KR100579832B1 - 스핀리스 코팅용 포토레지스트 조성물 - Google Patents

스핀리스 코팅용 포토레지스트 조성물 Download PDF

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Publication number
KR100579832B1
KR100579832B1 KR1020030035442A KR20030035442A KR100579832B1 KR 100579832 B1 KR100579832 B1 KR 100579832B1 KR 1020030035442 A KR1020030035442 A KR 1020030035442A KR 20030035442 A KR20030035442 A KR 20030035442A KR 100579832 B1 KR100579832 B1 KR 100579832B1
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KR
South Korea
Prior art keywords
group
methyl
methacrylate
good good
acrylate
Prior art date
Application number
KR1020030035442A
Other languages
English (en)
Korean (ko)
Other versions
KR20040104053A (ko
Inventor
배유리
김영근
최숙영
차혁진
이재환
이근주
류미선
서현진
우승우
우제선
유권일
이수현
정용만
최범영
한철
김웅
정낙칠
홍성재
김민지
최영수
정상협
최재록
Original Assignee
주식회사 삼양이엠에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 삼양이엠에스 filed Critical 주식회사 삼양이엠에스
Priority to KR1020030035442A priority Critical patent/KR100579832B1/ko
Priority to PCT/KR2004/001300 priority patent/WO2004107052A1/en
Priority to TW093115691A priority patent/TWI274962B/zh
Priority to TW093115695A priority patent/TWI266952B/zh
Priority to PCT/KR2004/001301 priority patent/WO2004107053A1/en
Publication of KR20040104053A publication Critical patent/KR20040104053A/ko
Application granted granted Critical
Publication of KR100579832B1 publication Critical patent/KR100579832B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
KR1020030035442A 2003-06-02 2003-06-02 스핀리스 코팅용 포토레지스트 조성물 KR100579832B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020030035442A KR100579832B1 (ko) 2003-06-02 2003-06-02 스핀리스 코팅용 포토레지스트 조성물
PCT/KR2004/001300 WO2004107052A1 (en) 2003-06-02 2004-06-01 Negative photoresist composition for spinless (slit) coating
TW093115691A TWI274962B (en) 2003-06-02 2004-06-01 Positive photoresist composition for spinless (SLIT) coating
TW093115695A TWI266952B (en) 2003-06-02 2004-06-01 Negative photoresist composition for spinless (slit) coating
PCT/KR2004/001301 WO2004107053A1 (en) 2003-06-02 2004-06-01 Positive photoresist composition for spinless (slit) coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030035442A KR100579832B1 (ko) 2003-06-02 2003-06-02 스핀리스 코팅용 포토레지스트 조성물

Publications (2)

Publication Number Publication Date
KR20040104053A KR20040104053A (ko) 2004-12-10
KR100579832B1 true KR100579832B1 (ko) 2006-05-15

Family

ID=33487834

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030035442A KR100579832B1 (ko) 2003-06-02 2003-06-02 스핀리스 코팅용 포토레지스트 조성물

Country Status (3)

Country Link
KR (1) KR100579832B1 (zh)
TW (2) TWI274962B (zh)
WO (2) WO2004107053A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101299967B1 (ko) * 2009-06-23 2013-08-27 주식회사 엘지화학 스핀리스용 열경화성 수지 조성물

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100595818B1 (ko) * 2004-03-10 2006-07-03 (주)서원인텍 엘라스토머 성형품의 도장방법
JP2005338831A (ja) * 2004-05-25 2005-12-08 Samsung Electronics Co Ltd 液晶表示装置の有機膜フォトレジスト組成物、そのスピンレスコーティング方法、これを用いた有機膜パターン形成方法及びこれにより製造された液晶表示装置
JP4828275B2 (ja) * 2006-03-30 2011-11-30 新日鐵化学株式会社 カラーフィルター用遮光性樹脂組成物及びカラーフィルター
CN106866435A (zh) * 2017-03-01 2017-06-20 无锡阿科力科技股份有限公司 一种含有桥环结构的聚醚胺及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1148105B1 (en) * 2000-04-17 2006-10-04 JSR Corporation Composition for film formation, method of film formation, and silica-based film
KR100367471B1 (ko) * 2000-12-14 2003-01-10 주식회사 아담스테크놀로지 오버코트용 레지스트 조성물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101299967B1 (ko) * 2009-06-23 2013-08-27 주식회사 엘지화학 스핀리스용 열경화성 수지 조성물

Also Published As

Publication number Publication date
TW200428140A (en) 2004-12-16
WO2004107053A1 (en) 2004-12-09
TW200428152A (en) 2004-12-16
TWI266952B (en) 2006-11-21
KR20040104053A (ko) 2004-12-10
TWI274962B (en) 2007-03-01
WO2004107052A1 (en) 2004-12-09

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