KR100606221B1 - 인쇄 회로 기판 - Google Patents

인쇄 회로 기판 Download PDF

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Publication number
KR100606221B1
KR100606221B1 KR1020040041683A KR20040041683A KR100606221B1 KR 100606221 B1 KR100606221 B1 KR 100606221B1 KR 1020040041683 A KR1020040041683 A KR 1020040041683A KR 20040041683 A KR20040041683 A KR 20040041683A KR 100606221 B1 KR100606221 B1 KR 100606221B1
Authority
KR
South Korea
Prior art keywords
pad
circuit board
printed circuit
component
electrode
Prior art date
Application number
KR1020040041683A
Other languages
English (en)
Korean (ko)
Other versions
KR20050063656A (ko
Inventor
다키자와미노루
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20050063656A publication Critical patent/KR20050063656A/ko
Application granted granted Critical
Publication of KR100606221B1 publication Critical patent/KR100606221B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020040041683A 2003-12-22 2004-06-08 인쇄 회로 기판 KR100606221B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003424959A JP4227008B2 (ja) 2003-12-22 2003-12-22 プリント配線回路基板
JPJP-P-2003-00424959 2003-12-22

Publications (2)

Publication Number Publication Date
KR20050063656A KR20050063656A (ko) 2005-06-28
KR100606221B1 true KR100606221B1 (ko) 2006-07-31

Family

ID=34784990

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040041683A KR100606221B1 (ko) 2003-12-22 2004-06-08 인쇄 회로 기판

Country Status (4)

Country Link
JP (1) JP4227008B2 (zh)
KR (1) KR100606221B1 (zh)
CN (1) CN100456909C (zh)
TW (1) TWI244360B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101069456B (zh) * 2005-03-29 2010-11-10 株式会社村田制作所 电子元件安装结构
JP2007123617A (ja) * 2005-10-28 2007-05-17 Toshiba Corp プリント配線板、プリント配線板を内蔵する電子機器、及びプリント配線板の製造方法
US10160092B2 (en) 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
WO2016063396A1 (ja) 2014-10-23 2016-04-28 三菱電機株式会社 配線板、電動機、電気機器及び空気調和機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0690077A (ja) * 1992-01-31 1994-03-29 Hitachi Telecom Technol Ltd 印刷配線板
JPH06334320A (ja) * 1993-05-20 1994-12-02 Mitsubishi Electric Corp 電子部品の実装方法
JPH07288378A (ja) * 1994-04-18 1995-10-31 Fujikura Ltd プリント配線板
KR200157790Y1 (ko) 1993-11-19 1999-10-01 손욱 평판디스플레이 모듈용 인쇄회로기판의 부품 실장 구조

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2744398B2 (ja) * 1993-06-11 1998-04-28 ローム株式会社 固体電解コンデンサーの基板実装構造
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
JP2000299548A (ja) * 1999-04-12 2000-10-24 Kenwood Corp プリント基板のランド構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0690077A (ja) * 1992-01-31 1994-03-29 Hitachi Telecom Technol Ltd 印刷配線板
JPH06334320A (ja) * 1993-05-20 1994-12-02 Mitsubishi Electric Corp 電子部品の実装方法
KR200157790Y1 (ko) 1993-11-19 1999-10-01 손욱 평판디스플레이 모듈용 인쇄회로기판의 부품 실장 구조
JPH07288378A (ja) * 1994-04-18 1995-10-31 Fujikura Ltd プリント配線板

Also Published As

Publication number Publication date
JP2005183797A (ja) 2005-07-07
JP4227008B2 (ja) 2009-02-18
CN1638608A (zh) 2005-07-13
TWI244360B (en) 2005-11-21
KR20050063656A (ko) 2005-06-28
TW200522822A (en) 2005-07-01
CN100456909C (zh) 2009-01-28

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