KR100553840B1 - 인쇄회로기판용 동박의 제조 방법 - Google Patents

인쇄회로기판용 동박의 제조 방법 Download PDF

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Publication number
KR100553840B1
KR100553840B1 KR1020030034371A KR20030034371A KR100553840B1 KR 100553840 B1 KR100553840 B1 KR 100553840B1 KR 1020030034371 A KR1020030034371 A KR 1020030034371A KR 20030034371 A KR20030034371 A KR 20030034371A KR 100553840 B1 KR100553840 B1 KR 100553840B1
Authority
KR
South Korea
Prior art keywords
copper foil
printed circuit
copper
circuit board
electrolysis bath
Prior art date
Application number
KR1020030034371A
Other languages
English (en)
Korean (ko)
Other versions
KR20040102768A (ko
Inventor
김상범
정승량
Original Assignee
일진소재산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일진소재산업주식회사 filed Critical 일진소재산업주식회사
Priority to KR1020030034371A priority Critical patent/KR100553840B1/ko
Priority to CNA2004800145772A priority patent/CN1795704A/zh
Priority to PCT/KR2004/000883 priority patent/WO2004107833A1/en
Priority to JP2006532035A priority patent/JP2007501330A/ja
Publication of KR20040102768A publication Critical patent/KR20040102768A/ko
Application granted granted Critical
Publication of KR100553840B1 publication Critical patent/KR100553840B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020030034371A 2003-05-29 2003-05-29 인쇄회로기판용 동박의 제조 방법 KR100553840B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020030034371A KR100553840B1 (ko) 2003-05-29 2003-05-29 인쇄회로기판용 동박의 제조 방법
CNA2004800145772A CN1795704A (zh) 2003-05-29 2004-04-16 用于印刷电路板的铜箔的制备方法
PCT/KR2004/000883 WO2004107833A1 (en) 2003-05-29 2004-04-16 Method for manufacturing copper foilfor printed circuit board
JP2006532035A JP2007501330A (ja) 2003-05-29 2004-04-16 印刷回路基板用の銅箔の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030034371A KR100553840B1 (ko) 2003-05-29 2003-05-29 인쇄회로기판용 동박의 제조 방법

Publications (2)

Publication Number Publication Date
KR20040102768A KR20040102768A (ko) 2004-12-08
KR100553840B1 true KR100553840B1 (ko) 2006-02-24

Family

ID=36806206

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030034371A KR100553840B1 (ko) 2003-05-29 2003-05-29 인쇄회로기판용 동박의 제조 방법

Country Status (4)

Country Link
JP (1) JP2007501330A (zh)
KR (1) KR100553840B1 (zh)
CN (1) CN1795704A (zh)
WO (1) WO2004107833A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110126128A (ko) * 2009-03-27 2011-11-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박 및 그 제조 방법
US20130189538A1 (en) * 2010-09-24 2013-07-25 Jx Nippon Mining & Metals Corporation Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring board
CN102548202B (zh) * 2010-12-08 2014-09-03 金居开发铜箔股份有限公司 经粗化处理的铜箔及其制造方法
EP2660359A4 (en) * 2011-07-29 2015-08-05 Furukawa Electric Co Ltd COPPER-BASED ELECTROLYTIC ALLOY SHEET, PROCESS FOR PRODUCTION THEREOF, ELECTROLYTIC SOLUTION USED FOR ITS PRODUCTION, NEGATIVE ELECTRODE COLLECTOR FOR SECONDARY BATTERIES USING SAME, SECONDARY BATTERY, AND SECONDARY BATTERY ELECTRODE
WO2013065699A1 (ja) * 2011-10-31 2013-05-10 古河電気工業株式会社 高強度、高耐熱電解銅箔及びその製造方法
JP5406905B2 (ja) * 2011-11-16 2014-02-05 ナン ヤ プラスティクス コーポレーション 高剥離強度と環境にやさしい微細な粒状表面からなるプリント回路基板用銅箔の製造方法。
WO2014119583A1 (ja) * 2013-01-29 2014-08-07 古河電気工業株式会社 電解銅箔、該電解銅箔を用いた電池用集電体、該集電体を用いた二次電池用電極、該電極を用いた二次電池

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR840001643B1 (ko) * 1981-04-03 1984-10-12 후루가와 서킷트 호일 가부시끼 가이샤 인쇄 회로용 동박(銅箔)
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
KR930007925B1 (ko) * 1991-09-16 1993-08-21 덕산금속 주식회사 동 및 동합금 또는 이들을 피복한 금속의 표면처리방법
JPH07138794A (ja) * 1993-11-10 1995-05-30 Japan Energy Corp 亜鉛−シリカ複合被膜を有する銅箔及びその製造方法
JP3238278B2 (ja) * 1994-04-12 2001-12-10 株式会社日鉱マテリアルズ 電解銅箔の製造方法
JP3329572B2 (ja) * 1994-04-15 2002-09-30 福田金属箔粉工業株式会社 印刷回路用銅箔およびその表面処理方法
US6497806B1 (en) * 2000-04-25 2002-12-24 Nippon Denkai, Ltd. Method of producing a roughening-treated copper foil
GB2361713B (en) * 2000-04-14 2003-09-24 Fukuda Metal Foil Powder Method for surface treatment of copper foil
JP3709142B2 (ja) * 2001-01-19 2005-10-19 福田金属箔粉工業株式会社 プリント配線板用銅箔及びその製造方法
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법

Also Published As

Publication number Publication date
WO2004107833A1 (en) 2004-12-09
JP2007501330A (ja) 2007-01-25
KR20040102768A (ko) 2004-12-08
CN1795704A (zh) 2006-06-28

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