KR100607302B1 - 기판 수납 용기 - Google Patents
기판 수납 용기 Download PDFInfo
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- KR100607302B1 KR100607302B1 KR1020047017214A KR20047017214A KR100607302B1 KR 100607302 B1 KR100607302 B1 KR 100607302B1 KR 1020047017214 A KR1020047017214 A KR 1020047017214A KR 20047017214 A KR20047017214 A KR 20047017214A KR 100607302 B1 KR100607302 B1 KR 100607302B1
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- check valve
- gas
- sleeve
- valve
- storage container
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- 238000003860 storage Methods 0.000 title claims abstract description 102
- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 230000005489 elastic deformation Effects 0.000 claims abstract description 41
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 238000009826 distribution Methods 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims description 188
- 238000000034 method Methods 0.000 claims description 19
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 230000008602 contraction Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 31
- 230000008878 coupling Effects 0.000 abstract description 14
- 238000010168 coupling process Methods 0.000 abstract description 14
- 238000005859 coupling reaction Methods 0.000 abstract description 14
- 230000007246 mechanism Effects 0.000 abstract description 13
- 238000011109 contamination Methods 0.000 abstract description 6
- 229910021645 metal ion Inorganic materials 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 23
- 238000010926 purge Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 17
- 229920001971 elastomer Polymers 0.000 description 16
- 230000002093 peripheral effect Effects 0.000 description 12
- 239000005060 rubber Substances 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000011261 inert gas Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 229920003049 isoprene rubber Polymers 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000002397 field ionisation mass spectrometry Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910021655 trace metal ion Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K15/00—Check valves
- F16K15/02—Check valves with guided rigid valve members
- F16K15/025—Check valves with guided rigid valve members the valve being loaded by a spring
- F16K15/026—Check valves with guided rigid valve members the valve being loaded by a spring the valve member being a movable body around which the medium flows when the valve is open
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K15/00—Check valves
- F16K15/02—Check valves with guided rigid valve members
- F16K15/06—Check valves with guided rigid valve members with guided stems
- F16K15/063—Check valves with guided rigid valve members with guided stems the valve being loaded by a spring
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
- F16K17/02—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side
- F16K17/04—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side spring-loaded
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7781—With separate connected fluid reactor surface
- Y10T137/7834—Valve seat or external sleeve moves to open valve
Abstract
Description
Claims (15)
- 용기 본체와, 이 용기 본체를 개폐하는 덮개와, 이 용기 본체와 덮개의 적어도 어느 한쪽의 관통공에 부착되어 용기 본체에 대한 기체의 유통을 제어하는 밸브체를 포함하여 이루어진 기판 수납 용기에 있어서,밸브체를, 관통공에 끼워진 기체 유통용의 고정 슬리브와, 이 고정 슬리브에 조합된 기체 유통용의 유지 슬리브와, 이들 고정 슬리브와 유지 슬리브 사이에 내장되는 탄성 체크 밸브와, 이 탄성 체크 밸브에 대향하는 기체 유통용의 내부 덮개 슬리브로 구성하고, 고정 슬리브와 내부 덮개 슬리브의 어느 한쪽을 탄성 체크 밸브에 의해 개폐 가능하도록 하여, 이 탄성 체크 밸브의 개방시에는 기체를 유통시키고, 탄성 체크 밸브의 폐색시에는 기체의 유통을 규제하도록 하고,관통공의 주연부에 리브를 형성해서 외측 방향으로 신장시키고, 고정 슬리브에 리브의 주연부에 접촉하는 플랜지를 형성하는 동시에, 유지 슬리브에는 관통공의 주연부에 접촉하는 플랜지를 형성한 것을 특징으로 하는기판 수납 용기.
- 제 1 항에 있어서,용기 본체의 바닥부에 관통공을 설치하고, 이 관통공에 밸브체를 가스 도입 밸브 또는 가스 배기 밸브로서 끼우도록 한기판 수납 용기.
- 삭제
- 제 1 항에 있어서,적어도 유지 슬리브와 탄성 체크 밸브의 주연부 사이에 기체 유통용 간극을 형성한기판 수납 용기.
- 제 1 항에 있어서,유지 슬리브에 내부 덮개 슬리브를 끼워 넣어 이들 사이에는 기체용 필터를 개재한기판 수납 용기.
- 제 1 항에 있어서,탄성 체크 밸브를, 적어도 고정 슬리브에 간극을 두고서 내장되는 체크 밸브와, 이 체크 밸브와 내부 덮개 슬리브 사이에 개재되는 탄성 변형 부재로 구성하고, 고정 슬리브의 개구부를 체크 밸브에 의해 개폐 가능하도록 하여, 체크 밸브의 개방시에는 기체를 유통시키고, 체크 밸브의 폐색시에는 기체의 유통을 규제하도록 한기판 수납 용기.
- 제 1 항에 있어서,탄성 체크 밸브를, 적어도 고정 슬리브에 간극을 두고서 내장되는 체크 밸브와, 이 체크 밸브와 고정 슬리브 사이에 개재되는 탄성 변형 부재로 구성하고, 내부 덮개 슬리브의 개구부를 체크 밸브에 의해 개폐 가능하도록 하여, 체크 밸브의 개방시에는 기체를 유통시키고, 체크 밸브의 폐색시에는 기체의 유통을 규제하도록 한기판 수납 용기.
- 제 1 항에 있어서,탄성 체크 밸브를, 적어도 고정 슬리브에 간극을 두고서 내장되는 체크 밸브와, 이 체크 밸브용 탄성 변형 부재로 구성하고, 체크 밸브와 탄성 변형 부재의 어느 한쪽과 내부 덮개 슬리브를 접촉시켜, 체크 밸브의 개방시에는 기체를 유통시키고, 체크 밸브의 폐색시에는 기체의 유통을 규제하도록 한기판 수납 용기.
- 제 6 항에 있어서,탄성 체크 밸브의 체크 밸브와 내부 덮개 슬리브의 어느 한쪽에 가이드체를, 다른 쪽에는 피가이드체를 각각 설치하고, 이들 가이드체와 피가이드체를 슬라이드 가능하게 끼워 맞춤시키도록 한기판 수납 용기
- 제 9 항에 있어서,가이드체를 단면이 대략 볼록한 형태로 하여 내부 덮개 슬리브에 형성하고, 피가이드체를 단면이 대략 오목한 형태로 하여 탄성 체크 밸브의 체크 밸브에 형성한기판 수납 용기
- 제 6 항에 있어서,탄성 체크 밸브의 체크 밸브에 밀봉 부재를 부착하고, 이 밀봉 부재를 고정 슬리브 또는 내부 덮개 슬리브의 개구부에 변형 접촉시켜서 밀봉하도록 한기판 수납 용기.
- 제 1 항에 있어서,용기 본체의 바닥부에 관통공을 설치하고, 이 관통공에 밸브체에 연통하는 중공의 노즐 타워를 세워 설치하여 그 주벽(周壁)에는 기체용의 분출구를 개구한기판 수납 용기.
- 제 1 항에 있어서,용기 본체의 바닥부에 관통공을 설치하여 그 근방에는 편향판을 붙이고, 이 편향판을 대략 "L"자형 단면으로 형성하여, 그 장편부(長片部)를 밸브체에 간극을 두고서 대향시킨기판 수납 용기.
- 제 1 항에 있어서,탄성 체크 밸브를, 적어도 고정 슬리브에 간극을 두고서 내장되는 체크 밸브와, 이 체크 밸브에 끼워지는 신축 가능한 벨로우즈로 구성하고, 벨로우즈의 주벽에 유통구를 설치하고, 이 벨로우즈의 신축에 의해 체크 밸브를 개폐하도록 한기판 수납 용기.
- 제 1 항에 있어서,탄성 체크 밸브를, 적어도 고정 슬리브에 간극을 두고서 내장되는 체크 밸브와, 이 체크 밸브에 일체화된 탄성의 스커트체로 구성하고, 체크 밸브에 유통구를 설치하는 동시에, 스커트체의 주연부로부터 대략 통형의 스커트 피이스를 굴곡 가능하게 신장시켜 체크 밸브에 끼워 맞추고, 이 스커트체의 변형에 의해 체크 밸브를 개폐하도록 한기판 수납 용기.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002311275A JP4204302B2 (ja) | 2002-10-25 | 2002-10-25 | 収納容器 |
JPJP-P-2002-00311275 | 2002-10-25 | ||
JPJP-P-2002-00344954 | 2002-11-28 | ||
JP2002344954A JP4201583B2 (ja) | 2002-11-28 | 2002-11-28 | 基板収納容器 |
PCT/JP2003/012612 WO2004038789A1 (ja) | 2002-10-25 | 2003-10-01 | 基板収納容器 |
Publications (2)
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KR20040104636A KR20040104636A (ko) | 2004-12-10 |
KR100607302B1 true KR100607302B1 (ko) | 2006-07-31 |
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KR1020047017214A KR100607302B1 (ko) | 2002-10-25 | 2003-10-01 | 기판 수납 용기 |
Country Status (6)
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US (3) | US7455180B2 (ko) |
EP (1) | EP1555689B1 (ko) |
KR (1) | KR100607302B1 (ko) |
DE (1) | DE60332644D1 (ko) |
TW (1) | TWI289534B (ko) |
WO (1) | WO2004038789A1 (ko) |
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KR20170084122A (ko) * | 2014-11-12 | 2017-07-19 | 미라이얼 가부시키가이샤 | 가스 퍼지용 필터 |
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-
2003
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- 2003-10-01 KR KR1020047017214A patent/KR100607302B1/ko active IP Right Grant
- 2003-10-01 WO PCT/JP2003/012612 patent/WO2004038789A1/ja active IP Right Grant
- 2003-10-01 US US10/496,932 patent/US7455180B2/en not_active Expired - Fee Related
- 2003-10-01 DE DE60332644T patent/DE60332644D1/de not_active Expired - Lifetime
- 2003-10-16 TW TW92128740A patent/TWI289534B/zh not_active IP Right Cessation
-
2008
- 2008-01-29 US US12/021,719 patent/US7658289B2/en not_active Expired - Lifetime
- 2008-02-20 US US12/034,040 patent/US7658290B2/en not_active Expired - Fee Related
Cited By (2)
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KR20170084122A (ko) * | 2014-11-12 | 2017-07-19 | 미라이얼 가부시키가이샤 | 가스 퍼지용 필터 |
KR102386695B1 (ko) * | 2014-11-12 | 2022-04-14 | 미라이얼 가부시키가이샤 | 가스 퍼지용 필터 |
Also Published As
Publication number | Publication date |
---|---|
US7658290B2 (en) | 2010-02-09 |
EP1555689A4 (en) | 2005-11-02 |
EP1555689A1 (en) | 2005-07-20 |
US20050077204A1 (en) | 2005-04-14 |
TW200415092A (en) | 2004-08-16 |
DE60332644D1 (de) | 2010-07-01 |
WO2004038789A1 (ja) | 2004-05-06 |
KR20040104636A (ko) | 2004-12-10 |
EP1555689B1 (en) | 2010-05-19 |
US7455180B2 (en) | 2008-11-25 |
US20080149527A1 (en) | 2008-06-26 |
US7658289B2 (en) | 2010-02-09 |
TWI289534B (en) | 2007-11-11 |
US20080149528A1 (en) | 2008-06-26 |
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