TW393717B - Wafer cassette transfer system and method - Google Patents

Wafer cassette transfer system and method Download PDF

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Publication number
TW393717B
TW393717B TW087117194A TW87117194A TW393717B TW 393717 B TW393717 B TW 393717B TW 087117194 A TW087117194 A TW 087117194A TW 87117194 A TW87117194 A TW 87117194A TW 393717 B TW393717 B TW 393717B
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TW
Taiwan
Prior art keywords
process equipment
cassette
wafer
wafer cassette
scope
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Application number
TW087117194A
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Chinese (zh)
Inventor
Sang-Yong Kim
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Samsung Electronics Co Ltd
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Publication of TW393717B publication Critical patent/TW393717B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

A wafer cassette transfer system and method in which at least two robot arms are mounted to an auto guided vehicle (AGV) system and the plurality of robot arms independently execute an instruction from an AGV controller of the auto quided vehicle system, so as to thereby improve a speed at which a wafer cassette is unloaded from the AGV system to a process equipment or loaded from the process equipment to the AGV system. As a result, loading/unloading time is reduced while a productivity is enhanced.

Description

A7 B7 發明镅诚 本發明偽關於一晶圓厘傳輸条統和方法,且更特別關 於其4至少兩機械臂被安裝於一自動導向蓮輸(AGV)糸統 且該等機械臂獨立地執行來自自動導向運輸糸統之一個AGV 控制器的一指令之一晶圓匣傳輸条統和方法,以改善一晶 圓匣從AGV条統被卸下至一製程設備或從製程設備被裝載 於AGV系統的速度;結果,裝載/卸下畤間減少而産能增 加。 相鼸拮術描沭 在早期的半導體製程之自動化中,自動化主要是用於 製程設備和量測設備之操作;然而,在製程設備間的晶圓 匣傳输很少被自動化;因此,晶圓匣直接由作業員在設備 間作傳翰。 近來,隨著半導體元件變為高度積集化,來自作業員 身體的微粒顯然是半導體元件之一主要污染物;據此,在 晶圓匣傳輸条統之自動化上的研究已大幅發展。 第1圖結構地顯示一傳統晶圓匣傳输条統。 一晶圓匣傳輸糸統包含有控制整個半導體製程且其中 儲存有大量製程資料的一主機2,下載製程資料並控制來 自主機電腦2的指令之多個製程設施4,及一内部糸統5, 其藉由半導體設備通信標準(SECS)協定來與圭機2溝通並 從主機2將傳输要求倍號送至一個AGV糸統6以將對由製程 設備4之一製程完成的晶圓匣傳輸至後績製程。 在此,主機2和製程設備4藉SECS協定溝通,而AGV条 " · ·*· 1 — 丨 _____ - ,1 本紙張尺度適中囡國家椋率((、NS ) Λ4規格(210x297公釐) ---^---J----^ 木-- (¾先聞讀背面之注意事項再填寫本頁) 訂 A7 B7 4·:;;κ部ΨΛ^ί?·局负T,消於合竹私印5.+- 五、發明说明(2 ) 統6和製程設備4藉一光耦合平行I/O模組溝通;在此,用 於與AGV条統6溝通的第一感測器4a在製程設備4中形成。 A於裝載/卸下來自製程設備4的晶圓匣之AGV条統6 可藉參考第2和3圖來解說。 AGV条統6包括用於處理從主機2和内部糸統5輸入的傳 輸要求倍號的一個AGV控制器7。 AGV控制器7包含有一主要控制器8、一光耦合平行I/O (Ρ-Ι/0)模組9、一驅動控制模組10、及一機械臂控制模組 11。 主控制器8用以控制Ρ-Ι/0模組9、驅動控制模組10、 及機械臂控制模組11;用於與製程設備4溝通的第二感測 器9a被連接於Ρ-Ι/0模組9。 一控制信號從主要控制器8輸入至驅動控制模組10, 且一驅動單元被從驅動控制模組10傳輸的一控制信號所驅 動;因此,AGV条統6移至指定的製程設備4。 另外,當第一和第二感測器4a和9a藉移動AGV糸統6而 對齊以彼此連通時,機械臂控制模組U驅動機械臂12以從 AGV糸統6卸下一晶圓匣或從製程設備4將晶圓匣裝載於AGV 条統6。 使用如此傳輸条統的一傳統晶圓匣傳輸方法如下;首 先,AGV条統6之主要控制器8和製程設備4之」控制器(未 示)藉由使用SECS協定而與主機2溝通以裝載或卸下一晶 圓匣。 然後,如果主機2將一傳輸要求信號_人至内部条統5 ---:~丨-;---f装丨| (誚先閱讀背面之注意事項再填寫本頁) 訂 本紙张尺廋適州中國國家標嘩.(CNS ) Λ4規格(2】OX 297公麓) A7 B7 五、發明説明(3 ) ,則藉由在主要控制器8之驅動控制模組10中處理的一控 制信號,驅動單元12移動到被主機2指定的製程設備4。 去AGV系統S之第二感測器9a與製程設備4之第一感测 器4a對齊時,主要控制器8將一控制信號輸入至P-I/O模組 9並因此起動與製程設備4的P- I/O連通以裝載/卸下晶圓 匣。 當晶圓匣準備要裝載/卸下時,AGV糸統6和製程設備 4繼續Ρ-Ι/0溝通並裝載/卸下晶圓匣。 在此,一單一機械臂13被安裝在AGV糸統6中,且至少 兩卡匣階台(未示)在製程設備4中形成;因此,AGV条統 6以一單一機械臂12抓起一晶圓匣並將它裝載/卸下。 然而,如果一晶圓匣在一傳統AGV条統中被裝載於一 製程設備或從一製程設備卸下,一機械臂被驅動至少兩次 ;因此,一相當時間為装載/卸下晶圓匣所需,因而增加 用以製造半導體元件的整個時間期間。 太發明之概襲 因此本發明之一目的偽提供一晶圓匣傳輸糸統和方法 ,其中一自動導向運輸糸統包括有至少兩機槭臂及分別驅 動該等機械臂的機械臂驅動單元,因而改善該晶圓匣傳輸 条統之性能並減少為傳輸所需的時間期間。 為了逹成上述目的和其它利益,提供一键晶圓匣傳輸 系統,用於將晶圔匣從一製程設備傳輸至另一製程設備, 該条統包括有:一無線傳輸/接收模組,用於接收來自一 主機的多個晶圓匣傳輸要求信號並傳輸經處理的該等晶圓 :… __„ — ft ____ —- - 本紙張尺度適用中國國家標卒(rNS ) Λ4規格(2丨0X297公釐) ---;-----γ^! (請先閱讀背面之注意事項再填筠本頁) 、1Τ —. A7 B7五、發明説明(4 ) 陧傳输要求信號;一控制器,用於處理從該主機接收的該 等晶圓匣傳輸要求信號並産生多種控制信號;連接於該控 制器ώ多健機槭臂驅動單元,其驅動多個機械臂以銎應於 一控制信號同時傳输不同的晶圓匣;及一驅動單元,其具 有多艏機械臂並移動至一經指定製程設備。 較佳地,該等機械臂和機械臂驅動單元分別有至少兩 艇。 •------ 一種依據本發明的晶圓匣傳輸方法,其包含下列步驟 :接收來自一主機的多鏑晶圓匣傳輸要求信號;依據所接 收傳輸要求信號將傳輸機械臂移動至一指定的製程設備; 將在多値晶圓匣傅輸要求信號中之一晶圓匣傳输要求信號 傳輸到多個機械臂中之一並以該機械臂實施一傳输;及將 一晶圓匣傳輸要求信號傳輸至該等機槭臂之其餘者並以該 等其餘機械臂實施一傳輸。 更詳細地,該等多個機械臂同時從該晶圓匣傳輸糸統 將該晶圓厘卸下至該製程設備。 更詳細地,該等多個機械臂同時從該製程設備將該晶 圓匣裝載至該晶圓匣傳輸糸統。 選擇地,該等多個機械臂部分地從該晶圓陧傅輸条統 將該晶圓匣卸下至該製程設備,且該等機械臂之其餘者從 該製程設備將該晶圓匣裝載至該晶圓匣傳输索統。 選擇地,在接收多個晶圓匣傳輸要求信號之步驟後, 可加入一步驟,該步驟被該等控制器卡匣階台指定使得該 等多個機械臂可分別相對於在製程設備中形成的多傾卡匣 _________~------ ^紙張尺度適ifl中國國家標率(CNS ) Λ4规格(210X297公嫠) (請先間讀背面之注意事項再填寫本頁)A7 B7 Inventions The present invention relates to a wafer conveyance system and method, and more particularly to at least two robot arms which are installed in an AGV system and these robot arms execute independently. One of the instructions from an AGV controller of an automated guided transport system is a cassette transfer system and method to improve a cassette being unloaded from the AGV system to a process equipment or loaded from the process equipment to the AGV. The speed of the system; as a result, the loading / unloading time is reduced and the capacity is increased. In the early stage of semiconductor process automation, automation was mainly used for the operation of process equipment and measurement equipment; however, wafer cassette transfer between process equipment was rarely automated; therefore, wafers The box is passed directly between the equipment by the operator. Recently, as semiconductor devices become highly accumulated, particles from the operator's body are clearly one of the major pollutants of semiconductor devices; accordingly, research on the automation of wafer cassette transfer systems has developed significantly. FIG. 1 is a structural view showing a conventional cassette transfer system. A wafer cassette transfer system includes a host computer 2 that controls the entire semiconductor process and stores a large amount of process data therein, a plurality of process facilities 4 that download process data and control instructions from the host computer 2, and an internal system 5, It uses the Semiconductor Equipment Communication Standard (SECS) protocol to communicate with the machine 2 and sends the transmission request times from the host 2 to an AGV system 6 to transfer the wafer cassette completed by one of the process equipment 4 To the post-production process. Here, the host computer 2 and the process equipment 4 communicate through the SECS agreement, and the AGV article " · · * · 1 — 丨 _____-, 1 paper size is moderate 尺度 country rate ((, NS) Λ4 specifications (210x297 mm) ) --- ^ --- J ---- ^ Wood-- (¾Read the notes on the back before filling in this page) Order A7 B7 4 :: ;; κ 部 ΨΛ ^ ί? · Bureau negative T, 5. +-5. V. Invention Description (2) System 6 and process equipment 4 communicate through an optically coupled parallel I / O module; here, the first sense for communicating with AGV Article 6 The measuring device 4a is formed in the process equipment 4. The AGV system 6 for loading / unloading the wafer cassettes from the process equipment 4 can be explained by referring to Figs. 2 and 3. The AGV system 6 includes a unit for processing slaves. 2 and internal system 5 input transmission requires an AGV controller 7 with multiples. The AGV controller 7 includes a main controller 8, an optically coupled parallel I / O (P-1 / 0) module 9, and a driver. Control module 10, and a robotic arm control module 11. The main controller 8 is used to control the P-1 / 0 module 9, the drive control module 10, and the robotic arm control module 11; used for process equipment 4 Communicating the second sensor 9a is connected to the P-1 / 0 module 9. A control signal is input from the main controller 8 to the drive control module 10, and a drive unit is driven by a control signal transmitted from the drive control module 10; therefore, the AGV system 6 is moved to the designated process equipment 4 In addition, when the first and second sensors 4a and 9a are aligned to communicate with each other by moving the AGV system 6, the robot arm control module U drives the robot arm 12 to remove a wafer cassette from the AGV system 6 Or load the wafer cassette from the process equipment 4 to the AGV system 6. A conventional wafer cassette transfer method using such a transport system is as follows; first, the main controller 8 of the AGV system 6 and the controller of the process equipment 4 (Not shown) communicates with host 2 by using the SECS protocol to load or unload a wafer cassette. Then, if host 2 sends a transmission request signal _ person to internal system 5 ---: ~ 丨-;- --f pack 丨 | (诮 Please read the notes on the back before filling this page) The size of the paper is 廋 Shizhou Chinese national standard. (CNS) Λ4 specifications (2) OX 297 feet A7 B7 V. Description of the invention (3), drive by a control signal processed in the drive control module 10 of the main controller 8. Yuan 12 moves to the process equipment 4 designated by the host 2. When the second sensor 9a of the AGV system S is aligned with the first sensor 4a of the process equipment 4, the main controller 8 inputs a control signal to PI / The O module 9 is thus activated to communicate with the P-I / O of the process equipment 4 to load / unload the wafer cassette. When the wafer cassette is ready to be loaded / unloaded, the AGV system 6 and the process equipment 4 continue to P- I / 0 communicates and loads / unloads cassettes. Here, a single robot arm 13 is installed in the AGV system 6, and at least two cassette stages (not shown) are formed in the process equipment 4; therefore, the AGV system 6 uses a single robot arm 12 to pick up a Wafer cassette and load / unload it. However, if a wafer cassette is loaded into or unloaded from a process equipment in a conventional AGV system, a robotic arm is driven at least twice; therefore, a considerable time is required to load / unload wafers Cartridges are required, thus increasing the entire time period for manufacturing semiconductor components. An overview of the invention is therefore an object of the present invention to provide a wafer cassette transfer system and method. One of the automatic guided transport systems includes at least two maple arms and a robot arm drive unit that drives the robot arms, respectively. The performance of the cassette transfer system is thus improved and the time period required for transfer is reduced. In order to achieve the above objectives and other benefits, a one-click wafer cassette transfer system is provided for transferring wafer cassettes from one process equipment to another process equipment. The system includes: a wireless transmission / reception module for For receiving multiple cassette transmission request signals from a host and transmitting the processed wafers:… __ „— ft ____ —--This paper size applies to the Chinese National Standard (rNS) Λ4 specification (2 丨 0X297 (Mm) ---; ----- γ ^! (Please read the notes on the back before filling this page), 1T —. A7 B7 V. Description of the invention (4) 陧 Transmission request signal; a control Controller for processing the wafer cassette transmission request signals received from the host and generating various control signals; connected to the controller's multi-machine maple arm drive unit, which drives multiple mechanical arms to respond to a control Signals are transmitted to different wafer cassettes at the same time; and a drive unit with multiple robot arms and moved to a designated process equipment. Preferably, these robot arms and robot arm drive units each have at least two boats.- ----- A cassette transfer according to the present invention The method includes the following steps: receiving a multi-box wafer cassette transmission request signal from a host; moving a transfer robotic arm to a designated process equipment according to the received transmission request signal; and transmitting the multi-box wafer cassette request signal One of the cassette transmission request signals is transmitted to one of the plurality of robotic arms and a transmission is performed by the robot arm; and one cassette transmission request signal is transmitted to the remaining ones of the machine arm The remaining robotic arms implement a transfer. In more detail, the multiple robotic arms simultaneously unload the wafer from the wafer cassette transfer system to the process equipment. In more detail, the multiple robotic arms At the same time, the wafer cassette is loaded from the process equipment to the wafer cassette transfer system. Optionally, the plurality of robotic arms are partially unloaded from the wafer cassette into the wafer cassette to the process Equipment, and the rest of the robotic arms load the cassette from the process equipment to the cassette transmission line. Alternatively, after receiving multiple cassette transmission request signals, a Step, which step is controlled by those The designation of the cassette stage enables the multiple robot arms to be compared with the multi-tilt cassettes formed in the process equipment. _________ ~ ------ ^ Paper size is suitable ifl China National Standard (CNS) Λ4 specifications (210X297 public address) (Please read the precautions on the back before filling in this page)

、1T A7 B7 五、發明説明(5 ) 階台且該晶圓匣可裝載於該卡匣階台或從其上卸下。 較佳地,製程設備判定晶圓匣是否被裝載在該等多値 卡匣^台中的正確位置;如果該晶圓匣被裝載在一不正確 位置,則製程設備操作一個連鎖並顯示一錯誤訊息。 更詳細地,如果該晶圓匣被判定為裝載在一正確位置 ,則該製程設備將一晶圓匣裝載/卸下要求信號傳輸至該 控制器。 較佳地,該控制器將一傳输通知信號傳输至該製程設 備以通知該等多値晶圓匣要被裝載/卸下。 更詳細地,該製程設備將一裝載/卸下備妥信號傳輸 至該控制器以通知該等多艢晶圓匣己備妥要被裝載/卸下。 較佳地,該製程設備將一晶圓匣裝載/卸下完成信號 傳輸至該控制器。 圖忒簡屋描沭 本發明之上述目的和其它利益將藉由參考於伴随圖式 詳細描述其之較佳實施例而變得更清楚,其中: 第1圖説明一傳統晶圓匝傳输条統; 第2圔更詳細説明一傳統晶圓匣傳輸条統; 第3圖偽一製程設備和一個AGV糸統之一透視圖; 第4圔説明依據本發明的一晶圓匣傳輸条統; 第5圖說明依據本發明安裝有多個機械#的一傾AGV 条統; 第6圖更詳細說明在第4圔中所示的AGV糸統; 第7圖偽說明依據本發明使用一晶圓匣傳輸糸統的一 本紙張尺度適川中國國家標準((、NS ) Λ4规格(210X297公漦) ---;-I^——Λ.% —— (誚先閱讀背面之注意事項再填寫本頁) 訂 A7 B7_五、發明説明(S ) 傳輸方法之一流程圖;及 第8圖説明依據本發明的一傳輸方法之晶圓匣裝載/ 卸下4序。 較徉窗旃例夕註細描沭 本發明現在將藉參考伴随圖式被更充分描逑於後,圖 式顯示本發明之較佳實施例;然而,本發明可以許多不同 形式來實施並不應被構成為限制在此提出的實施例;而是 ,這些賁施例被提供以使本掲露完全和完整,並充分將本 發明之範躊傳输於熟知該技術者。 本發明之一晶圓匣傳輸条統包括有控制整锢I半導體製 程且其中儲存有大量製程相關資料的一主機110 ,下載製 程資料並控制來自該主機的指令並實施一半導髏製程之多 個製程設備120,及一内部糸統140,及將從由主機110的 製程設備輸入的一晶圓匣相關信號所處理的一傳輸要求信 號送到一個AGV条統130。 另外,該晶圓匣傳輸糸統包括有至少兩値機械臂及經 由内部条統140接收來自主機no的一傳輸要求信號並將一 完整晶圓匣從一製程設備120傳輸到另一製程設備120的AGV 条統130。 當製程設備12 0將下載來自主機110的一傳輸要求信號 ,或將一傳輸狀態回報於該主機時,或當内鉍糸统14〇將 遞送從主機傳输的傳輸要求信號時,在主機11()和製程設 備120,及主機110和内部条統14〇間藉由SECS協定實施通 信。 石紙張尺度適別中國國家標率(CNS ) Λ4規格(210χ]97公釐_)9_ ---*---^----^ 衣------訂------^ ^ (請先閱讀背面之注意事項再填寫本頁) A7 B7 五、發明説明(7 ) ---:·--^---、装— (讀先閱讀背面之注意事項再填寫本頁) 在此,AGV糸統130透過主機110、内部糸統140、及該 AGV糸統130來獲得如至/從一晶圓匣要被裝載/卸下的製 程設4之位置、晶圓匣之數目、及晶圓匣識別等資訊。 當要被傳送至AGV糸統130的晶圓匣之詳細傅輸資訊被 内部条統14 0輸入時,AGV条統130移動至被主機110指定的 製程設備120,並嘗試與製程設備120作Ρ-Ι/0連通。 為了在AGV糸統13 0和製程設備120間實施Ρ-Ι/0連通, 需要第一感測器142在製程設備12Q之一預定部分中形成, 而第二威测器122在面對製程設備120的AGV条統130之部分 中形成。 在此,一感測器單元14 1包含第一和第二感測器142和 122;感測器單元141之數目偽與機械臂之者相同使得晶圓 匣可獨立地被AGV条統130和製程設備12 0所傳輸。 AGV条統130可藉參考第5和6圖被更詳細解説。 AGV糸統130包括有一値AGV控制器單元131、用於藉用 AGV控制器131來驅動該AGV条統的一驅動單元137、及安裝 在AGV系統130中的多個機械臂138和139。 更詳細地,AGV控制器單元131包括有一主要控制器134 、連接於主要控制器134的一個P-I/G模組132、及多個機 械臂控制模組135和136;在本發明之一實施例中使用兩個 機械臂驅動模組。 ~ 更詳細地,無線地從内部条統140输入至主控制器134 的主機110之傳輸要求信號在主控制器134中被處理;主控 制器134電氣地連接於驅動單元137,其又電氣地連接於驅 _____________—ΙΟ—_ ^紙張尺度適州中國國家標埤(('NS > Λ4規格(210X297公f ) 經嬈部屮次掠淖灼員-T-;i,i资合竹社印9-'!冬 A7 ____B7五、發明説明(8 ) 動控制模組133使得AGV糸統13G可移動到設有相對晶圓匣 的製程設備120。 負外,至少兩個機械臂控制模組135和136被連接於主 控制器134,且機械臂138和139分別連接於機械臂控制模 組135和136;因此,機械臂138和139被主控制器134控制 而獨立地操作。 請參考第5圔,機械臂138和139包含圓柱狀旋轉連榫 、被鉸鏈連接於該等圓柱狀旋轉連桿且被彎成預定角度的 連接連桿、被鉸鍵連接於該等連接連桿且驅動一抓取器以 抓取晶圓匣的驅動連桿、及被凸緣連接於驅動連捍之端點 部分的抓取器。 用於以其中安裝有多個機械臂138和139的一個AGV糸 統來傳輸晶圓匣之方法可藉參考第7和8圖來解説。 作為一實施例,從製程設備120之一卡匣階台(未示 )將一晶圓匝裝載於AGV系統130的一程序將被解説。 作為一實施例,兩晶圓匣從製程設備120之兩卡匣階 台被裝載於AGV条統130 ;較佳地,至少兩機械臂接收獨立 信號並實施工作,且先完成的機械臂可先賁施另一新工作。 請參考第7圖和第8圔之A與B,製程設備120進行至 一卡匣階台裝載多Η已完成晶圓之晶圓匣,並以SECS協定 回報主機110要被傳輸的晶圓匣已發生。 ' 然後,主機110將關於要被傳輸的晶圓匝之傳輸資訊 輸入到内部条統140 ;如在第7圔之步驟10中所示,内部 糸統140無線地將用於將晶圓匣傳輸至後鑛程序將被實施 ___________-41-_ 本紙張尺度適用中囷國家標續(CNS ) Λ4规格(210X29*7公釐) ---‘---^----(--- (請先閲讀背面之注意事項再填寫本頁)1T A7 B7 5. Description of the invention (5) Stage and the cassette can be loaded on or unloaded from the cassette stage. Preferably, the process equipment determines whether the wafer cassette is loaded in the correct position in the multiple cassettes; if the wafer cassette is loaded in an incorrect position, the process equipment operates a chain and displays an error message . In more detail, if the wafer cassette is determined to be loaded in a correct position, the process equipment transmits a wafer cassette loading / unloading request signal to the controller. Preferably, the controller transmits a transmission notification signal to the process equipment to notify the multiple wafer cassettes to be loaded / unloaded. In more detail, the process equipment transmits a loading / unloading ready signal to the controller to notify the multiple wafer cassettes that they are ready to be loaded / unloaded. Preferably, the process equipment transmits a wafer cassette loading / unloading completion signal to the controller. The above objects and other benefits of the present invention will be made clearer by referring to the accompanying drawings to describe the preferred embodiments in detail, in which: Figure 1 illustrates a conventional wafer turn transfer bar Figure 2 illustrates a conventional cassette transfer system in more detail; Figure 3 is a perspective view of a process equipment and an AGV system; Figure 4 illustrates a cassette transfer system according to the present invention; Fig. 5 illustrates a tilted AGV system with a plurality of mechanical devices installed according to the present invention; Fig. 6 illustrates the AGV system shown in Fig. 4 in more detail; Fig. 7 illustrates the use of a wafer according to the present invention. A paper size of the cassette transmission system is suitable for the Chinese national standard ((, NS) Λ4 specification (210X297) 漦 ---; -I ^ —— Λ.% —— (诮 Please read the notes on the back before filling (This page) Order A7 B7_ V. A flowchart of the invention's (S) transfer method; and Figure 8 illustrates the loading / unloading sequence of a wafer cassette according to a transfer method of the present invention. 4 steps. Note that the invention will now be described more fully with reference to the accompanying drawings, which show the invention The preferred embodiments of the invention; however, the invention may be embodied in many different forms and should not be construed as limiting the embodiments set forth herein; rather, these embodiments are provided to make this disclosure complete and complete, and adequate The method of the present invention is transmitted to those skilled in the art. A wafer cassette transfer system of the present invention includes a host 110 that controls the entire semiconductor process and stores a large amount of process-related data therein, downloads process data and controls A plurality of process equipment 120, an internal system 140, and a transmission request signal processed from a cassette-related signal input from the process equipment of the host 110 are sent from the host to implement a half-guide process. To an AGV system 130. In addition, the wafer cassette transmission system includes at least two robot arms and receives a transmission request signal from the host no via the internal system 140 and sends a complete wafer cassette from a process equipment 120 AGV system 130 transmitted to another process device 120. When the process device 120 will download a transmission request signal from the host 110, or report a transmission status to the host, or when When the bismuth system 14 will transmit the transmission request signal transmitted from the host, the host 11 () and the process equipment 120, and the host 110 and the internal system 140 will implement communication through the SECS protocol. The paper size is suitable for China National standard rate (CNS) Λ4 specification (210χ) 97 mm_) 9_ --- * --- ^ ---- ^ clothing ------ order ------ ^ ^ (Please read first Note on the back, please fill out this page) A7 B7 V. Description of the invention (7) ---: ·-^ ---, install— (Read the notes on the back before filling out this page) Here, AGVAG The system 130 obtains, for example, the position of the process setting 4 from / to a wafer cassette to be loaded / unloaded, the number of wafer cassettes, and the wafer cassette through the host 110, the internal system 140, and the AGV system 130. Identification and other information. When the detailed information of the wafer cassette to be transmitted to the AGV system 130 is input by the internal system 140, the AGV system 130 moves to the process equipment 120 designated by the host 110, and attempts to make a process with the process equipment 120. -I / 0 connectivity. In order to implement P-1 / 0 communication between the AGV system 130 and the process equipment 120, the first sensor 142 is required to be formed in a predetermined part of the process equipment 12Q, and the second sensor 122 is faced to the process equipment 120 of the AGV system 130 is formed. Here, a sensor unit 141 includes first and second sensors 142 and 122; the number of the sensor units 141 is the same as that of the robot arm, so that the wafer cassette can be independently controlled by the AGV system 130 and Process equipment 120 transmission. The AGV system 130 can be explained in more detail with reference to FIGS. 5 and 6. The AGV system 130 includes an AGV controller unit 131, a driving unit 137 for driving the AGV system by borrowing the AGV controller 131, and a plurality of robot arms 138 and 139 installed in the AGV system 130. In more detail, the AGV controller unit 131 includes a main controller 134, a PI / G module 132 connected to the main controller 134, and a plurality of robotic arm control modules 135 and 136; in an embodiment of the present invention Two robotic arm drive modules are used. ~ In more detail, the transmission request signal wirelessly input from the internal system 140 to the host 110 of the main controller 134 is processed in the main controller 134; the main controller 134 is electrically connected to the drive unit 137, which in turn is electrically Connected to the drive _____________ —ΙΟ—_ ^ Paper size Shizhou China National Standard (('NS > Λ4 size (210X297 male f) Warp-crasher-T-; i, i Zihezhu Press 9- '! Winter A7 __B7 V. Description of the Invention (8) The motion control module 133 enables the AGV system 13G to be moved to the processing equipment 120 equipped with the opposite wafer box. Outside the negative, at least two robotic arms control the mold. The groups 135 and 136 are connected to the main controller 134, and the robot arms 138 and 139 are connected to the robot control modules 135 and 136, respectively; therefore, the robot arms 138 and 139 are controlled by the main controller 134 to operate independently. Please refer to In the fifth stage, the robotic arms 138 and 139 include cylindrical rotary joints, hinged connecting links connected to the cylindrical rotary links and bent to a predetermined angle, hinged to the connecting links, and driven. A gripper for gripping a drive link of a wafer cassette, and a flange connected to the drive The gripper at the end portion of the defender. The method for transferring a wafer cassette in an AGV system with a plurality of robot arms 138 and 139 installed therein can be explained by referring to FIGS. 7 and 8. As an embodiment A procedure for loading a wafer turn into the AGV system 130 from one cassette stage (not shown) of the process equipment 120 will be explained. As an example, two wafer cassettes from the two cassette stages of the process equipment 120 The stage is loaded on the AGV system 130; preferably, at least two robotic arms receive independent signals and perform work, and the robotic arm completed first can perform another new job first. Please refer to Figure 7 and Figure 8A With B, the process equipment 120 proceeds to a cassette stage to load multiple completed wafer cassettes, and reports the occurrence of the cassette to be transferred by the host 110 with the SECS agreement. Then, the host 110 will The transfer information of the transferred wafer turns is input to the internal system 140; as shown in step 10 of step 7), the internal system 140 will wirelessly transfer the wafer cassette to the post-mine process. __________- 41-_ This paper size is applicable to the China National Standard Renewal (CNS) Λ4 specification (210X29 * 7) Li) ---‘--- ^ ---- (--- (Please read the notes on the back before filling this page)

、1T :¾¾-部十*樣卑^’k T,消灼合竹社印ft'i'f' A7 B7五、發明説明(9 ) 的製程設備之傳輸要求信號傳輸到AGV条統130之主控制器 134 ,及包括晶圓匣將被傳至的製程設備之位置資訊的各 種資“。 主機110之傅輸要求信號被主控制器134處理,其然後 將一控制信號施用於驅動控制模組133 ;因此,如在第7 圖之步驟20中所示,AGV条統130被驅動單元13?移動至置 有晶圓匣的指定製程設備。 然後,當製程設備120之第二感測器122和AGV糸統130 之第一戲測器142對齊時,主控制器134依序將信號施於連 接至Ρ-Ι/0模組132的多傾感測器單元141 ,因而如在第7 圖之步驟30中所示,起動與製程設備120的連通。 然後,如在第7圖之步驟40中所示,主控制器134將 其中晶圓匣以機槭臂138和139來傳輸而設置的卡匣階台之 數目傳輸至製程設備120。 更詳細地,主控制器134經由P-I/O棋組132和感測器 單元141將用於指定從其中要被AGV条統130之機械臂13 8裝 載的晶圓匣被釋放的一卡匣階台之一高信號CS_no 1傅輸至 製程設備。 另外,代表高信號CS_nol有效的一高有效倍號VALID1 被傳輸至製程設備120,以因而指定機械臂138將被裝載其 内的一卡g階台。 < 接著,為了指定從其中要被機械臂139裝載的晶圓匣 將被釋放的一卡匣階台,另一高信號CS_no2和有效信號VA LID2藉用P-I/O模組132和感测器單元141而傳输至製程設 ----------------=4 2------- 本紙張尺度適中國國家標準(C:NS〉Λ4規格(2丨0X297公f ) -------^----装— (誚先閲讀背面之注意事項再填寫本頁) 訂 A7 _______________ B7__ Λ '發明説明(10 ) 備 120。 當用於指定卡匣階台的信號CS_nol、CS_no2、VALID1 開、^UD2開都被輸入至製程設備120時,製程設備120打 開一卡匣入/出門(未示)以釋放晶圓匣,其中所有程序 都在指定卡匣階台完成;然後,藉用安裝於製程設備120 的機械臂(未示)晶画匣被釋放至相對的卡匣階台。 當晶圓匣被釋放至卡匣階铃時,如在第7圖之步驟50 中所示,製程設備120藉用一感测器128來感測該晶圓匣是 否被正確釋放,以因而判定在晶圓匣定位上的失敗。 如果晶圓匣被不正確地釋放至卡匣階台,如在第7圖 之步驟53中所示,一連鎖被操作以防止進一步傳輸程序且 如在第7圖之步驟56中所示,一錯誤訊息被同時顯示。 如果晶圓匣被正確釋放,則製程設備120將用於將釋 放至階台的晶圓匣卸下至AGV条統130的一高卸下要求信號 UP_REQ1傳輸至主控制器134。 當傳輸完成時,如在第7圖之步驟S0中所示,製程設 備120將另一高卸下要求信號UP_REQ2傳輸至主控制器134。 當高卸下要求倍號Up_REQl和Up_REQ2從製程設備120 被輸入至主控制器134時,主控制器134將用於將不可卸下 晶圓匣傳輸至AGV条統130的一高傳輸通知信號TR_INF1傳 輸至製程設備120 ;如在第7圖之步驟70中辦示,當如此 傳輸完成時,主控制器134將另一高傳輸通知信號TR_INF2 傳輸至製程設備120。 當高傳輸通知信號TR_INF1和TR_INF2從AGV糸統130之 —---------- -----"13 ------—- 本紙張尺度遶州中國國家棉準(CNS〉Λ4規格(210X 297公麓〉 ---一--^---《:浓-- (請先閱讀背面之注意事項再填寫本頁) --0 A7 ____^_B7_ 五、發明説明(u )、 1T: ¾¾-Minimum 10 * ^ 'k T, scorching and printing of the bamboo society ft'i'f' A7 B7 V. Invention description (9) The transmission of the process equipment requires the signal to be transmitted to the AGV system 130 The main controller 134 and various information including the position information of the process equipment to which the wafer cassette will be transmitted. The host 110's input request signal is processed by the main controller 134, which then applies a control signal to the drive control module. Group 133; therefore, as shown in step 20 of FIG. 7, the AGV system 130 is moved by the drive unit 13 to the designated process equipment in which the cassette is placed. Then, as the second sensor of the process equipment 120, When 122 is aligned with the first camera 142 of the AGV system 130, the main controller 134 sequentially applies signals to the multi-tilt sensor unit 141 connected to the P-1 / 0 module 132. As shown in step 30 of the figure, communication with the process equipment 120 is initiated. Then, as shown in step 40 of FIG. 7, the main controller 134 sets the wafer cassettes to be transported by the maple arms 138 and 139. The number of cassette stages is transmitted to the process equipment 120. In more detail, the main controller 134 via the PI / O chess set 132 and the sensor unit 14 1 High signal CS_no 1 is used to designate one of the cassette stages from which a wafer cassette to be loaded by the robot arm 13 8 of the AGV system 130 is released to the process equipment. In addition, the high signal CS_nol is valid. A high effective number VALID1 is transferred to the process equipment 120 to thereby specify a card g stage in which the robot arm 138 will be loaded. ≪ Next, in order to specify the wafer cassette from which the robot arm 139 is to be loaded One cassette stage to be released, another high signal CS_no2 and effective signal VA LID2 are transmitted to the process equipment by using the PI / O module 132 and the sensor unit 141 ------------ ------ = 4 2 ------- This paper is in accordance with Chinese national standard (C: NS> Λ4 specification (2 丨 0X297 male f) ------- ^ ---- install — (诮 Please read the notes on the back before filling in this page) Order A7 _______________ B7__ Λ 'Invention (10) Reserve 120. When the signals CS_nol, CS_no2, VALID1 ON and ^ UD2 ON are used to specify the cassette stage When inputting to the process equipment 120, the process equipment 120 opens a cassette entry / exit (not shown) to release the wafer cassette, wherein all procedures are completed at the designated cassette stage; then The picture cassette borrowed from the robotic arm (not shown) installed in the process equipment 120 is released to the opposite cassette stage. When the wafer cassette is released to the cassette stage, as shown in step 50 of FIG. 7 It is shown that the process equipment 120 utilizes a sensor 128 to detect whether the wafer cassette is correctly released, so as to determine the failure of the wafer cassette positioning. If the cassette is incorrectly released to the cassette stage, as shown in step 53 of FIG. 7, a chain is operated to prevent further transfer procedures and as shown in step 56 of FIG. 7, a Error messages are displayed at the same time. If the wafer cassette is properly released, the process equipment 120 transmits a high unloading request signal UP_REQ1 for unloading the wafer cassette released to the stage to the AGV system 130 to the main controller 134. When the transmission is completed, as shown in step S0 in FIG. 7, the process equipment 120 transmits another high unload request signal UP_REQ2 to the main controller 134. When the high unloading request times Up_REQl and Up_REQ2 are input from the process device 120 to the main controller 134, the main controller 134 will use a high transmission notification signal TR_INF1 to transfer the non-removable wafer cassette to the AGV system 130. Transmission to process equipment 120; as shown in step 70 of FIG. 7, when such transmission is completed, the main controller 134 transmits another high transmission notification signal TR_INF2 to the process equipment 120. When the high transmission notification signals TR_INF1 and TR_INF2 are from the AGV system 130 ------------ ----- " 13 --------- this paper scales around the state China National Cotton Standard (CNS> Λ4 specification (210X 297 male feet) ----------------: thick-(Please read the precautions on the back before filling out this page) --0 A7 ____ ^ _ B7_ 5. Description of the invention (U)

主控制器132輸入時,製程設備120將一高卸下備妥信號RE ADY1傳輸至主控制器134 ;當如此傳輸完成時,如在第7When the main controller 132 is input, the process equipment 120 transmits a high unloading ready signal RE ADY1 to the main controller 134; when the transmission is completed, as in the seventh

'I 圖之步驟δΟ中所示,製程設備120傳輸另~卸下備妥信號 READY2。 當卸下備妥信號READY 1和READY 2從製程設備120輸入 時,主控制器134判定製程設備120己備妥卸下晶圓匣。 然後,一控制信號被施於機械臂控制模組135和136, 其然後將該控制信號施於機械臂138和139 ,如在第7圖之 步驟90中所示,以因而起動裝載該晶圓匣。 與晶圓匣之裝載同時地,主控制器134將一高忙碌信 號BUSY1傳輸至製程設備120,用以表示機械臂138和139正 在操作;當傳輸完成時,如在第7圖之步驟80中所示,主 控制器134將另一忙碌信號傳輸至製程設備120。 當晶圓匣從製程設備120被裝載至AGV条統130時,如 在第7圖之步驟100中所示,主控制器134將一裝載完成信 號C0M_1傳輸至製程設備120並接著傳輸另一裝載完成信號 C0H_2〇 同時,第8圖之A和C、或B和C的信號組合代表安裝於 AGV条統130的兩機械臂之機械臂138從製程設備120將晶圓 匣裝載至AGV系統130,而機械臂139從AGV系統130將晶圓 匣卸下至製程設備120。 、 第8圖之A和C的組合將被解說為一簧施例。 首先,晶圓匣藉用主機110而從製程設備12〇被裝載至 AGV条統130;然後,AGV条統130將晶圓匣卸下至後績製程 :____________- 本紙張尺度適用中國囷家標率(rNS > Λ4规格(210X297公f > (請先聞讀背面之注意事項再填寫本頁) 裝·As shown in step δ0 in the figure, the process equipment 120 transmits another ~ unloading the ready signal READY2. When the readiness ready signals READY 1 and READY 2 are input from the process equipment 120, the main controller 134 determines that the process equipment 120 is ready to remove the wafer cassette. Then, a control signal is applied to the robotic arm control modules 135 and 136, which then applies the control signal to the robotic arms 138 and 139, as shown in step 90 of FIG. 7, to thereby start loading the wafer. cassette. Simultaneously with the loading of the wafer cassette, the main controller 134 transmits a high busy signal BUSY1 to the process equipment 120 to indicate that the robot arms 138 and 139 are operating; when the transfer is completed, as in step 80 in FIG. 7 As shown, the main controller 134 transmits another busy signal to the process device 120. When the wafer cassette is loaded from the processing equipment 120 to the AGV system 130, as shown in step 100 of FIG. 7, the main controller 134 transmits a loading completion signal COM_1 to the processing equipment 120 and then transfers another loading Completion signal C0H_2〇 At the same time, the signal combination of A and C, or B and C of FIG. 8 represents the robot arm 138 of the two robot arms mounted on the AGV system 130, loading the wafer cassette from the process equipment 120 to the AGV system 130, The robot arm 139 unloads the wafer cassette from the AGV system 130 to the process equipment 120. The combination of A and C in Fig. 8 will be explained as a spring embodiment. First, the wafer cassette borrows the host 110 and is loaded from the process equipment 120 to the AGV system 130; then, the AGV system 130 unloads the wafer cassette to the subsequent process: ____________- This paper standard is applicable to the Chinese family standard Rate (rNS > Λ4 specifications (210X297 male f > (Please read the precautions on the back before filling out this page))

*1T A7 B7五、發明説明(12 ) 設備;此時,將程序已完成的晶圔匣傳輸至另一後缅製程 設備的一要求信號藉由無線通信而從該後續製程設備输人 至Αί^条統130 ;然後.AGV条統130藉用從主機110輸人的 傳輸要求信號而移動至經指定製程設備。 然後,主控制器134將高信號CS_nol、CS_no3、VALID1 、及VALID3傳輸至製程設備120 ,用以經由P-Ι/Ο模組132 來指定製程設備120之卡匣階台。 如此信號被輸入其中的製程設備120打開所有卡匣入 /出門124和126並將完成晶圓匣釋放至該階台。 製程設備120藉用感测器128來感测晶圓匣是否存在卡 匣階台中;依據如此感測之結果,製程設備120將表示可 被卸下至卡匣階台的晶圓匝已備妥之一高卸下要求信號Up _REQ1傳輸至主控制器134。 另外,製程設備120將表示可被裝載至另一卡匣階台 的晶圓匣己放空之一高裝載要求信號1〇_1^£|3傳輸至主控 制器134。 接著,主控制器134將傳輸通知信號TR_INF傅輸至製 程設備120,用以將放置在卡匣階台的晶圓匣裝載至AGV糸 統130,並也將一痼TR_IMF3傳輸至製程設備120 ,用以將 裝載在AGV条統130中的晶圓匣卸下至另一卡匣階台。 當傳輸通知信號1ER_INF1和TR_INF3從主撻制器134傳 輸時,製程設備120確認晶圓匣之裝載/卸下狀態,並將 高卸下備妥倍號READY1傳輸至主控制器134。 然後,製程設備120傳输代表製程設備120已備妥要從 ----- ------i_5 ___-—— 本紙张尺度適用中國國家標净.< (、NS ) Λ4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 本紙张尺度適州中W國家標率(C'NS ) Λ4規格(2丨0X297公t ) A7 B7 五、發明説明(13) 主控制器134卸下晶圓匣的一裝載備妥信號READY3。 然後,主控制器134將驅動信號施於機械臂138和139。 i控制器134然後將表示機械臂138和139正在操作的 忙碌信號BUSYl和BUSY3傳輸至製程設備。 當裝載/卸下被機械臂138和139完成時,製程設備120 將表示晶圓匣之裝載/卸下已完成的完成信號COM_l和COM _3傳輸至主控制器134。 然後,主控制器134將所有高倍號轉換為低者並持鑕 至後績程序。* 1T A7 B7 V. Description of the invention (12) equipment; At this time, a request signal for transmitting the completed cassette to another post-Burma process equipment is input from the subsequent process equipment to Αί by wireless communication ^ Article 130; then. AGV Article 130 borrows the transmission request signal input from the host 110 to move to the designated process equipment. Then, the main controller 134 transmits the high signals CS_nol, CS_no3, VALID1, and VALID3 to the process equipment 120 for specifying the cassette stage of the process equipment 120 via the P-I / O module 132. The process equipment 120 into which such a signal is inputted opens all the cassette entry / exit doors 124 and 126 and releases the completed wafer cassette to the stage. The process equipment 120 uses the sensor 128 to sense whether the wafer cassette is present in the cassette stage; based on the result of such sensing, the process equipment 120 will indicate that the wafer turns that can be unloaded to the cassette stage are ready One high-removal request signal Up_REQ1 is transmitted to the main controller 134. In addition, the process equipment 120 transmits a high loading request signal 10_1 ^ || 3 to the main controller 134, which indicates that a wafer cassette that can be loaded to another cassette stage has been emptied. Next, the main controller 134 transmits the transmission notification signal TR_INF to the process equipment 120, which is used to load the wafer cassette placed on the cassette stage to the AGV system 130, and also transmits a TR_IMF3 to the process equipment 120. It is used to unload the wafer cassette loaded in the AGV strip 130 to another cassette stage. When the transmission notification signals 1ER_INF1 and TR_INF3 are transmitted from the main tart maker 134, the process equipment 120 confirms the loading / unloading state of the wafer cassette, and transmits the high unloading ready number READY1 to the main controller 134. Then, the process equipment 120 transmission represents that the process equipment 120 is ready to be processed from ---------------- i_5 ___----- This paper size is applicable to China National Standards. ≪ (, NS) Λ4 specifications ( 210X297 mm) (Please read the notes on the back before filling out this page) The size of the paper is W state standard (C'NS) Λ4 specification (2 丨 0X297 mm t) A7 B7 V. Description of the invention (13 ) The main controller 134 unloads a wafer ready signal READY3. Then, the main controller 134 applies driving signals to the robot arms 138 and 139. The i controller 134 then transmits busy signals BUSY1 and BUSY3 indicating that the robot arms 138 and 139 are operating to the process equipment. When loading / unloading is completed by the robotic arms 138 and 139, the process equipment 120 transmits completion signals COM_1 and COM_3 indicating that the loading / unloading of the wafer cassette has been completed to the main controller 134. Then, the main controller 134 converts all the high magnification numbers to the lower one and holds it to the subsequent performance program.

如上所述,至少兩具機械臂被安裝在AGV条統中;該 等機械臂將晶圓匣從製程設備裝載至AGV条統,從AGV条統 將至少兩個晶圓匣卸下至製程設備,或同時地實施裝載和 卸下;結果,晶圓匣裝載/卸下時間期間可被減小而AGV 条統之性能被加強。 本發明藉參考前述實施例而被描逑於上;然而顯然的 ,在前面描述之啓發上對熟知該技術者許多變換修正和變 化將是清楚的;據此,本發明包括落於所附申請專例範圍 之精神和範晴内的所有這些變換修正和變化。 元件樺號對照弄 2、110主機 5、140内部条統 4、120製程設備 7、131 AGV控制_ δ、130 AGV (自動導向蓮輸)条統 4a、142第一感測器 8、134主控制器 9、132光耦合平行Ι/0(Ρ-Ι/0)模組 _____=44---- ---,——τ---f衮—— (諳先閲讀背面之注意事項再填寫本頁)As mentioned above, at least two robot arms are installed in the AGV system; these robot arms load wafer cassettes from the process equipment to the AGV system, and unload at least two wafer cassettes from the AGV system to the process equipment , Or load and unload simultaneously; as a result, the cassette loading / unloading time can be reduced and the performance of the AGV system can be enhanced. The present invention has been described above with reference to the foregoing embodiments; however, it is clear that many modifications and changes will be apparent to those skilled in the art in light of the foregoing description; accordingly, the present invention includes the following applications: The spirit of the scope of the special case and all these changes within Fan Qing are amended and changed. Component number, control unit 2, 110 host 5, 140 internal system 4, 120 process equipment 7, 131 AGV control _ δ, 130 AGV (automatically guided) system 4a, 142 first sensor 8, 134 main Controller 9, 132 optically coupled parallel I / 0 (P-I / 0) module _____ = 44 ---- ---, --τ --- f 衮 —— (谙 Please read the precautions on the back first (Fill in this page again)

•1T A7 B7 五、發明説明(14 ) 11、 135、136機械臂控制模組 12、 137驅動單元 10、133驅動控制模組 9a、!22第二感測器 141感测器單元 13、 138、139機械臂 124、126卡匣人/出門 S10、 S20、 S30、 S40、 S50、 S53、 S56、 S60、 S70、 S80 、S90、S100、S110 步驟 _ ^ ^束 訂 ^ (諳先閱讀背面之注意事項再填寫本頁) ":'':;;"外小少^準-"只二消贽合作社印纪 本纸張尺度適用中國國家標準(CNS ) Λ4規格(210 X 297公釐11 7 -• 1T A7 B7 V. Description of the invention (14) 11, 135, 136 Manipulator control module 12, 137 drive unit 10, 133 drive control module 9a,! 22 Second sensor 141 Sensor unit 13, 138 , 139 Robot Arm 124, 126 Cassette Man / Go Out S10, S20, S30, S40, S50, S53, S56, S60, S70, S80, S90, S100, S110 Steps _ ^ 束 定 ^ (谙 Read the first (Please fill in this page again for more details) ":'':;; " Foreigner and Younger ^ Standard- " Only Erxiao Cooperative Cooperative Press India Paper Size Applicable to Chinese National Standard (CNS) Λ4 Specification (210 X 297) 11 11-

Claims (1)

經濟部中央橾準局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍 1. 一種晶圓匣傳输条統,用於將晶圓匣從一製程設備傳输 至另一製程設備,該系统包含有: 一無線傳输/接收模組,用於接收來自一主機的多 橱晶圓匣傳輸要求信號並傳輸經處理的傳输要求信號; 一控制器,用於處理從該無線傳輸/接收模組接收 的該等晶圓匣傳输要求信號並産生多楢不同控制信號; _接於該控制器的多個機械臂驅動單元,使得多個 機械臂可響應於該等控制信號同時傳输不同的該等晶圓 匣;及 隨該等1 掴機械贊安裝的一繮展單元,其移動至由 該主機指定的該另一製程設備。 2. 依據申請專利範圍第1項之条統,其中該等機械臂有至 少兩個。 3. 依據申請專利範圍第2項之糸統,其中該等機槭臂驅動 單元有至少兩値。 4. 一種用於傳輸晶圓匣的方法,其包含下列步驟: 接收來自一主機的多掴晶圓匣傳輸要求信號; 依據所接收的該等晶圓匣傳輸要求信號將一傳輸機 械臂移動至一指定製程設備; 將該等多個晶圓匣傳輸要求信號中之一傅輸到該等 多個機械臂中之一,及將晶圓匣傳輸要求信號傳輸未有 至該晶圓匣傳輸要求信號被傳輸到來的該等多個機械臂 中之其餘者,並分別由該一機械臂和由該等其餘機械甯 實施傳输。 W-— 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 恭· 訂 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍 5. 依據申謓專利範圍第4項之方法,其中在實施傳输的該 步驟中,該等多個機械臂同時從一晶圓匣傳輸装置將等 該晶圓匣卸下至該指定製程設備。 6. 依據申_専利範圍第4項之方法,其中在實施傳輸的該 步驟中,該等多艏機械臂同時從該晶圓匣傳輸裝置將該 等晶圓匣裝載至該指定製程設備。 * 7.依據申請專利範圍第6項之方法,其中在簧施傳輸的該 步驟中,該等機槭臂部分地從該晶圓匣傳輸裝置將該等 晶圓匣卸下至該指定製程設備,且該等機械臂中之其餘 者從該指定製程設備將該等晶圓匣裝載至該晶圓匣傳輸 裝置。 8. 依據申請專利範圍第5或6項之方法,其在傳輸多偏晶圓 匣傳輸要求信號之該步驟後,更包含下列步驟:由該等 控制器卡匣階台指定使得該等多傾機械臂分別相對於在 該指定製程設備中形成的多個卡匣階台且針對該等卡匣 階台裝載或卸下該等晶圓匣。 9. 依據申諳專利範圍第8項之方法,其中該指定製程設備 判定該等晶圓匣是否被正確地放置在該等多掴卡匣階台 中,如果該等晶圓匣經判定偽不正確地放置,則該製程 設備作出一個連鎖動作以制止一傳輸程序被進一步進行 ,並顯示一錯誤訊息。 10. 依據申請專利範圍第3項之方法,其更包含下列步驟: 如果該等晶圓匣經判定像正確地放置,則由該指定製 程設備將一晶圓匣裝載/卸下要求信號傳输至該控制 -;-- 本紙張尺度逋用中國國家標準(CNS ) A4規格(210X297公釐) ---^——^---弋农—— (請先閱讀背面之注意事項再填寫本頁) 訂 A8 B8 C8 D8 七、申請專利範圍 器,使得該等晶圓匣可被裝載/卸下。 11. 依據申請專利範圍第10項之方法,其更包含下列步驟 :由該控制器將表示該等多値晶圓匣要被裝載/卸下 的一傳輸通知信號傳輸至經指定製程設備。 12. 依據申讅專利範圍第11項之方法,其更包含下列步驟 :由該指定製程設備將表示該等晶圓匣已備妥要被裝 載/卸下的一裝載/卸下備妥信號傳輸至該控制器。 13. 依據申請專利範圍第4項之方法,其在實施傳輸之該步 驟後,更包含下列步驟:由該指定製程設備將表示該 等晶圓匣之裝載/卸下已完成的一晶圓匣裝載/卸下 完成信號傳輸至該控制器。 (請先閲讀背面之注$項再填寫本頁) T 訂 經濟部中央標準局貝工消費合作社印製 本紙張尺度適用中國國家棵準(CNS ) A4規格(210X297公兼120Printed by A8, B8, C8, and D8 of the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs. 6. Scope of Patent Application 1. A cassette transfer system for transferring cassettes from one process equipment to another process equipment. The system includes: a wireless transmission / reception module for receiving multi-cabinet wafer tray transmission request signals from a host and transmitting the processed transmission request signals; a controller for processing the wireless transmission / reception signals; The wafer cassette transmits the request signals received by the receiving module and generates multiple different control signals; _ multiple robot arm drive units connected to the controller, so that multiple robot arms can simultaneously transmit in response to the control signals Different wafer cassettes; and a margin unit installed with the 1st machine, moved to the other process equipment designated by the host. 2. According to Article 1 of the scope of patent application, there are at least two of these robot arms. 3. According to the system of item 2 of the scope of the patent application, there are at least two units of these maple arm drive units. 4. A method for transmitting a wafer cassette, comprising the following steps: receiving a plurality of wafer cassette transmission request signals from a host; moving a transmission robotic arm to the received wafer cassette transmission request signals; A designated process equipment; input one of the plurality of wafer cassette transmission request signals to one of the plurality of robotic arms, and transmit the wafer cassette transmission request signal to the wafer cassette transmission request The signals are transmitted to the remaining ones of the multiple robot arms, and are transmitted by the one robot arm and by the remaining robots, respectively. W-— This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling out this page). Congratulations · Ordered by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. 6. Scope of patent application 5. The method according to item 4 of the scope of patent application, wherein in the step of carrying out the transfer, the multiple robot arms are simultaneously unloaded from a cassette transfer device to wait for the cassette To the specified process equipment. 6. The method according to item 4 of the application scope, wherein in the step of carrying out the transfer, the multiple robot arms simultaneously load the cassettes from the cassette transfer device to the designated process equipment. * 7. The method according to item 6 of the scope of patent application, wherein in this step of the spring application transfer, the machine arm is partially unloaded from the wafer cassette transfer device to the designated process equipment And the rest of the robotic arms load the wafer cassettes from the designated process equipment to the wafer cassette transfer device. 8. According to the method of claim 5 or 6 of the patent application scope, after the step of transmitting the multi-biased wafer cassette transmission request signal, it further includes the following steps: designated by the controller cassette stage to make the The robot arm respectively loads or unloads the wafer cassettes with respect to the plurality of cassette stages formed in the designated process equipment for the cassette stages. 9. The method according to item 8 of the patent scope of the application, wherein the designated process equipment determines whether the cassettes are correctly placed in the multiple cassette stages, and if the cassettes are judged to be false or incorrect Place, the process equipment makes a chain action to stop a transmission process from being carried out further, and displays an error message. 10. The method according to item 3 of the scope of patent application, which further includes the following steps: If the wafer cassettes are determined to be placed correctly, a designated cassette loading / unloading signal is transmitted by the specified process equipment To this control ----- This paper size adopts China National Standard (CNS) A4 specification (210X297 mm) --- ^ ---- ^ --- crop farmer-(Please read the precautions on the back before filling in this Page) Order A8 B8 C8 D8 VII. Patent application scope device, so that these wafer cassettes can be loaded / unloaded. 11. The method according to item 10 of the scope of patent application, further comprising the steps of: transmitting, by the controller, a transmission notification signal indicating that the multiple wafer cassettes are to be loaded / unloaded to the designated process equipment. 12. The method according to claim 11 of the scope of patent application, which further includes the following steps: a designated loading / unloading signal transmission indicating that the wafer cassettes are ready to be loaded / unloaded by the designated process equipment To the controller. 13. The method according to item 4 of the scope of patent application, which includes the following steps after the step of transferring: the designated process equipment will indicate that a wafer cassette has been loaded / unloaded from the wafer cassettes. A load / unload completion signal is transmitted to the controller. (Please read the note on the back before filling in this page.) T Order Printed by Shellfish Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210X297) and 120
TW087117194A 1998-03-13 1998-10-17 Wafer cassette transfer system and method TW393717B (en)

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* Cited by examiner, † Cited by third party
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* Cited by examiner, † Cited by third party
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Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260461A (en) * 1996-03-26 1997-10-03 Canon Inc Semiconductor manufacture device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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