙。上述基板輸送車2 a〜2 c為了不造成後續基板輸送車2的阻礙，必須增加 處理裝置Μ 1與處理裝置μ2的間隔，會因該量而增長輸 送路徑1。 如上述，配合處理速度緩慢之處理裝置Μ，一旦增長 處理裝置Μ的設置間隔時，會增加輸送路徑^的全長。而 輸送路徑1 一旦增長時，同時會增長基板輸送車2的輸送 距離使效率不佳。 又，該製造線係可對應不同品種之半導體裝置的製造 而並排處理裝置Μ。 另一方面，係根據品種對晶圓基板施以不同的處理。 因此基板輸送車2係根據各品種僅選擇必要的裝置輪送 晶圓基板。例如’第3圖中，基板輸送車2 c在輸送不須 處理裝置Μ處理的品種時，上述基板輸送車2 c必須在處 理裝置1的處理之後，移動至處理裝置M3。但是，如第 3圖所示，在處理裝置M2之前形成基板輸送車2 ^、2 b的行列時，上述基板輸送車2 c於上述行列移動前，不 能移動處理裝置M3。 如果，即使形成空的處理裝置M3時，基板輸送車2 c仍必須外加於等待處理之處理裝置2的輸送車2 a2 b之列。其間上述處理裝置M3同聘呈停止的狀態。 ^因此，不但整體形成長的處理時間，同時會導致處理 裝置之動作率降低的問題。 本紙張尺度適用 tIWii?^NS)A,1^(21〇x 297 ^) .]4--------訂---------線 (請先閱讀背面之注意事項再填寫本頁j 經濟部智慧財產局員工消费合作社印奴 4 9 A7 B7 明說 明發 經濟部智玆財產局員工消费合作社印製 【發明之目的】 丰發明之目的為可防止特定之處理裝置前使輸送車不 致滞留而形成其他處理上的妨礙。 又，其他之目的係可有效利用輸送路，有效地使處理 裝置動作而可提高生產效率。 【解決目的之手段】 為達成上述目的’第1之發明係以具備串聯配置複數 處理裝置之區段，沿著該等複數處理裝置設置輸送路徑之 半導體裝置的製造線為前提。 並且，其特徵為.在上述處理裝置之中，與預定之處 理裝置對應的位置，在離開輸送路徑的位置上設置缓衝埠 ，載置晶圓基板，構成使輸送路徑移動之輸送體可退避至 上述緩衝埠者。 第2之發明係以第1發明為前提，其特徵為：在上述 處理裝置之中，與處理速度較緩之處理裝置對應的位置， 在離開輸送路徑的位置上設置緩衝埠者。 第3之發明係以第1、第2發明為前提，其特徵為： 輸送路徑為皮帶式輸送機所構成者。 並且，具備串聯配置複數處理裝置之區段，係包含未 串聯配置處理裝置部份，及串聯配置所有處理裝置等雙方 於本發明之中。 【圖示之簡單說明】 第1圖為第1實施例的半導體裝置之製造線。 第2圖為第2實施例的半導體裝置之製造線。 第3圖為習知例之半導體裝置之製造線。 ____ ' 6 ^紙張尺度適用中13國家標準（CMS)A.l规格（2i〇 X 297公沒) · ---- ----------I t - - -----^il------ f請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 4442 4 9 a? B7 五、發明說明（） 【本發明之實施例】 第1圖表示之第1實施例是沿者輸送路徑1與處理裝 置Μ之相反側設置複數緩衝埠P 1〜P 4之點係與上述習 知例不同。該緩衝埠Ρ 1〜Ρ 4係將晶圓基板收納於無塵 箱3而輸送之基板輸送車2形成可複數台待機者。並且， 上述基板輸送車2藉著未圖示之控制C P U的指令移動、 停止是與習知例相同。 又，各處理裝置Μ可決定特定其位置之位址，位址I D 4係沿輸送路徑1安裝。該位址I D 4係顯示其位址之 標識者。 另一方面’上述基板輸送車2具備未圖示之讀取位址 I D 4的I D感測器。上述位址I D4可確認輸送路徑1 上移動之基板輸送車2是例如以條碼等所構成者。因此， 載置晶圓基板之基板輸送車2是藉I D感測器讀取位址I D 4，檢測出本身的位置。並且，基板輸送車2可一邊將 此檢測彳§说傳送至控制C. P LJ ’而在輸送路經1上移動。 '如上述’上述控制CPU可利用來自基板輸送車2之 位址I D 4的檢測信號’確認基板輸送車2的位置。 又，上述控制CPU係對應製造之半導體裝置的品種 記憶必要處理裝置的位址。並且，基板輸送車2 一旦到達 必要之處理裝置的位址時，發出在其位置停止的指令。 因此，該第1實施例中，上述基板輸送車2係相當於 本發明之輸送體。 以上述製造線說明製造半導體裝置的方法如下d 基板輸送車2 a〜2 c係於輸送路徑1上讀取上述位 7 本紙張尺度適用中0囚家標準（CNS>A4規格（210 X 297公爱） I 1111 -----裝 lit 訂- - - - ----線 {請先閱讀背面之注意事項再填寫本頁) 4442 4 9 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 址I D 4而朝著箭頭X方向移動。並且，根據控制c p u 的指令，於必要之處理裝置前停止。 例如，基板輸送車2 a —旦停止於處理裝置Mg之前 時，處理裝置M2從該基板輸送車2 a上的無塵箱3接受 晶圓基板，開始進行處理。如上述，處理裝置M2在處理 晶圓基板的期間，基板輸送車2 a係於載置第1所示之空 的無塵箱3狀態，退避至緩衝埠p 2。 其次，傳送處理裝置M2所須處理之基板的基板輸送 車2 b係於處理裝置M2前到達。但是，由於處理裝置μ 2係於使用中，因此基板輸送車2 b必須等待上述處理裝 置M2成空為止。此時，上述基板輸送車2 t>可退避至緩 衝琿P 2。如上述’基板輸送車2 a與2 b係於緩衝槔p 2内#機’因此在處理裝置m2前的輸送路徑1上不會構 成其他基板輸送車2移動上的阻礙。 因此’其次之基板輸送車2 c於輸送無須進行處理裝 置M2之處理的品種時，可通過處理裝置m2之前，朝處 理裝置M3輸送晶圓基板。並且，處理裝置m3在處理晶 圓基板的期間’上述基板輸送車2 c可於緩衝埠p 3内待 機。 另一方面’完成上述處理裝置M2的處理之基板係收 納於無塵箱3内，送回基板輸送車2a。如此，上述處理 裝置Μ 2上可接受基板輸送車2 b的晶圓基板，上述基板 輸送車2.a可朝著其次必需之處理裝置，例如處理裝置μ 3移動。並且，如處理裝置μ 3在使用中時，可於緩衝埠 Ρ 3内待機。處理裝置μ 3成空時，處理裝置Μ 3接受晶 圓基板加以處理。 8 本紙張尺度適用中囤國豕標準規彳各（210 X 297公釐） tT ----訂--I I I I I--線 (請先閱讀背面之注意事項再填寫本頁) A7 444249 五、發明說明（） 上过基板輸送車2係將晶圓基板輸送至必要之處 理裝置Ml〜μ4，於接受其晶圓基板的期間，或處理晶 圓基板的期間’可在緩衝埠ρ 1〜ρ 4内待機。 如以上所述，藉緩衝埠ρ丄〜ρ 4的設置，可使等待 完成特定處理裝置的處理之基板輸送車2退避至該緩衝埠 Ρ. 1〜Ρ4。因此，基板輸送車2不會阻塞輸送路徑i， 尤其不會在處理速度緩慢處理裝置之前形成長的基板輸送 車2的列子而妨礙其他基板輸送車2的通行g 因此，任意的基板輸送車2皆可有效地將基板輸送至 必要的處理裝置jy [内，提高生產率。 此外，該第1實施例中，沿著輸送路徑i具備4個 衝埠P 1〜P 4，但是緩衝埠之數量不論數量為何皆可： 也可以僅設置對應特定的處理裝置，或者對應所有的處理 裝置Μ » 又，上述第1實施例中，與輸送路徑同一平面上， 雖叹置緩料P 1〜P 4，但其位置不僅限於實施異。例 如’也可以在輸送路徑丨上方，或下方與輸送路徑丄不同 的平面上設魏衝埠Ρ。即可自輸祕徑丨使基板輸送車 2退避即可。 ^，如上述第1實施例，藉位址可特定處理上所需的 處理裝置也可以在相反側特定不必要之處理裝置者。即， 將不必要的處理裝置Μ沿著輸送路徑i並排時，可越過此 輸送晶圓基板者。 例如’可配置配合所有品種製造用所必須之工程的處 理裝置構成製造線。並且，t造特定的品種時，控制c p -______9 本紙張又度適鮮卵家標準（CNS)A4祕（21Q /297公 ί I A--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製V. Description of the invention (4442 4 9… The second board conveyer 2 is a dust-free box 3 for storing wafer substrates, and moves in the direction of the arrow on the conveyance path 1. Moreover, the crystals are placed on the substrate conveyer 2. The processing of the round substrate is moved to the required processing device "stopped before. When the substrate transfer vehicle 2 is stopped, the processing device is handled by the wafer substrate conveyed from the dustless box 3". Χ, each processing device M It has a mechanism that allows the wafer substrate stored in the dust-free box 3 to be stored in the device without being exposed to outside air: '' As described above, the substrate transport vehicle 2 can select the necessary processing device μ and move in the direction of arrow X, The necessary processing is performed on the wafer substrate, and the substrate transport vehicle 2 completes the processing of the manufacturing line when it reaches the right end of the transportation path 1. When the wafer substrate is sequentially processed on the manufacturing line of the semiconductor device, the transportation path may be A plurality of substrate transport vehicles 2 are transported on top 1. As described above, when the processing device M has a device for delaying the processing speed, a plurality of substrate transport vehicles 2 may be held in front of the equipment. In addition, a plurality of substrate transport vehicles In the case of 2, a specific position is required, and the symbols 2 a to 2 c are added to indicate it. In the processing device μ, the specific device is attached with the symbols M 1 to M 3. For example, 'in the manufacturing line shown in FIG. 3' When the processing speed of the processing device μ is slower than that of the front and rear processing devices M1 and M3, a row of substrate transfer vehicles 2 a to 2 c waiting for the processing of the processing device M2 will be formed on the transport path 。. During the processing of the wafer substrate sent by the vehicle 2 a in the processing device 2, the substrate transportation vehicle 2 a is used as the front. The substrate transportation vehicles 2 b and 2 c are in a standby state. ^ FA * ----- (It -------- • Line (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs * '< 4 This paper standard applies to the Chinese standard of 0 ( CNS) AJ specification (210 X 297 issued ^ A7 444249 V. Description of the invention () Also, when the substrate conveyance carts 2 a to 2 c waiting on the conveyance path 1 form a long line, the processing device in front of it] ^ An obstacle to the subsequent substrate transfer cart 2 that transports wafer substrates will be formed on i. The above substrate transfer carts 2 a to 2 c are In order not to hinder the subsequent substrate conveying vehicle 2, the distance between the processing device M1 and the processing device μ2 must be increased, and the conveying path 1 will be increased by this amount. As mentioned above, the processing device M with a slow processing speed will increase the processing device once. When the interval of M is set, the total length of the conveying path ^ is increased. When the conveying path 1 is increased, the conveying distance of the substrate conveying vehicle 2 is increased at the same time to make the efficiency inferior. Moreover, the manufacturing line can correspond to different types of semiconductor devices. The processing equipment M is manufactured side by side. On the other hand, the wafer substrate is processed differently according to the type. Therefore, the substrate transport vehicle 2 selects only the necessary equipment to rotate the wafer substrate according to the type. For example, in Fig. 3, when the substrate transfer cart 2c is transporting a product that does not require processing by the processing device M, the substrate transfer cart 2c must be moved to the processing device M3 after being processed by the processing device 1. However, as shown in Fig. 3, when the ranks of the substrate transfer vehicles 2 ^ and 2b are formed before the processing device M2, the substrate transfer cart 2c cannot move the processing device M3 before the ranks and columns are moved. If, even when the empty processing device M3 is formed, the substrate transfer cart 2 c must still be added to the transfer cart 2 a2 b of the processing device 2 waiting to be processed. In the meantime, the above-mentioned processing device M3 has been stopped. ^ Therefore, not only the overall processing time is long, but also the problem that the operating rate of the processing device is reduced. This paper size is suitable for tIWii? ^ NS) A, 1 ^ (21〇x 297 ^).) 4 -------- Order --------- Line (Please read the precautions on the back first Please fill in this page again. J Indus slave consumer cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 9 A7 B7 clearly stated that it was printed by the employee consumer cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs [invention purpose] The purpose of the invention is to prevent specific processing devices Preventing the transportation vehicle from staying and causing other processing obstacles. Another purpose is to effectively use the transportation path, effectively operate the processing device, and improve production efficiency. [Means for Solving the Purpose] To achieve the above purpose, the first The invention is based on the premise that a semiconductor device manufacturing line is provided with a section in which a plurality of processing devices are arranged in series, and a conveying path is provided along the plurality of processing devices. Furthermore, the invention is characterized in that among the processing devices, a predetermined processing is performed. At the position corresponding to the device, a buffer port is provided at a position away from the transport path, and a wafer substrate is placed to constitute a person who can move the transport path of the transport path to the buffer port. The second invention is based on the first invention. , It is characterized in that among the above-mentioned processing devices, a buffer port is provided at a position corresponding to a processing device with a slower processing speed away from the conveying path. The third invention is based on the first and second inventions, It is characterized in that the conveying path is constituted by a belt conveyor. Moreover, a section provided with a plurality of processing devices arranged in series includes both a processing device section not arranged in series and all processing devices arranged in series in the present invention. [Brief description of the diagram] Fig. 1 is a manufacturing line of the semiconductor device of the first embodiment. Fig. 2 is a manufacturing line of the semiconductor device of the second embodiment. Fig. 3 is a conventional example of manufacturing a semiconductor device. ____ '6 ^ Paper size applies to 13 national standards (CMS) Al specifications (2i0X 297 public) · ---- ---------- I t------- ^ il ------ f Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4442 4 9 a? B7 V. Description of the invention () [Examples of the invention] The first embodiment shown in FIG. 1 is the one along the conveyor path 1 and the processing device M. Opposite side is provided a plurality of buffer lines port P 1~P point 4 of the above-described conventional example differs. The buffer ports P 1 to P 4 are substrate transfer vehicles 2 that store wafer substrates in the dust-free box 3 and form a plurality of standby persons. In addition, the substrate conveyance vehicle 2 is moved and stopped by a command not shown in the figure to control C P U as in the conventional example. In addition, each processing device M can determine an address that specifies its position, and the addresses I D 4 are installed along the transport path 1. The address I D 4 indicates the identifier of the address. On the other hand, 'the substrate transport vehicle 2 is provided with an ID sensor having a read address I D 4 (not shown). The above-mentioned address I D4 can confirm that the substrate conveyance cart 2 moving on the conveyance path 1 is constituted by, for example, a bar code or the like. Therefore, the substrate transport vehicle 2 on which the wafer substrate is placed reads the address I D 4 by an ID sensor and detects its own position. In addition, the substrate conveyance vehicle 2 can move the detection path 彳 § to the control C. P LJ ′ and move on the conveyance path 1. 'As described above', the control CPU can confirm the position of the substrate transport vehicle 2 using the detection signal from the address I D 4 of the substrate transport vehicle 2. In addition, the above-mentioned control CPU memorizes the address of a necessary processing device corresponding to the type of semiconductor device manufactured. When the substrate transfer cart 2 reaches the address of a necessary processing device, it issues a command to stop at that position. Therefore, in the first embodiment, the substrate transport vehicle 2 is equivalent to the transport body of the present invention. The method of manufacturing a semiconductor device according to the above manufacturing line is as follows: d. Substrate conveyer 2 a ~ 2 c. Read the above bits on conveying path 1. 7 This paper is applicable to the standard of 0 prisoners (CNS > A4 specification (210 X 297). Love) I 1111 ----- install lit-order-------- line {Please read the notes on the back before filling this page) 4442 4 9 Printed by A7 B7 of the Consumer Cooperatives of Intellectual Property Bureau of the Ministry of Economic Affairs 5 Description of the invention () Address ID 4 and move in the direction of arrow X. In addition, according to an instruction to control c p u, it stops before a necessary processing device. For example, when the substrate transfer vehicle 2a stops before the processing device Mg, the processing device M2 receives the wafer substrate from the clean box 3 on the substrate transfer vehicle 2a and starts processing. As described above, during the processing of the wafer substrate by the processing device M2, the substrate transfer vehicle 2a is in a state where the empty clean box 3 shown in the first is placed, and is retracted to the buffer port p2. Next, the substrate transfer cart 2 b for transferring the substrate to be processed by the processing device M2 arrives in front of the processing device M2. However, since the processing device µ2 is in use, the substrate transfer cart 2b must wait until the processing device M2 becomes empty. At this time, the substrate transfer vehicle 2 t > can be retracted to the buffer P 2. As described above, the "substrate transfer vehicles 2a and 2b are attached to the buffer # p2 inside machine", so that the transportation path 1 in front of the processing device m2 does not constitute an obstacle to the movement of other substrate transfer vehicles 2. Therefore, when the substrate transfer vehicle 2c is used to transfer a product that does not require the processing device M2, the wafer substrate can be transferred to the processing device M3 before passing through the processing device m2. In addition, the processing device m3 may wait in the buffer port p3 while the wafer transfer vehicle 2c is processing the wafer substrate. On the other hand, the substrates that have been processed by the processing device M2 are received in the dust-free box 3 and returned to the substrate transport vehicle 2a. In this way, the wafer substrates of the substrate transfer cart 2b can be accepted on the processing device M2, and the substrate transfer cart 2.a can be moved toward the next necessary processing device, such as the processing device μ3. In addition, if the processing device μ 3 is in use, it can stand by in the buffer port P 3. When the processing device µ 3 becomes empty, the processing device M 3 receives a wafer substrate for processing. 8 This paper size applies to the national standard of each store (210 X 297 mm) tT ---- order --IIII I-- line (please read the precautions on the back before filling this page) A7 444249 V. Description of the Invention (2) The board transfer truck 2 is used to transfer wafer substrates to necessary processing devices M1 to μ4. During the period of receiving the wafer substrates or during the processing of the wafer substrates, it may be in the buffer port ρ 1 to ρ. Standby within 4. As described above, by setting the buffer ports ρ 丄 ~ ρ 4, the substrate transport vehicle 2 waiting to complete the processing of a specific processing device can be retreated to the buffer ports P. 1 ~ P4. Therefore, the substrate conveyance cart 2 does not block the conveyance path i, and in particular, it does not form a long array of substrate conveyance carts 2 before the processing device with a slow processing speed, which prevents the passage of other substrate conveyance carts 2. Therefore, any substrate conveyance cart 2 Both can efficiently transfer substrates to the necessary processing device jy [, and improve productivity. In addition, in the first embodiment, four flushing ports P 1 to P 4 are provided along the conveying path i, but the number of buffer ports may be irrespective of the number: only a specific processing device may be provided, or all Processing device M »In the above-mentioned first embodiment, although the retarders P 1 to P 4 are set on the same plane as the conveyance path, the positions are not limited to implementation differences. For example, 'Weichong port P' may also be provided on a plane above the conveying path 丨 or below a plane different from the conveying path 丄. That is, the secret path 丨 can be used to retreat the substrate transport vehicle 2. ^ As in the first embodiment described above, the borrowing address can specify the processing device required for processing, or it can specify the unnecessary processing device on the opposite side. That is, when unnecessary processing apparatuses M are arranged side by side along the transport path i, a person who can transport wafer substrates beyond this can be transported. For example, a processing line can be configured to cope with the processes necessary for the manufacture of all kinds of products to form a manufacturing line. In addition, when making specific varieties, control cp -______ 9 This paper is also suitable for fresh egg family standard (CNS) A4 secret (21Q / 297) I A -------- Order ------ --- line (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs
經 濟 部 智 慧 財 產 局 員 工 消 费 合 作 社 印 製ί 1442 4 9 U僅選擇其品種所必需的處理裝置，於基板輸送車賦予位 址之指令，僅於必要之處理裝置上以基板輸送車2輸送晶 圓基板。因此可使製造線具有泛用性。 第2圖表示之第2實施例為輸送路徑ί之皮帶式輸送 機所成的點與上述第1實施例不同。且於此輸送路徑丄上 載置收納應處理之晶圓基板的無塵箱3。該第2實施例中 ，輸送路徑1為可移動者，因此即使無第2實施例所示之 基板輸送車2，上述無塵箱3仍可載置於輸送路徑ί上， 以預疋的速度朝著箭頭X方向移動。即，上述之無塵箱3 為本發明之輸送體。 此外，沿著上述輸送路徑1呈串聯配置之處理裝置M 係與上述第1實施例之裝置相同者。 但是，該第2實施例中，對應所有處理裝置M的位置 上具備緩衝蜂P。 上述無塵箱3具備可讀取具處理裝置]^之位址丨D4 的I D感測器，可一邊讀取上述位址j D 4而前進。該工' D資訊係送訊至未圖示之控制c p u，該控制c p u係可 辨識上述無塵箱3之位置者。 此外，無塵箱3到達所需處理裝置M之前，控制◦p U為控制接受具有各處理裝置M之晶圓基板用的收納手段 ，將每一無塵箱3收納於處理裝置内。並且，上述收納手 段係可自無塵箱3取出晶圓基板，設定於處理部者。 又4第2貫％例之製造線上，具備可將無塵箱3從 輸送路徑1移動至緩衝埠P.’或從緩衝埠p送回輸送路徑 1的未圖示之如機械人得移動手段。且該移動手段同樣可 藉上述控制C P u控制。 [_____ 10 本纸張尺度中關家鮮（CNS)A彳祕（2】GX297公#Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1442 4 9 U Select only the processing equipment necessary for its variety, and give the address on the substrate transport vehicle, and use the substrate transport vehicle 2 to transport wafers only on the necessary processing equipment Substrate. Therefore, the manufacturing line can be made universal. The second embodiment shown in Fig. 2 is different from the first embodiment in the points formed by the belt conveyor of the conveying path. A dust-free box 3 for storing wafer substrates to be processed is placed on the transport path 丄. In the second embodiment, the conveying path 1 is movable, so even if there is no substrate conveying vehicle 2 shown in the second embodiment, the above-mentioned dust-free box 3 can still be placed on the conveying path ί at a predetermined speed. Move in the direction of arrow X. That is, the above-mentioned dust-free box 3 is a conveyance body of the present invention. In addition, the processing apparatuses M arranged in series along the above-mentioned conveying path 1 are the same as those of the above-mentioned first embodiment. However, in the second embodiment, buffer bees P are provided at positions corresponding to all the processing devices M. The above-mentioned dust-free box 3 is provided with an ID sensor capable of reading the address D4 of the processing device] ^, and can advance while reading the address j D4. The worker 'D information is sent to a control c p u (not shown), which can identify the position of the dust-free box 3. In addition, before the clean box 3 reaches the required processing device M, the control p u is a storage means for controlling the reception of the wafer substrate having each processing device M, and each clean box 3 is stored in the processing device. In addition, the above-mentioned storage means is a person who can take out a wafer substrate from the dustless box 3 and set it to a processing section. In the manufacturing line of the second example, the second embodiment includes a non-illustrated moving means such as a robot that can move the clean box 3 from the conveying path 1 to the buffer port P. 'or return from the buffer port p to the conveying path 1. . And the moving means can also be controlled by the above-mentioned control CPu. [_____ 10 Guan Jiaxian (CNS) A secret in this paper standard (2) GX297 公 #
A7 ^ 442 4 9 五、發明說明（） 亦即，上述控制c P U係根據無塵箱3讀出之位址！ D 4的資訊，控制上述收納手段，或上述移動手段。 藉上述第2實施例之製造線說明製造半:導體裝置的方 法如下。 上述無塵箱3係可收納晶圓基板，放置於輸送路徑丄 守 了 邊項取各處理裝置Μ的位址I D4，朝著箭頭 方向移動。 無塵箱3 —旦來到必備之處理裝置]ν[前時，藉控制c Ρ ϋ的控制’可將無塵箱3收納於裝置内加以處理。一旦 元成晶圓基板的處理，無塵箱3於收納晶圓基板之後，回 到輸送路徑1上。回到輸送路徑i上的無塵箱3與輸送路 徑1同時前進至必備的處理裝置M為止。並且，晶圓基板 上更重覆施以必要的處理，製造半導體裝置。 上述無塵箱3係將晶圓基板輸送至所須的處理裝置μ 為止，其處理裝置Μ於使用中時，與上述第丄實施例的輸 送車2相同’在緩衝璋ρ待機。 又热塵相3也可以在晶圓基板的處理中，於緩衝崞ρ 待機。 如上述無塵箱3由於在緩衝埠ρ待機，因此後續的無 塵箱3可越過待機中的無塵箱3。因此，可有效進行所需 處理·1¾•置Μ之晶圓基板的輸送或處理。 又’如第2實施例所示，輸送路徑i為皮帶式輸送機 所構成時，可將複數輸送體以一皮帶同時移動，因此可不 須各別控制輸送體。但是，皮帶式輸送機時，如沒有缓衝 埠P則不能僅使特定的無塵箱3停止在必要處。 11 本纸張尺度適《 ΐ囤國糸標準（CNS)別規格（210 X 297公楚 -! 1..1--------訂---------線 (請先閱讀背面之注咅？事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 4 442 4 3A7 ^ 442 4 9 V. Description of the invention () That is, the above control c P U is the address read out according to the clean box 3! The information of D 4 controls the above-mentioned storage means or the above-mentioned movement means. The method of manufacturing a semi-conductor device by using the manufacturing line of the second embodiment is described below. The above-mentioned dust-free box 3 can store wafer substrates, and is placed on the conveying path 丄. The side takes the address I D4 of each processing device M and moves in the direction of the arrow. Dust-free box 3-Once you come to the necessary processing device] ν [Previously, by controlling c ρ ϋ control ', dust-free box 3 can be stored in the device for processing. Once the wafer substrate is processed, the dustless box 3 returns to the transport path 1 after the wafer substrate is stored. The clean box 3 returned to the conveying path i and the conveying path 1 advance to the necessary processing device M at the same time. In addition, necessary processing is repeatedly performed on the wafer substrate to manufacture a semiconductor device. The above-mentioned dust-free box 3 is used to transport the wafer substrate to the required processing device µ. When the processing device M is in use, it is on standby at the buffer station p 'like the transport vehicle 2 of the first embodiment described above. Also, the hot dust phase 3 may wait in the buffer 崞 ρ during the processing of the wafer substrate. As described above, since the clean box 3 is waiting at the buffer port ρ, the subsequent clean box 3 can pass through the clean box 3 in standby. Therefore, it is possible to efficiently carry out the processing or processing of the wafer substrates required for processing. Also, as shown in the second embodiment, when the conveying path i is constituted by a belt conveyor, a plurality of conveying bodies can be simultaneously moved by one belt, so that it is not necessary to individually control the conveying bodies. However, in the case of a belt conveyor, if the buffer port P is not provided, the specific clean box 3 cannot be stopped only where necessary. 11 The size of this paper is suitable for "CNS" specifications (210 X 297 Gongchu-! 1..1 -------- Order --------- line (Please Read the note on the back? Matters before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 442 4 3
五、發明說明（） 為了在皮π式輸送機上停止一無塵箱3，必須停止輪 送路徑1整體。亦即，輸送路徑丄上载置複數無塵箱3時 ，會使輸送路徑1上所有的無塵.箱3同時停止。 由於上述會導致輸送效率及處理效率的惡化，但只要 設置緩衝淳P即不會有此問題。 再者，該第2實施例中，直接將無塵箱3載置於形成 輸送路徑之皮帶式輸送機上，但也可以載置輸送可辨識位 址I D 4之托架上。 ° 又，從輸送路徑1朝著緩衝埠之無塵箱3，或移動载 置無塵箱之托架的手段，同樣不僅限於上述機器人等。 如，緩衝埠P係形成與皮帶式輸送機上之同一平面時，於 上述皮帶式輸送機設置可朝著側面方向轉動之方向J^換部 ，可從該方向轉向部使無塵箱3朝著緩衝埠p移動。 但是，也可以將緩衝埠p設置在與輸送路徑：不同 平面上之點，係與第1實施例相巧。 ' 又’本發明半導體裝置之製造線也可以不含製造半 體裝置的所有步驟。例如可以僅具備形成特定層之步驟。 此時，可藉其他製造線形成者。即隨機並排處理裝; 間距式製造線，或以手動將晶圓基板搬送至處理裝 p 經濟部智慧財產局員工消费合作社印製 線組合使用。 又 ^ 【發明效果】 根據第1之發明’由於可使輸送體朝著遠離輪送 的緩衝埠上退避，因此等待特定處理裝置處倚完成之偟 體，可不致造成其他輸送體移動時的阻礙。 輸迗 又，k續之輸送體可越過緩衝埠待機中的輸送 。 '頭'，可 本纸張尺度適用中國國家標準（CNS)A.l規恪（21〇χ 297公沒 A7 4 442 4 9 五、發明說明（ 將晶圓基板輸送至所需的處理裝置，因此可有效利用處理 裝置β 根據第2之發明’尤其可以使等待處理緩慢之處理裝 置處理的輪送體退避至緩衝埠，不致在輸送路徑上形成列 子而造成其他輸送體移動時的阻礙。 根據第3之發明，由於可將輸送路徑上的複數輸送體 ，利用一皮τρ*同時移動，因而可以各別控制輸送體。 如上述，即使輸送路徑本身移動時，可以使特定的 送體退避至緩解H可—邊移動其他輸送體，僅使 特定之輸送體退避至緩衝埠，於整體的流動中僅停止 定之輸送體。因此，可不需停止輸送體，可 下進行，可提高其輸送效率者。 助狀怎 (請先閱讀背面之注意事項再填寫本頁) -If n n n - 訂· ;線_ 經濟部智^財產局員工消费合作社印製 適 度 尺 張 紙 本 I公 297 X ο ⑵ 格 -· N (c 準 標5. Description of the invention () In order to stop a dustless box 3 on a leather π conveyor, the entire rotation path 1 must be stopped. That is, when a plurality of dust-free boxes 3 are placed on the conveying path, all the dust-free boxes 3 on the conveying path 1 are stopped at the same time. Because of the above, the transportation efficiency and processing efficiency will be deteriorated, but as long as the buffer P is set, this problem will not occur. Furthermore, in the second embodiment, the dust-free box 3 is directly placed on a belt conveyor forming a conveyance path, but it may be placed on a carriage that conveys an identifiable address I D 4. ° Also, the means for moving from the conveying path 1 toward the clean box 3 of the buffer port, or moving the bracket on which the clean box is placed is not limited to the above-mentioned robots and the like. For example, when the buffer port P is formed on the same plane as the belt conveyor, the belt conveyor is provided with a direction that can be turned in the side direction, and a change part can be turned from this direction, so that the clean box 3 can be turned toward Move towards buffer port p. However, the buffer port p may be provided at a point different from the plane of the transport path: coincident with the first embodiment. Also, the manufacturing line of the semiconductor device of the present invention may not include all steps for manufacturing the half device. For example, only a step of forming a specific layer may be provided. At this time, you can borrow other manufacturing line creators. That is, a random side-by-side processing package; a pitch-type manufacturing line, or a manual conveyance of wafer substrates to a processing package. A combination of the printing lines of the employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. ^ [Inventive effect] According to the first invention, "the conveyor can be evacuated toward the buffer port away from the carousel. Therefore, the carcass waiting for the completion of the processing by the specific processing device can prevent the movement of other conveyors. . In addition, k-continued conveyors can move across the buffer port during standby. 'Head', this paper size can be applied to Chinese National Standards (CNS) Al regulations (21〇χ 297 Public A7 4 442 4 9 V. Description of the invention (Transfer wafer substrate to the required processing device, so it can be Effective use of the processing device β According to the second invention 'in particular, the carousel waiting for processing by the processing device that is slow to be processed can be retracted to the buffer port, so as not to form a line on the conveying path and cause obstacles when other conveying bodies move. According to the third According to the invention, since a plurality of conveyance bodies on the conveyance path can be simultaneously moved by one skin τρ *, the conveyance bodies can be individually controlled. As described above, even when the conveyance path itself is moved, a specific conveyance body can be retreated to a relief H Can-while moving other conveyors, only the specific conveyors are retreated to the buffer port, and only the fixed conveyors are stopped in the overall flow. Therefore, it is not necessary to stop the conveyors, and it can be carried out to improve its transport efficiency. What is the status (please read the precautions on the back before filling out this page) -If nnn-Order ·; _ Printed a moderate ruled paper by the Ministry of Economic Affairs, the Intellectual Property Bureau Staff Consumer Cooperatives I Male 297 X ο ⑵--N (c standard