KR100625712B1 - 웨이퍼 미립자 오염 정도가 낮은 정전 웨이퍼 클램프 - Google Patents

웨이퍼 미립자 오염 정도가 낮은 정전 웨이퍼 클램프 Download PDF

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Publication number
KR100625712B1
KR100625712B1 KR1020007011266A KR20007011266A KR100625712B1 KR 100625712 B1 KR100625712 B1 KR 100625712B1 KR 1020007011266 A KR1020007011266 A KR 1020007011266A KR 20007011266 A KR20007011266 A KR 20007011266A KR 100625712 B1 KR100625712 B1 KR 100625712B1
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KR
South Korea
Prior art keywords
clamping
clamping surface
dielectric layer
electrode
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020007011266A
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English (en)
Korean (ko)
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KR20010042592A (ko
Inventor
그랜트 켄지. 라센
Original Assignee
베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
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Application filed by 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. filed Critical 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Publication of KR20010042592A publication Critical patent/KR20010042592A/ko
Application granted granted Critical
Publication of KR100625712B1 publication Critical patent/KR100625712B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020007011266A 1998-04-10 1999-04-08 웨이퍼 미립자 오염 정도가 낮은 정전 웨이퍼 클램프 Expired - Fee Related KR100625712B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/058,944 1998-04-10
US09/058,944 US5969934A (en) 1998-04-10 1998-04-10 Electrostatic wafer clamp having low particulate contamination of wafers
US9/058,944 1998-04-10

Publications (2)

Publication Number Publication Date
KR20010042592A KR20010042592A (ko) 2001-05-25
KR100625712B1 true KR100625712B1 (ko) 2006-09-20

Family

ID=22019869

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007011266A Expired - Fee Related KR100625712B1 (ko) 1998-04-10 1999-04-08 웨이퍼 미립자 오염 정도가 낮은 정전 웨이퍼 클램프

Country Status (7)

Country Link
US (1) US5969934A (enExample)
EP (1) EP1070381B1 (enExample)
JP (1) JP2002511662A (enExample)
KR (1) KR100625712B1 (enExample)
DE (1) DE69904709T2 (enExample)
TW (1) TW410414B (enExample)
WO (1) WO1999053603A1 (enExample)

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US20070181420A1 (en) * 2006-02-07 2007-08-09 Ming-Tung Wang Wafer stage having an encapsulated central pedestal plate
KR101553422B1 (ko) * 2007-12-19 2015-09-15 램 리써치 코포레이션 플라즈마 처리 장치를 위한 복합 샤워헤드 전극 어셈블리
TWI484576B (zh) 2007-12-19 2015-05-11 Lam Res Corp 半導體真空處理設備用之薄膜黏接劑
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
US8169769B2 (en) * 2008-09-11 2012-05-01 Tel Epion Inc. Electrostatic chuck power supply
US7948734B2 (en) * 2008-09-11 2011-05-24 Tel Epion Inc. Electrostatic chuck power supply
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
JP5808750B2 (ja) * 2009-11-30 2015-11-10 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 傾斜側壁を備える静電チャック
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
US9633885B2 (en) * 2014-02-12 2017-04-25 Axcelis Technologies, Inc. Variable electrode pattern for versatile electrostatic clamp operation
WO2016135565A1 (en) 2015-02-23 2016-09-01 M Cubed Technologies, Inc. Film electrode for electrostatic chuck
KR20190104040A (ko) * 2017-01-27 2019-09-05 울트라테크 인크. 기판-바이어스된 원자층 증착을 위한 향상된 전기적 절연을 가진 척 시스템 및 방법
US12327749B2 (en) * 2022-09-21 2025-06-10 Intel Corporation Carrier chuck and methods of forming and using thereof
WO2025204031A1 (ja) * 2024-03-27 2025-10-02 日本発條株式会社 ステージ、およびステージの作製方法

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Also Published As

Publication number Publication date
US5969934A (en) 1999-10-19
TW410414B (en) 2000-11-01
JP2002511662A (ja) 2002-04-16
WO1999053603A1 (en) 1999-10-21
DE69904709D1 (de) 2003-02-06
DE69904709T2 (de) 2003-11-13
EP1070381B1 (en) 2003-01-02
KR20010042592A (ko) 2001-05-25
EP1070381A1 (en) 2001-01-24

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