KR100605436B1 - 고체 촬상 장치 - Google Patents

고체 촬상 장치 Download PDF

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Publication number
KR100605436B1
KR100605436B1 KR1019990009916A KR19990009916A KR100605436B1 KR 100605436 B1 KR100605436 B1 KR 100605436B1 KR 1019990009916 A KR1019990009916 A KR 1019990009916A KR 19990009916 A KR19990009916 A KR 19990009916A KR 100605436 B1 KR100605436 B1 KR 100605436B1
Authority
KR
South Korea
Prior art keywords
imaging device
state imaging
solid
signal charge
photoelectric conversion
Prior art date
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Expired - Lifetime
Application number
KR1019990009916A
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English (en)
Korean (ko)
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KR19990078166A (ko
Inventor
스즈끼료지
Original Assignee
소니 가부시끼 가이샤
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Application filed by 소니 가부시끼 가이샤 filed Critical 소니 가부시끼 가이샤
Publication of KR19990078166A publication Critical patent/KR19990078166A/ko
Application granted granted Critical
Publication of KR100605436B1 publication Critical patent/KR100605436B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033Photosensitive area

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
KR1019990009916A 1998-03-23 1999-03-23 고체 촬상 장치 Expired - Lifetime KR100605436B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10074392A JPH11274462A (ja) 1998-03-23 1998-03-23 固体撮像装置
JP1998-074392 1998-03-23

Publications (2)

Publication Number Publication Date
KR19990078166A KR19990078166A (ko) 1999-10-25
KR100605436B1 true KR100605436B1 (ko) 2006-07-28

Family

ID=13545876

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990009916A Expired - Lifetime KR100605436B1 (ko) 1998-03-23 1999-03-23 고체 촬상 장치

Country Status (4)

Country Link
US (1) US6326655B1 (enExample)
JP (1) JPH11274462A (enExample)
KR (1) KR100605436B1 (enExample)
GB (1) GB2335793B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4604296B2 (ja) * 1999-02-09 2011-01-05 ソニー株式会社 固体撮像装置及びその製造方法
US6727521B2 (en) * 2000-09-25 2004-04-27 Foveon, Inc. Vertical color filter detector group and array
JP3688980B2 (ja) * 2000-06-28 2005-08-31 株式会社東芝 Mos型固体撮像装置及びその製造方法
US6949445B2 (en) * 2003-03-12 2005-09-27 Micron Technology, Inc. Method of forming angled implant for trench isolation
JP2004303982A (ja) * 2003-03-31 2004-10-28 Matsushita Electric Ind Co Ltd 固体撮像素子
US7391066B2 (en) * 2003-04-25 2008-06-24 Micron Technology, Inc. Imager floating diffusion region and process for forming same
KR100523672B1 (ko) * 2003-04-30 2005-10-24 매그나칩 반도체 유한회사 다중 플로팅디퓨젼영역을 구비하는 씨모스 이미지센서
JP4578792B2 (ja) * 2003-09-26 2010-11-10 富士通セミコンダクター株式会社 固体撮像装置
JP4703163B2 (ja) 2004-10-19 2011-06-15 株式会社東芝 固体撮像装置
JP5361110B2 (ja) * 2004-10-20 2013-12-04 三星電子株式会社 非平面トランジスタを有する固体イメージセンサ素子及びその製造方法
JP4660228B2 (ja) * 2005-03-09 2011-03-30 株式会社東芝 固体撮像装置
CN102473714B (zh) * 2009-07-10 2016-06-22 株式会社岛津制作所 固体摄像元件
JP5246218B2 (ja) * 2010-07-26 2013-07-24 富士通セミコンダクター株式会社 固体撮像装置の製造方法
JP2011142344A (ja) * 2011-04-04 2011-07-21 Sony Corp 固体撮像装置
US20150021668A1 (en) * 2013-07-19 2015-01-22 Stmicroelectronics Sa Photosensitive cell of an image sensor
JP2014135515A (ja) * 2014-04-08 2014-07-24 Sony Corp 固体撮像装置
JP2017054947A (ja) * 2015-09-10 2017-03-16 セイコーエプソン株式会社 固体撮像素子及びその製造方法、並びに、電子機器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR890015584A (ko) * 1988-03-31 1989-10-30 미다 가쓰시게 증폭형 고체촬상장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1595253A (en) * 1977-01-24 1981-08-12 Hitachi Ltd Solid-state imaging devices
JPS5815280A (ja) * 1981-07-21 1983-01-28 Nec Corp 固体撮像素子
JPS59198756A (ja) * 1983-04-27 1984-11-10 Hitachi Ltd 固体撮像素子およびその製造方法
JPH0230183A (ja) * 1988-07-19 1990-01-31 Nec Corp 固体撮像素子
JP3070146B2 (ja) * 1991-06-19 2000-07-24 ソニー株式会社 固体撮像装置
DE69228838T2 (de) * 1991-07-12 1999-10-21 Sony Corp., Tokio/Tokyo Verfahren zur Steuerung einer Ladungstransferschaltung
JP2832136B2 (ja) * 1992-12-28 1998-12-02 シャープ株式会社 固体撮像装置及びその製造方法
KR950002084A (ko) * 1993-06-22 1995-01-04 오가 노리오 전하전송장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR890015584A (ko) * 1988-03-31 1989-10-30 미다 가쓰시게 증폭형 고체촬상장치

Also Published As

Publication number Publication date
GB9906454D0 (en) 1999-05-12
KR19990078166A (ko) 1999-10-25
JPH11274462A (ja) 1999-10-08
GB2335793A (en) 1999-09-29
GB2335793B (en) 2003-03-05
US6326655B1 (en) 2001-12-04

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