KR100605436B1 - 고체 촬상 장치 - Google Patents
고체 촬상 장치 Download PDFInfo
- Publication number
- KR100605436B1 KR100605436B1 KR1019990009916A KR19990009916A KR100605436B1 KR 100605436 B1 KR100605436 B1 KR 100605436B1 KR 1019990009916 A KR1019990009916 A KR 1019990009916A KR 19990009916 A KR19990009916 A KR 19990009916A KR 100605436 B1 KR100605436 B1 KR 100605436B1
- Authority
- KR
- South Korea
- Prior art keywords
- imaging device
- state imaging
- solid
- signal charge
- photoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 43
- 238000006243 chemical reaction Methods 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000012535 impurity Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000005036 potential barrier Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10074392A JPH11274462A (ja) | 1998-03-23 | 1998-03-23 | 固体撮像装置 |
| JP1998-074392 | 1998-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990078166A KR19990078166A (ko) | 1999-10-25 |
| KR100605436B1 true KR100605436B1 (ko) | 2006-07-28 |
Family
ID=13545876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990009916A Expired - Lifetime KR100605436B1 (ko) | 1998-03-23 | 1999-03-23 | 고체 촬상 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6326655B1 (enExample) |
| JP (1) | JPH11274462A (enExample) |
| KR (1) | KR100605436B1 (enExample) |
| GB (1) | GB2335793B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4604296B2 (ja) * | 1999-02-09 | 2011-01-05 | ソニー株式会社 | 固体撮像装置及びその製造方法 |
| US6727521B2 (en) * | 2000-09-25 | 2004-04-27 | Foveon, Inc. | Vertical color filter detector group and array |
| JP3688980B2 (ja) * | 2000-06-28 | 2005-08-31 | 株式会社東芝 | Mos型固体撮像装置及びその製造方法 |
| US6949445B2 (en) * | 2003-03-12 | 2005-09-27 | Micron Technology, Inc. | Method of forming angled implant for trench isolation |
| JP2004303982A (ja) * | 2003-03-31 | 2004-10-28 | Matsushita Electric Ind Co Ltd | 固体撮像素子 |
| US7391066B2 (en) * | 2003-04-25 | 2008-06-24 | Micron Technology, Inc. | Imager floating diffusion region and process for forming same |
| KR100523672B1 (ko) * | 2003-04-30 | 2005-10-24 | 매그나칩 반도체 유한회사 | 다중 플로팅디퓨젼영역을 구비하는 씨모스 이미지센서 |
| JP4578792B2 (ja) * | 2003-09-26 | 2010-11-10 | 富士通セミコンダクター株式会社 | 固体撮像装置 |
| JP4703163B2 (ja) | 2004-10-19 | 2011-06-15 | 株式会社東芝 | 固体撮像装置 |
| JP5361110B2 (ja) * | 2004-10-20 | 2013-12-04 | 三星電子株式会社 | 非平面トランジスタを有する固体イメージセンサ素子及びその製造方法 |
| JP4660228B2 (ja) * | 2005-03-09 | 2011-03-30 | 株式会社東芝 | 固体撮像装置 |
| CN102473714B (zh) * | 2009-07-10 | 2016-06-22 | 株式会社岛津制作所 | 固体摄像元件 |
| JP5246218B2 (ja) * | 2010-07-26 | 2013-07-24 | 富士通セミコンダクター株式会社 | 固体撮像装置の製造方法 |
| JP2011142344A (ja) * | 2011-04-04 | 2011-07-21 | Sony Corp | 固体撮像装置 |
| US20150021668A1 (en) * | 2013-07-19 | 2015-01-22 | Stmicroelectronics Sa | Photosensitive cell of an image sensor |
| JP2014135515A (ja) * | 2014-04-08 | 2014-07-24 | Sony Corp | 固体撮像装置 |
| JP2017054947A (ja) * | 2015-09-10 | 2017-03-16 | セイコーエプソン株式会社 | 固体撮像素子及びその製造方法、並びに、電子機器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR890015584A (ko) * | 1988-03-31 | 1989-10-30 | 미다 가쓰시게 | 증폭형 고체촬상장치 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1595253A (en) * | 1977-01-24 | 1981-08-12 | Hitachi Ltd | Solid-state imaging devices |
| JPS5815280A (ja) * | 1981-07-21 | 1983-01-28 | Nec Corp | 固体撮像素子 |
| JPS59198756A (ja) * | 1983-04-27 | 1984-11-10 | Hitachi Ltd | 固体撮像素子およびその製造方法 |
| JPH0230183A (ja) * | 1988-07-19 | 1990-01-31 | Nec Corp | 固体撮像素子 |
| JP3070146B2 (ja) * | 1991-06-19 | 2000-07-24 | ソニー株式会社 | 固体撮像装置 |
| DE69228838T2 (de) * | 1991-07-12 | 1999-10-21 | Sony Corp., Tokio/Tokyo | Verfahren zur Steuerung einer Ladungstransferschaltung |
| JP2832136B2 (ja) * | 1992-12-28 | 1998-12-02 | シャープ株式会社 | 固体撮像装置及びその製造方法 |
| KR950002084A (ko) * | 1993-06-22 | 1995-01-04 | 오가 노리오 | 전하전송장치 |
-
1998
- 1998-03-23 JP JP10074392A patent/JPH11274462A/ja active Pending
-
1999
- 1999-03-19 GB GB9906454A patent/GB2335793B/en not_active Expired - Lifetime
- 1999-03-22 US US09/273,271 patent/US6326655B1/en not_active Expired - Lifetime
- 1999-03-23 KR KR1019990009916A patent/KR100605436B1/ko not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR890015584A (ko) * | 1988-03-31 | 1989-10-30 | 미다 가쓰시게 | 증폭형 고체촬상장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9906454D0 (en) | 1999-05-12 |
| KR19990078166A (ko) | 1999-10-25 |
| JPH11274462A (ja) | 1999-10-08 |
| GB2335793A (en) | 1999-09-29 |
| GB2335793B (en) | 2003-03-05 |
| US6326655B1 (en) | 2001-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100605436B1 (ko) | 고체 촬상 장치 | |
| JP4224036B2 (ja) | フォトダイオード領域を埋め込んだイメージセンサ及びその製造方法 | |
| JP4976273B2 (ja) | シーモスイメージセンサ及びその製造方法 | |
| CN101320744B (zh) | 固态成像装置及其制造方法 | |
| US6423993B1 (en) | Solid-state image-sensing device and method for producing the same | |
| JP4420039B2 (ja) | 固体撮像装置 | |
| US9196649B2 (en) | Solid-state imaging device | |
| US20060108613A1 (en) | CMOS image sensor | |
| EP2341539A2 (en) | Image sensor with embedded photodiode region and manufacturing method for same | |
| JP4406964B2 (ja) | 固体撮像素子及びその製造方法 | |
| KR100218773B1 (ko) | 고체촬상장치 | |
| JP2009135319A (ja) | 固体撮像装置及びカメラ | |
| KR980012585A (ko) | 수직형 전달게이트를 가지는 전하결합형 고체촬상소자 및 그 제조방법 | |
| US20090144354A1 (en) | Imaging device | |
| JPH11307752A (ja) | 固体撮像装置 | |
| JPH11274461A (ja) | 固体撮像装置とその製造方法 | |
| CN101222587A (zh) | 固态成像器件和电子装置 | |
| JP2005347759A (ja) | 暗電流を減少させるためのイメージセンサー及びその製造方法 | |
| CN116250248A (zh) | 固态摄像装置及其制造方法和电子设备 | |
| JP2006100620A (ja) | 固体撮像素子及び半導体装置 | |
| JP4775486B2 (ja) | 固体撮像装置及びその製造方法 | |
| US20250063757A1 (en) | Semiconductor device and electronic device | |
| US20250359133A1 (en) | Semiconductor device and electronic apparatus | |
| JP2014135515A (ja) | 固体撮像装置 | |
| JP2007184368A (ja) | 固体撮像装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19990323 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20040323 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19990323 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20051205 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20060608 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20060720 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20060721 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20090626 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20100712 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20110713 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20120713 Start annual number: 7 End annual number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20130712 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20130712 Start annual number: 8 End annual number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20140711 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20140711 Start annual number: 9 End annual number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20150710 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20150710 Start annual number: 10 End annual number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20160708 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20160708 Start annual number: 11 End annual number: 11 |
|
| FPAY | Annual fee payment |
Payment date: 20170707 Year of fee payment: 12 |
|
| PR1001 | Payment of annual fee |
Payment date: 20170707 Start annual number: 12 End annual number: 12 |
|
| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |
Termination date: 20190923 Termination category: Expiration of duration |