KR100615763B1 - 열처리 장치의 온도 교정 방법 - Google Patents

열처리 장치의 온도 교정 방법 Download PDF

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Publication number
KR100615763B1
KR100615763B1 KR1020000050637A KR20000050637A KR100615763B1 KR 100615763 B1 KR100615763 B1 KR 100615763B1 KR 1020000050637 A KR1020000050637 A KR 1020000050637A KR 20000050637 A KR20000050637 A KR 20000050637A KR 100615763 B1 KR100615763 B1 KR 100615763B1
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South Korea
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temperature
heat treatment
thin film
processing chamber
processing
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Expired - Fee Related
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KR1020000050637A
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English (en)
Korean (ko)
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KR20010030160A (ko
Inventor
후지오 스즈키
코이치 사카모토
웬링 왕
모유루 야스하라
프라디프 팬디
선일 샤
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동경 엘렉트론 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/10—Heating of the reaction chamber or the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/12—Heating of the reaction chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
KR1020000050637A 1999-09-02 2000-08-30 열처리 장치의 온도 교정 방법 Expired - Fee Related KR100615763B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24891299A JP4426024B2 (ja) 1999-09-02 1999-09-02 熱処理装置の温度校正方法
JP99-248912 1999-09-02

Publications (2)

Publication Number Publication Date
KR20010030160A KR20010030160A (ko) 2001-04-16
KR100615763B1 true KR100615763B1 (ko) 2006-08-25

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KR1020000050637A Expired - Fee Related KR100615763B1 (ko) 1999-09-02 2000-08-30 열처리 장치의 온도 교정 방법

Country Status (4)

Country Link
US (1) US6329643B1 (enExample)
JP (1) JP4426024B2 (enExample)
KR (1) KR100615763B1 (enExample)
TW (1) TW476997B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4551515B2 (ja) * 1998-10-07 2010-09-29 株式会社日立国際電気 半導体製造装置およびその温度制御方法
US6850322B2 (en) * 2000-12-29 2005-02-01 Advanced Micro Devices, Inc. Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace
JP4731755B2 (ja) 2001-07-26 2011-07-27 東京エレクトロン株式会社 移載装置の制御方法および熱処理方法並びに熱処理装置
JP2003074468A (ja) * 2001-08-31 2003-03-12 Toshiba Corp 真空排気システム及びその監視・制御方法
DE10216610A1 (de) * 2002-04-15 2003-10-30 Wacker Siltronic Halbleitermat Verfahren zur Temperaturkalibrierung eines Hochtemperaturreaktors
JP2004071987A (ja) * 2002-08-08 2004-03-04 Hitachi Kokusai Electric Inc 半導体装置の製造方法
JP3853302B2 (ja) 2002-08-09 2006-12-06 東京エレクトロン株式会社 熱処理方法及び熱処理装置
US7619184B2 (en) * 2003-03-04 2009-11-17 Micron Technology, Inc. Multi-parameter process and control method
DE102004051409B4 (de) * 2004-10-21 2010-01-07 Ivoclar Vivadent Ag Brennofen
EP1734571B1 (en) * 2005-06-10 2008-08-20 S.O.I.TEC. Silicon on Insulator Technologies S.A. Thermal processing equipment calibration method
JP5200492B2 (ja) * 2007-10-31 2013-06-05 株式会社Ｓｕｍｃｏ 気相成長装置の温度計の校正方法
JP5766647B2 (ja) * 2012-03-28 2015-08-19 東京エレクトロン株式会社 熱処理システム、熱処理方法、及び、プログラム
CN104364888B (zh) * 2012-05-28 2017-02-22 株式会社日立国际电气 基板处理装置、温度计测系统、处理装置的温度计测方法、输送装置以及记录介质
US9658118B2 (en) 2012-11-16 2017-05-23 Linear Technology Corporation Precision temperature measurement devices, sensors, and methods
US11513042B2 (en) * 2015-01-26 2022-11-29 SPEX SamplePrep, LLC Power-compensated fusion furnace
CN111719130B (zh) * 2020-06-22 2022-10-21 北京北方华创微电子装备有限公司 半导体镀膜设备中的温度调整方法及半导体镀膜设备
JP7754586B2 (ja) * 2021-06-08 2025-10-15 東京エレクトロン株式会社 温度補正情報算出装置、半導体製造装置、プログラム、温度補正情報算出方法
CN115903718B (zh) * 2021-08-26 2025-06-27 佛山市信章荣自动化设备有限公司 一种温控器自动热调炉
CN114384946B (zh) * 2021-12-17 2023-03-14 西安北方华创微电子装备有限公司 半导体热处理设备的补偿参数获取方法和设备
US12341038B2 (en) * 2022-01-11 2025-06-24 Applied Materials, Inc. Dynamic and localized temperature control for epitaxial deposition reactors

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681931A (en) * 1979-12-10 1981-07-04 Toshiba Corp Oxidizing furnace for semiconductor substrate
JPH03145121A (ja) * 1989-10-31 1991-06-20 Toshiba Corp 半導体熱処理用温度制御装置
JPH05267200A (ja) * 1992-03-24 1993-10-15 Hitachi Ltd 半導体熱処理装置
JPH09199491A (ja) * 1996-01-23 1997-07-31 Tokyo Electron Ltd 温度調整方法及びその装置
JPH1043666A (ja) * 1996-05-28 1998-02-17 Tokyo Electron Ltd 塗布膜形成方法及びその装置

Family Cites Families (10)

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US5001327A (en) * 1987-09-11 1991-03-19 Hitachi, Ltd. Apparatus and method for performing heat treatment on semiconductor wafers
US5273424A (en) * 1990-03-23 1993-12-28 Tokyo Electron Sagami Limited Vertical heat treatment apparatus
JPH0690126B2 (ja) * 1990-10-30 1994-11-14 株式会社島津製作所 キャピラリレオメータおよび温度検査棒
US5387557A (en) * 1991-10-23 1995-02-07 F. T. L. Co., Ltd. Method for manufacturing semiconductor devices using heat-treatment vertical reactor with temperature zones
US5616264A (en) 1993-06-15 1997-04-01 Tokyo Electron Limited Method and apparatus for controlling temperature in rapid heat treatment system
KR950001953A (ko) * 1993-06-30 1995-01-04 이노우에 아키라 웨이퍼의 열처리방법
FI94066C (fi) 1994-05-16 1995-07-10 Valmet Paper Machinery Inc Rainamateriaalin valmistuskoneella kuten kartonki- tai paperikoneella ja/tai jälkikäsittelykoneella valmistettavan paperiradan eri poikkiprofiilien kokonaisvaltainen hallintajärjestelmä
JP3504784B2 (ja) * 1995-09-07 2004-03-08 東京エレクトロン株式会社 熱処理方法
EP1093664A4 (en) * 1998-05-11 2003-07-09 Semitool Inc TEMPERATURE CONTROL SYSTEM FOR THERMAL ACTUATOR
JP3487497B2 (ja) * 1998-06-24 2004-01-19 岩手東芝エレクトロニクス株式会社 被処理体収容治具及びこれを用いた熱処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681931A (en) * 1979-12-10 1981-07-04 Toshiba Corp Oxidizing furnace for semiconductor substrate
JPH03145121A (ja) * 1989-10-31 1991-06-20 Toshiba Corp 半導体熱処理用温度制御装置
JPH05267200A (ja) * 1992-03-24 1993-10-15 Hitachi Ltd 半導体熱処理装置
JPH09199491A (ja) * 1996-01-23 1997-07-31 Tokyo Electron Ltd 温度調整方法及びその装置
JPH1043666A (ja) * 1996-05-28 1998-02-17 Tokyo Electron Ltd 塗布膜形成方法及びその装置

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Publication number Publication date
TW476997B (en) 2002-02-21
JP2001077041A (ja) 2001-03-23
US6329643B1 (en) 2001-12-11
KR20010030160A (ko) 2001-04-16
JP4426024B2 (ja) 2010-03-03

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